CN110265380A - A kind of peripheral apparatus ic chip package structure - Google Patents
A kind of peripheral apparatus ic chip package structure Download PDFInfo
- Publication number
- CN110265380A CN110265380A CN201910567523.7A CN201910567523A CN110265380A CN 110265380 A CN110265380 A CN 110265380A CN 201910567523 A CN201910567523 A CN 201910567523A CN 110265380 A CN110265380 A CN 110265380A
- Authority
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- Prior art keywords
- thermally conductive
- slot
- chip
- epoxy resin
- package structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 230000002093 peripheral effect Effects 0.000 title claims abstract description 16
- 239000003822 epoxy resin Substances 0.000 claims abstract description 28
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 28
- 230000006835 compression Effects 0.000 claims abstract description 22
- 238000007906 compression Methods 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 6
- 239000007767 bonding agent Substances 0.000 claims abstract description 5
- 230000017525 heat dissipation Effects 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 12
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 2
- 229910052760 oxygen Inorganic materials 0.000 claims 2
- 239000001301 oxygen Substances 0.000 claims 2
- -1 chip Substances 0.000 abstract description 4
- 238000005538 encapsulation Methods 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 abstract description 2
- 230000005855 radiation Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 6
- 238000003466 welding Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49544—Deformation absorbing parts in the lead frame plane, e.g. meanderline shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to chip encapsulation technology fields, and disclose a kind of peripheral apparatus ic chip package structure, including substrate, bonding agent, chip, lead, pin, epoxy resin, circuit board and through-hole, the left and right sides of the pin are fixedly installed with convex block, the overall width of the convex block and pin is slightly larger than the diameter of through-hole, the bottom surface of the epoxy resin opens up fluted, the inside of the groove is fixedly installed with compression blocks, the inside of the epoxy resin and is located at the top position of chip and offers cavity.This kind of peripheral apparatus ic chip package structure, when external connection radiating device, heat sink is pressed into the either flush with epoxy resin, spring-compressed, heat is transmitted to radiator by heat-conducting block and heat sink and radiates at this time, and when non-external connection radiating device, heat sink is ejected the top surface of epoxy resin by spring, by fin increasing heat radiation area, to improve the efficiency of heat dissipation.
Description
Technical field
The present invention relates to chip encapsulation technology field, specially a kind of peripheral apparatus ic chip package structure.
Background technique
Chip package is that a kind of pair of chip and related components carry out that fixed technique is mounted and sealed, and encapsulating structure rises
The effects of to placement, fixation, sealing and protecting chip.
The structure of common chip package is as shown in Figure 1, thereon has chip, the top surface of chip by adhesive bond
It is connected to pin by lead, substrate and chip are packaged by epoxy resin then, pin is finally inserted into circuit board
It is welded, when chip operation generates heat, and heat dissipation is gradually to be radiated by chip to epoxy inner, then pass through epoxy
The surface of resin and air carry out heat exchange, therefore the efficiency to radiate is lower, and since the size of pin is less than on circuit board
Clear size of opening, thus it is easy to appear pin and the unwelded secured phenomenon of through-hole when welding, cause chip can not normal work
Make.
Summary of the invention
(1) the technical issues of solving
In view of the deficiencies of the prior art, the present invention provides a kind of peripheral apparatus ic chip package structure, have
Spring radiator can effectively radiate to chip, compression type bayonet unit can guarantee that chip is whole and connect with circuit board
Connect it is firm to realize effectively welding the advantages that, solve common chip-packaging structure heat loss through radiation efficiency it is lower, welding draw
Foot is easy to appear the problem of not prison welding is leaned on.
(2) technical solution
To realize that above-mentioned spring radiator can effectively radiate to chip, compression type bayonet unit can guarantee
It is firm to realize the purpose effectively welded that chip is integrally connect with circuit board, the invention provides the following technical scheme: a kind of outer
If integration of equipments circuit chip package structure, including substrate, bonding agent, chip, lead, pin, epoxy resin, circuit board and logical
Hole, the left and right sides of the pin are fixedly installed with convex block, and the overall width of the convex block and pin is straight slightly larger than through-hole
Diameter, the bottom surface of the epoxy resin open up fluted, and the inside of the groove is fixedly installed with compression blocks, the epoxy resin
Cavity is offered at top position that is internal and being located at chip, the top surface of the epoxy resin offers through slot one, the chip
Top surface and be located at cavity inside be fixedly installed with thermally conductive box, the top surface of the thermally conductive box offers through slot two, described thermally conductive
Bottom surface inside box is fixedly installed with spring, and the top of the spring is fixedly installed with heat sink.
Preferably, the size of the compression blocks and the size of groove are identical, and the thickness of the compression blocks is greater than the depth of groove
Degree, the material of the compression blocks are soft anti-corrosive rubber block.
Preferably, the through slot one is connected with cavity, and the quantity of the through slot one is five, and five through slots one exist
The top surface of epoxy resin is in being uniformly distributed on length direction.
Preferably, volume shared by the thermally conductive box is identical as the volume in cavity inside space, and the thermally conductive box material is
The preferable thin-walled copper alloy box of heating conduction.
Preferably, the through slot two is connected to the inside of thermally conductive box, the quantity of the through slot two and position respectively with through slot
One quantity is identical with position.
Preferably, the quantity of the spring is three, and three springs are in the inside of thermally conductive box on length direction
It is uniformly distributed, the spring is in the state of compression always.
Preferably, the heat sink is made of bottom plate and fin, and the material of the bottom plate and the material of fin are identical, described
The plane of structure product of bottom plate is identical as the cross-sectional area inside thermally conductive box, and the size of the fin and the size of through slot one and through slot two are equal
Identical, the total height of the fin and bottom plate is less than at a distance from the bottom surface to thermally conductive box inner bottom surface of bottom plate.
(3) beneficial effect
Be compared with the prior art, the present invention have it is following the utility model has the advantages that
1, this kind of peripheral apparatus ic chip package structure pushes heat sink when external connection radiating device
To the either flush with epoxy resin, spring-compressed, heat is transmitted to radiator by heat-conducting block and heat sink and carries out at this time
Heat dissipation, when non-external connection radiating device, the top surface of heat sink ejection epoxy resin is increased radiating surface by fin by spring
Product, to improve the efficiency of heat dissipation.
2, this kind of peripheral apparatus ic chip package structure carries out the convex block of pin bottom across through-hole when installation
Limit, compression blocks are compressed, and integrally apply upward thrust to chip, enable pin and circuit using thrust and convex block
Plate be in close contact, thus guarantee to weld it is firm.
Detailed description of the invention
Fig. 1 is existing chip-packaging structure schematic diagram；
Fig. 2 is structure of the invention overall schematic；
Fig. 3 is structure of the invention entirety perspective view of the explosion；
Fig. 4 is structure of the invention sectional view.
In figure: 1, substrate；101, bonding agent；102, chip；103, lead；104, pin；105, convex block；2, asphalt mixtures modified by epoxy resin
Rouge；201, groove；202, cavity；203, through slot one；3, circuit board；301, through-hole；4, compression blocks；5, thermally conductive box；501, through slot
Two；6, spring；7, heat sink；701, bottom plate；702, fin.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Please refer to Fig. 2-4, a kind of peripheral apparatus ic chip package structure, including substrate 1, bonding agent 101, chip
102, lead 103, pin 104, epoxy resin 2, circuit board 3 and through-hole 301, the left and right sides of pin 104 are fixedly mounted
There is convex block 105, convex block 105 is slightly larger than the diameter of through-hole 301 with the overall width of pin 104, plays the role of limit, epoxy resin
2 bottom surface opens up fluted 201, and the inside of groove 201 is fixedly installed with compression blocks 4, size and the groove 201 of compression blocks 4
Size is identical, and the thickness of compression blocks 4 is greater than the depth of groove 201, and the material of compression blocks 4 is soft anti-corrosive rubber block, so that
Compression blocks 4 can be pressurized and thrust output, the inside of epoxy resin 2 and be located at the top position of chip 102 and offer cavity
202, for installing radiating subassembly, the top surface of epoxy resin 2 offers through slot 1, and through slot 1 is connected with cavity 202,
The quantity of through slot 1 is five, and five through slots 1, in being uniformly distributed on length direction, are mentioned in the top surface of epoxy resin 2
Thermally conductive box 5, thermally conductive box are fixedly installed with for the space of radiating subassembly movement, the top surface of chip 102 and positioned at the inside of cavity 202
Volume shared by 5 is identical as the volume of 202 inner space of cavity, plays the fixed function to thermally conductive box 5 by cavity 202, leads
Hot 5 material of box is the preferable thin-walled copper alloy box of heating conduction, and the top surface of thermally conductive box 5 offers through slot 2 501, through slot 2 501
It is connected to the inside of thermally conductive box 5, the quantity of through slot 2 501 and position are identical as the quantity of through slot 1 and position respectively, thermally conductive
Bottom surface inside box 5 is fixedly installed with spring 6, and the quantity of spring 6 is three, and three springs 6 are in length in the inside of thermally conductive box 5
Being uniformly distributed on direction, state of the spring 6 always in compression, is used for thrust output, the top of spring 6 is fixedly installed with scattered
Hot plate 7, for radiating, heat sink 7 is made of bottom plate 701 and fin 702, the material of bottom plate 701 and the material of fin 702
Identical, the plane of structure product of bottom plate 701 is identical as the cross-sectional area inside thermally conductive box 5, enables bottom plate 701 in thermally conductive box 5
Portion slides up and down, and the size of fin 702 and the size of through slot 1 and through slot 2 501 are all the same, when bottom plate 701 is in thermally conductive
When top inside box 5, fin 702 can stretch out the top surface of epoxy resin 2, and fin 702 and the total height of bottom plate 701 are small
In the bottom surface of bottom plate 701 to the distance of thermally conductive 5 inner bottom surface of box, so that fin 702 can be withdrawn when spring 6 compresses
To the top surface flush of top surface and epoxy resin 2, it is easily installed radiator.
Working principle: passing through through-hole 301 for pin 104 and convex block 105 when installation, carries out 105 opposing circuit board 3 of convex block
Limit, while compression blocks 4 are pressurized, and apply upward thrust to epoxy resin 2, to make the bottom surface card of convex block 105 Yu through-hole 301
It is firm to connect, and when external connection radiating device, fin 702 is compressed to 702 top surface of fin and epoxy resin 2 by radiator
Either flush, the heat of chip 102 passes to heat sink 7 by thermally conductive box 5 at this time, then passes through heat sink 7 and epoxy resin 2
Top surface pass to radiator and radiate, when non-external connection radiating device, spring 6 jacks heat sink 7 upwards, directly
It is contacted to the top surface of bottom plate 701 with the top surface inside thermally conductive box 5, fin 702 stretches out the top surface of epoxy resin 2, chip 102 at this time
The heat of generation passes to bottom plate 701 and fin 702 by thermally conductive box 5, and carries out hot friendship by the surface of fin 702 and air
It changes.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.Simultaneously in the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length
Degree ", " width ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner",
The orientation or positional relationship of the instructions such as "outside", " clockwise ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, only
It is that for the convenience of describing the present invention and simplifying the description, rather than the equipment of indication or suggestion meaning or element must have specifically
Orientation is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.And in attached drawing of the invention,
Filling pattern is intended merely to difference figure layer, does not do other any restrictions.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (7)
1. a kind of peripheral apparatus ic chip package structure, including substrate (1), bonding agent (101), chip (102), lead
(103), pin (104), epoxy resin (2), circuit board (3) and through-hole (301), it is characterised in that: a left side for the pin (104)
Right two sides are fixedly installed with convex block (105), and the overall width of the convex block (105) and pin (104) is slightly larger than through-hole (301)
Diameter, the bottom surface of the epoxy resin (2) opens up fluted (201), and the inside of the groove (201) is fixedly installed with compression
Block (4), the inside of the epoxy resin (2) and be located at chip (102) top position at offer cavity (202), the ring
The top surface of oxygen resin (2) offers through slot one (203), the top surface of the chip (102) and the inside for being located at cavity (202) is fixed
It is equipped with thermally conductive box (5), the top surface of the thermally conductive box (5) offers through slot two (501), the internal bottom surface of the thermally conductive box (5)
It is fixedly installed with spring (6), the top of the spring (6) is fixedly installed with heat sink (7).
2. a kind of peripheral apparatus ic chip package structure according to claim 1, it is characterised in that: the compression
The size of block (4) is identical as the size of groove (201), and the thickness of the compression blocks (4) is greater than the depth of groove (201), described
The material of compression blocks (4) is soft anti-corrosive rubber block.
3. a kind of peripheral apparatus ic chip package structure according to claim 1, it is characterised in that: the through slot
One (203) are connected with cavity (202), and the quantity of the through slot one (203) is five, and five through slots one (203) are in ring
The top surface of oxygen resin (2) is in being uniformly distributed on length direction.
4. a kind of peripheral apparatus ic chip package structure according to claim 1, it is characterised in that: described thermally conductive
Volume shared by box (5) is identical as the volume of cavity (202) inner space, and thermally conductive box (5) material is that heating conduction is preferable
Thin-walled copper alloy box.
5. a kind of peripheral apparatus ic chip package structure according to claim 1, it is characterised in that: the through slot
Two (501) are connected to the inside of thermally conductive box (5), the quantity of the through slot two (501) and the position number with through slot one (203) respectively
It measures identical with position.
6. a kind of peripheral apparatus ic chip package structure according to claim 1, it is characterised in that: the spring
(6) quantity is three, and three springs (6) are in the inside of thermally conductive box (5) in being uniformly distributed on length direction, the bullet
State of the spring (6) always in compression.
7. a kind of peripheral apparatus ic chip package structure according to claim 1, it is characterised in that: the heat dissipation
Plate (7) is made of bottom plate (701) and fin (702), and the material of the bottom plate (701) is identical as the material of fin (702), described
The plane of structure of bottom plate (701) is long-pending identical as the internal cross-sectional area of thermally conductive box (5), the size and through slot one of the fin (702)
(203) and the size of through slot two (501) is all the same, and the total height of the fin (702) and bottom plate (701) is less than bottom plate (701)
Bottom surface to thermally conductive box (5) inner bottom surface distance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910567523.7A CN110265380B (en) | 2019-06-27 | 2019-06-27 | Peripheral equipment integrated circuit chip packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910567523.7A CN110265380B (en) | 2019-06-27 | 2019-06-27 | Peripheral equipment integrated circuit chip packaging structure |
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| Publication Number | Publication Date |
|---|---|
| CN110265380A true CN110265380A (en) | 2019-09-20 |
| CN110265380B CN110265380B (en) | 2020-10-23 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910567523.7A Active CN110265380B (en) | 2019-06-27 | 2019-06-27 | Peripheral equipment integrated circuit chip packaging structure |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111726975A (en) * | 2020-08-03 | 2020-09-29 | 成都市天行通科技有限公司 | LED display screen with adjustable heat conduction device |
| CN113513877A (en) * | 2021-05-12 | 2021-10-19 | 扬州联华电子科技有限公司 | LED packaging support with heat dissipation function |
| CN114361115A (en) * | 2021-12-31 | 2022-04-15 | 中山市木林森微电子有限公司 | Multi-chip embedded type packaging module structure |
| CN114823582A (en) * | 2022-07-01 | 2022-07-29 | 开平依利安达电子有限公司 | Packaging structure of chip heat dissipation part of multilayer printed circuit board |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113513877A (en) * | 2021-05-12 | 2021-10-19 | 扬州联华电子科技有限公司 | LED packaging support with heat dissipation function |
| CN113513877B (en) * | 2021-05-12 | 2022-10-14 | 扬州联华电子科技有限公司 | LED packaging support with heat dissipation function |
| CN114361115A (en) * | 2021-12-31 | 2022-04-15 | 中山市木林森微电子有限公司 | Multi-chip embedded type packaging module structure |
| CN114823582A (en) * | 2022-07-01 | 2022-07-29 | 开平依利安达电子有限公司 | Packaging structure of chip heat dissipation part of multilayer printed circuit board |
| CN114823582B (en) * | 2022-07-01 | 2022-11-01 | 开平依利安达电子有限公司 | Packaging structure of chip heat dissipation part of multilayer printed circuit board |
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