CN217588910U

CN217588910U - Chip packaging structure

Info

Publication number: CN217588910U
Application number: CN202221640659.XU
Authority: CN
Inventors: 赖振楠; 刘清水
Original assignee: Hosin Global Electronics Co Ltd
Current assignee: Hosin Global Electronics Co Ltd
Priority date: 2022-06-27
Filing date: 2022-06-27
Publication date: 2022-10-14
Anticipated expiration: 2032-06-27

Abstract

The utility model provides a chip packaging structure, include: the micro-channel module is provided with a first groove, a micro-channel cavity and a plurality of conductive columns; each conductive column avoids the first groove and penetrates through the upper surface and the lower surface of the micro-channel module; a substrate having a first chip, a plurality of first pads, and a plurality of second pads thereon; the lower surface of the first chip covers the first bonding pad, and a plurality of first bonding pads of the first chip are electrically connected with the first bonding pads respectively; the lower surface of the micro-channel module is attached to the upper surface of the substrate, the first chip is embedded into the first groove, the lower ends of the conductive columns are electrically connected with the second bonding pads respectively, the second chip is fixed on the upper surface of the micro-channel module, and the second bonding pads of the second chip are electrically connected with the upper ends of the conductive columns respectively. The utility model discloses can simplify the processing technology in miniflow channel chamber.

Description

Chip packaging structure

Technical Field

The utility model relates to an integrated circuit field, more specifically says, relates to a chip package structure.

Background

With the continuous improvement and development of integrated circuits, the volume of the integrated circuits is continuously reduced on the structure; the function is continuously improved. While the functions are improved, the number of transistors required by the integrated circuit is increased, and the number of semiconductors (i.e., bare chips) packaged in a single chip is also increased. The heat management and dissipation of the semiconductor heat in the chip becomes an important design point in the integrated circuit and semiconductor packaging process.

The micro-channel cavity is a plate layer with a channel with two open ends, and is a heat dissipation technology with higher efficiency in the existing heat dissipation mode. The micro-channel cavity is attached to the surface of the chip, and the cooling liquid flows in from the opening at one end and flows out from the opening at the other end after absorbing the heat near the device, so that the purpose of heat dissipation of the device is achieved. The micro-channel heat dissipation has the advantages of high surface area/volume ratio, low thermal resistance, low flow and the like, so that the micro-channel heat dissipation is an effective heat dissipation mode. Generally, a micro-flow channel for conveying heat dissipation cooling liquid is arranged above a main working area of the electronic chip to meet the requirement of small volume of the electronic equipment.

However, the current micro-channel heat dissipation structure applied inside the chip has a complex preparation process, and Through holes need to be prepared by using a TSV (Through-Silicon Vias) process to form micro-channels distributed among a plurality of bare chips.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model lies in, to above-mentioned chip use microchannel heat radiation structure because of using TSV preparation through-hole and leading to the problem that technology is complicated, the cost is higher, provide a new chip packaging structure.

The utility model provides an above-mentioned technical problem's technical scheme be, provide a chip packaging structure, include:

the micro-channel module is provided with a first groove, a micro-channel cavity and a plurality of conductive columns; the first groove is positioned on the lower surface of the micro-channel module; each conductive column avoids the first groove and penetrates through the upper surface and the lower surface of the micro-channel module;

a substrate having a first chip, a plurality of first pads, and a plurality of second pads thereon; the lower surface of the first chip covers the first bonding pad, and a plurality of first bonding pads of the first chip are electrically connected with the first bonding pads respectively; the lower surface of microchannel module pastes in the upper surface of base plate, first chip is embedded into in the first recess, many the lower extreme that leads electrical pillar is connected with a plurality of the second pad electricity respectively, the upper surface of microchannel module is fixed with the second chip, just a plurality of second pads of second chip respectively with many the upper end electricity of leading electrical pillar is connected.

As a further improvement, the microchannel module further comprises a liquid inlet and a liquid outlet, and the microchannel cavity is respectively communicated with the liquid inlet and the liquid outlet.

As a further improvement of the present invention, the microchannel module comprises a rectangular-shaped heat dissipation gasket and a flat-plate-shaped heat dissipation plate, and the microchannel cavity is located in the heat dissipation plate;

the radiating gasket is fixed on the upper surface of the substrate and surrounds the first chip, the radiating plate is fixed above the radiating gasket and the first chip, and each conducting column consists of a first part positioned in the radiating gasket and a second part positioned in the radiating plate.

As a further improvement, the chip package structure further includes a package body, the substrate, the first chip, the second chip, the micro channel module pass through the package body is integrated into a package body to form a chip main body, the liquid inlet and the liquid outlet respectively extend to outside the package body, just the liquid inlet and the liquid outlet extend to above the liquid inlet and the liquid outlet the outer part of the package body is formed with a joint.

As a further improvement of the present invention, the inlet and the outlet are respectively located two opposite side surfaces of the microchannel module, the microchannel cavity includes at least one coolant passage located above the first groove.

As a further improvement of the present invention, the microchannel cavity includes a coolant channel that is serpentine and is located in a plane parallel to the surface of the substrate.

As a further improvement of the present invention, the liquid inlet is disposed adjacent to the lower surface of the micro flow channel module, and the liquid outlet is disposed adjacent to the upper surface of the micro flow channel module;

the micro-channel cavity comprises a first buffer area communicated with the liquid inlet, a second buffer area communicated with the liquid outlet and a plurality of cooling liquid channels perpendicular to the upper surface of the substrate, the planes of the first buffer area and the second buffer area are parallel to the surface of the substrate, the lower end of each cooling liquid channel is communicated with the first buffer area, and the upper end of each cooling liquid channel is communicated with the second buffer area.

As a further improvement of the utility model, the upper surface of the first chip is provided with an electromagnetic shielding layer.

As a further improvement of the utility model, the bottom wall of the first groove and the space between the electromagnetic shielding layers are filled with heat-conducting glue.

As a further improvement, the upper surface and the lower surface of the micro flow channel module have a chamfer at the position where the conductive post meets.

The utility model discloses following beneficial effect has: dispel the heat to the first chip of encapsulation in first recess through setting up the microchannel chamber on the microchannel module, the heat of first chip except can being taken away in the microchannel chamber simultaneously, the heat of leading electrical pillar can also be taken away in the heat-conduction of microchannel module itself, and because the microchannel module is relatively independent, thereby need not through the TSV technology when processing the microchannel chamber, when simplifying the processing technology in microchannel chamber, realize the high-efficient heat dissipation of chip.

Drawings

Fig. 1 is a schematic cross-sectional view of a chip package structure provided in an embodiment of the present invention;

FIG. 2 is a cross-sectional view of the micro flow channel module in the chip package structure according to the embodiment of the present invention, taken along a direction parallel to the upper surface;

fig. 3 is a schematic cross-sectional view of a chip package structure according to another embodiment of the present invention;

FIG. 4 is a schematic diagram of a micro flow channel cavity in a chip package structure according to another embodiment of the present invention;

fig. 5 is a cross-sectional view of a micro flow channel module using a vertical coolant flow channel in a chip package structure according to an embodiment of the present invention, taken along a direction perpendicular to an upper surface;

FIG. 6 is a schematic diagram of a partial cross-sectional structure of the upper surface of the micro flow channel module in the chip package structure according to the embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Fig. 1 is a schematic cross-sectional view of a chip package structure according to an embodiment of the present invention, which can be applied to a chip stack package structure including a plurality of bare chips. The utility model discloses in, chip package structure includes base plate 11, first chip 12, second chip 13, packaging body and miniflow channel module 15, and above-mentioned base plate 11, first chip 12, second chip 13 and miniflow channel module 15 form chip main part 10 through the integrative encapsulation of packaging body. The first chip 12 and the second chip 13 are both unpackaged bare DIEs (DIE) capable of performing a specific function, wherein an adhesive is disposed at a bonding position of the first chip 12 and the substrate 11 for bonding the first chip, and a length/width dimension of the first chip 12 is smaller than a length/width dimension of the second chip 13, for example, when the chip package structure is applied to a memory device, the first chip 12 may be a master chip, and the second chip 13 is a storage medium. In addition, a plurality of passive components, such as resistors and capacitors, may be further packaged in the package, and these passive components may form a circuit together with the first chip 12 and the second chip 13 to implement corresponding functions. Of course, in practical applications, the chip package structure may not include a package body.

In this embodiment, the main body of the micro flow channel module 15 may be made of a heat-conducting and insulating material with high temperature resistance, such as glass, ceramic, silicon substrate, heat-conducting potting adhesive, and alumina, and the melting point of these materials is much higher than that of tin, so that the internal structure of the first chip 12 and the second chip 13 will not be affected during soldering and high-frequency operation. Specifically, the main body of the micro flow channel module 15 may have a rectangular parallelepiped shape, and the size of the cross section of the rectangular parallelepiped shape is smaller than the size of the upper surface of the substrate 11 and larger than the size of the upper surface of the first chip 12.

The micro flow channel module 15 is provided with a first groove 1501, a micro flow channel cavity and a plurality of conductive posts 154, wherein the first groove 1501 is located on the lower surface of the micro flow channel module 15. In the micro flow channel module 15, each conductive pillar 154 avoids the first groove 1501 and penetrates through the upper surface and the lower surface of the micro flow channel module 15. For example, as shown in fig. 2, the first groove 1501 can be located in the central region of the lower surface of the micro channel module 15, and accordingly, the micro channel cavity is located in the orthographic projection region of the first groove 1501, and the conductive pillars 154 are distributed around the first groove 1501 and the micro channel cavity. In particular, the conductive posts 154 may be perpendicular to the upper and lower surfaces of the micro channel module 15.

The substrate 11 is an interposer substrate for carrying the first chip 12, the second chip 13 and the passive component, and is mainly composed of a substrate (specifically, a hard substrate, a flexible film substrate, a co-fired ceramic substrate, etc.) and a copper foil (the thickness of which may be 1.5 μm to 18 μm) on the substrate, and the substrate 11 has a plurality of substrate pads, at least some of which are electrically connected through the copper foil. The substrate 11 can realize not only the fixing and heat conduction of the first chip 12, the second chip 13, the passive element, and the like, but also the electrical connection between the first chip 12, the second chip 13, and the passive element. In addition, the lower surface of the substrate 11 may be provided with first solder balls 171, and the chip body 10 may be soldered to a circuit board through the first solder balls 171, or may be electrically connected to the spring plates in the connector through the first solder balls 171 after being assembled to the connector. The respective structures of the substrate 11, the first chip 12, the second chip 13 and the passive component are well known in the art and will not be described herein again.

Specifically, the surface of the first chip 12 has a plurality of first pads (i.e., pad, not shown in the figure), the surface of the second chip 13 has a plurality of second pads (i.e., pad, not shown in the figure), and accordingly, the upper surface of the substrate 11 has a plurality of first pads and a plurality of second pads. The first chip 12 covers all the first pads on the lower surface thereof and the first pads are fixed on the substrate 11 in a manner that the first pads are electrically connected to the first pads, i.e. the first pads of the first chip 12 are electrically connected to the first pads of the substrate 11 in a one-to-one correspondence manner, and the first pads can be welded together by the second solder balls 172, or the first pads and the first pads are bonded together by the conductive adhesive. The micro flow channel module 15 is fixed on the substrate 11 in a manner that the lower surface is attached to the upper surface of the substrate 11, the first chip 12 is embedded in the first groove 1501, the lower ends of the conductive posts 154 are respectively electrically connected with the second pads, that is, the lower ends of the conductive posts 154 are electrically connected with the second pads of the substrate 11 in a one-to-one correspondence manner, and the lower ends of the conductive posts 154 and the second pads can be fixed together in a solder ball welding manner, or the lower ends of the conductive posts 154 and the second pads are bonded together by conductive adhesive. The second chip 13 is fixed on the upper surface of the micro flow channel module 15, and the second pads of the second chip 13 are electrically connected to the upper ends of the conductive pillars 154, i.e. the upper ends of the conductive pillars 154 are electrically connected to the second pads of the second chip 13 in a one-to-one correspondence, and the upper ends of the conductive pillars 154 and the second pads can be welded and fixed together through the third solder balls 173, or the upper ends of the conductive pillars 154 and the second pads are bonded together through the conductive adhesive.

In this way, the micro flow channel cavity can absorb the heat generated by the first chip 12 in the first groove 1501 during operation, so that the first chip 12 can be always at a suitable operating temperature. Meanwhile, the micro-channel cavity can take away heat of the first chip 12 and can also take away heat of a part of the conductive posts 154 through heat conduction of the micro-channel module body, and because the micro-channel module 15 is relatively independent, efficient heat dissipation of the chip is achieved while the processing technology of the micro-channel cavity is simplified.

In an embodiment of the present invention, the micro flow channel module 15 further includes a liquid inlet 151 and a liquid outlet 152, and the cooling liquid flowing from the liquid inlet 151 can flow out from the liquid outlet 152 through the micro flow channel cavity. The inlet 151 and the outlet 152 may be respectively disposed on the side surfaces of the microchannel module 15, and the microchannel cavity includes at least one coolant channel 153 connected between the inlet 151 and the outlet 152.

When the substrate 11, the first chip 12, the second chip 13 and the micro flow channel module 15 are integrally packaged by the package, the liquid inlet 151 and the liquid outlet 152 protrude outside the package, and joints are formed on the portions of the liquid inlet and the liquid outlet that protrude outside the package and are connected to the cooling liquid circulation pipeline through the joints.

When the chip body 10 is connected to a coolant circulation line (in which a pressure providing device such as a water pump is disposed) through the liquid inlet 151 and the liquid outlet 152, the coolant flowing from the liquid inlet 151 may flow into a micro flow channel formed by the coolant channel 153, and absorb heat generated by the first chip 12 and the second chip 13 during operation, and then flow out from the liquid outlet 152, thereby dissipating heat from the first chip 12 and the second chip 13.

In another embodiment of the present invention, as shown in fig. 3, the micro flow channel module 15 may include a heat sink 1502 having a rectangular cross section and a heat sink 1503 having a flat plate shape, wherein the height of the heat sink 1502 is adapted to the height of the first chip 12, and the liquid inlet 151, the liquid outlet 152 and the micro flow channel cavity are all located on the heat sink 1503. In the package, the heat dissipation pad 1502 is fixed on the upper surface of the substrate 11 and surrounds the first chip 12, the heat dissipation plate 1503 is fixed above the heat dissipation pad 1502 and the first chip 12, and each conductive pillar 154 is composed of a first portion located in the heat dissipation pad 1502 and a second portion located in the heat dissipation plate 1503. The micro flow channel module 15 reduces the difficulty in manufacturing the first groove 1501, and on the other hand, can replace various chip packages of different sizes or types, so that the heat dissipation pads 1502 of different sizes can be replaced according to different die sizes, and the heat dissipation plates 1503 above the heat dissipation pads 1502 only need to be of fewer sizes and models. In this structure, the heat sink 1502 can absorb heat to a certain extent, and the heat transferred to the heat sink 1502 by heat conduction is taken away by the micro flow channel cavity in the heat sink 1503, thereby further improving heat dissipation performance.

In an embodiment of the present invention, the liquid inlet 151 and the liquid outlet 152 are respectively located on two opposite side surfaces of the micro flow channel module 15. That is, the cooling liquid flows in from one of the side surfaces and flows out from the other side surface, so that the micro-channel cavity can be simplified on the one hand, and the cooling liquid channel can be shorter on the other hand, thereby being beneficial to the cooling liquid to rapidly flow through the micro-channel module 15 and improving the heat dissipation efficiency. Preferably, the micro flow channel cavity of the micro flow channel module 15 includes a plurality of cooling liquid channels 153 parallel to the surface of the substrate 11, and two ends of each cooling liquid channel 153 are respectively communicated with the liquid inlet 151 and the liquid outlet 152. Specifically, the microchannel cavity portion of the microchannel module 15 may be formed of at least two laminae, and the surface of at least one of the adjacent laminae may have a through-groove, and after the plurality of laminae are laminated, the cooling liquid channel 153 is formed by the through-groove on the surface of the lamina. The two laminates and the through grooves on the surfaces of the laminates can be formed in an injection molding mode, so that the processing of the micro-channel cavity can be greatly simplified.

As shown in fig. 4, the micro flow channel cavity of the micro flow channel module 15 may further include a cooling liquid channel 153 having a serpentine shape and located in a plane parallel to the substrate 11. In this case, the microchannel cavity of the microchannel module 15 may be formed by two plates parallel to the upper surface of the substrate 11, respectively, and at least one of the plates may have a serpentine groove on its surface, and the coolant channel 153 may be formed by stacking the two plates. In particular, to improve the heat dissipation efficiency of the first chip 12, the coolant channel 153 may be disposed adjacent to the bottom of the first groove 1501.

Since the liquid inlet 151 continuously absorbs heat while flowing through the cooling liquid channel 153, the temperature of the cooling liquid is relatively high when the cooling liquid reaches the rear end of the cooling liquid channel 153, which affects the heat absorption efficiency of the rear end and causes uneven heat dissipation of the first chip 12 and the second chip 13. Therefore, the liquid inlet 151 and the liquid outlet 152 may be disposed adjacent to the lower surface of the micro channel module 15, and the liquid outlet 152 may be disposed adjacent to the upper surface of the micro channel module 15, that is, the liquid inlet 151 and the liquid outlet 152 are located at different heights of the micro channel module 15. Correspondingly, the micro flow channel cavity includes a first buffer area 156 communicated with the liquid inlet 151, a second buffer area 155 communicated with the liquid outlet 152, and a plurality of cooling liquid channels 153 perpendicular to the surface of the substrate 11, wherein the planes of the first buffer area 156 and the second buffer area 155 are parallel to the substrate 11, the first buffer area 156 is adjacent to the bottom wall of the first groove 1501, and the second buffer area 155 is adjacent to the upper surface of the micro flow channel module 15, so that after the encapsulation is completed, the first buffer area 156 is adjacent to the upper surface of the first chip 12, and the second buffer area 155 is adjacent to the lower surface of the second chip 13. The lower end of each coolant channel 153 communicates with the first buffer zone 156, and the upper end of each coolant channel 153 communicates with the second buffer zone 155. Thus, the cooling liquid flowing in from the liquid inlet 151 first enters the first buffer area 156, absorbs the heat emitted from the first chip 12, and then enters the second buffer area 155 through the cooling liquid channel 153, and the cooling liquid flows out from the liquid outlet 152 after the second buffer area 155 absorbs the heat emitted from the second chip 13. Because the flow resistance of the cooling liquid in the first buffer area 156 and the second buffer area 155 is relatively small, the temperature of the cooling liquid in the first buffer area 156 and the second buffer area 155 can be relatively uniform, and the problem of uneven heat dissipation of the first chip 12 and the second chip 13 can be solved to a certain extent.

Accordingly, when the microchannel structure includes the coolant channel 153 perpendicular to the surface of the substrate 11, the microchannel module 15 includes a bottom member 1504, an intermediate member 1505, and a top member 1506, wherein the bottom member 1504 has a second groove on the upper surface, the top member 1506 has a third groove on the lower surface, and the intermediate member 1505 has a plurality of through holes passing through the upper and lower surfaces; moreover, the lower surface of the intermediate member 1505 is sealingly connected with the upper surface of the bottom member 1504, the upper surface of the intermediate member 1505 is sealingly connected with the lower surface of the top member 1506, a first buffer zone 156 is formed by the second groove and the lower surface of the intermediate member 1505, a second buffer zone 155 is formed by the third groove and the upper surface of the intermediate member, and the coolant channel 153 is formed by a through hole, i.e., the micro channel module 15 is formed by stacking three parts of the bottom member 1504, the intermediate member 1505, and the top member 1506. Accordingly, a plurality of conductive posts 154 extend through the bottom member 1504, intermediate member 1505, and top member 1506, respectively. With the above structure, the fabrication process of the micro flow channel module 15 can be simplified, for example, the bottom member 1504, the middle member 1505 and the top member 1506 can be separately fabricated, and the conductive pillar 154 can be implanted after the three parts are stacked.

Preferably, in order to avoid the radio frequency interference when the first chip 12 and the second chip 13 operate at high frequency simultaneously, the electromagnetic shielding layer 16 may be disposed on the upper surface of the first chip 12. The electromagnetic shielding layer 16 may be formed on the upper surface of the first chip 12 by spraying, attaching or depositing.

In addition, in order to improve the heat dissipation efficiency of the micro channel module to the first chip 12, a heat conductive adhesive may be filled between the bottom wall of the first groove 1501 and the electromagnetic shielding layer 16. Similarly, a thermal conductive adhesive may be filled between the upper surface of the micro channel module 15 and the lower surface of the second chip 13 to improve the heat dissipation efficiency of the micro channel module 15 to the second chip 13.

In one embodiment of the present invention, as shown in fig. 6, a chamfer is provided on the upper surface of the micro flow channel module 15 at the position where the upper end of the conductive post 154 meets, and the chamfer can increase the contact area between the third solder ball 173 and the conductive post 154, thereby increasing the welding stability. Similarly, chamfers may also be provided on the upper surface of the micro flow channel module 15 at locations where the bottom ends of the conductive posts 154 meet.

Among the above-mentioned chip package structure, the preparation of microchannel chamber technology is simple, can effectively take away the heat that the chip high frequency operation produced, and the microchannel chamber can take away the heat of first chip 12 and second chip 13 simultaneously, can also take away the heat that leads the production of electrical pillar 154 simultaneously, increases substantially the radiating efficiency.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A chip package structure, comprising:

a substrate having a first chip, a plurality of first pads, and a plurality of second pads thereon; the lower surface of the first chip covers the first bonding pad, and a plurality of first bonding pads of the first chip are electrically connected with the first bonding pads respectively; the lower surface of the micro-channel module is attached to the upper surface of the substrate, the first chip is embedded into the first groove, the lower ends of the conductive columns are electrically connected with the second bonding pads respectively, the second chip is fixed on the upper surface of the micro-channel module, and the second bonding pads of the second chip are electrically connected with the upper ends of the conductive columns respectively.

2. The chip package structure of claim 1, wherein the micro flow channel module further comprises a liquid inlet and a liquid outlet, and the micro flow channel cavity is respectively communicated with the liquid inlet and the liquid outlet.

3. The chip package structure of claim 2, wherein the micro flow channel module comprises a heat sink pad in a shape of a Chinese character 'hui' and a heat sink in a shape of a flat plate, and the micro flow channel cavity is located in the heat sink;

4. The chip package structure according to claim 2, further comprising a package body, wherein the substrate, the first chip, the second chip, and the micro channel module are integrally packaged by the package body to form a chip main body, the liquid inlet and the liquid outlet respectively protrude outside the package body, and joints are formed on portions of the liquid inlet and the liquid outlet that protrude outside the package body.

5. The chip package structure according to any one of claims 2 to 4, wherein the liquid inlet and the liquid outlet are located on two opposite side surfaces of the micro flow channel module, respectively, and the micro flow channel cavity comprises at least one cooling liquid channel located above the first groove.

6. The chip package structure of claim 5, wherein the micro flow channel cavity comprises a cooling fluid channel having a serpentine shape and lying in a plane parallel to the surface of the substrate.

7. The chip package structure of any one of claims 2-4, wherein the liquid inlet is disposed adjacent to a lower surface of the micro flow channel module, and the liquid outlet is disposed adjacent to an upper surface of the micro flow channel module;

8. The chip packaging structure according to any one of claims 1 to 4, wherein the upper surface of the first chip has an electromagnetic shielding layer.

9. The chip package structure according to claim 8, wherein a thermal conductive adhesive is filled between the bottom wall of the first groove and the electromagnetic shielding layer.

10. The chip package structure according to any one of claims 1 to 4, wherein the micro flow channel module has chamfers at positions where the conductive posts meet on the upper surface and the lower surface of the micro flow channel module.