CN111696925A - Chip packaging structure and method - Google Patents
Chip packaging structure and method Download PDFInfo
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- CN111696925A CN111696925A CN202010418581.6A CN202010418581A CN111696925A CN 111696925 A CN111696925 A CN 111696925A CN 202010418581 A CN202010418581 A CN 202010418581A CN 111696925 A CN111696925 A CN 111696925A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a chip packaging structure and a chip packaging method, wherein the chip packaging structure comprises a packaging base plate, a shell frame is fixedly arranged on the upper surface of the packaging base plate, a chip sealing shell is fixedly arranged on the upper surface of the shell frame, a packaging chip is fixedly arranged on the upper surface of the packaging base plate, which is positioned on the inner side of the chip sealing shell, a plurality of chip conduction pins are fixedly arranged on the lower surface of the packaging chip, and a pin packaging adhesive layer is arranged on the inner surface of the packaging base plate. According to the chip packaging structure and the method, the heat conduction silver strip layer can be added while the chip heat conduction adhesive layer is used for packaging and fixing, the heat conduction efficiency is increased through the material of the heat conduction silver strip layer, so that the packaged chip can be more efficiently conducted heat conduction and heat dissipation, the heat dissipation effect of the chip is improved, and the heat of the circuit part of the packaging structure can be conducted through the heat conduction patch and the heat conduction upright post, so that the packaging structure can be cooled.
Description
Technical Field
The invention relates to the field of chip packaging, in particular to a chip packaging structure and a chip packaging method.
Background
The chip packaging structure is a shell for a semiconductor integrated circuit chip, plays a role in placing, fixing, sealing, protecting and enhancing the electric heating performance of the chip, and is a bridge for communicating the world inside the chip with an external circuit, pins on the chip are connected to pins of the packaging shell, and the pins of the packaging shell are connected with other devices for use, so that the packaging plays an important role in a CPU chip and the chips, which are indispensable parts of the chip and are widely used on various chips, and the use requirements of the chip are gradually improved along with the continuous improvement of the demand of network digital construction, thereby increasing the use requirements of the chip packaging structure, but the existing chip packaging structure can not meet the use requirements of people, needs to improve the chip packaging structure, and can not conduct heat more efficiently during packaging through glue when the chip packaging structure is installed and used, the heat conduction efficiency of glue encapsulation has been reduced to lead to the chip radiating effect poor, simultaneously, can not conduct packaging structure circuit connection part's heat, lead to packaging structure's radiating efficiency poor, can't more stable use.
Disclosure of Invention
The invention mainly aims to provide a chip packaging structure and a chip packaging method, which can effectively solve the problems of poor heat dissipation effect of a chip and poor heat dissipation efficiency of a packaging structure in the background technology.
In order to achieve the purpose, the invention adopts the technical scheme that:
a chip packaging structure comprises a packaging base plate, wherein a shell frame is fixedly arranged on the upper surface of the packaging base plate, a chip sealing shell is fixedly arranged on the upper surface of the shell frame, a packaging chip is fixedly arranged on the inner side of the chip sealing shell on the upper surface of the packaging base plate, a plurality of chip conduction pins are fixedly arranged on the lower surface of the packaging chip, a pin packaging adhesive layer is arranged on the inner surface of the packaging base plate, a pin inserting plate is fixedly arranged on the lower position of the pin packaging adhesive layer on the inner surface of the packaging base plate, a conduction circuit board is fixedly arranged on the lower position of the pin inserting plate on the inner surface of the packaging base plate, a plurality of conduction tin beads are arranged on the lower surface of the conduction circuit board, a chip heat conduction adhesive layer is arranged on the outer side of the packaging chip on the inner surface of the chip sealing shell, the inside of chip heat conduction glue film is provided with heat conduction silver strip layer, the outside position fixed mounting that the internal surface of chip seal shell is located chip heat conduction glue film has a plurality of chip reference columns, a plurality of location inside grooves have been seted up to the upper surface of encapsulation chip, the slow-witted fluting has been seted up in the outside of encapsulation bed plate, the equal fixed adhesion in both sides that the upper surface of foot needle inserting plate is located foot needle encapsulation glue film installs the heat conduction paster, the last fixed surface of heat conduction paster installs the heat conduction stand.
Preferably, the package base plate, the housing frame and the chip sealing housing are all square in shape, and the housing frame is inserted into an inner position of the package base plate.
Preferably, the chip conduction pins penetrate through the pin packaging adhesive layer and are inserted into the inner positions of the pin insertion plate, and the plurality of chip conduction pins are arranged in parallel.
Preferably, the pin packaging adhesive layer is fixedly connected with the upper surface of the pin insertion plate, and the pin insertion plate is fixedly connected with the upper surface of the conductive circuit board.
Preferably, the conductive circuit board has a size smaller than that of the package base plate, and the lower surface of the conductive circuit board is parallel to the lower surface of the package base plate.
Preferably, the encapsulation chip protrudes the top surface position of the encapsulation bed plate, the chip heat conduction glue layer is connected with the encapsulation chip in a wrapping mode, and the upper surface of the encapsulation bed plate is connected with the chip heat conduction glue layer in a laminating mode.
Preferably, the chip heat-conducting adhesive layer is connected with the packaged chip through smearing, the heat-conducting silver strip layer is located above the packaged chip, and the heat-conducting silver strip layer is attached to and connected with the inner wall of the chip sealing shell.
Preferably, the number of the chip positioning columns is the same as that of the positioning inner grooves, and the chip positioning columns are inserted into the inner sides of the positioning inner grooves to be matched and connected.
Preferably, the heat conduction stand is located the inside position of encapsulation bed plate, the upper end and the laminating of chip heat-conducting glue layer of heat conduction stand are connected.
Preferably, a method for using a chip packaging structure includes the following steps:
s1: the packaging base plate, the chip sealing shell and the packaging chip are dedusted and placed on a packaging tool, and the pin insertion plate and the conduction circuit board are fixedly connected through integral molding or welding;
s2: coating a pin packaging adhesive layer on the pin insertion plate in the packaging base plate to enable the pin packaging adhesive layer to be accumulated above the pin insertion plate, then putting the packaged chip into the inner side of the packaging base plate, simultaneously driving the chip conduction pins below to be inserted into the pin insertion plate by the packaged chip, enabling the chip conduction pins below the packaged chip and the chip conduction pins to be in contact with the pin packaging adhesive layer, and packaging and fixing the packaged chip through adhesion of the pin packaging adhesive layer;
s3: coating a chip heat-conducting adhesive layer on the upper part of the packaged chip, simultaneously placing a heat-conducting silver strip layer when the chip heat-conducting adhesive layer is coated, then installing a chip sealing shell above a packaging base plate through a packaging tool, clamping a shell frame below the chip sealing shell into the packaging base plate for positioning, attaching the chip heat-conducting adhesive layer to the lower part of the chip sealing shell, connecting the chip sealing shell and the packaged chip through the chip heat-conducting adhesive layer, and covering the packaged chip through the chip sealing shell to complete packaging;
s4: the lower part of the conductive circuit board is used for installing conductive tin beads through a bead planting process, the packaged chip is connected and installed through a packaging base plate when in use, the packaged chip is connected with a pin inserting plate and a conductive circuit board circuit through chip conductive pins and is connected and transmitted with using equipment through the conductive tin beads;
s5: the encapsulation chip uses when generating heat to conduct the heat to chip seal shell through chip heat conduction glue film, and chip heat conduction glue film increases heat conduction efficiency through inside heat conduction silver bar layer, makes the quick conduction of the heat of encapsulation chip dispel the heat to chip seal shell to chip heat conduction glue film laminating heat conduction stand, heat conduction stand pass through the heat conduction paster and pin insert the board and be connected, also carries out quick conduction heat dissipation to the heat that the pin insert the board sent.
Compared with the prior art, the invention has the following beneficial effects:
through the encapsulation chip that sets up, chip heat conduction glue film, heat conduction silver strip layer and chip seal shell, can add heat conduction silver strip layer when encapsulating fixedly through chip heat conduction glue film, material through heat conduction silver strip layer increases heat conduction efficiency, thereby more efficient carries out the heat conduction heat dissipation to the encapsulation chip, the radiating effect of chip is improved, pin through setting up inserts the board, heat conduction paster and heat conduction stand, can conduct packaging structure circuit connection part's heat through heat conduction paster and heat conduction stand, thereby cool down the heat dissipation to packaging structure, more stable use.
Drawings
Fig. 1 is a schematic diagram of an overall structure of a chip packaging structure and method according to the present invention;
FIG. 2 is a top view of a chip package structure and method of the present invention;
FIG. 3 is a cut-away view of a package base plate, a housing frame and a chip package housing according to the chip package structure and method of the present invention;
FIG. 4 is a top view of a packaged chip and a thermally conductive silver stripe layer of a chip packaging structure and method in accordance with the present invention;
FIG. 5 is a top view of a packaged chip of the chip packaging structure and method of the present invention;
fig. 6 is a bottom view of a chip package structure and method according to the present invention.
In the figure: 1. packaging the base plate; 2. a housing frame; 3. a chip sealing shell; 4. packaging the chip; 5. chip conduction pins; 6. a pin packaging adhesive layer; 7. a pin insertion plate; 8. a conductive circuit board; 9. conducting tin beads; 10. a chip heat-conducting adhesive layer; 11. a thermally conductive silver strip layer; 12. a chip positioning column; 13. positioning the inner groove; 14. performing fool-proof slotting; 15. a heat conducting patch; 16. a thermally conductive column.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1:
as shown in fig. 1-6, the present invention relates to a chip package structure, which comprises a package base plate 1, a housing frame 2 fixedly mounted on the upper surface of the package base plate 1, a chip sealing housing 3 fixedly mounted on the upper surface of the housing frame 2, a package chip 4 fixedly mounted on the upper surface of the package base plate 1 at the inner side of the chip sealing housing 3, a plurality of chip conduction pins 5 fixedly mounted on the lower surface of the package chip 4, a pin packaging adhesive layer 6 disposed on the inner surface of the package base plate 1, a pin insertion plate 7 fixedly mounted on the inner surface of the package base plate 1 at the lower side of the pin packaging adhesive layer 6, a conduction circuit board 8 fixedly mounted on the inner surface of the package base plate 1 at the lower side of the pin insertion plate 7, a plurality of conduction solder beads 9 disposed on the lower surface of the conduction circuit board 8, and a chip heat conduction adhesive layer 10 disposed on the inner surface of the chip sealing housing 3 at the outer side of the package, a heat conducting silver strip layer 11 is arranged inside the chip heat conducting adhesive layer 10, a plurality of chip positioning columns 12 are fixedly arranged on the inner surface of the chip sealing shell 3 and positioned on the outer side of the chip heat conducting adhesive layer 10, a plurality of positioning inner grooves 13 are formed in the upper surface of the packaged chip 4, a foolproof notch 14 is formed in the outer side of the packaging base plate 1, heat conducting patches 15 are fixedly adhered to the two sides, positioned on the pin packaging adhesive layer 6, of the upper surface of the pin inserting plate 7, and heat conducting upright columns 16 are fixedly arranged on the upper surface of the heat conducting patches 15;
the packaging base plate 1, the shell frame 2 and the chip sealing shell 3 are all square in shape, the shell frame 2 is inserted into the internal position of the packaging base plate 1, and the shell frame 2 and the packaging base plate 1 are used for wrapping and fixing a packaging chip 4; the chip conduction pins 5 penetrate through the pin packaging adhesive layer 6 and are inserted into the pin insertion plate 7, the chip conduction pins 5 are arranged in parallel, and the chip conduction pins 5 are inserted into the pin insertion plate 7 for circuit connection; the pin packaging adhesive layer 6 is fixedly connected with the upper surface of the pin insertion plate 7, and the pin insertion plate 7 is fixedly connected with the upper surface of the conduction circuit board 8; the size of the conductive circuit board 8 is smaller than that of the packaging base plate 1, and the lower surface of the conductive circuit board 8 is parallel to the lower surface of the packaging base plate 1; the packaging chip 4 protrudes out of the upper surface of the packaging base plate 1, the chip heat-conducting adhesive layer 10 is wrapped and connected with the packaging chip 4, and the upper surface of the packaging base plate 1 is attached and connected with the chip heat-conducting adhesive layer 10; the chip heat-conducting adhesive layer 10 is connected with the packaged chip 4 through coating, the heat-conducting silver strip layer 11 is positioned above the packaged chip 4, the heat-conducting silver strip layer 11 is attached to and connected with the inner wall of the chip sealing shell 3, and the chip heat-conducting adhesive layer 10 has the effects of fixing and conducting heat to the packaged chip 4; the number of the chip positioning columns 12 is the same as that of the positioning inner grooves 13, and the chip positioning columns 12 are inserted into the inner sides of the positioning inner grooves 13 and are connected in a matched mode; the heat-conducting upright column 16 is located at the inner position of the package base plate 1, and the upper end of the heat-conducting upright column 16 is attached to the chip heat-conducting adhesive layer 10.
Example 2:
on the basis of embodiment 1, a method for using a chip packaging structure includes the following steps:
s1: the packaging base plate 1, the chip sealing shell 3 and the packaging chip 4 are dedusted and placed on a packaging tool, and the pin insertion plate 7 and the conduction circuit board 8 are fixedly connected by the packaging base plate 1 through integral forming or welding;
s2: coating a pin packaging adhesive layer 6 on a pin insertion plate 7 in the packaging base plate 1 to enable the pin packaging adhesive layer 6 to be stacked above the pin insertion plate 7, then putting the packaged chip 4 into the inner side of the packaging base plate 1, simultaneously driving a chip conduction pin 5 below the packaged chip 4 to be inserted into the pin insertion plate 7, enabling the chip conduction pin 5 below the packaged chip 4 and the chip conduction pin 5 to contact the pin packaging adhesive layer 6, and packaging and fixing the packaged chip 4 through adhesion of the pin packaging adhesive layer 6;
s3: coating a chip heat-conducting adhesive layer 10 above a packaged chip 4, simultaneously placing a heat-conducting silver strip layer 11 when the chip heat-conducting adhesive layer 10 is coated, then installing a chip sealing shell 3 above a packaging base plate 1 through a packaging tool, clamping a shell frame 2 below the chip sealing shell 3 into the packaging base plate 1 for positioning, and attaching the chip heat-conducting adhesive layer 10 below the chip sealing shell 3, so that the chip heat-conducting adhesive layer 10 connects the chip sealing shell 3 and the packaged chip 4, and the packaged chip 4 is covered by the chip sealing shell 3 to complete packaging;
s4: the lower part of the conductive circuit board 8 is provided with conductive tin beads 9 through a bead planting process, the packaged chip is connected and installed through the packaging base plate 1 when in use, the packaged chip 4 is in circuit connection with the pin insertion plate 7 and the conductive circuit board 8 through the chip conductive pins 5, and is connected and transmitted with the use equipment through the conductive tin beads 9;
s5: the packaging chip 4 conducts heat to the chip sealing shell 3 through the chip heat conducting adhesive layer 10 when heating, the chip heat conducting adhesive layer 10 increases heat conduction efficiency through the internal heat conducting silver strip layer 11, heat is conducted to the chip sealing shell 3 quickly through the heat of the packaging chip 4, the chip heat conducting adhesive layer 10 is attached to the heat conducting upright post 16, the heat conducting upright post 16 is connected with the pin insertion plate 7 through the heat conducting patch 15, and quick conduction heat dissipation is conducted on the heat sent by the pin insertion plate 7.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A chip packaging structure is characterized in that: including encapsulation bed plate (1), the last fixed surface of encapsulation bed plate (1) installs shell frame (2), the last fixed surface of shell frame (2) installs chip seal shell (3), the inboard position fixed mounting that the upper surface of encapsulation bed plate (1) is located chip seal shell (3) has encapsulation chip (4), the lower fixed surface of encapsulation chip (4) installs a plurality of chip conduction pins (5), the internal surface of encapsulation bed plate (1) is provided with pin encapsulation glue film (6), the internal surface of encapsulation bed plate (1) is located the lower position fixed mounting of pin encapsulation glue film (6) and is inserted board (7) to the pin, the internal surface of encapsulation bed plate (1) is located the lower position fixed mounting that pin inserted board (7) and is had conduction circuit board (8), the lower surface of conduction circuit board (8) is provided with a plurality of conduction tin pearls (9), the outer side position that the internal surface of chip seal shell (3) is located encapsulation chip (4) is provided with chip heat-conducting adhesive layer (10), the inside of chip heat-conducting adhesive layer (10) is provided with heat conduction silver strip layer (11), the outer side position fixed mounting that the internal surface of chip seal shell (3) is located chip heat-conducting adhesive layer (10) has a plurality of chip reference columns (12), a plurality of location inside grooves (13) have been seted up to the upper surface of encapsulation chip (4), prevent that encapsulation bed plate (1) has been seted up and have been prevented slotted (14), heat conduction paster (15) is installed to the equal fixed adhesion in both sides that the upper surface of foot needle inserting plate (7) is located foot needle encapsulation adhesive layer (6), the last fixed surface of heat conduction paster (15) installs heat conduction stand (16).
2. The chip packaging structure according to claim 1, wherein: the shape of encapsulation bed plate (1), shell frame (2) and chip seal shell (3) is the square, shell frame (2) insert to the inside position of encapsulation bed plate (1).
3. The chip packaging structure according to claim 1, wherein: the chip conduction pins (5) penetrate through the pin packaging adhesive layer (6) and are inserted into the inner positions of the pin insertion plates (7), and the chip conduction pins (5) are arranged in parallel.
4. The chip packaging structure according to claim 1, wherein: the pin packaging adhesive layer (6) is fixedly connected with the upper surface of the pin inserting plate (7), and the pin inserting plate (7) is fixedly connected with the upper surface of the conduction circuit board (8).
5. The chip packaging structure according to claim 1, wherein: the size of the conduction circuit board (8) is smaller than that of the packaging base plate (1), and the lower surface of the conduction circuit board (8) is parallel to the lower surface of the packaging base plate (1).
6. The chip packaging structure according to claim 1, wherein: the packaging base plate is characterized in that the packaging chip (4) protrudes out of the upper surface of the packaging base plate (1), the chip heat-conducting adhesive layer (10) is connected with the packaging chip (4) in a wrapping mode, and the upper surface of the packaging base plate (1) is connected with the chip heat-conducting adhesive layer (10) in a laminating mode.
7. The chip packaging structure according to claim 1, wherein: the chip heat-conducting adhesive layer (10) is connected with the packaged chip (4) through smearing, the heat-conducting silver strip layer (11) is located above the packaged chip (4), and the heat-conducting silver strip layer (11) is attached to and connected with the inner wall of the chip sealing shell (3).
8. The chip packaging structure according to claim 1, wherein: the number of the chip positioning columns (12) is the same as that of the positioning inner grooves (13), and the chip positioning columns (12) are inserted into the inner sides of the positioning inner grooves (13) to be connected in a matched mode.
9. The chip packaging structure according to claim 1, wherein: the heat conduction stand column (16) is located at the inner position of the packaging base plate (1), and the upper end of the heat conduction stand column (16) is attached to the chip heat conduction adhesive layer (10).
10. The method for using the chip packaging structure according to claim 1, wherein: the method comprises the following steps:
s1: the packaging base plate (1), the chip sealing shell (3) and the packaging chip (4) are dedusted and placed on a packaging tool, and the packaging base plate (1) is fixedly connected with the pin insertion plate (7) and the conduction circuit board (8) through integral forming or welding;
s2: a pin packaging adhesive layer (6) is coated above a pin insertion plate (7) in the packaging base plate (1), the pin packaging adhesive layer (6) is stacked above the pin insertion plate (7), then a packaging chip (4) is placed to the inner side of the packaging base plate (1), meanwhile, the packaging chip (4) drives a chip conduction pin (5) below to be inserted into the pin insertion plate (7), the lower side of the packaging chip (4) and the chip conduction pin (5) are in contact with the pin packaging adhesive layer (6), and the packaging chip (4) is packaged and fixed through adhesion of the pin packaging adhesive layer (6);
s3: a chip heat-conducting adhesive layer (10) is coated above the packaged chip (4), a heat-conducting silver strip layer (11) is placed when the chip heat-conducting adhesive layer (10) is coated, then a chip sealing shell (3) is installed above the packaging base plate (1) through a packaging tool, a shell frame (2) below the chip sealing shell (3) is clamped into the packaging base plate (1) for positioning, the chip heat-conducting adhesive layer (10) is attached to the lower portion of the chip sealing shell (3), the chip heat-conducting adhesive layer (10) is used for connecting the chip sealing shell (3) and the packaged chip (4), and the packaged chip (4) is covered by the chip sealing shell (3) to complete packaging;
s4: the lower part of the conductive circuit board (8) is used for installing the conductive tin beads (9) through a bead planting process, the packaged chip is connected and installed through the packaging base plate (1) when in use, the packaged chip (4) is in circuit connection with the pin insertion plate (7) and the conductive circuit board (8) through the chip conductive pins (5), and is connected and transmitted with using equipment through the conductive tin beads (9);
s5: the utility model discloses a heat conduction chip packaging structure, including encapsulation chip (4), chip heat conduction glue film (10) are with heat conduction to chip seal shell (3) when using to generate heat, chip heat conduction glue film (10) increase heat conduction efficiency through inside heat conduction silver strip layer (11), make the quick conduction of heat of encapsulation chip (4) dispel the heat to chip seal shell (3), and chip heat conduction glue film (10) laminating heat conduction stand (16), heat conduction stand (16) are inserted board (7) through heat conduction paster (15) and foot needle and are connected, the heat that inserts board (7) and send to the foot needle also carries out quick conduction heat dissipation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010418581.6A CN111696925A (en) | 2020-05-18 | 2020-05-18 | Chip packaging structure and method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010418581.6A CN111696925A (en) | 2020-05-18 | 2020-05-18 | Chip packaging structure and method |
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| CN111696925A true CN111696925A (en) | 2020-09-22 |
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| CN202010418581.6A Pending CN111696925A (en) | 2020-05-18 | 2020-05-18 | Chip packaging structure and method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113013119A (en) * | 2021-03-03 | 2021-06-22 | 同辉电子科技股份有限公司 | LED chip with array structure |
| CN115101480A (en) * | 2022-08-24 | 2022-09-23 | 广东长华科技有限公司 | Thin and light semiconductor packaging structure |
| CN116759392A (en) * | 2023-08-23 | 2023-09-15 | 成都宇熙电子技术有限公司 | SIP encapsulation equipment |
-
2020
- 2020-05-18 CN CN202010418581.6A patent/CN111696925A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113013119A (en) * | 2021-03-03 | 2021-06-22 | 同辉电子科技股份有限公司 | LED chip with array structure |
| CN113013119B (en) * | 2021-03-03 | 2022-07-12 | 同辉电子科技股份有限公司 | LED chip with array structure |
| CN115101480A (en) * | 2022-08-24 | 2022-09-23 | 广东长华科技有限公司 | Thin and light semiconductor packaging structure |
| CN115101480B (en) * | 2022-08-24 | 2022-11-04 | 广东长华科技有限公司 | Thin and light semiconductor packaging structure |
| CN116759392A (en) * | 2023-08-23 | 2023-09-15 | 成都宇熙电子技术有限公司 | SIP encapsulation equipment |
| CN116759392B (en) * | 2023-08-23 | 2023-11-14 | 成都宇熙电子技术有限公司 | SIP encapsulation equipment |
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