CN212876176U

CN212876176U - Paster pasting board structure

Info

Publication number: CN212876176U
Application number: CN202021033081.2U
Authority: CN
Inventors: 常嘉伟; 王霞; 王志伟
Original assignee: Jiangsu Fulanke Information Technology Co ltd
Current assignee: Jiangsu Fulanke Information Technology Co ltd
Priority date: 2020-06-08
Filing date: 2020-06-08
Publication date: 2021-04-02
Anticipated expiration: 2030-06-08

Abstract

The utility model discloses a paster flitch structure, including PCB paster board, the side of PCB paster board is close to the equal fixed mounting in four corners position and has the mounting structure, the fixed the inlaying in middle part of PCB paster board is established and is installed heat dissipation mechanism, the last fixed surface of heat dissipation mechanism installs the LED paster, the upper surface of PCB paster board is located the equal fixed packing in LED paster both sides and is installed and packs soldering tin, the last fixed surface who packs soldering tin sprays has the insulated paint, the last fixed surface of PCB paster board installs the component paster. A paster flitch structure and production technology, can prevent that the wiring point from exposing and leading to into water the short circuit to have good waterproof performance, and fixed point spraying can save more spraying raw and other materials, and can inject through automation equipment and fill soldering tin and carry out fixed connection, install more swift like this, need not manual and press the welding one by one, make the speed of having improved the paster.

Description

Paster pasting board structure

Technical Field

The utility model relates to a paster flitch field, in particular to paster flitch structure.

Background

The surface mounted LED is pasted on the surface of a circuit board, is suitable for SMT processing and can be reflow-welded, the surface mounted LED well solves the problems of brightness, visual angle, flatness, reliability, consistency and the like, compared with other packaging devices, the surface mounted LED has the advantages of strong vibration resistance, low welding spot defect rate, good high-frequency characteristic and the like, more LED chips are packaged on a smaller area, lighter PCB and reflecting layer materials are adopted, less epoxy resin needs to be filled in the reflecting layer, the size is reduced by removing heavier carbon steel material pins, the weight of the product can be easily reduced by half, the volume and the weight are only about 1/10 of the traditional plug-in component, after the surface mount type packaging is adopted, the volume of the electronic product is reduced by 40-60%, the weight is reduced by 60-80%, the application is more perfect, the use power consumption is lower, and the surface mount type packaging method is widely applied to various fields; however, the existing patch pasting board structure and the production process have certain disadvantages when in use, the pins and the exposed wiring end of the joint part cannot be sealed after the patch pasting, and tin is fixed by manpower during the patch pasting, so that the trouble of tin fixing is very high, time and labor are wasted, and the heat dissipation effect of the structure is poor.

SUMMERY OF THE UTILITY MODEL

A primary object of the present invention is to provide a patch board structure, which can effectively solve the problems of the prior art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a patch board structure comprises a PCB patch board, wherein mounting structures are fixedly arranged on the side surface of the PCB patch board close to four corners, the middle part of the PCB patch board is fixedly embedded with a heat dissipation mechanism, the upper surface of the heat dissipation mechanism is fixedly provided with an LED patch, the upper surface of the PCB paster plate is fixedly filled and installed with filling soldering tin at both sides of the LED paster, the upper surface of the filling soldering tin is fixedly sprayed with insulating paint, the upper surface of the PCB paster plate is fixedly provided with an element paster, a first conducting wire card is fixedly arranged on the upper surface of the PCB paster plate close to the edge of one side, a second lead card is fixedly arranged on the upper surface of the PCB patch board below the first lead card, a first butt joint groove is fixedly arranged on one side of the first lead card on the upper surface of the PCB patch board, the upper surface of the PCB paster plate is fixedly provided with a second butt joint groove below the first butt joint groove.

Preferably, the surface of the PCB die attaching plate is provided with a mounting square hole, the upper surface of the PCB die attaching plate is fixedly provided with fixing plates at two sides of the mounting square hole, the inner side surface of each fixing plate is fixedly provided with a contact copper sheet, and the surface of each contact copper sheet is provided with a fixing clamp hole.

Preferably, the mounting structure comprises a mounting elastic sheet and a fixing fixture block, the mounting structure is fixedly connected with the PCB patch board through one end of the mounting elastic sheet, and the fixing fixture block is fixedly mounted on the surface of the mounting elastic sheet close to the other end of the mounting elastic sheet.

Preferably, the heat dissipation mechanism includes alloy aluminum plate, heat conduction silicone grease and radiating fin, alloy aluminum plate's lower fixed surface installs radiating fin, alloy aluminum plate's upper surface has smeared heat conduction silicone grease.

Preferably, the surface of the two sides of the LED patch is fixedly provided with a fixed elastic sheet, the surface of the fixed elastic sheet is fixedly provided with a protruding clamping block, the LED patch is clamped into a fixed clamping hole through the protruding clamping block of the fixed elastic sheet and is fixedly and electrically connected with a contact copper sheet, and the LED patch is fixedly bonded with the alloy aluminum plate through heat conduction silicone grease.

Preferably, a wire clamping groove has all been seted up at the middle part of a wire clamp with No. two wire clamps, the inboard fixed mounting that the upper surface of PCB paster board is located a butt joint recess has anodal contact piece, the inboard fixed mounting that the upper surface of PCB paster board is located No. two butt joint recesses has the negative pole contact piece.

Compared with the prior art, the utility model discloses following beneficial effect has:

in the utility model, the insulating paint is sprayed and arranged, thus the position of the fixed point is positioned for insulating paint spraying and packaging, the short circuit of water inlet caused by the exposed wiring point can be prevented, thereby having excellent waterproof performance, and more spraying raw materials can be saved by fixed point spraying;

through the LED paster that sets up, the LED paster can be in advance with its and PCB paster board laminating chucking, alright carry out the injection through automation equipment after the laminating chucking and fill soldering tin and carry out fixed connection, install more swift like this, need not manual one by one and press the welding, make the speed of paster improved, and the radiating mechanism that is equipped with behind the paster can be better play good cooling effect when using for the component on the paster board.

Drawings

Fig. 1 is a schematic view of the overall structure of a patch pasting board structure of the present invention;

fig. 2 is an enlarged view of a portion a in fig. 1 of a patch panel structure of the present invention;

fig. 3 is a partial cross-sectional view of a patch pasting board structure according to the present invention;

fig. 4 is a partial view of a first wire card of a patch panel structure of the present invention;

fig. 5 is a partial sectional view of a PCB chip board and a mounting structure of a chip board structure according to the present invention;

in the figure: 1. a PCB patch board; 101. installing a square hole; 102. fixing the plate; 103. a contact copper sheet; 2. a mounting structure; 201. installing an elastic sheet; 202. fixing the fixture block; 3. a heat dissipation mechanism; 301. an alloy aluminum plate; 302. heat-conducting silicone grease; 303. a heat dissipating fin; 4. LED surface mounting; 401. fixing the elastic sheet; 402. a convex clamping block; 5. filling soldering tin; 6. insulating paint; 7. element pasting; 8. a first wire card; 801. a wire clamp groove; 9. a second conductor clamp; 10. a first butt joint groove; 1001. a positive electrode contact piece; 11. a second butt joint groove; 1101. a negative contact tab.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in FIGS. 1-5, a patch pasting board structure comprises a PCB pasting board 1, wherein mounting structures 2 are fixedly mounted on the side surface of the PCB pasting board 1 near four corners, a heat dissipation mechanism 3 is fixedly embedded in the middle of the PCB pasting board 1, an LED patch 4 is fixedly mounted on the upper surface of the heat dissipation mechanism 3, filling soldering tin 5 is fixedly filled and mounted on the upper surface of the PCB pasting board 1 at two sides of the LED patch 4, insulating paint 6 is fixedly sprayed on the upper surface of the filling soldering tin 5, an element patch 7 is fixedly mounted on the upper surface of the PCB pasting board 1, a first lead card 8 is fixedly mounted on the upper surface of the PCB pasting board 1 near one side edge, a second lead card 9 is fixedly mounted below the first lead card 8 on the upper surface of the PCB pasting board 1, a first butt-joint groove 10 is fixedly mounted on one side of the first lead card 8 on the upper surface of the PCB pasting board 1, a second butt joint groove 11 is fixedly arranged on the upper surface of the PCB patch board 1 below the first butt joint groove 10;

the surface of the PCB patch board 1 is provided with a mounting square hole 101, the upper surface of the PCB patch board 1 is fixedly provided with fixed plates 102 at two sides of the mounting square hole 101, the inner side surface of each fixed plate 102 is fixedly provided with a contact copper sheet 103, and the surface of each contact copper sheet 103 is provided with a fixing clamping hole; the mounting structure 2 comprises a mounting elastic sheet 201 and a fixing fixture block 202, the mounting structure 2 is fixedly connected with the PCB patch board 1 through one end of the mounting elastic sheet 201, and the fixing fixture block 202 is fixedly mounted on the surface of the mounting elastic sheet 201 close to the other end; the heat dissipation mechanism 3 comprises an alloy aluminum plate 301, heat-conducting silicone grease 302 and heat dissipation fins 303, wherein the heat dissipation fins 303 are fixedly mounted on the lower surface of the alloy aluminum plate 301, and the heat-conducting silicone grease 302 is coated on the upper surface of the alloy aluminum plate 301; the LED patch 4 is fixedly provided with fixing elastic pieces 401 on the surfaces of two sides, the surface of each fixing elastic piece 401 is fixedly provided with a protruding fixture block 402, the LED patch 4 is clamped into a fixing fixture hole through the protruding fixture block 402 of each fixing elastic piece 401 to be fixedly and electrically connected with the contact copper sheet 103, the LED patch 4 is fixedly bonded with the alloy aluminum plate 301 through the heat conduction silicone grease 302, the LED patch 4 arranged on the LED patch 4 can be attached and clamped with the PCB patch plate 1 in advance, and after the LED patch 4 is attached and clamped, the injection filling soldering tin 5 can be fixedly connected through automatic equipment, so that the mounting is more rapid, manual pressing and welding are not needed, the speed of the patch is increased, and the heat dissipation mechanism 3 arranged after the patch can better play a good cooling effect when used for elements on the patch panel; wire clamping grooves 801 are formed in the middle of the first wire clamp 8 and the second wire clamp 9, a positive contact piece 1001 is fixedly mounted on the inner side, located in the first butt joint groove 10, of the upper surface of the PCB patch board 1, and a negative contact piece 1101 is fixedly mounted on the inner side, located in the second butt joint groove 11, of the upper surface of the PCB patch board 1.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A patch flitch plate structure is characterized in that: the LED packaging structure comprises a PCB (printed circuit board) patch board (1), wherein a mounting structure (2) is fixedly mounted on the side surface of the PCB patch board (1) close to the four corners, a heat dissipation mechanism (3) is fixedly embedded in the middle of the PCB patch board (1), an LED patch (4) is fixedly mounted on the upper surface of the heat dissipation mechanism (3), filling soldering tin (5) is fixedly mounted on the two sides of the LED patch (4) on the upper surface of the PCB patch board (1), insulating paint (6) is sprayed on the upper surface of the filling soldering tin (5), an element patch (7) is fixedly mounted on the upper surface of the PCB patch board (1), a first wire clamp (8) is fixedly mounted on the upper surface of the PCB patch board (1) close to the edge of one side, a second wire clamp (9) is fixedly mounted on the lower surface of the PCB patch board (1) close to the edge of one side, one side fixed mounting that the upper surface of PCB paster board (1) is located a conductor clamp (8) has a butt joint recess (10) No. one, the below fixed mounting that the upper surface of PCB paster board (1) is located a butt joint recess (10) has No. two butt joint recesses (11).

2. A patch panel construction according to claim 1 wherein: the PCB is characterized in that a mounting square hole (101) is formed in the surface of the PCB patch board (1), fixing plates (102) are fixedly mounted on the two sides, located in the mounting square hole (101), of the upper surface of the PCB patch board (1), contact copper sheets (103) are fixedly mounted on the inner side faces of the fixing plates (102), and fixing clamp holes are formed in the surface of the contact copper sheets (103).

3. A patch panel construction according to claim 1 wherein: the mounting structure (2) comprises a mounting elastic sheet (201) and a fixed clamping block (202), one end of the mounting structure (2) is fixedly connected with the PCB attaching sheet plate (1) through the mounting elastic sheet (201), and the surface of the mounting elastic sheet (201) is close to the other end and is fixedly provided with the fixed clamping block (202).

4. A patch panel construction according to claim 2 wherein: heat dissipation mechanism (3) include alloy aluminum plate (301), heat conduction silicone grease (302) and radiating fin (303), the lower fixed surface of alloy aluminum plate (301) installs radiating fin (303), heat conduction silicone grease (302) have been paintd to the upper surface of alloy aluminum plate (301).

5. A patch panel construction according to claim 4 wherein: the LED patch is characterized in that fixed elastic pieces (401) are fixedly mounted on the surfaces of two sides of the LED patch (4), protruding clamping blocks (402) are fixedly mounted on the surface of each fixed elastic piece (401), the LED patch (4) is clamped into the fixing clamping holes through the protruding clamping blocks (402) of the fixed elastic pieces (401) and is fixedly and electrically connected with the contact copper sheets (103), and the LED patch (4) is fixedly bonded with the alloy aluminum plate (301) through the heat conduction silicone grease (302).

6. A patch panel construction according to claim 1 wherein: wire draw-in groove (801) have all been seted up to a conductor card (8) with the middle part of No. two conductor card (9), the inboard fixed mounting that the upper surface of PCB paster board (1) is located a butt joint recess (10) has anodal contact piece (1001), the inboard fixed mounting that the upper surface of PCB paster board (1) is located No. two butt joint recesses (11) has negative pole contact piece (1101).