CN212211815U - Heat dissipation device and controller of power device - Google Patents

Heat dissipation device and controller of power device Download PDF

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CN212211815U
CN212211815U CN202021361125.4U CN202021361125U CN212211815U CN 212211815 U CN212211815 U CN 212211815U CN 202021361125 U CN202021361125 U CN 202021361125U CN 212211815 U CN212211815 U CN 212211815U
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heat dissipation
pcb
heat
heat dissipating
board surface
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刘锦晨
任新杰
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Guangdong Meizhi Compressor Co Ltd
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Guangdong Meizhi Compressor Co Ltd
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Abstract

The application provides a heat dissipation device and a controller of a power device, wherein the heat dissipation device of the power device comprises a PCB (printed circuit board), a heat dissipation box and a heat conduction gasket; the PCB is provided with a first board surface and a second board surface which are opposite to each other, the first board surface is provided with a heating area for integrated installation of a power device, the second board surface is provided with a heat dissipation area corresponding to the heating area, the PCB is provided with a heat dissipation through hole, and the heat dissipation through hole is arranged in the heating area and penetrates through the first board surface and the second board surface; the heat dissipation box comprises a box body, and the box body is provided with an accommodating cavity for accommodating the PCB; the heat conduction gasket is attached to the heat dissipation area, and the PCB is connected with the inner wall surface of the box body through the heat conduction gasket. The heat dissipation device of the power device is simple in structure, convenient to produce and assemble and capable of effectively improving the heat dissipation effect.

Description

Heat dissipation device and controller of power device
Technical Field
The application belongs to the technical field of controllers, and particularly relates to a heat dissipation device of a power device and a controller.
Background
In the practical application of the conventional low-voltage high-power controller, because the current passing through the controller is usually very large, in a circuit of the controller adopting the surface mount of the power device, the power device generates a large amount of heat due to the switching loss generated by the on-off state of the high-frequency power device, and also generates a large amount of heat due to the internal resistance and the large current generated by the conduction loss during normal conduction. Under the condition, if the heat cannot be dissipated in time, on one hand, the working safety area of the power device is greatly reduced, and further the power device is caused to work in a damaged area and fail; on the other hand, poor heat dissipation can increase the surface temperature of the PCB, and over-high temperature can cause the circuit layer to burn, so the heat dissipation problem of the power device is very important. However, the power devices in the industry currently use TOP-247 packaging or D2PARK packaging; in the TOP-247 packaging mode, the power device mainly radiates heat through the iron cover, and although a good radiating effect can be achieved, the mode needs manual operation, is complex in production and low in efficiency; in the D2PARK package method, the power device usually adopts a bottom surface mount heat dissipation method, but this heat dissipation method requires a secondary die bonding, a reflow oven, and a solder carrier during wave soldering, and furthermore, the MOS (metal-oxide semiconductor) used in the package method also has a relatively large internal resistance and a general heat dissipation effect.
SUMMERY OF THE UTILITY MODEL
An object of the embodiment of the present application is to provide a heat dissipation apparatus for a power device, so as to solve the technical problems existing in the prior art that the power device in a controller is inconvenient to produce and assemble and has a poor heat dissipation effect.
In order to achieve the purpose, the technical scheme adopted by the application is as follows: provided is a heat dissipation device of a power device, including:
the PCB is provided with a first board surface and a second board surface which are opposite to each other, the first board surface is provided with a heating area for integrated installation of a power device, the second board surface is provided with a heat dissipation area corresponding to the heating area, the PCB is provided with a plurality of heat dissipation through holes, and the heat dissipation through holes are arranged in the heating area and penetrate through the first board surface and the second board surface;
the heat dissipation box comprises a box body, and the box body is provided with an accommodating cavity for accommodating the PCB; and the number of the first and second groups,
the heat conduction gaskets are attached to the heat dissipation area, and the PCB is connected with the inner wall surface of the box body through the heat conduction gaskets.
Optionally, two opposite inner walls of the box body are respectively provided with a guide groove, and two opposite edges of the PCB are disposed in the guide grooves of the corresponding sides.
Optionally, a plurality of heat dissipation bosses are convexly arranged on the inner wall surface of the box body opposite to the second board surface, each heat dissipation boss corresponds to one heat conduction gasket in position, and the other surface of the heat conduction gasket, which is deviated from the PCB board, is attached to the top end surface of the heat dissipation boss.
Optionally, a stud protruding towards the inner wall surface of the box body is arranged on the second board surface, and the PCB is fixedly connected with the box body by penetrating through the box body through a screw and then being screwed with the stud.
Optionally, the box body is provided with two open ends, and a plurality of radiating fins arranged in parallel at intervals are arranged on the peripheral side surface of the box body.
Optionally, the heat dissipation box further comprises two end covers respectively covering the two ends of the box body, wherein one end cover is provided with a wire passing hole.
Optionally, a sealing member is sandwiched between the open edge of the box body and the end cover on the corresponding side.
Optionally, the heat conducting gasket is provided with a back adhesive layer, and the heat conducting gasket is bonded to the heat dissipation area of the second board surface through the back adhesive layer.
Optionally, a heat dissipation pad is disposed on the PCB, and the power device is soldered to the PCB through the heat dissipation pad.
The present application also proposes a controller comprising a heat dissipation device of a power device as described above.
The application provides a heat abstractor and controller of power device's beneficial effect lies in: compared with the prior art, in the heat dissipation device of the power device, because a plurality of power devices which can generate a large amount of heat are arranged on the heating area of the first board surface of the PCB board, a plurality of heat dissipation through holes are arranged on the PCB board, and a heat-conducting gasket is adhered on the heat dissipation area corresponding to the position of the heating area on the second board surface, the PCB board can be connected with the inner wall surface of the box body of the heat dissipation box through the heat conduction gasket, so that when in actual use, a large amount of heat generated by a plurality of power devices on the first board surface can be transferred to the second board surface through the PCB board and the heat dissipation through holes, particularly to the heat dissipation area of the second board surface, then, the heat on the second plate surface can be transferred out through the heat-conducting gasket and the whole heat-radiating box, therefore, the heat dissipation device has a better heat dissipation effect, and has the advantages of simple structure, convenience in assembly, high production efficiency, good sealing effect and the like.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of a heat dissipation apparatus of a power device according to an embodiment of the present disclosure;
fig. 2 is an exploded view of a heat dissipation device of a power device according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a heat dissipation device of a power device provided in an embodiment of the present application, where an end cover at one end is removed;
fig. 4 is a schematic structural diagram of an end cover of a heat dissipation apparatus of a power device according to an embodiment of the present application.
The reference numbers illustrate:
Figure BDA0002579905660000031
Figure BDA0002579905660000041
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It should be noted that the terms of orientation such as left, right, up and down in the embodiments of the present application are only relative to each other or are referred to the normal use state of the product, and should not be considered as limiting.
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present application and should not be construed as limiting the present application.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
The embodiment of the application provides a heat dissipation device of a power device.
Referring to fig. 1 to 3, the heat dissipation apparatus of the power device includes a PCB 100, a heat dissipation box 200 and a thermal pad 300, wherein the PCB 100 has a first board surface 110 and a second board surface 120 opposite to each other, the first board surface 110 is provided with a heating area 111 for integrally mounting the power device 400, the second board surface 120 is provided with a heat dissipation area corresponding to the heating area 111, the PCB 100 is provided with a heat dissipation via hole, and the heat dissipation via hole is disposed in the heating area 111 and penetrates through the first board surface 110 and the second board surface 120; the heat dissipation case 200 includes a case body 210, the case body 210 having a receiving cavity 240 for receiving the PCB board 100; the heat conductive pad 300 is attached to the heat dissipation area, and the PCB 100 is connected to the inner wall surface of the case 210 through the heat conductive pad 300.
Based on the structural design, in the embodiment, since the plurality of power devices 400 capable of generating a large amount of heat are mounted on the heating area 111 of the first board surface 110 of the PCB 100, the PCB 100 is provided with the plurality of heat dissipating through holes, and the heat dissipating area corresponding to the heating area 111 on the second board surface 120 is attached with the heat conductive gasket 300, and the PCB 100 is connected to the inner wall surface of the box body 210 of the heat dissipating box 200 through the heat conductive gasket 300, in practical use, a large amount of heat generated by the plurality of power devices 400 on the first board surface 110 can be transferred to the second board surface 120 through the PCB 100 and the heat dissipating through holes, especially to the heat dissipating area of the second board surface 120, and then the heat on the second board surface 120 can be transferred out through the heat conductive gasket 300 and the whole heat dissipating box 200, thereby having a better heat dissipating effect.
It should be noted that, in the present application, a single-sided surface-mount device process is adopted for the production and assembly of the PCB board 100, which has the advantages of simple production, convenience and high efficiency, and in order to reduce the heat generation amount, the power device 400 preferably adopts a top-layer-packaged NMOS (N-Metal-Oxide-Semiconductor), a certain distance is kept between the plurality of power devices 400, the plurality of power devices 400 are intensively arranged on the same line or a plurality of lines, a certain area including the line is the heat generation area 111, and the heat generation area 111 can be provided in a plurality, of course, other heat generation devices such as a sampling resistor, an MCU and the like are also intensively arranged in the heat generation area 111. The heating area 111 provided with the power device 400 is connected with the corresponding heat dissipation area through the heat dissipation via hole. In addition, in the present embodiment, a heat dissipation pad is disposed on the PCB board 100, and the power device 400 is soldered on the PCB board 100 through the heat dissipation pad.
Referring to fig. 3, in the present embodiment, two opposite inner walls of the case 210 are respectively provided with a guide groove 211, and two opposite outer edges of the PCB 100 slide into the guide grooves 211 of the corresponding sides. In actual installation, the assembled PCB 100 can be directly slid into the guide groove 211, so that the assembly process is very convenient, and the production efficiency is improved.
Further, referring to fig. 3, in the present embodiment, a plurality of heat dissipation bosses 212 are convexly disposed on an inner wall surface of the case 210 opposite to the second board surface 120, each heat dissipation boss 212 corresponds to a heat conducting gasket 300, and the other surface of the heat conducting gasket 300 departing from the PCB 100 is attached to a top end surface of the heat dissipation boss 212. Here, after the PCB 100 is assembled, the second board surface 120 has a certain distance with respect to the inner wall surface of the case 210, and after the heat dissipation boss 212 is disposed, the heat dissipation boss 212 is tightly attached to the heat dissipation area of the PCB 100 through the heat conductive gasket 300, thereby facilitating the improvement of the heat dissipation effect. In the present embodiment, the number of the heat generating regions 111, the heat conducting pads 300 and the heat dissipating bosses 212 is two, but it is understood that the number may be one or more than two in other embodiments, which is not limited herein. Preferably, the width of the heat dissipation boss 212 is respectively consistent with the width of the heat generation region 111 and the width of the heat conductive gasket 300, so as to maximize the effective contact area between the PCB 100 and the heat dissipation box 200 and improve the heat dissipation effect.
Further, as shown in fig. 3, in the present embodiment, the second plate surface 120 is provided with a stud 130 protruding toward the inner wall surface of the box 210, and the PCB 100 is screwed with the stud 130 after passing through the box 210 by a screw, so as to realize the fixed connection with the box 210. It is understood that the width of the guiding groove 211 is generally larger than the thickness of the PCB 100 for easy installation, but this may cause the PCB 100 to easily shake after being installed in the heat dissipating box 200, and the connection of the PCB 100 in the box 210 may be more stable by the way that the screw penetrates through the box 210 and is screwed with the stud 130. However, the design is not limited thereto, and the fixing and connecting manner of the case 210 and the PCB 100 is not limited to screwing, etc.
Further, referring to fig. 2 and fig. 3, in the present embodiment, the box body 210 is provided with two open ends, and a plurality of heat dissipation fins 212 arranged in parallel at intervals are disposed on the outer circumferential surface of the box body 210. Specifically, the box body 210 is rectangular, the heat dissipation box 200 is preferably made of an aluminum alloy material with a good heat conduction effect, and the length extending direction of the heat dissipation fins 212 is consistent with the length direction of the box body 210. Thus, after the heat dissipation fins 212 are disposed on all four sides of the box 210, the heat dissipation area can be greatly increased, and the heat dissipation effect can be enhanced.
Referring to fig. 3, in the present embodiment, the heat dissipation box 200 further includes two end caps 220 respectively covering the two ends of the box body 210, wherein one of the end caps 220 is provided with a wire passing hole 221. Thus, after the two end caps 220 are connected with the box body 210, a box structure with four closed sides can be formed, which is beneficial to the sealing effect of the heat dissipation box 200, and meanwhile, the plurality of lead wires connected with the PCB 100 can be conveniently led out by arranging the plurality of wire passing holes 221 on one end cap 220.
Further, as shown in fig. 1 and 2, in the present embodiment, a sealing member 230 is interposed between the open edge of the box body 210 and the end cap 220 on the corresponding side. The sealing member 230 may be, but is not limited to, a sealing rubber sheet, etc., and thus, the sealing effect of the heat dissipation case 200 may be further improved.
Referring to fig. 3, in the present embodiment, the thermal pad 300 is provided with a back adhesive layer, and the thermal pad 300 is adhered to the heat dissipation area of the second board 120 through the back adhesive layer. Thus, the bonding of the thermal pad 300 can be conveniently achieved. In addition, the heat conductive pad 300 is preferably made of a material having a large thermal conductivity, a high compression ratio and a high viscosity, and the thickness of the heat conductive pad 300 is designed to be as thin as possible in order to reduce thermal resistance, while satisfying the requirement of flattening small bumps on the bottom surface of the PCBA. During assembly, the heat dissipation area to which the thermal pad 300 is to be attached may be drawn on the second board surface 120 of the PCB 100 in advance, so as to facilitate the convenient and fast attachment of the thermal pad 300. The PCB 100 with the thermal pad 300 attached thereto may be mounted in the heat dissipation case 200 in an inverted manner.
In summary, the whole process of mounting the PCB on the PCB 100 by SMT or by DIP package is abbreviated as PCBA (Printed Circuit Board Assembly). In the present application, since only one SMT (Surface mount Technology) and HI process is required in the manufacturing process of the PCBA, no solder carrier is required; after the PCBA is manufactured, the thermal pad 300 with adhesive is attached to the heat dissipation area of the second board surface 120 of the PCB 100, so that the PCB 100 can be conveniently installed in the guide groove 211 of the heat dissipation case 200 in an inverted manner, and then the screw is screwed from the bottom of the heat dissipation case 200 to the screw seat of the PCB 100. According to the process, the heat dissipation device of the power device has the advantages of simple production, convenience in assembly, good heat dissipation effect and good sealing effect.
The present application further provides a controller, where the controller includes a heat dissipation device of a power device, and the specific structure of the heat dissipation device of the power device refers to the above embodiments, and since the controller adopts all technical solutions of all the above embodiments, the controller also has all beneficial effects brought by the technical solutions of the above embodiments, and details are not repeated here.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (10)

1. A heat dissipating apparatus for a power device, comprising:
the PCB is provided with a first board surface and a second board surface which are opposite to each other, the first board surface is provided with a heating area for integrated installation of a power device, the second board surface is provided with a heat dissipation area corresponding to the heating area, the PCB is provided with a heat dissipation through hole, and the heat dissipation through hole is arranged in the heating area and penetrates through the first board surface and the second board surface;
the heat dissipation box comprises a box body, and the box body is provided with an accommodating cavity for accommodating the PCB; and the number of the first and second groups,
the heat conduction gasket is attached to the heat dissipation area, and the PCB is connected with the inner wall surface of the box body through the heat conduction gasket.
2. The heat dissipating device for power devices as claimed in claim 1, wherein the case has a guide groove formed on each of two opposite inner walls thereof, and two opposite edges of the PCB are disposed in the guide grooves on the corresponding sides.
3. The heat dissipating device for a power device according to claim 2, wherein a plurality of heat dissipating bosses are convexly provided on an inner wall surface of the case body opposite to the second board surface, each heat dissipating boss corresponds to one heat conducting pad, and another surface of the heat conducting pad facing away from the PCB is attached to a top end surface of the heat dissipating boss.
4. The heat dissipating device for a power device according to claim 3, wherein a stud protruding toward an inner wall surface of the case is provided on the second board surface, and the PCB is fixedly connected to the case by being screwed to the stud after passing through the case with a screw.
5. The heat dissipating device for a power device as claimed in claim 1, wherein the case has two open ends, and a plurality of fins are disposed on the outer peripheral side of the case.
6. The heat dissipating device for power devices according to claim 5, wherein the heat dissipating box further comprises two end caps covering the openings at the two ends of the box body, respectively, wherein one of the end caps is provided with a wire passing hole.
7. The heat dissipating device for power devices as claimed in claim 6, wherein a sealing member is interposed between the open edge of the box body and the end cap on the corresponding side.
8. The heat dissipating device for power devices as claimed in any one of claims 1 to 7, wherein the thermal pad is provided with a backing layer, and the thermal pad is bonded to the heat dissipating region of the second board surface through the backing layer.
9. The heat dissipating device for power devices as claimed in any one of claims 1 to 7, wherein a heat dissipating pad is provided on the PCB, and the power device is soldered to the PCB via the heat dissipating pad.
10. A controller comprising the heat dissipating device of the power device according to any one of claims 1 to 9.
CN202021361125.4U 2020-07-10 2020-07-10 Heat dissipation device and controller of power device Active CN212211815U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115579714A (en) * 2022-11-17 2023-01-06 济南邦德激光股份有限公司 Laser device heat abstractor and laser device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115579714A (en) * 2022-11-17 2023-01-06 济南邦德激光股份有限公司 Laser device heat abstractor and laser device
CN115579714B (en) * 2022-11-17 2023-03-10 济南邦德激光股份有限公司 Laser device heat abstractor and laser device

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