CN115101480B - Thin and light semiconductor packaging structure - Google Patents
Thin and light semiconductor packaging structure Download PDFInfo
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- CN115101480B CN115101480B CN202211017195.1A CN202211017195A CN115101480B CN 115101480 B CN115101480 B CN 115101480B CN 202211017195 A CN202211017195 A CN 202211017195A CN 115101480 B CN115101480 B CN 115101480B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- Condensed Matter Physics & Semiconductors (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- General Details Of Gearings (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention relates to a semiconductor packaging structure with light and thin thickness, which comprises a chip carrier, a sealing cover, pins and a chip, wherein the chip is fixedly arranged on the upper surface of the chip carrier; the sealing cover can seal the chip arranged on the surface of the chip carrier, so that the chip is protected, when the insertion column fixedly arranged at the bottom of the sealing cover is inserted into the insertion groove on the surface of the chip carrier, the sealing cover is arranged outside the chip at the moment, the insertion column is fixed inside the insertion groove by the limiting mechanism, the sealing cover is prevented from being separated from the surface of the chip carrier, so that the connection between the chip carrier and the sealing cover is firmer, and the effects of moisture prevention, water prevention and the like of the chip are better.
Description
Technical Field
The invention belongs to the technical field of semiconductors, and particularly relates to a thin and light semiconductor packaging structure.
Background
Semiconductors have applications in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power conversion, and the like; the semiconductor package structure is formed by fixing a chip (or wafer) on a corresponding chip carrier, and coating a layer of packaging colloid for protection on the chip and the chip carrier after the chip and the chip carrier are electrically connected as necessary to avoid the pollution of liquid, dust and gas in the environment to the internal circuit; however, for the high-power semiconductor package structure, the internal power device is easy to generate heat during operation, and if the heat cannot be effectively transferred to the outside of the semiconductor package structure in time, the accumulated heat will greatly affect the performance of the chip during operation, thereby affecting the reliability of the semiconductor package structure, and at the same time, there is a problem that the chip is not convenient to detach.
However, if a thin shell is adopted as the packaging structure of the chip, the heat dissipation performance of the packaging structure can be greatly improved, but the shock resistance of the packaging shell can be greatly reduced, and then the chip is likely to be damaged when the chip is vibrated in the transportation and use processes.
Disclosure of Invention
The present invention is directed to provide a semiconductor package structure with simple structure and reasonable design to solve the above problems.
The invention realizes the purpose through the following technical scheme:
the utility model provides a frivolous semiconductor package structure of thickness, includes chip carrier, sealed cowling, pin and chip, chip fixed mounting is at the upper surface of chip carrier, and the outside at the chip is established to the sealed cowling cover, the last fixed surface of chip carrier is equipped with the pin, and the pin is close to the one end of chip and is connected with the chip through carrying-on line, and the pin is close to one section of chip and flushes with chip carrier upper surface place plane, the fixed inserting groove that is equipped with of bottom of sealed cowling, the inserting groove corresponding with the inserting groove is seted up to the upper surface of chip carrier, the inside of chip carrier is equipped with fixes the inserting groove at the inside stop gear of inserting groove with the inserting groove.
In actual operation, the sealing cover can play a role in sealing a chip arranged on the surface of a chip carrier, so that the chip is protected, when the insertion column fixedly arranged at the bottom of the sealing cover is inserted into the insertion groove on the surface of the chip carrier, the sealing cover is arranged outside the chip, in order to ensure that the insertion of the insertion column and the insertion groove is firmer, namely the sealing property between the sealing cover and the chip carrier is better, the insertion column is fixed inside the insertion groove through the limiting mechanism, so that the sealing cover is prevented from being separated from the surface of the chip carrier, the connection between the chip carrier and the sealing cover is firmer, and the effects of moisture protection, water prevention and the like of the chip are better.
As a further optimization scheme of the invention, the limiting mechanism comprises a limiting groove, an accommodating groove, a lower pressing column and a wedge-shaped limiting block, the limiting groove is positioned on the side wall of the inserting column, the accommodating groove is formed in the position, corresponding to the limiting groove, in the chip carrier, the bottom of the accommodating groove is fixedly connected with one end of the wedge-shaped limiting block through a compression spring, the tip of the wedge-shaped limiting block faces the limiting groove, the inclined surface of the wedge-shaped limiting block is arranged downwards, the lower pressing column is fixedly arranged at the position, close to the side wall of the inserting column, of the bottom of the limiting groove, the top of the lower pressing column is subjected to smoothing treatment, one end, far away from the limiting groove, of the wedge-shaped limiting block is fixedly connected with one end of the pull rope, the other end of the pull rope penetrates out of the bottom of the accommodating groove to be fixedly connected with the pulling mechanism, and the pulling mechanism drives the wedge-shaped limiting block to move towards the direction close to the bottom of the accommodating groove.
In practical operation, when the pulling mechanism does not pull one end of the wedge-shaped limiting block through the pull rope, the wedge-shaped limiting block extends out of the outer port of the accommodating groove under the action of a compression spring fixedly connected with the wedge-shaped limiting block, the tip of the wedge-shaped limiting block extends into the limiting groove, so that the effect of limiting the inserting column is achieved, the inserting column is prevented from being separated from the inside of the inserting groove, meanwhile, the wedge-shaped limiting block gradually extends into the limiting groove, meanwhile, the inclined plane at the bottom of the wedge-shaped limiting block gradually extrudes the top of the downward pressing column and extrudes the downward pressing column, the inserting column moves downward in the inserting groove, the sealing cover is pressed downward on the top surface of the chip carrier, and the sealing performance between the chip carrier and the sealing cover is good;
when the sealing cover needs to be detached from the surface of the chip carrier, namely, when the chip needs to be taken out for replacement or maintenance, one end of the pull rope can be pulled by the pulling mechanism, the other end of the pull rope can drive the wedge-shaped limiting block to contract towards the inside of the accommodating groove, the wedge-shaped limiting block is accommodated in the accommodating groove and separated from the inside of the limiting groove, the wedge-shaped limiting block does not limit the inserting column any more, the inserting column can be easily taken out from the inside of the inserting groove, and the sealing cover can be detached;
the limiting mechanism and the sealing cover are arranged, so that the sealing performance between the chip carrier and the sealing cover is good, the chip is protected, the dismounting is more convenient compared with the traditional glue sealing, and the chip carrier, the sealing cover and the chip cannot be damaged during the dismounting, so that the chip carrier, the sealing cover and the chip can be repeatedly used, and the environmental protection and the sustainable development are facilitated.
As a further optimization scheme of the invention, the pulling mechanism comprises a threaded column, a threaded groove, a rotary groove body, a rotary piece and a slot body, wherein the rotary groove body is positioned at the central position of the bottom of the chip carrier, the threaded groove is formed in the bottom of the rotary groove body, the threaded groove is in threaded connection with the threaded column, one end of the threaded column, facing the rotary groove body, is fixedly connected with the surface of the rotary piece, the center of the rotary piece is overlapped with the central axis of the threaded column, the slot body is formed in one surface of the rotary piece, which is far away from the threaded column, and the other end of a pull rope fixedly connected with the wedge-shaped limiting block enters the interior of the rotary groove body and is fixedly connected with the side edge of the rotary piece.
Accomodate the wedge stopper in the inside of accomodating the groove at actual need, can adopt the bottle opener to stretch into the inside of inserting the groove body this moment, then drive the rotation of rotating member through the bottle opener, will pull the one end of the stay cord that links firmly with the wedge stopper when the rotating member pivoted, and then the tensile one end of keeping away from the wedge stopper will be convoluteed gradually at the outward flange of rotatory groove body, and the other end of stay cord will drive the wedge stopper and accomodate the inside of accomodating the groove.
As a further optimization scheme of the invention, the bottom of the insertion groove is fixedly provided with a spring piece which is of an oval structure, and when the upper surface of the chip carrier is in contact with the bottom of the sealing cover, the spring piece is in a compression deformation state.
It is specific, when the grafting post was pegged graft with the inserting groove, the spring leaf will receive the extrusion and warp, and the wedge stopper is fixed the position of grafting post again, and then the spring leaf props the grafting post in the inside of inserting groove tightly, make the installation of grafting post more firm, and after wedge stopper is relieved spacingly to the grafting post, the spring leaf will kick-back under self elasticity this moment, and drive the grafting post and shift up, the sealed cowling at grafting capital portion will break away from the upper surface of chip carrier automatically this moment, be convenient for take off the sealed cowling from the surface of chip carrier.
As a further optimization scheme of the invention, the sealing cover comprises hollow upright posts and a top cover, the hollow upright posts are of a cylindrical tubular structure with a sealed bottom and an open top, the hollow upright posts are provided with a plurality of groups, the outer edges of the groups of hollow upright posts are fixedly connected with each other to form a rectangular frame structure, the top cover is fixedly arranged inside the rectangular frame structure, the hollow upright posts and the top cover form a rectangular groove structure integrally and cover the outer side of the chip, a heat dissipation mechanism for dissipating heat inside the sealing cover is arranged inside the hollow upright posts, the outer edges of the hollow upright posts, which are far away from the top cover, are provided with heat dissipation through grooves, and the heat dissipation through grooves are not communicated with the inside of the rectangular groove body.
When the sealing cover is actually used, the supporting frame of the sealing cover is formed by the plurality of groups of hollow stand columns, the supporting strength of the hollow stand columns is high, so that the sealing cover is high in impact resistance, the wall thickness of the hollow stand columns is still high in supporting strength under the condition that the wall thickness of the hollow stand columns is thin, the heat dissipation performance inside the sealing cover can be increased by reducing the wall thickness of the hollow stand columns, and the mode can not cause the poor impact resistance of the sealing cover.
As a further optimization scheme of the invention, the heat dissipation mechanism comprises heat transfer blades, a disc-shaped sliding cavity, a sliding disc and a vertical rotating rod, the vertical rotating rod is vertically arranged at the center position inside the hollow upright post, the heat transfer blades are uniformly arranged on the outer edge of the vertical rotating rod, the bottom end of the vertical rotating rod extends into the disc-shaped sliding cavity at the bottom of the hollow upright post and is fixedly connected with the top center of the sliding disc inside the disc-shaped sliding cavity, the disc-shaped sliding cavity and the sliding disc are mutually connected in a sliding manner, the side edge of the sliding disc is uniformly provided with balls, and rotating mechanisms for driving the vertical rotating rod to rotate are arranged inside the hollow upright post and the top cover.
When the heat dissipation device is in actual use, the heat inside the sealing cover can be transferred to the inside of the hollow upright post through the hollow upright post, the heat transfer blade inside the hollow upright post can play a good heat dissipation effect, the area temperature close to the top cover inside the hollow upright post can be higher, the area temperature far away from the top cover inside the hollow upright post can be relatively lower, when the heat transfer blade is located in the high-temperature area inside the hollow upright post for a period of time, the heat in the high-temperature area of the hollow upright post can be transferred to the heat transfer blade, then the heat transfer blade moves to the low-temperature area inside the hollow upright post, the transferred heat on the heat transfer blade can be released at the moment, and the heat dissipation through groove is formed in the edge far away from the top cover on the hollow upright post, so that the heat on the heat transfer blade in the low-temperature area inside the hollow upright post can be further dissipated, the rotating mechanism drives the heat transfer blade to rotate inside the hollow upright post, the effect of 'carrying' in the direction close to the top cover, namely the heat inside the sealing cover is achieved, then the heat can be transferred to the outside at the position close to the heat dissipation through groove, and the effect of dissipating inside the sealing cover can be achieved.
As a further optimization scheme of the invention, the rotating mechanism comprises a transmission circular gear disc, fan blades, a rotating shaft, a driving circular gear disc and transmission ropes, wherein the transmission circular gear disc is fixedly arranged at the top of the vertical rotating rod, the driving circular gear disc is movably arranged in a cavity in the sealing cover, the transmission ropes are hooped at the periphery of a plurality of groups of transmission circular gear discs, the transmission ropes pass through the surface edge of the driving circular gear disc, the gear transmission ratio of the driving circular gear disc to the transmission circular gear disc is one, the transmission ropes are uniformly provided with pulling balls matched with the tooth clearance of the transmission circular gear disc in size, the pulling balls are fixedly connected to the transmission ropes, the rotating shaft at the top of the driving circular gear disc is fixedly connected with one end of the rotating shaft, and the fan blades are detachably arranged at the other end of the rotating shaft.
During actual operation, the position to installing electrical components and chip always can be provided with heat abstractor, heat abstractor will blow the heat dissipation when the inside temperature of instrument reaches the certain condition, the wind that heat abstractor blew off this moment will drive the flabellum and rotate, the flabellum will drive the rotation of initiative circular gear dish through the axis of rotation, the pulling ball on the driving rope will be stirred to initiative circular gear dish pivoted in-process, and then drive the transmission of driving rope, can drive the pulling ball removal in reverse again when the driving rope transmits, the rotation that will drive the transmission circular gear dish when the edge of pulling ball process transmission circular gear dish, and then drive vertical dwang and heat transfer blade's rotation.
As a further optimization scheme of the invention, the heat transfer blades are provided with a plurality of groups, and the plurality of groups of heat transfer blades are annularly arranged around the central axis of the vertical rotating rod at equal intervals at the edge of the vertical rotating rod.
As a further optimization scheme of the invention, a corrugated heat dissipation plate is horizontally arranged in the top cover, two ends of the corrugated heat dissipation plate are fixedly connected with the surface edge of the hollow upright post, and a vertical heat conduction plate is fixedly arranged on the upper surface of the corrugated heat dissipation plate.
As a further optimization scheme of the invention, the vertical heat conduction plates are provided with a plurality of groups, the vertical heat conduction plates are arranged at equal intervals on the surface edge of the corrugated heat dissipation plate, and the vertical heat conduction plates extend out of the upper surface edge of the top cover.
In actual operation, the corrugated heat dissipation plate is positioned inside the top cover, so that the top cover is supported, the compressive strength of the top cover is higher, meanwhile, the corrugated heat dissipation plate and the vertical heat conduction plate are matched with each other to transfer heat inside the sealing cover to the outside, an external cold source can be transferred to the corrugated heat dissipation plate through the vertical heat conduction plate and then transferred to the inside of the sealing cover, and the effect of exchanging heat between the inside of the sealing cover and the outside is achieved.
The invention has the beneficial effects that: according to the invention, the arrangement of the limiting mechanism and the sealing cover can ensure that the sealing property between the chip carrier and the sealing cover is good, so that the chip is protected, and meanwhile, compared with the traditional glue seal, the disassembly is more convenient, and the chip carrier, the sealing cover and the chip can not be damaged during disassembly, so that the chip carrier, the sealing cover and the chip can be repeatedly utilized, and the environmental protection and sustainable development can be realized;
simultaneously the sealed cowling includes hollow stand and top cap, and hollow stand supports intensity big, and then makes the shock resistance of sealed cowling strong, and the wall thickness of hollow stand still has higher support intensity under thinner circumstances, and then can be through reducing the wall thickness of hollow stand in order to increase the inside heat dispersion of sealed cowling, and this kind of mode can not make the shock resistance of sealed cowling relatively poor.
Drawings
FIG. 1 is a schematic external view of the present invention;
FIG. 2 is an enlarged view of the structure at A in FIG. 1 according to the present invention;
FIG. 3 is a schematic view of the internal structure of the hollow column of the present invention;
FIG. 4 is an enlarged view of the structure at B in FIG. 3 according to the present invention;
FIG. 5 is a schematic structural view of a spacing mechanism according to the present invention;
FIG. 6 is an enlarged view of the structure of FIG. 5 at C according to the present invention;
FIG. 7 is an enlarged view of the structure of FIG. 5;
FIG. 8 is a schematic structural view of a rotating mechanism according to the present invention;
FIG. 9 is an enlarged view of E of FIG. 8 according to the present invention.
In the figure: 1. a chip carrier; 2. a sealing cover; 3. a transmission circular gear plate; 4. a vertical heat conducting plate; 5. a pin; 6. a fan blade; 7. a heat transfer blade; 8. a heat dissipation through groove; 9. a chip; 10. carrying a wire; 11. a corrugated heat dissipation plate; 12. a rotating shaft; 13. a disc-shaped sliding chamber; 14. a sliding disk; 15. a vertical rotating rod; 16. pulling the ball; 17. a threaded post; 18. inserting grooves; 19. inserting the column; 20. a limiting groove; 21. a hollow upright post; 22. a top cover; 23. a receiving groove; 24. a spring plate; 25. pressing the column; 26. a wedge-shaped limiting block; 27. a thread groove; 28. rotating the trough body; 29. a rotating member; 30. a slot body; 31. a driving circular gear plate; 32. a transmission rope.
Detailed Description
The present application will now be described in further detail with reference to the drawings, it should be noted that the following detailed description is given for illustrative purposes only and is not to be construed as limiting the scope of the present application, as those skilled in the art will be able to make numerous insubstantial modifications and adaptations to the present application based on the above disclosure.
As shown in fig. 1 to 9, a semiconductor package structure with a light and thin thickness includes a chip carrier 1, a sealing cover 2, a pin 5 and a chip 9, the chip 9 is fixedly mounted on an upper surface of the chip carrier 1, the sealing cover 2 covers the chip 9, the pin 5 is fixedly disposed on the upper surface of the chip carrier 1, one end of the pin 5 close to the chip 9 is connected to the chip 9 through a carrying line 10, a section of the pin 5 close to the chip 9 is flush with a plane where the upper surface of the chip carrier 1 is located, a plugging column 19 is fixedly disposed at the bottom of the sealing cover 2, a plugging slot 18 corresponding to the plugging column 19 is disposed on the upper surface of the chip carrier 1, and a limiting mechanism for fixing the plugging column 19 inside the plugging slot 18 is disposed inside the chip carrier 1.
In actual operation, the sealing cover 2 can seal the chip 9 arranged on the surface of the chip carrier 1, so that the chip 9 is protected, when the plug-in post 19 fixedly arranged at the bottom of the sealing cover 2 is plugged with the plug-in groove 18 on the surface of the chip carrier 1, the sealing cover 2 covers the chip 9, in order to ensure that the plug-in of the plug-in post 19 and the plug-in groove 18 is firmer, namely the sealing performance between the sealing cover 2 and the chip carrier 1 is better, at the moment, the plug-in post 19 is fixed in the plug-in groove 18 through the limiting mechanism, the sealing cover 2 is prevented from being separated from the surface of the chip carrier 1, so that the connection between the chip carrier 1 and the sealing cover 2 is firmer, and the effects of moisture protection, water prevention and the like of the chip 9 are better.
Stop gear includes spacing groove 20, accomodate groove 23, hold down post 25 and wedge stopper 26, spacing groove 20 is located the lateral wall of grafting post 19, chip carrier 1's inside has been seted up with the corresponding position department in spacing groove 20 and has been accomodate groove 23, the one end fixed connection of compression spring and wedge stopper 26 is passed through to the bottom of accomodating groove 23, wedge stopper 26 most advanced towards spacing groove 20, and wedge stopper 26's inclined plane sets up down, the fixed compression leg 25 that is equipped with of position department that the bottom of spacing groove 20 is close to grafting post 19 lateral wall, the top of holding down post 25 is through smooth processing, wedge stopper 26 keeps away from the one end of spacing groove 20 still with the one end fixed connection of stay cord, the other end of stay cord is worn out the bottom of accomodating groove 23 and is dragged mechanism fixed connection, it drives wedge stopper 26 and removes to the direction that is close to accomodating groove 23 bottom to dragging the mechanism.
In practical operation, when the pulling mechanism does not pull one end of the wedge-shaped limiting block 26 through the pull rope, at this time, the wedge-shaped limiting block 26 will extend out of the outer port of the accommodating groove 23 under the action of the compression spring fixedly connected with the wedge-shaped limiting block 26, and the tip of the wedge-shaped limiting block 26 will extend into the inside of the limiting groove 20, so as to perform a limiting function on the inserting column 19, prevent the inserting column 19 from being separated from the inside of the inserting groove 18, and simultaneously, while the wedge-shaped limiting block 26 gradually extends into the inside of the limiting groove 20, the inclined surface at the bottom of the wedge-shaped limiting block 26 will gradually extrude the top of the lower pressing column 25 and extrude the lower pressing column 25 downwards, so that the inserting column 19 moves downwards in the inside of the inserting groove 18, so that the sealing cover 2 is pressed downwards on the top surface of the chip carrier 1, and the sealing performance between the chip carrier 1 and the sealing cover 2 is good;
when the sealing cover 2 needs to be detached from the surface of the chip carrier 1, that is, the chip 9 needs to be taken out for replacement or maintenance, at this time, one end of the pulling rope can be pulled by the pulling mechanism, the other end of the pulling rope can drive the wedge-shaped limiting block 26 to contract towards the inside of the accommodating groove 23, at this time, the wedge-shaped limiting block 26 is accommodated in the accommodating groove 23 and separated from the inside of the limiting groove 20, and then the wedge-shaped limiting block 26 does not limit the inserting column 19 any more, the inserting column 19 can be easily pulled out from the inside of the inserting groove 18, and at this time, the sealing cover 2 can be detached;
furthermore, due to the arrangement of the limiting mechanism and the sealing cover 2, the sealing performance between the chip carrier 1 and the sealing cover 2 can be guaranteed to be good, the chip 9 is protected, meanwhile, compared with the traditional glue sealing, the glue sealing device is more convenient to disassemble, and meanwhile, the chip carrier 1, the sealing cover 2 and the chip 9 cannot be damaged during disassembling, so that the chip carrier 1, the sealing cover 2 and the chip 9 can be repeatedly utilized, and the environmental protection and sustainable development can be favorably realized.
The mechanism of dragging includes screw thread post 17, thread groove 27, rotatory cell body 28, rotating member 29 and slot body 30, rotatory cell body 28 is located the central point of 1 bottom of chip carrier and puts, thread groove 27 has been seted up to the bottom of rotatory cell body 28, thread groove 27 and screw thread post 17 spiro union each other, screw thread post 17 is connected towards the one end of rotatory cell body 28 and the fixed surface of rotating member 29, the center of rotating member 29 and the central axis of screw thread post 17 coincide each other, slot body 30 has been seted up to the one side that rotating member 29 deviates from screw thread post 17, the other end of the stay cord that links firmly with wedge stopper 26 gets into the inside of rotatory cell body 28 and the side edge fixed connection of rotating member 29.
Accomodate wedge stopper 26 when accomodating the inside of groove 23 at actual need, can adopt the bottle opener to stretch into the inside of slot body 30 this moment, then drive the rotation of rotating member 29 through the bottle opener, will drag the one end of the stay cord that links firmly with wedge stopper 26 when rotating member 29 pivoted, and then the tensile one end of keeping away from wedge stopper 26 will be convoluteed gradually at the outward flange of rotatory groove body 28, and the other end of stay cord will drive wedge stopper 26 and accomodate the inside of accomodating groove 23.
The bottom of the inserting groove 18 is fixedly provided with a spring piece 24, the spring piece 24 is of an oval structure, and when the upper surface of the chip carrier 1 is contacted with the bottom of the sealing cover 2, the spring piece 24 is in a compression deformation state.
Specifically, when inserting column 19 and inserting groove 18 peg graft, spring leaf 24 will receive the extrusion and warp, and wedge stopper 26 fixes inserting column 19's position again, and then spring leaf 24 props inserting column 19 tight in inserting groove 18's inside, make inserting column 19's installation more firm, and after wedge stopper 26 removes spacingly inserting column 19, spring leaf 24 will kick-back under self elasticity this moment, and drive inserting column 19 and shift up, the sealed cowling 2 at inserting column 19 top will break away from the upper surface of chip carrier 1 automatically this moment, be convenient for take off sealed cowling 2 from the surface of chip carrier 1.
As shown in fig. 1, in practical use, a plurality of groups of hollow columns 21 form a support frame of the sealing cover 2, the hollow columns 21 have high support strength, so that the sealing cover 2 has high impact resistance, and the wall thickness of the hollow columns 21 is still higher in support strength under the condition of being thinner, so that the heat dissipation performance inside the sealing cover 2 can be increased by reducing the wall thickness of the hollow columns 21, and in this way, the sealing cover 2 does not have poor impact resistance.
The heat dissipation mechanism comprises heat transfer blades 7, a disc-shaped sliding cavity 13, a sliding disc 14 and a vertical rotating rod 15, the vertical center of the vertical rotating rod 15 is arranged in the hollow upright post 21, the heat transfer blades 7 are uniformly arranged on the outer edge of the vertical rotating rod 15, the bottom end of the vertical rotating rod 15 extends into the disc-shaped sliding cavity 13 at the bottom of the hollow upright post 21 and is fixedly connected with the center of the top of the sliding disc 14 in the disc-shaped sliding cavity 13, the disc-shaped sliding cavity 13 is in sliding connection with the sliding disc 14, balls are uniformly arranged on the side edges of the sliding disc 14, and rotating mechanisms for driving the vertical rotating rod 15 to rotate are arranged in the hollow upright post 21 and the top cover 22.
During actual use, the heat inside the sealing cover 2 can be transferred to the inside of the hollow upright post 21 through the hollow upright post 21, the heat transfer blades 7 inside the hollow upright post 21 can achieve a good heat dissipation effect, the area temperature inside the hollow upright post 21 close to the top cover 22 can be higher, the area temperature inside the hollow upright post 21 far away from the top cover 22 can be relatively lower, when the heat transfer blades 7 are located in the high-temperature area inside the hollow upright post 21 for a period of time, the heat in the high-temperature area of the hollow upright post 21 can be transferred to the heat transfer blades 7, then the heat transfer blades 7 move to the low-temperature area inside the hollow upright post 21, at the moment, the transferred heat on the heat transfer blades 7 can be released, and due to the fact that the heat dissipation through grooves 8 are formed in the edges of the hollow upright post 21 far away from the top cover 22, dissipation of the heat on the heat transfer blades 7 in the low-temperature area inside the hollow upright post 21 is further promoted, the rotating mechanism drives the heat transfer blades 7 to rotate inside the hollow upright post 21, the sealing cover 2 is close to the top cover 22, namely, the heat dissipation through grooves 8 are further, and the heat can be transferred to the outside.
Slewing mechanism includes transmission circular gear dish 3, flabellum 6, axis of rotation 12, initiative circular gear dish 31 and driving rope 32, 3 fixed mounting at the top of vertical dwang 15 of transmission circular gear dish, 31 movable mounting of initiative circular gear dish is in the inside cavity of sealed cowling 2, the periphery department at a plurality of groups transmission circular gear dish 3 is established to driving rope 32 hoop, and driving rope 32 is marginal through the surface of initiative circular gear dish 31, the gear drive ratio of initiative circular gear dish 31 and transmission circular gear dish 3 is one, and evenly be equipped with on the driving rope 32 with 3 tooth clearance size assorted pulling beads 16 of transmission circular gear dish, pulling beads 16 fixed connection is on driving rope 32, the pivot at initiative circular gear dish 31 top and the one end fixed connection of axis of rotation 12, the other end demountable installation of axis of rotation 12 has flabellum 6.
During the in-service use, the position to equipment internally mounted have electrical components and chip 9 always can be provided with heat abstractor, heat abstractor will blow the heat dissipation when equipment internal temperature reaches the certain condition, the wind that heat abstractor blew off this moment will drive flabellum 6 and rotate, flabellum 6 will drive the rotation of initiative disk gear 31 through axis of rotation 12, pulling ball 16 on the driving rope 32 will be stirred to initiative disk gear 31 pivoted in-process, and then drive the transmission of driving rope 32, can drive pulling ball 16 and remove in return when driving rope 32 transmits, pulling ball 16 will drive the rotation of driving disk gear 3 when the edge of driving disk gear 3, and then drive vertical dwang 15 and heat transfer blade 7's rotation.
The heat transfer blades 7 are provided with a plurality of groups, and the plurality of groups of heat transfer blades 7 are annularly arranged around the central axis of the vertical rotating rod 15 at the edge of the vertical rotating rod 15 at equal intervals.
The corrugated heat dissipation plate 11 is horizontally arranged inside the top cover 22, two ends of the corrugated heat dissipation plate 11 are fixedly connected with the surface edge of the hollow upright post 21, and the vertical heat conduction plate 4 is fixedly arranged on the upper surface of the corrugated heat dissipation plate 11.
The vertical heat-conducting plates 4 are provided with a plurality of groups, the groups of vertical heat-conducting plates 4 are arranged at the surface edge of the corrugated heat-dissipating plate 11 at equal intervals, and the vertical heat-conducting plates 4 extend out of the upper surface edge of the top cover 22.
In actual operation, the corrugated heat dissipation plate 11 is located inside the top cover 22, so that the top cover 22 is supported, the compressive strength of the top cover 22 is higher, meanwhile, the corrugated heat dissipation plate 11 and the vertical heat conduction plate 4 are matched with each other to transfer heat inside the sealing cover 2 to the outside, an external cold source can also be transferred to the corrugated heat dissipation plate 11 through the vertical heat conduction plate 4 and then transferred to the inside of the sealing cover 2, and the effect of exchanging heat between the inside of the sealing cover 2 and the outside is achieved.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention.
Claims (8)
1. The semiconductor packaging structure is characterized by comprising a chip carrier (1), a sealing cover (2), pins (5) and a chip (9), wherein the chip (9) is fixedly mounted on the upper surface of the chip carrier (1), the sealing cover (2) covers the chip (9), the pins (5) are fixedly arranged on the upper surface of the chip carrier (1), one end, close to the chip (9), of each pin (5) is connected with the chip (9) through a carrying line (10), one section, close to the chip (9), of each pin (5) is flush with the plane where the upper surface of the chip carrier (1) is located, a splicing column (19) is fixedly arranged at the bottom of the sealing cover (2), a splicing groove (18) corresponding to the splicing column (19) is formed in the upper surface of the chip carrier (1), and a limiting mechanism for fixing the splicing column (19) in the splicing groove (18) is arranged in the chip carrier (1);
the limiting mechanism comprises a limiting groove (20), an accommodating groove (23), a lower pressing column (25) and a wedge-shaped limiting block (26), the limiting groove (20) is located on the side wall of the inserting column (19), the accommodating groove (23) is formed in the position, corresponding to the limiting groove (20), in the chip carrier (1), the bottom of the accommodating groove (23) is fixedly connected with one end of the wedge-shaped limiting block (26) through a compression spring, the tip of the wedge-shaped limiting block (26) faces the limiting groove (20), the inclined surface of the wedge-shaped limiting block (26) is arranged downwards, the lower pressing column (25) is fixedly arranged at the position, close to the side wall of the inserting column (19), of the bottom of the limiting groove (20), the top of the lower pressing column (25) is subjected to smoothing treatment, one end, far away from the limiting groove (20), of the wedge-shaped limiting block (26) is fixedly connected with one end of the pull rope, the other end of the pull rope penetrates through the bottom of the accommodating groove (23) and is fixedly connected with the pulling mechanism, and the pulling mechanism drives the wedge-shaped limiting block (26) to move towards the direction close to the bottom of the accommodating groove (23);
the utility model discloses a chip carrier's chip carrier, chip carrier's chip carrier (1) and chip carrier's chip carrier, pull the mechanism and include screw thread post (17), thread groove (27), rotatory cell body (28), thread groove (27) and slot body (30), rotatory cell body (28) are located the central point of chip carrier (1) bottom and put, and thread groove (27) have been seted up to the bottom of rotatory cell body (28), and thread groove (27) and screw thread post (17) spiro union each other, slot body (30) have been seted up to the one side that rotatory cell body (28) was deviated from to screw thread post (17) in screw thread post (17), with the other end of the stay cord that wedge stopper (26) linked firmly gets into the inside of rotatory cell body (28) and the side edge fixed connection of rotatory cell body (29).
2. The semiconductor package structure of claim 1, wherein: the bottom of the inserting groove (18) is fixedly provided with a spring piece (24), the spring piece (24) is of an oval structure, and when the upper surface of the chip carrier (1) is in contact with the bottom of the sealing cover (2), the spring piece (24) is in a compression deformation state.
3. The semiconductor package structure of claim 2, wherein: sealing boot (2) are including hollow stand (21) and top cap (22), hollow stand (21) are the bottom seal, open-top's cylinder tubular structure, and hollow stand (21) are equipped with a plurality of groups, the outward flange of a plurality of groups hollow stand (21) links firmly a whole rectangular frame structure of constituteing each other, rectangular frame structure's inside is fixed and is equipped with top cap (22), hollow stand (21) and top cap (22) whole form the rectangle cell body structure and cover establish in the outside of chip (9), the inside of hollow stand (21) is equipped with carries out radiating heat dissipation mechanism to sealing boot (2) inside, and hollow stand (21) deviate from the outward flange of top cap (22) and seted up heat dissipation through groove (8), the inside that heat dissipation through groove (8) and rectangle cell body does not communicate.
4. The semiconductor package structure of claim 3, wherein: heat dissipation mechanism includes heat transfer blade (7), disk sliding chamber (13), sliding tray (14) and vertical dwang (15), the vertical central point that sets up in hollow column (21) of vertical dwang (15) puts the department, and the outward flange of vertical dwang (15) evenly is equipped with heat transfer blade (7), and the bottom of vertical dwang (15) stretches into the inside of the disk sliding chamber (13) of hollow column (21) bottom, and with the top center fixed connection of the inside sliding tray (14) of disk sliding chamber (13), disk sliding chamber (13) and sliding tray (14) mutual sliding connection, and the side edge of sliding tray (14) evenly is equipped with the ball, the inside of hollow column (21) and top cap (22) is equipped with the slewing mechanism that drives vertical dwang (15) pivoted.
5. The semiconductor package structure of claim 4, wherein: slewing mechanism includes transmission gear disc (3), flabellum (6), axis of rotation (12), initiative gear disc (31) and driving rope (32), transmission gear disc (3) fixed mounting is at the top of vertical dwang (15), and initiative gear disc (31) movable mounting is in the inside cavity of sealed cowling (2), driving rope (32) hoop is established in the periphery department of a plurality of groups transmission gear disc (3), and driving rope (32) are through the surface edge of initiative gear disc (31), and initiative gear disc (31) are one with the gear drive ratio of transmission gear disc (3), and evenly be equipped with on driving rope (32) with transmission gear disc (3) tooth clearance size assorted pulling ball (16), pulling ball (16) fixed connection is on driving rope (32), the pivot at initiative gear disc (31) top and the one end fixed connection of axis of rotation (12), the other end demountable installation of axis of rotation (12) has flabellum (6).
6. The semiconductor package structure of claim 5, wherein: the heat transfer blades (7) are provided with a plurality of groups, and the heat transfer blades (7) of the plurality of groups are annularly arranged at the edge of the vertical rotating rod (15) in an equidistant mode around the central axis of the vertical rotating rod (15).
7. The semiconductor package structure of claim 6, wherein: the heat dissipation structure is characterized in that a corrugated heat dissipation plate (11) is horizontally arranged inside the top cover (22), two ends of the corrugated heat dissipation plate (11) are fixedly connected with the surface edge of the hollow upright post (21), and a vertical heat conduction plate (4) is fixedly arranged on the upper surface of the corrugated heat dissipation plate (11).
8. The semiconductor package structure of claim 7, wherein: vertical heat-conducting plate (4) are equipped with a plurality of groups, and a plurality of vertical heat-conducting plates (4) of group are arranged at the surperficial edge equidistance of corrugated heating panel (11), and vertical heat-conducting plate (4) stretch out the upper surface edge of top cap (22).
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN209216970U (en) * | 2018-11-28 | 2019-08-06 | 深圳市优尚至科技有限公司 | A kind of integrated circuit SIP encapsulating structure |
| CN111092057A (en) * | 2019-12-12 | 2020-05-01 | 袁晓华 | Packaging method for densely-arranged semiconductor chips of terminal of Internet of things |
| CN111696925A (en) * | 2020-05-18 | 2020-09-22 | 马鞍山芯海科技有限公司 | Chip packaging structure and method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN100578782C (en) * | 2008-09-04 | 2010-01-06 | 浙江华越芯装电子股份有限公司 | Large power multi-chip encapsulation construction |
| CN216250710U (en) * | 2021-11-16 | 2022-04-08 | 深圳市汇芯源科技有限公司 | Power management chip packaging structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN209216970U (en) * | 2018-11-28 | 2019-08-06 | 深圳市优尚至科技有限公司 | A kind of integrated circuit SIP encapsulating structure |
| CN111092057A (en) * | 2019-12-12 | 2020-05-01 | 袁晓华 | Packaging method for densely-arranged semiconductor chips of terminal of Internet of things |
| CN111696925A (en) * | 2020-05-18 | 2020-09-22 | 马鞍山芯海科技有限公司 | Chip packaging structure and method |
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