CN208985583U - A kind of novel Led unit module encapsulating structure - Google Patents
A kind of novel Led unit module encapsulating structure Download PDFInfo
- Publication number
- CN208985583U CN208985583U CN201821908438.XU CN201821908438U CN208985583U CN 208985583 U CN208985583 U CN 208985583U CN 201821908438 U CN201821908438 U CN 201821908438U CN 208985583 U CN208985583 U CN 208985583U
- Authority
- CN
- China
- Prior art keywords
- led unit
- ceramic
- upper substrate
- base
- box body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of novel Led unit module encapsulating structures, including box body and Led unit, the intracavity bottom of the box body is fixedly connected with lower substrate, the downside of the box body is equipped with several through-holes, the upside of the lower substrate is equipped with upper substrate with screw, the downside mounting circuit boards of the upper substrate, binding post is connected on the circuit board, the upside of the upper substrate is equipped with several open slots, the Led unit includes base of ceramic, chip is installed in groove on the upside of the base of ceramic, the protective cover of back taper is installed on the base of ceramic, the chip is located in protective cover, the both ends of the chip are connected with pin, the pin and binding post weld.After the utility model upper substrate when assembled and lower substrate are spirally connected, circuit board is located in mounting groove, circuit board by individually separated, can effective protection circuit board from electrostatic damage.Led unit is installed in open slot in a manner of being clamped, easy for installation.
Description
Technical field
The utility model relates to Led display screen technology field, specially a kind of novel Led unit module encapsulating structure.
Background technique
Display screen increasingly plays a significant role in socio-economic activity as modernization information spreading tool, uses
Purposes is also increasingly wider.Producer is mostly using semiconductor light-emitting-diode as its matrix illuminator both at home and abroad at present, first by multiple groups
LED core is integrated into the i.e. so-called Led unit module of display unit plate, then muti-piece display unit board group is connect one
It rises, while being equipped with power supply device and being grouped into an entire display screen.Current Led unit module mostly uses aluminum substrate, Led unit
Pedestal be connected on aluminum substrate in a welding manner, production technology is more complex, and the manufacturing cost of aluminum substrate is high.
Utility model content
The purpose of this utility model is to provide a kind of novel Led unit module encapsulating structures, to solve above-mentioned background skill
The problem of being proposed in art.
To achieve the above object, the utility model provides the following technical solutions: a kind of novel Led unit module encapsulation knot
Structure, including box body and Led unit, the intracavity bottom of the box body are fixedly connected with lower substrate, if the downside of the box body is equipped with
Dry through-hole, the upside of the lower substrate is equipped with upper substrate, the downside mounting circuit boards of the upper substrate, the electricity with screw
Binding post is connected on the plate of road, the upside of the upper substrate is equipped with several open slots, and the Led unit includes base of ceramic,
Chip is installed in the groove on the upside of the base of ceramic, the protective cover of back taper, the core are installed on the base of ceramic
Piece is located in protective cover, and the both ends of the chip are connected with pin, and the pin and binding post weld, under the base of ceramic
End is connected to open slot.
Preferably, the upper port of the box body is connected with end cap, and insertion is equipped with protection screen in the end cap.
Preferably, the upper end of the protective cover is equipped with lens, and the inside of the lens is equipped with fluorescence coating.
Preferably, the upside of the lower substrate is equipped with mounting groove, and the circuit board is located in mounting groove.
Preferably, the binding post runs through upper substrate, and the pin runs through base of ceramic.
Preferably, the upper substrate is that rectangle and open slot are arranged in a matrix, and the lower substrate and upper substrate are using leading
Hot silicone grease injection molding.
Compared with prior art, the utility model has the beneficial effects that the utility model upper substrate when assembled and lower base
After plate is spirally connected, circuit board is located in mounting groove, circuit board by individually separate, can effective protection circuit board from electrostatic damage.
Led unit is installed in open slot in a manner of being clamped, easy for installation.Through-hole is distributed in the bottom of box body, is conducive to improve
Heat dissipation effect.
Detailed description of the invention
FIG. 1 is a schematic structural view of the utility model；
Fig. 2 is partial enlarged view at A in the utility model Fig. 1.
In figure: 1 box body, 2 end caps, 3 protection screens, 4 through-holes, 5 upper substrates, 6 lower substrates, 7 mounting grooves, 8 circuit boards, 9 Led
Unit, 91 base of ceramic, 92 protective covers, 93 lens, 94 fluorescence coatings, 95 chips, 96 pins, 10 open slots, 11 binding posts.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
The utility model provides a kind of technical solution referring to FIG. 1-2: a kind of novel Led unit module encapsulating structure, packet
Box body 1 and Led unit 9 are included, the box body 1 is manufactured using albronze, and the intracavity bottom of the box body 1 is fixedly connected with lower base
The downside of plate 6, the box body 1 is equipped with several through-holes 4, and the upside of the lower substrate 6 is equipped with upper substrate 5 with screw, described
The downside mounting circuit boards 8 of upper substrate 5 are connected with binding post 11 on the circuit board 8, if the upside of the upper substrate 5 is equipped with
Dry open slot 10, the Led unit 9 include base of ceramic 91, are equipped with chip in the groove of 91 upside of base of ceramic
95, the protective cover 92 of back taper is installed, the chip 95 is located in protective cover 92, the chip 95 on the base of ceramic 91
Both ends be connected with pin 96, the pin 96 is welded with binding post 11, and the lower end of the base of ceramic 91 is connected to open slot
10, silica gel is coated in the lower end of base of ceramic 91, and after base of ceramic 91 and open slot 10 are clamped, bottom bonding is secured.
Specifically, the upper port of the box body 1 is connected with end cap 2, insertion is equipped with protection screen 3 in the end cap 2, protects
Screen 3 is manufactured using transparent glass or transparent acrylic.
Specifically, the upper end of the protective cover 92 is equipped with lens 93, the inside of the lens 93 is equipped with fluorescence coating 94, institute
Aluminium foil is pasted in the inside for stating protective cover 92, increases emergency light reflex.
Specifically, the upside of the lower substrate 6 is equipped with mounting groove 7, the circuit board 8 is located in mounting groove 7, the circuit
Plate 8 is that Led unit 9 provides electric energy, and controls its power on/off.
Specifically, the binding post 11 runs through upper substrate 5, the pin 96 runs through base of ceramic 91, the pin 96 with
Binding post 11 uses tin welding.
Specifically, the upper substrate 5 is rectangle and open slot 10 is arranged in a matrix, the lower substrate 6 and upper substrate 5 make
With heat-conducting silicone grease injection molding, hot silicone grease note has good thermal conductivity and insulating properties, and opposite aluminum substrate does not need to do insulation position
Reason.
Working principle: it when assembling, is screwed between lower substrate 6 and the bottom of box body 1, circuit board 8 is mounted on base
After the downside of plate 5, upper substrate 5 and lower substrate 6 are spirally connected, circuit board 8 is located in mounting groove 7, and circuit board 8 is individually separated, can
Effective protection circuit board 8 is from electrostatic damage.Led unit 9 is installed in open slot 10 in a manner of clamping, easy for installation.?
Through-hole 4 is distributed in the bottom of box body 1, is conducive to improve heat dissipation effect, and after the engaging of end cap 2, inside is sealed, and is conducive to protect
Led unit 9.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of novel Led unit module encapsulating structure, including box body (1) and Led unit (9), it is characterised in that: the box body
(1) intracavity bottom is fixedly connected with lower substrate (6), and the downside of the box body (1) is equipped with several through-holes (4), the lower base
The upside of plate (6) is equipped with upper substrate (5) with screw, the downside mounting circuit boards (8) of the upper substrate (5), the circuit board
(8) it is connected on binding post (11), the upside of the upper substrate (5) is equipped with several open slots (10), the Led unit (9)
It including base of ceramic (91), is equipped with chip (95) in the groove on the upside of the base of ceramic (91), the base of ceramic (91)
On the protective cover (92) of back taper is installed, the chip (95) is located in protective cover (92), and the both ends of the chip (95) connect
It is connected to pin (96), the pin (96) and binding post (11) are welded, and the lower end of the base of ceramic (91) is connected to open slot
(10)。
2. a kind of novel Led unit module encapsulating structure according to claim 1, it is characterised in that: the box body (1)
Upper port is connected with end cap (2), and insertion is equipped with protection screen (3) in the end cap (2).
3. a kind of novel Led unit module encapsulating structure according to claim 1, it is characterised in that: the protective cover
(92) upper end is equipped with lens (93), and the inside of the lens (93) is equipped with fluorescence coating (94).
4. a kind of novel Led unit module encapsulating structure according to claim 1, it is characterised in that: the lower substrate (6)
Upside be equipped with mounting groove (7), it is interior that the circuit board (8) is located at mounting groove (7).
5. a kind of novel Led unit module encapsulating structure according to claim 1, it is characterised in that: the binding post
(11) run through upper substrate (5), the pin (96) runs through base of ceramic (91).
6. a kind of novel Led unit module encapsulating structure according to claim 1, it is characterised in that: the upper substrate (5)
For rectangle and open slot (10) is arranged in a matrix, and the lower substrate (6) and upper substrate (5) use heat-conducting silicone grease injection molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821908438.XU CN208985583U (en) | 2018-11-20 | 2018-11-20 | A kind of novel Led unit module encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821908438.XU CN208985583U (en) | 2018-11-20 | 2018-11-20 | A kind of novel Led unit module encapsulating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208985583U true CN208985583U (en) | 2019-06-14 |
Family
ID=66791223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821908438.XU Active CN208985583U (en) | 2018-11-20 | 2018-11-20 | A kind of novel Led unit module encapsulating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208985583U (en) |
-
2018
- 2018-11-20 CN CN201821908438.XU patent/CN208985583U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203026534U (en) | Half glue-poured sealed solar junction box | |
| CN103094454A (en) | Packaging method of light-emitting diode (LED) device | |
| CN202013883U (en) | High-power LED (Light Emitting Diode) module sealing structure | |
| CN202032396U (en) | LED road lighting lamp module | |
| CN205452355U (en) | High -power flip -chip structure ultraviolet LED solidification light source | |
| CN102734745B (en) | LED (light-emitting diode) module | |
| CN208985583U (en) | A kind of novel Led unit module encapsulating structure | |
| CN102364684B (en) | LED (Light-Emitting Diode) module and manufacturing process thereof | |
| CN207883721U (en) | A kind of LED light bar with excellent heat dispersion performance | |
| CN201434352Y (en) | Light-emitting diode encapsulation structure and light bar applying same | |
| CN208348977U (en) | A kind of LED watertight optical integrated heat dissipation mould group | |
| CN102969436A (en) | Phase transition constant temperature heat radiation heat conduction LED (Light Emitting Diode) packaging module | |
| CN201732816U (en) | Aluminum base circuit board and light bar used for directly bonding LED elements | |
| CN202120909U (en) | LED module group | |
| CN213878149U (en) | Evenly-distributed white light LED packaging structure | |
| CN202056580U (en) | LED (light-emitting diode) floodlighting lamp module | |
| CN202797061U (en) | COB package high-power LED lamp | |
| CN203596351U (en) | LED-COB (chip on board) light source | |
| CN203013797U (en) | LED fluorescent lamp package module | |
| CN204834676U (en) | LED light source module based on mirror aluminum substrate | |
| CN209213488U (en) | A kind of LED lamp bead mould group | |
| CN209876548U (en) | LED lamp structure with ceramic substrate | |
| CN210035304U (en) | Lamp holder structure of solar street lamp | |
| CN106352260B (en) | Power supply photoelectricity module is gone without gold thread White-light LED chip using high pressure | |
| CN210110786U (en) | COB packaging substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |