CN209876548U - LED lamp structure with ceramic substrate - Google Patents
LED lamp structure with ceramic substrate Download PDFInfo
- Publication number
- CN209876548U CN209876548U CN201920981936.5U CN201920981936U CN209876548U CN 209876548 U CN209876548 U CN 209876548U CN 201920981936 U CN201920981936 U CN 201920981936U CN 209876548 U CN209876548 U CN 209876548U
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- CN
- China
- Prior art keywords
- copper foil
- ceramic substrate
- led lamp
- tin layer
- soldering tin
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses a LED lamp structure with ceramic substrate, including base plate body, fin and copper foil, base plate body lower extreme is equipped with the fin, and base plate body upper end is equipped with the copper foil, and the copper foil outside is equipped with the solder mask, the copper foil passes through two fixed connection bases on soldering tin layer, and joint lens on the cassette, a soldering tin layer fixed connection LED chip is passed through to the cassette upper end, and the lead wire is installed at LED chip both ends, and the other end of lead wire passes through two fixed connection copper foils on soldering tin layer, inside from the last ceramic substrate, copper foil and the three on soldering tin layer of being equipped with in proper order of bottom of base plate body, the utility model discloses in, adopt ceramic substrate, material stability can be high, can bear temperature, moisture and ultraviolet influence to the heat conduction efficiency is not influenced by environment and time, and heat conduction is stable to prolong the life of LED lamp.
Description
Technical Field
The utility model relates to a LED lamp technical field specifically is a LED lamp structure with ceramic substrate.
Background
With the development of social economy and the improvement of living standard of people, the requirement of people on business space is higher and higher. Lighting is one of the important components of a shop space, light design can attract and guide the eyes of consumers, and an LED is a solid semiconductor device capable of converting electrical energy into visible light, which can directly convert electricity into light. The heart of the LED is a semiconductor wafer, one end of the wafer is attached to a support, the other end of the wafer is a negative electrode, and the other end of the wafer is connected with a positive electrode of a power supply, so that the whole wafer is packaged by epoxy resin.
In the existing LED packaging, crystal grains are bonded on a support by adopting a solid crystal glue, but the inside of the solid crystal glue is provided with a glue component, so that the weather resistance of the glue is poor, and the glue can absorb moisture in the air and is continuously deteriorated along with the lapse of time, so that the heat conduction performance of the glue is reduced. Accordingly, one skilled in the art provides an LED lamp structure having a ceramic substrate to solve the problems set forth in the background art.
Disclosure of Invention
An object of the utility model is to provide a LED lamp structure with ceramic substrate to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a LED lamp structure with ceramic substrate, includes base plate body, fin and copper foil, base plate body lower extreme is equipped with the fin, and base plate body upper end is equipped with the copper foil, and the copper foil outside is equipped with the solder mask, the copper foil passes through two fixed connection bases on the soldering tin layer, base joint cassette, joint lens on the cassette, and a soldering tin layer fixed connection LED chip is passed through to the cassette upper end, and the lead wire is installed at LED chip both ends, and the other end of lead wire passes through two fixed connection copper foils on the soldering tin layer, inside ceramic substrate, copper foil and the soldering tin layer three of being equipped with in proper order from last down of.
As a further aspect of the present invention: the lens is filled with silicone.
As a further aspect of the present invention: the LED chip is electrically connected with the lead.
As a further aspect of the present invention: the copper foil is fixedly connected with the radiating fin through the third soldering tin layer.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses in, adopt ceramic substrate, the material stability can be high, can bear temperature, moisture and ultraviolet influence to the heat conduction efficiency does not receive environment and time influence, and heat conductivility is stable, thereby prolongs the life of LED lamp.
Drawings
Fig. 1 is a schematic structural diagram of an LED lamp structure with a ceramic substrate.
Fig. 2 is a schematic diagram of what is in an LED lamp structure having a ceramic substrate.
In the figure: 1-substrate body, 2-radiating fin, 3-copper foil, 4-solder mask, 5-base, 6-clamping base, 7-lens, 8-LED chip, 9-silicone resin, 10-first solder layer, 11-lead, 12-second solder layer, 13-ceramic substrate, 14-copper foil and 15-third solder layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Please refer to fig. 1-2, in an embodiment of the present invention, an LED lamp structure with a ceramic substrate includes a substrate body 1, a heat sink 2 and a copper foil 3, the lower end of the substrate body 1 is provided with the heat sink 2, the upper end of the substrate body 1 is provided with the copper foil 3, and the outer side of the copper foil 3 is provided with a solder mask 4, the copper foil 3 passes through a solder layer two 12 fixed connection base 5, the base 5 is connected with a card seat 6, a card lens 7 is connected on the card seat 6, the upper end of the card seat 6 passes through a solder layer one 10 fixed connection LED chip 8, leads 11 are installed at two ends of the LED chip 8, the other end of the lead 11 passes through a solder layer two 12 fixed connection copper foil 3, the inside of the substrate body 1 is provided with a ceramic substrate.
The lens 7 is filled with silicone 9.
The LED chip 8 is electrically connected with a lead 11.
The copper foil 14 is fixedly connected with the heat sink 2 through a third solder layer 15.
The utility model discloses a theory of operation is:
the utility model discloses in, adopt ceramic substrate 13, the material stability can be high, can bear temperature, moisture and ultraviolet influence to the heat conduction efficiency does not receive environment and time to influence, and heat conductivility is stable, thereby prolongs the life of LED lamp.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (4)
1. An LED lamp structure with a ceramic substrate comprises a substrate body (1), a radiating fin (2) and a copper foil (3), it is characterized in that the lower end of the substrate body (1) is provided with a radiating fin (2), the upper end of the substrate body (1) is provided with a copper foil (3), and solder mask (4) is arranged on the outer side of the copper foil (3), the copper foil (3) is fixedly connected with the base (5) through a second soldering tin layer (12), the base (5) is clamped with the clamping seat (6), the lens (7) is clamped on the clamping seat (6), the upper end of the clamping seat (6) is fixedly connected with the LED chip (8) through a first soldering tin layer (10), leads (11) are arranged at two ends of the LED chip (8), the other end of each lead (11) is fixedly connected with the copper foil (3) through the second soldering tin layer (12), the ceramic substrate (13), the copper foil (14) and the third soldering tin layer (15) are sequentially arranged in the substrate body (1) from top to bottom.
2. The LED lamp structure with ceramic substrate as set forth in claim 1, wherein the lens (7) is filled with silicone (9) inside.
3. The LED lamp structure with the ceramic substrate as set forth in claim 1, wherein the LED chip (8) is electrically connected with a lead (11).
4. The LED lamp structure with ceramic substrate as set forth in claim 1, wherein the copper foil (14) is fixedly connected to the heat sink (2) by a third solder layer (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920981936.5U CN209876548U (en) | 2019-06-26 | 2019-06-26 | LED lamp structure with ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920981936.5U CN209876548U (en) | 2019-06-26 | 2019-06-26 | LED lamp structure with ceramic substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209876548U true CN209876548U (en) | 2019-12-31 |
Family
ID=68947098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920981936.5U Expired - Fee Related CN209876548U (en) | 2019-06-26 | 2019-06-26 | LED lamp structure with ceramic substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209876548U (en) |
-
2019
- 2019-06-26 CN CN201920981936.5U patent/CN209876548U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191231 Termination date: 20200626 |