CN203800073U - COB light source composite aluminum substrate support - Google Patents
COB light source composite aluminum substrate support Download PDFInfo
- Publication number
- CN203800073U CN203800073U CN201420037374.6U CN201420037374U CN203800073U CN 203800073 U CN203800073 U CN 203800073U CN 201420037374 U CN201420037374 U CN 201420037374U CN 203800073 U CN203800073 U CN 203800073U
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- China
- Prior art keywords
- bonding area
- light source
- aluminum substrate
- die
- composite aluminum
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- Expired - Fee Related
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- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The utility model relates to a COB light source composite aluminum substrate support. The COB light source composite aluminum substrate support includes a circuit layer arranged at an uppermost end, a bonding layer arranged at the middle and a die-bonding area which is arranged at a lowest end; the uppermost layer, the bonding layer and the die-bonding area are pressed fittingly in a traditional sandwiching manner so as to form the COB light source composite aluminum substrate support; the circuit layer is responsible for welding wire connection; the bonding layer is made of NO-FLOW materials and is combined with the circuit layer at the uppermost end and the die-bonding area at the lowest end; the bottom of the die-bonding area at the lowest end directly contacts with a chip; and the surface of the die-bonding area is provided with a high-reflectivity coating. According to the structure of the COB light source composite aluminum substrate support of the utility model, the chip can directly contact an aluminum substrate in the die-bonding area when encapsulation is performed, so that heat can be led out faster; and the reflectivity of the support itself can be increased, and light efficiency can be improved by 5% to 8%, and therefore, risks of traditional processes can be completely avoided, and long-term use quality of the high luminous efficacy of a light source can be ensured.
Description
Technical field
The utility model relates to a kind of COB light source composite aluminum base board mount, belongs to aluminium base technical field.
Background technology
COB light source is exactly that LED chip is directly attached to the integrated area source technology of high light efficiency on the mirror metal substrate of high reflecting rate, this technology has been rejected support concept, electroless plating, without Reflow Soldering, without paster operation, so operation reduces closely 1/3rd, cost has also saved 1/3rd.COB light source can simply be interpreted as the integrated area source of high power, can be according to lighting area and the overall dimension of product design structural design light source.This product is electrically stable, and circuit design, optical design, heat dissipation design are scientific and reasonable; Adopt heat sink technology, guarantee that LED has leading hot lumen depreciation.Install simply, easy to use, reduce Design of Luminaires difficulty, save light fixture processing and follow-up maintenance cost.
COB chip on board (Chip On Board, COB) first technical process is at heat-conduction epoxy resin for substrate surface (the general epoxy resin with mixing silver-colored particle), to cover silicon chip to lay a little, then silicon chip is directly placed in to substrate surface, till being heat-treated to silicon chip and being securely fixed in substrate, by the method for wire bond, between silicon chip and substrate, directly set up and be electrically connected again subsequently.Bare chip technology mainly contains two kinds of forms: a kind of COB technology, another kind is flip chip technology (Flip Chip).Chip on board encapsulation (COB), semiconductor chip handing-over is mounted on printed substrate, the electrical connection of chip and substrate realizes with lead-in wire sewing method, and the electrical connection of chip and substrate realizes with lead-in wire sewing method, and covers to guarantee reliability with resin.
At present, in existing aluminium base support, light source is used COB aluminium base heat conductivility poor (1.0W/M-K) conventionally, surface reflection poor (70%-80%), causes light source light decay serious, and light efficiency is not high, to this, be necessary to be improved, to overcome the deficiency existing.
Utility model content
The purpose of this utility model is to provide the COB aluminium base support of a kind of heat conductivility high (150W/M-K), reflectivity high (85%～92%), to bring into play better the effect of aluminium base.
To achieve these goals, the technical solution of the utility model is as follows.
A kind of COB light source composite aluminum base board mount, comprise the line layer that is arranged on topmost, the adhesive linkage in the middle of being arranged on and be arranged on crystal bonding area bottom, adopt the pressing of tradition " sandwich " mode to form, above described line layer, being responsible for bonding wire connects, described adhesive linkage adopts NO-FLOW material to be combined with line layer topmost and crystal bonding area bottom, bottom, described crystal bonding area is bottom contact chip directly, and surface, described crystal bonding area is provided with highly-reflective coating.
Further, bottom, described crystal bonding area is bottom contact chip directly, and surface, described crystal bonding area is provided with highly-reflective coating.
The beneficial effect of this utility model is: in the utility model apparatus structure, during encapsulation, chip can be in direct contact with to the aluminium base of crystal bonding area, make heat be able to derive sooner, increased in addition the reflectivity of support itself, can promote light efficiency 5%-8%, avoid the risk of traditional handicraft completely, guaranteed the long-term quality of using of the high light transmittance efficiency of light source.
Accompanying drawing explanation
Fig. 1 is overall structure schematic diagram of the present utility model.
Fig. 2 is line layer structural representation of the present utility model.
Fig. 3 is crystal bonding area of the present utility model structural representation.
Fig. 4 is adhesive linkage structural representation of the present utility model.
Embodiment
Below in conjunction with accompanying drawing, embodiment of the present utility model is described, to better understand the utility model.
COB light source composite aluminum base board mount as shown in Figure 1, Figure 2, Figure 3, Figure 4, comprise the line layer that is arranged on topmost, the adhesive linkage in the middle of being arranged on and be arranged on crystal bonding area bottom, adopt the pressing of tradition " sandwich " mode to form, above described line layer, being responsible for bonding wire connects, described adhesive linkage adopts NO-FLOW material to be combined with line layer topmost and crystal bonding area bottom, bottom, described crystal bonding area is bottom contact chip directly, and surface, described crystal bonding area is provided with highly-reflective coating.
The utility model COB NEW TYPE OF COMPOSITE aluminium base support can be in direct contact with chip the aluminium base of crystal bonding area when encapsulation, makes heat be able to derive sooner, when reducing junction temperature of chip, has promoted the useful life of light conversion efficiency and light source.The special coating in surface, crystal bonding area is processed, and has increased the reflectivity of support itself, can promote light efficiency 5%～8%.Avoid the risk of conventional surface treatment process (electrosilvering) sulfuration completely, guaranteed the long-term using character of light source.In part, replace specular aluminium substrate holder and reduce costs the approach that an exploration is provided aspect improving product cost performance.
The above is preferred implementation of the present utility model; it should be pointed out that for those skilled in the art, do not departing under the prerequisite of the utility model principle; can also make some improvements and modifications, these improvements and modifications are also considered as protection range of the present utility model.
Claims (2)
1. a COB light source composite aluminum base board mount, it is characterized in that: comprise the line layer that is arranged on topmost, the adhesive linkage in the middle of being arranged on and be arranged on crystal bonding area bottom, adopt the pressing of tradition " sandwich " mode to form, above described line layer, being responsible for bonding wire connects, described adhesive linkage adopts NO-FLOW material to be combined with line layer topmost and crystal bonding area bottom, bottom, described crystal bonding area is bottom contact chip directly, and surface, described crystal bonding area is provided with highly-reflective coating.
2. COB light source composite aluminum base board mount according to claim 1, is characterized in that: bottom, described crystal bonding area is bottom contact chip directly, and surface, described crystal bonding area is provided with highly-reflective coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420037374.6U CN203800073U (en) | 2014-01-22 | 2014-01-22 | COB light source composite aluminum substrate support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420037374.6U CN203800073U (en) | 2014-01-22 | 2014-01-22 | COB light source composite aluminum substrate support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203800073U true CN203800073U (en) | 2014-08-27 |
Family
ID=51382266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420037374.6U Expired - Fee Related CN203800073U (en) | 2014-01-22 | 2014-01-22 | COB light source composite aluminum substrate support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203800073U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104776402A (en) * | 2015-05-04 | 2015-07-15 | 周玉红 | Aluminum substrate installation frame |
| CN109671831A (en) * | 2018-11-01 | 2019-04-23 | 佛山市中昊光电科技有限公司 | A kind of full spectrum COB light source |
-
2014
- 2014-01-22 CN CN201420037374.6U patent/CN203800073U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104776402A (en) * | 2015-05-04 | 2015-07-15 | 周玉红 | Aluminum substrate installation frame |
| CN109671831A (en) * | 2018-11-01 | 2019-04-23 | 佛山市中昊光电科技有限公司 | A kind of full spectrum COB light source |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140827 Termination date: 20150122 |
|
| EXPY | Termination of patent right or utility model |