CN109671831A - A kind of full spectrum COB light source - Google Patents

A kind of full spectrum COB light source Download PDF

Info

Publication number
CN109671831A
CN109671831A CN201811292583.4A CN201811292583A CN109671831A CN 109671831 A CN109671831 A CN 109671831A CN 201811292583 A CN201811292583 A CN 201811292583A CN 109671831 A CN109671831 A CN 109671831A
Authority
CN
China
Prior art keywords
light
fluorescent powder
blue
led chip
full spectrum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811292583.4A
Other languages
Chinese (zh)
Inventor
王孟源
曾伟强
董挺波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FOSHAN ZHONGHAO PHOTOELECTRIC TECHNOLOGY CO LTD
Original Assignee
FOSHAN ZHONGHAO PHOTOELECTRIC TECHNOLOGY CO LTD
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FOSHAN ZHONGHAO PHOTOELECTRIC TECHNOLOGY CO LTD filed Critical FOSHAN ZHONGHAO PHOTOELECTRIC TECHNOLOGY CO LTD
Priority to CN201811292583.4A priority Critical patent/CN109671831A/en
Publication of CN109671831A publication Critical patent/CN109671831A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
    • H01L33/504Elements with two or more wavelength conversion materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • H01L33/60Reflective elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention relates to a kind of full spectrum COB light source, the light conversion layer including substrate, at least two LED chips and all LED chips of covering;The LED chip includes at least one first blue-light LED chip and at least one second blue-light LED chip, and the wave-length coverage of first blue-light LED chip is 465-480nm, and the wave-length coverage of second blue-light LED chip is 440-460nm;The light conversion layer includes packaging plastic and the full spectrum fluorescent powder that is uniformly distributed in inside the packaging plastic.Full spectrum COB light source provided by the invention, full spectrum fluorescent powder is excited using the blue-light LED chip of two different wave lengths, colour gamut is higher, the problem that traditional COB light source spectral gamut is low, colour rendering index is low is breached, the true color of object and the health for being more advantageous to human eye can be preferably restored, on the other hand, it is arranged by different ratio formulas, the simulation of sunlight in different time periods is realized, all close to sunlight, health is comfortable for fidelity and saturation degree.

Description

A kind of full spectrum COB light source
Technical field
The present invention relates to a kind of LED encapsulation technology field more particularly to a kind of full spectrum COB light sources.
Background technique
LED as light source of new generation, have energy-saving and environmental protection, safety, service life length, low-power consumption, low-heat, high brightness, waterproof, The features such as miniature, shockproof, easy light modulation, light beam concentration, easy maintenance, it can be widely applied to various instructions, display, decoration, back The fields such as light source, general lighting.
COB light source encapsulation, i.e. chip on board encapsulate, and are one of bare chip mounting technologies, LED chip is mounted on printed wire On plate, the electrical connection of chip and substrate is realized with lead sewing method, and is covered with resin to ensure reliability.With COB The extensive use of illuminating product, people also increasingly pay attention to the performance of COB product and photochromic quality.It is most of currently on the market The colour rendering index of COB product is not high (general colour rendering index Ra be lower than 70), poor to the color reducibility of object, seen in us The object color arrived is easy distortion or colour cast, is not suitable for human eye vision preference.Therefore, it is necessary to propose a kind of novel COB light Source solves problem above.
The present invention proposes a kind of full spectrum COB light source, and colour rendering index is high, preferably the reduction true color of object, favorably In the health of human eye.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of full spectrum COB light sources, and colour rendering index is high, preferably reduzate The true color of body, is conducive to the health of human eye.
In order to solve the above-mentioned technical problem, the present invention proposes a kind of full spectrum COB light source, including substrate, at least two LED The light conversion layer of chip and all LED chips of covering;
The LED chip includes at least one first blue-light LED chip and at least one second blue-light LED chip, described The wave-length coverage of first blue-light LED chip is 465-480nm, and the wave-length coverage of second blue-light LED chip is 440- 460nm;
The light conversion layer includes packaging plastic and the full spectrum fluorescent powder that is uniformly distributed in inside the packaging plastic;
The full spectrum fluorescent powder includes Blue-green phosphor, green light fluorescent powder, yellow fluorescent powder and red light fluorescent powder, Described in Blue-green phosphor, green light fluorescent powder, yellow fluorescent powder and the red light fluorescent powder weight ratio between packaging plastic respectively Are as follows: 3-5%, 12-15%, 5-7% and 1-4%.
Preferably, the excitation wavelength of the Blue-green phosphor is 480-500nm, and the excitation wavelength of green light fluorescent powder is 520- 540nm, the excitation wavelength of yellow fluorescent powder are 560-575nm, and the excitation wavelength of red light fluorescent powder is 630-660nm.
Preferably, the green light fluorescent powder includes first wave length green light fluorescent powder and second wave length green light fluorescent powder, wherein Weight ratio between the first wave length green light fluorescent powder and packaging plastic are as follows: 3-5%;
Weight ratio between the second wave length green light fluorescent powder and packaging plastic are as follows: 7-12%.
Preferably, the excitation wavelength of the first wave length green light fluorescent powder is 520-530nm;
The excitation wavelength of the second wave length fluorescent powder is 530-540nm.
Preferably, first blue-light LED chip and second blue-light LED chip interval are arranged;
The range of the ratio of number of the quantity of first blue-light LED chip and second blue-light LED chip are as follows: 25%-60%.
Preferably, the front of the substrate is provided with crystal bonding area, and the crystal bonding area is for installing the LED chip.
It preferably, further include box dam, the box dam is in closed hoop structure, is set to the front of the substrate and surrounds institute State crystal bonding area.
Preferably, the box dam is made of white box dam glue, and the diameter of the box dam is 9~13mm, the box dam dam body Width be 0.9~1.3mm.
Preferably, the substrate is metal substrate or ceramic substrate.
Preferably, the surface of the crystal bonding area is provided with high reflection layer.
Compared with prior art, the beneficial effects of the present invention are:
1, full spectrum COB light source provided by the invention excites full spectrum glimmering using the blue-light LED chip of two different wave lengths Light powder, colour rendering index Ra are greater than 97, and colour gamut is higher, breaches that traditional COB light source spectral gamut is low, colour rendering index is low asks Topic, can preferably restore the true color of object and the health for being more advantageous to human eye, on the other hand, be matched by different ratios Side's setting, realizes the simulation of sunlight in different time periods, is all larger than 90 with the similarity degree Rf of sunlight, fidelity and For saturation degree all close to sunlight, health is comfortable.
2, full spectrum COB light source provided by the invention, the crystal bonding area surface are provided with high reflection layer, the high reflection layer Reflectivity be higher than 98%, the high reflection layer is that mirror surface aluminium layer for improving the reflectivity of COB light source improves the COB light The light extraction efficiency in source.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the full spectrum COB light source of the present invention;
Fig. 2 is the spectral distribution curve figure of the embodiment of the present invention one;
Fig. 3 is the spectral distribution curve figure of the embodiment of the present invention two;
Fig. 4 is the spectral distribution curve figure of the embodiment of the present invention three.
Specific embodiment
It is with reference to the accompanying drawing and preferred real in order to make those skilled in the art more fully understand technical solution of the present invention Applying example, the present invention is described in further detail.
As shown in Figure 1, a kind of full spectrum COB light source, including substrate 1, at least two LED chips 2 and all LED of covering The light conversion layer 3 of chip 2;
The LED chip 2 includes at least one the first blue-light LED chip 21 and at least one second blue-light LED chip 22, The wave-length coverage of first blue-light LED chip 21 is 465-480nm, and the wave-length coverage of second blue-light LED chip 22 is 440-460nm;
The light conversion layer 3 includes packaging plastic and the full spectrum fluorescent powder being uniformly distributed in inside the packaging plastic.
The substrate 1 is metal substrate or ceramic substrate, and front is provided with crystal bonding area, and the crystal bonding area is for installing LED chip 2, more preferably, the surface of the crystal bonding area are provided with high reflection layer, and the reflectivity of the high reflection layer is higher than 98%, In the present embodiment, the high reflection layer is mirror surface aluminium layer, for improving the reflectivity of full spectrum COB light source, improves the full light Compose the light extraction efficiency of COB light source.
The type of the LED chip 2 is two kinds, respectively the first blue-light LED chip 21 and the second blue-light LED chip 22, The wave-length coverage 465-480nm of first blue-light LED chip 21, specifically, the wavelength of first blue-light LED chip 21 is The wave-length coverage of 470nm, 472nm, 475nm or 478nm, second blue-light LED chip 22 are 440-460nm, specifically, institute The wavelength for stating the second blue-light LED chip 22 is 445nm, 450nm or 455nm.Swashed respectively by the LED chip of different wavelength range Full spectrum fluorescent powder is sent out, the light of approximate sunlight is issued convenient for full spectrum COB light source.
More preferably, in order to enable full spectrum COB light source issues the light of uniform approximate sunlight, first blue-ray LED The proportional region of the quantity of the quantity of chip 21 and second blue-light LED chip 22 is 25%-60%, specifically, described the The ratio of number of one blue-light LED chip 21 and second blue-light LED chip 22 is 30%, 40% or 50%, and is spaced setting, Guarantee the light-emitting uniformity of the complete entire light-emitting surface of spectrum COB light source.
The light conversion layer 3 covers all LED chips 2, is used to for the blue light that the LED chip 2 issues being converted to white Light, to obtain the light of full spectrum, the light conversion layer 3 includes packaging plastic and the full light being uniformly distributed in inside the packaging plastic Fluorescent powder is composed, the packaging plastic is epoxy resin or silica gel, for encapsulating all LED chips 2, and all LED chips 2 are protected, In the present embodiment, the packaging plastic is silica gel, due to the perfect heat-dissipating of silica gel, for improving the full spectrum COB light source Heat dissipation performance.
The full spectrum fluorescent powder includes Blue-green phosphor, green light fluorescent powder, yellow fluorescent powder and red light fluorescent powder.
Wherein, the weight ratio between the Blue-green phosphor and packaging plastic are as follows: 3-5%, specifically, the Blue-green phosphor Weight between packaging plastic is 3.5%, 4% or 4.5%, excitation wavelength 480-500nm, specially 482nm, 484nm, 486nm or 488nm.
Weight ratio between the green light fluorescent powder and packaging plastic is 12-15%, specifically, the green light fluorescent powder includes First wave length green light fluorescent powder and second wave length green light fluorescent powder, wherein the first wave length green light fluorescent powder and packaging plastic it Between weight ratio are as follows: 3-5%, specifically, weight between the first wave length green light fluorescent powder and packaging plastic is 3.5%, 4% Or 4.5%.The excitation wavelength of the first wave length green light fluorescent powder be 520-530nm, specially 522nm, 524nm, 526nm or 528nm。
Weight ratio between the second wave length green light fluorescent powder and packaging plastic are as follows: 7-12%, specifically, second wave Weight between long green light fluorescent powder and packaging plastic is 8%, 9%, 10% or 11%.The excitation wave of the second wave length fluorescent powder A length of 530-540nm, specially 532nm, 534nm, 536nm or 538nm.
Weight ratio between the yellow fluorescent powder and packaging plastic are as follows: 5-7%, specifically, the yellow fluorescent powder and envelope Filling the weight between glue is 5.5%, 6% or 6.5%, excitation wavelength 560-575nm, specially 563nm, 568nm, 570nm or 572nm.
Weight ratio between the red light fluorescent powder and packaging plastic are as follows: 1-4%, specifically, the red light fluorescent powder and envelope Filling the weight between glue is 1.5%, 2%, 2.5%, 3% or 3.5%, excitation wavelength 630-660nm, specially 635nm, 640nm, 645nm, 650nm or 655nm.
All LED chips can be smoothly covered for the ease of light conversion layer, further include box dam 4, the box dam 4 is in close ring Shape structure is set to the front of the substrate 1 and surrounds the crystal bonding area.The box dam 4 is made of white box dam glue, described to enclose The diameter on dam 4 is 9~13mm, and the width of the box dam dam body is 0.9~1.3mm, and specifically, the width of the box dam dam body is 0.9mm, 1.0mm, 1.1mm, 1.3mm.The present invention makes the box dam 4 using white box dam glue, for improving full spectrum COB light The width of the reflectivity in source, the box dam dam body is set as 0.9~1.3mm, if the width of the box dam dam body is less than 0.9mm, Then box dam 4 and the binding force of the substrate 1 are too small, are easy to fall off, the poor reliability of Quan Guangpu COB light source, if the box dam dam The width of body is greater than 1.3mm, then occupies the excessive area of the substrate 1, be unfavorable for the Miniaturization Design of COB light source.
As in Figure 2-4, the present invention excites full spectrum fluorescent powder using the blue-light LED chip of two different wave lengths, obtains White light, colour rendering index Ra is all larger than 95, is all larger than 90 with the similarity degree Rf of sunlight, colour gamut is higher, breaches tradition The problem that COB light source spectral gamut is low, colour rendering index is low can preferably restore the true color of object and be more advantageous to human eye Health.
Embodiment one
A kind of full spectrum COB light source, the light including substrate 1, at least two LED chips 2 and all LED chips 2 of covering Conversion coating 3;
The LED chip 2 includes at least one the first blue-light LED chip 21 and at least one second blue-light LED chip 22, The wavelength of first blue-light LED chip 21 is 465nm, and the wave-length coverage of second blue-light LED chip 22 is 440nm;
The light conversion layer 3 includes packaging plastic and the full spectrum fluorescent powder being uniformly distributed in inside the packaging plastic.
The substrate 1 is metal substrate or ceramic substrate, and front is provided with crystal bonding area, and the crystal bonding area is for installing LED chip 2.
The type of the LED chip 2 is two kinds, respectively the first blue-light LED chip 21 and the second blue-light LED chip 22, The proportional region of the quantity of first blue-light LED chip 21 and the quantity of second blue-light LED chip 22 is 25%, and Every setting.
The light conversion layer 3 covers all LED chips 2, is used to for the blue light that the LED chip 2 issues being converted to white Light, to obtain the light of full spectrum, the light conversion layer 3 includes packaging plastic and the full light being uniformly distributed in inside the packaging plastic Fluorescent powder is composed, the packaging plastic is epoxy resin or silica gel, for encapsulating all LED chips 2, and all LED chips 2 are protected, In the present embodiment, the packaging plastic is silica gel, due to the perfect heat-dissipating of silica gel, for improving the full spectrum COB light source Heat dissipation performance.
The full spectrum fluorescent powder includes Blue-green phosphor, green light fluorescent powder, yellow fluorescent powder and red light fluorescent powder.
Wherein, the weight ratio between the Blue-green phosphor and packaging plastic are as follows: 3%, excitation wavelength 480nm.
The green light fluorescent powder includes first wave length green light fluorescent powder and second wave length green light fluorescent powder, wherein described Weight ratio between one wavelength green light fluorescent powder and packaging plastic are as follows: 3%, the excitation wavelength of the first wave length green light fluorescent powder is 520nm。
Weight ratio between the second wave length green light fluorescent powder and packaging plastic are as follows: 7%, the second wave length fluorescent powder Excitation wavelength is 530nm.
Weight ratio between the yellow fluorescent powder and packaging plastic are as follows: 5%, excitation wavelength 560nm.
Weight ratio between the red light fluorescent powder and packaging plastic are as follows: 1%, excitation wavelength 630nm.
All LED chips can be smoothly covered for the ease of light conversion layer, further include box dam 4, the box dam 4 is in close ring Shape structure is set to the front of the substrate 1 and surrounds the crystal bonding area.The box dam 4 is made of white box dam glue, described to enclose The diameter on dam 4 is 9mm, and the width of the box dam dam body is 0.9mm.
As shown in Fig. 2, the figure is the spectral distribution curve figure that the present embodiment obtains, using the structure and ginseng of the present embodiment Number has obtained the sunlight of 3000K colour temperature, and colour rendering index Ra is 98, and the similarity degree Rf with sunlight is 91, fidelity With saturation degree all close to sunlight, health is comfortable.
Embodiment two
A kind of full spectrum COB light source, the light including substrate 1, at least two LED chips 2 and all LED chips 2 of covering Conversion coating 3;
The LED chip 2 includes at least one the first blue-light LED chip 21 and at least one second blue-light LED chip 22, The wavelength of first blue-light LED chip 21 is 480nm, and the wave-length coverage of second blue-light LED chip 22 is 460nm;
The light conversion layer 3 includes packaging plastic and the full spectrum fluorescent powder being uniformly distributed in inside the packaging plastic.
The substrate 1 is metal substrate or ceramic substrate, and front is provided with crystal bonding area, and the crystal bonding area is for installing LED chip 2.
The type of the LED chip 2 is two kinds, respectively the first blue-light LED chip 21 and the second blue-light LED chip 22, The proportional region of the quantity of first blue-light LED chip 21 and the quantity of second blue-light LED chip 22 is 60%, and Every setting.
The light conversion layer 3 covers all LED chips 2, is used to for the blue light that the LED chip 2 issues being converted to white Light, to obtain the light of full spectrum, the light conversion layer 3 includes packaging plastic and the full light being uniformly distributed in inside the packaging plastic Fluorescent powder is composed, the packaging plastic is epoxy resin or silica gel, for encapsulating all LED chips 2, and all LED chips 2 are protected, In the present embodiment, the packaging plastic is silica gel, due to the perfect heat-dissipating of silica gel, for improving the full spectrum COB light source Heat dissipation performance.
The full spectrum fluorescent powder includes Blue-green phosphor, green light fluorescent powder, yellow fluorescent powder and red light fluorescent powder.
Wherein, the weight ratio between the Blue-green phosphor and packaging plastic are as follows: 5%, excitation wavelength 500nm.
The green light fluorescent powder includes first wave length green light fluorescent powder and second wave length green light fluorescent powder, wherein described Weight ratio between one wavelength green light fluorescent powder and packaging plastic are as follows: 5%, the excitation wavelength of the first wave length green light fluorescent powder is 530nm。
Weight ratio between the second wave length green light fluorescent powder and packaging plastic are as follows: 10%, the second wave length fluorescent powder Excitation wavelength be 540nm.
Weight ratio between the yellow fluorescent powder and packaging plastic are as follows: 7%, excitation wavelength 575nm.
Weight ratio between the red light fluorescent powder and packaging plastic are as follows: 4%, excitation wavelength 660nm.
All LED chips can be smoothly covered for the ease of light conversion layer, further include box dam 4, the box dam 4 is in close ring Shape structure is set to the front of the substrate 1 and surrounds the crystal bonding area.The box dam 4 is made of white box dam glue, described to enclose The diameter on dam 4 is 9mm, and the width of the box dam dam body is 0.9mm.
As shown in figure 3, the figure is the spectral distribution curve figure that the present embodiment obtains, using the structure and ginseng of the present embodiment Number has obtained the sunlight of 5700K colour temperature, and colour rendering index Ra is 98, and the similarity degree Rf with sunlight is 95, fidelity With saturation degree all close to sunlight, health is comfortable.
Embodiment three
A kind of full spectrum COB light source, the light including substrate 1, at least two LED chips 2 and all LED chips 2 of covering Conversion coating 3;
The LED chip 2 includes at least one the first blue-light LED chip 21 and at least one second blue-light LED chip 22, The wavelength of first blue-light LED chip 21 is 475nm, and the wave-length coverage of second blue-light LED chip 22 is 447nm;
The light conversion layer 3 includes packaging plastic and the full spectrum fluorescent powder being uniformly distributed in inside the packaging plastic.
The substrate 1 is metal substrate or ceramic substrate, and front is provided with crystal bonding area, and the crystal bonding area is for installing LED chip 2.
The type of the LED chip 2 is two kinds, respectively the first blue-light LED chip 21 and the second blue-light LED chip 22, The proportional region of the quantity of first blue-light LED chip 21 and the quantity of second blue-light LED chip 22 is 60%, and Every setting.
The light conversion layer 3 covers all LED chips 2, is used to for the blue light that the LED chip 2 issues being converted to white Light, to obtain the light of full spectrum, the light conversion layer 3 includes packaging plastic and the full light being uniformly distributed in inside the packaging plastic Fluorescent powder is composed, the packaging plastic is epoxy resin or silica gel, for encapsulating all LED chips 2, and all LED chips 2 are protected, In the present embodiment, the packaging plastic is silica gel, due to the perfect heat-dissipating of silica gel, for improving the full spectrum COB light source Heat dissipation performance.
The full spectrum fluorescent powder includes Blue-green phosphor, green light fluorescent powder, yellow fluorescent powder and red light fluorescent powder.
Wherein, the weight ratio between the Blue-green phosphor and packaging plastic are as follows: 4%, excitation wavelength 490nm.
The green light fluorescent powder includes first wave length green light fluorescent powder and second wave length green light fluorescent powder, wherein described Weight ratio between one wavelength green light fluorescent powder and packaging plastic are as follows: 4%, the excitation wavelength of the first wave length green light fluorescent powder is 525nm。
Weight ratio between the second wave length green light fluorescent powder and packaging plastic are as follows: 9%, the second wave length fluorescent powder Excitation wavelength is 535nm.
Weight ratio between the yellow fluorescent powder and packaging plastic are as follows: 6%, excitation wavelength 565nm.
Weight ratio between the red light fluorescent powder and packaging plastic are as follows: 2%, excitation wavelength 640nm.
All LED chips can be smoothly covered for the ease of light conversion layer, further include box dam 4, the box dam 4 is in close ring Shape structure is set to the front of the substrate 1 and surrounds the crystal bonding area.The box dam 4 is made of white box dam glue, described to enclose The diameter on dam 4 is 9mm, and the width of the box dam dam body is 0.9mm.
As shown in figure 4, the figure is the spectral distribution curve figure that the present embodiment obtains, using the structure and ginseng of the present embodiment Number has obtained the sunlight of 4000K colour temperature, and colour rendering index Ra is 97, and the similarity degree Rf with sunlight is 96, fidelity With saturation degree all close to sunlight, health is comfortable.
Compared with prior art, the beneficial effects of the present invention are:
1, full spectrum COB light source provided by the invention excites full spectrum glimmering using the blue-light LED chip of two different wave lengths Light powder, colour rendering index Ra are greater than 97, and colour gamut is higher, breaches that traditional COB light source spectral gamut is low, colour rendering index is low asks Topic, can preferably restore the true color of object and the health for being more advantageous to human eye, on the other hand, be matched by different ratios Side's setting, realizes the simulation of sunlight in different time periods, is all larger than 90 with the similarity degree Rf of sunlight, fidelity and For saturation degree all close to sunlight, health is comfortable.
2, full spectrum COB light source provided by the invention, the crystal bonding area surface are provided with high reflection layer, the high reflection layer Reflectivity be higher than 98%, the high reflection layer is that mirror surface aluminium layer for improving the reflectivity of COB light source improves the COB light The light extraction efficiency in source.
The above is a preferred embodiment of the present invention, it is noted that for those skilled in the art For, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also considered as Protection scope of the present invention.

Claims (10)

1. a kind of full spectrum COB light source, which is characterized in that including substrate, at least two LED chips and all LED cores of covering The light conversion layer of piece;
The LED chip includes at least one first blue-light LED chip and at least one second blue-light LED chip, and described first The wave-length coverage of blue-light LED chip is 465-480nm, and the wave-length coverage of second blue-light LED chip is 440-460nm;
The light conversion layer includes packaging plastic and the full spectrum fluorescent powder that is uniformly distributed in inside the packaging plastic;
The full spectrum fluorescent powder includes Blue-green phosphor, green light fluorescent powder, yellow fluorescent powder and red light fluorescent powder, wherein institute State the weight ratio of Blue-green phosphor, green light fluorescent powder, yellow fluorescent powder and red light fluorescent powder respectively between packaging plastic are as follows: 3- 5%, 12-15%, 5-7% and 1-4%.
2. full spectrum COB light source according to claim 1, which is characterized in that the excitation wavelength of the Blue-green phosphor is 480-500nm, the excitation wavelength of green light fluorescent powder are 520-540nm, and the excitation wavelength of yellow fluorescent powder is 560-575nm, red The excitation wavelength of emitting phosphor is 630-660nm.
3. full spectrum COB light source according to claim 1 or 2, which is characterized in that the green light fluorescent powder includes first wave Long green light fluorescent powder and second wave length green light fluorescent powder, wherein the weight between the first wave length green light fluorescent powder and packaging plastic Measure ratio are as follows: 3-5%;
Weight ratio between the second wave length green light fluorescent powder and packaging plastic are as follows: 7-12%.
4. full spectrum COB light source according to claim 3, which is characterized in that the first wave length green light fluorescent powder swashs Hair wavelength is 520-530nm;
The excitation wavelength of the second wave length fluorescent powder is 530-540nm.
5. full spectrum COB light source according to claim 1, which is characterized in that first blue-light LED chip and described the The setting of two blue-light LED chip intervals;
The range of the ratio of number of the quantity of first blue-light LED chip and second blue-light LED chip are as follows: 25%- 60%.
6. full spectrum COB light source according to claim 1, which is characterized in that the front of the substrate is provided with crystal bonding area, The crystal bonding area is for installing the LED chip.
7. full spectrum COB light source according to claim 6, which is characterized in that further include box dam, the box dam is in close ring Shape structure is set to the front of the substrate and surrounds the crystal bonding area.
8. full spectrum COB light source according to claim 7, which is characterized in that the box dam is made of white box dam glue, institute The diameter for stating box dam is 9~13mm, and the width of the box dam dam body is 0.9~1.3mm.
9. full spectrum COB light source according to claim 1, which is characterized in that the substrate is metal substrate or ceramic base Plate.
10. full spectrum COB light source according to claim 6, which is characterized in that the surface of the crystal bonding area is provided with high anti- Penetrate layer.
CN201811292583.4A 2018-11-01 2018-11-01 A kind of full spectrum COB light source Pending CN109671831A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811292583.4A CN109671831A (en) 2018-11-01 2018-11-01 A kind of full spectrum COB light source

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811292583.4A CN109671831A (en) 2018-11-01 2018-11-01 A kind of full spectrum COB light source

Publications (1)

Publication Number Publication Date
CN109671831A true CN109671831A (en) 2019-04-23

Family

ID=66141713

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811292583.4A Pending CN109671831A (en) 2018-11-01 2018-11-01 A kind of full spectrum COB light source

Country Status (1)

Country Link
CN (1) CN109671831A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111081852A (en) * 2019-12-31 2020-04-28 广州硅能照明有限公司 Full-spectrum LED light source and LED lamp
CN111261624A (en) * 2020-02-28 2020-06-09 京东方科技集团股份有限公司 LED assembly, light source and liquid crystal display device
CN111653555A (en) * 2020-05-25 2020-09-11 中山市木林森电子有限公司 Full-spectrum LED light source and manufacturing method thereof
CN113241340A (en) * 2021-05-08 2021-08-10 上海煜珑电子科技有限公司 Optical device and method for manufacturing the same
CN113921683A (en) * 2021-09-06 2022-01-11 广州硅能照明有限公司 Colorful COB light source

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203800073U (en) * 2014-01-22 2014-08-27 深圳市众鑫旺电子科技有限公司 COB light source composite aluminum substrate support
CN104263359A (en) * 2014-09-12 2015-01-07 江门市科恒实业股份有限公司 Full spectrum LED (light-emitting diode) fluorescent powder and application thereof
CN204905250U (en) * 2015-08-06 2015-12-23 永林电子有限公司 COB packaging structure
CN105702837A (en) * 2015-12-10 2016-06-22 广东新光源电子科技有限公司 LED light source imitating spectrum of sunlight
CN105762144A (en) * 2016-05-24 2016-07-13 杜军 Full-spectrum high-color-rendering LED white light emitting device and manufacturing method thereof
CN105870303A (en) * 2016-04-18 2016-08-17 佛山市中昊光电科技有限公司 Full-spectrum LED light source
CN106328638A (en) * 2016-10-31 2017-01-11 佛山市中昊光电科技有限公司 COB light source
CN206163515U (en) * 2016-09-22 2017-05-10 佛山市中昊光电科技有限公司 LEDCOB device
CN107785477A (en) * 2017-09-18 2018-03-09 苏州汉瑞森光电科技股份有限公司 A kind of high heat conduction LED encapsulation structure
CN207966977U (en) * 2018-03-06 2018-10-12 东莞市伊伯光电科技有限公司 A kind of full spectrum COB light source

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203800073U (en) * 2014-01-22 2014-08-27 深圳市众鑫旺电子科技有限公司 COB light source composite aluminum substrate support
CN104263359A (en) * 2014-09-12 2015-01-07 江门市科恒实业股份有限公司 Full spectrum LED (light-emitting diode) fluorescent powder and application thereof
CN204905250U (en) * 2015-08-06 2015-12-23 永林电子有限公司 COB packaging structure
CN105702837A (en) * 2015-12-10 2016-06-22 广东新光源电子科技有限公司 LED light source imitating spectrum of sunlight
CN105870303A (en) * 2016-04-18 2016-08-17 佛山市中昊光电科技有限公司 Full-spectrum LED light source
CN105762144A (en) * 2016-05-24 2016-07-13 杜军 Full-spectrum high-color-rendering LED white light emitting device and manufacturing method thereof
CN206163515U (en) * 2016-09-22 2017-05-10 佛山市中昊光电科技有限公司 LEDCOB device
CN106328638A (en) * 2016-10-31 2017-01-11 佛山市中昊光电科技有限公司 COB light source
CN107785477A (en) * 2017-09-18 2018-03-09 苏州汉瑞森光电科技股份有限公司 A kind of high heat conduction LED encapsulation structure
CN207966977U (en) * 2018-03-06 2018-10-12 东莞市伊伯光电科技有限公司 A kind of full spectrum COB light source

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111081852A (en) * 2019-12-31 2020-04-28 广州硅能照明有限公司 Full-spectrum LED light source and LED lamp
CN111261624A (en) * 2020-02-28 2020-06-09 京东方科技集团股份有限公司 LED assembly, light source and liquid crystal display device
CN111261624B (en) * 2020-02-28 2022-08-09 京东方科技集团股份有限公司 LED assembly, light source and liquid crystal display device
US11500243B2 (en) 2020-02-28 2022-11-15 Chongqing Boe Optoelectronics Technology Co., Ltd. LED assembly, light source and liquid crystal display device
CN111653555A (en) * 2020-05-25 2020-09-11 中山市木林森电子有限公司 Full-spectrum LED light source and manufacturing method thereof
CN113241340A (en) * 2021-05-08 2021-08-10 上海煜珑电子科技有限公司 Optical device and method for manufacturing the same
CN113921683A (en) * 2021-09-06 2022-01-11 广州硅能照明有限公司 Colorful COB light source
CN113921683B (en) * 2021-09-06 2024-04-02 硅能光电半导体(广州)有限公司 Colorful COB light source

Similar Documents

Publication Publication Date Title
CN109671831A (en) A kind of full spectrum COB light source
CN105870303B (en) Full-spectrum LED light source
CN106664765B (en) Lighting device with variable colour gamut
US9241384B2 (en) Solid state lighting devices with adjustable color point
CN102687294B (en) Solid state emitter package including a plurality of emitters
CN102244185B (en) White light LED (light emitting diode) with high color rendering index, high light efficiency and low color temperature and preparation method thereof
CN111180428A (en) Spectrum dimming packaging structure containing purple light or near ultraviolet chip and manufacturing method thereof
CN106328638A (en) COB light source
CN109671836A (en) A kind of adjustable aobvious implementation method for referring to brightness-adjustable white light LEDs of adjustable color temperature
CN107623064A (en) Simulate LED light source of blackbody radiation spectrum and preparation method and application
CN114373850A (en) Full-spectrum LED light source, LED light emitting component and LED lighting device
CN113078250A (en) Natural light imitating full-spectrum LED light source and manufacturing method thereof
CN108878624A (en) A kind of white LED light source and lighting device
CN110047825A (en) It is a kind of can bluish-green two waveband excitated red fluorescent powder White-light LED package structure and illumination mode
CN108807648B (en) A kind of light-emitting diode encapsulation structure and packaging method
CN108561764B (en) LED filament structure and LED illumination lamp based on it
CN207350253U (en) Wavelength converter
CN107248511B (en) Three-primary-color white light LED with low-spinor rhythm factor
CN202495470U (en) White light emitting diode
CN205900592U (en) LED wafer packaging hardware
CN103887299A (en) High-voltage LED light source
CN207990231U (en) LED filament structure and LED illumination lamp based on it
CN208608225U (en) Low blue light damages LED light source
CN207818600U (en) A kind of color temperature-tunable LED packagings
CN208566216U (en) Low blue light LED light source and lighting device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20190423