CN206163515U - LEDCOB device - Google Patents
LEDCOB device Download PDFInfo
- Publication number
- CN206163515U CN206163515U CN201621069811.8U CN201621069811U CN206163515U CN 206163515 U CN206163515 U CN 206163515U CN 201621069811 U CN201621069811 U CN 201621069811U CN 206163515 U CN206163515 U CN 206163515U
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- Prior art keywords
- box dam
- chip
- led
- substrate
- bonding area
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- 239000000084 colloidal system Substances 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims description 37
- 239000013078 crystal Substances 0.000 claims description 30
- 239000002184 metal Substances 0.000 claims description 21
- 238000012856 packing Methods 0.000 claims description 11
- 238000002310 reflectometry Methods 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 abstract description 3
- 238000009434 installation Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 4
- 238000000605 extraction Methods 0.000 description 3
- 238000011900 installation process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005034 decoration Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model relates to a LEDCOB device, including base plate, at least one LED chip, driver chip and rectification chip, box dam and encapsulation colloid, the LED chip set up in on the base plate, the box dam includes first box dam and second box dam, the LED chip set up in in the first box dam, driver chip and rectification chip set up in in the second box dam, encapsulation colloid fill in in the box dam and cover LED chip and driver chip and the rectification chip in the box dam. The utility model provides a LEDCOB device will LED chip and driver chip and rectification chip all set up in on the base plate, driver chip and rectification chip drive LED chip for the LED chip can normally be worked, will the utility model discloses a LEDCOB device installs in application end, need not to install in addition drive arrangement, has simplified application end's installation greatly, and has reduced application end's installing component, more does benefit to application end's miniaturized design.
Description
Technical field
The utility model is related to a kind of LED encapsulation technologies field, more particularly to a kind of LED COB devices.
Background technology
Apply central in traditional LED, due to the low pressure constant current drive characteristic of LED itself, and line voltage is ac high-voltage,
LED cannot be supplied directly to use, therefore the LED/light source corresponding constant-current supply that must arrange in pairs or groups just can be used normally.LED/light source
The mode for powering up, causes many puzzlements, in lamp installation, it is necessary to a procedure more to the application of LED；In Design of Luminaires
On, it is necessary to consider power supply installing space；In light fixture sizing, it is necessary to consider matching for light source and power supply；On quality is reviewed, and
There is responsibility and evade hidden danger.
In order to overcome the above difficult, a kind of LED/light source that ac high-voltage driving can be used directly is expected on market, by power supply
Function be integrated in light source, and accomplished Highgrade integration, realize undersized design.
The utility model proposes a kind of LED COB light sources, directly can be driven using ac high-voltage, designed using COB, produced
Product reasonable in design, is installed on application end, without the need for loaded down with trivial details driving means, is easy to miniaturization.
The content of the invention
The technical problems to be solved in the utility model is to provide a kind of LED COB devices, can directly use ac high-voltage
Drive, designed using COB, product structure design rationally, is installed on application end, without the need for loaded down with trivial details driving means, be easy to miniaturization
Design.
In order to solve above-mentioned technical problem, the utility model proposes a kind of LED COB devices, including substrate, at least one
LED chip, driving chip and rectification chip, box dam and packing colloid, the LED chip is arranged on the substrate, described
Box dam includes the first box dam and the second box dam, and the LED chip is arranged in first box dam, the driving chip and rectification
Chip is arranged in second box dam, and the packing colloid is filled in the box dam and covers the LED chip in box dam, drives
Dynamic chip and rectification chip.
Preferably, the front of the substrate is provided with crystal bonding area and electrode district；
The crystal bonding area includes the first crystal bonding area and the second crystal bonding area, and first crystal bonding area is located at the central authorities of the substrate
Position；
Second crystal bonding area be distributed in a pair of the substrate it is diagonal on.
Preferably, the electrode district is the metal level for being arranged at the substrate front side.
Preferably, the metal level is provided with two, respectively the first metal layer and second metal layer, first metal
Layer and second metal layer respectively positioned at the substrate another pair it is diagonal on.
Preferably, the surface of first crystal bonding area is provided with high reflection layer, and the reflectivity of the high reflection layer is higher than
98%。
Preferably, first crystal bonding area is in closed hoop structure, its a diameter of 11mm.
Preferably, first box dam is made up of white box dam glue, a diameter of 0.4 ~ 1.0mm of first box dam.
Preferably, the substrate is ceramic substrate, rectangular, and its size is 19*19mm.
Preferably, the packing colloid is made up of transparent silica gel and fluorescent material.
Compared with prior art, the beneficial effects of the utility model are：
1st, the LED COB devices that the utility model is provided, the LED chip and driving chip and rectification chip are respectively provided with
On the substrate, driving chip and rectification chip drive LED chip so that LED chip can normal work, by this practicality newly
The LED COB devices of type are installed on application end, without the need for additionally mounted driving means, enormously simplify the installation process of application end,
And reduce the installing component of application end, the more conducively Miniaturization Design of application end.
2nd, the LED COB devices that the utility model is provided, the surface of first crystal bonding area is provided with high reflection layer, is used for
The reflectivity of LED COB devices is improved, the light extraction efficiency of the LED COB devices is improved, in addition, white box dam glue makes described
First box dam, further increases the reflectivity of LED COB devices.
Description of the drawings
Fig. 1 is the structural representation of the utility model LED COB devices.
Specific embodiment
In order that those skilled in the art more fully understands the technical solution of the utility model, below in conjunction with the accompanying drawings with it is excellent
The utility model is described in further detail to select embodiment.
As shown in figure 1, a kind of LED COB devices, including substrate 1, at least one LED chip 2, driving chip and rectification core
Piece 3, box dam 4 and packing colloid（Not shown in figure）, the LED chip 2 is arranged at 1 on the substrate, and the box dam 4 includes
First box dam 41 and the second box dam 42, the LED chip 2 is arranged in first box dam 41, the driving chip and rectification
Chip 3 is arranged in second box dam 42, and the packing colloid is filled in the box dam 4 and covers the LED core in box dam
Piece 2 and driving chip and rectification chip 3.
The substrate 1 is metal substrate or ceramic substrate, and in the present embodiment, the substrate is ceramic substrate, rectangular, its
Size is 19*19mm, and the front of the substrate is provided with crystal bonding area 11 and electrode district 12.
The crystal bonding area 11 includes the first crystal bonding area 111 and the second crystal bonding area 112, and first crystal bonding area 111 is located at institute
The middle position of substrate 1 is stated, it is rounded, for installing LED chip 2, in the present embodiment, the diameter of first crystal bonding area 111
For 11mm.More preferably, the surface of first crystal bonding area 111 is provided with high reflection layer, and the reflectivity of the high reflection layer is higher than
98%, for improving the reflectivity of LED COB devices, improve the light extraction efficiency of the LED COB devices；Second crystal bonding area
112 are distributed in a pair of the substrate 1 diagonally, for installing driving chip and rectification chip 3, wherein, it is described in the utility model
Be diagonally two non-conterminous angles of rectangle, mention in this specification and claims it is diagonal with this at diagonal implication phase
Together.
The electrode district 12 is the metal level for being arranged at the substrate front side, for realizing LED COB devices with external world's electricity
The electrical connection in source, the metal level is provided with two, respectively the first metal layer and second metal layer, the first metal layer and
Second metal layer respectively positioned at the another on diagonal of the substrate, the first metal layer and the second metal layer with it is described
Pass through circuit realiration electrical connection between crystal bonding area 11.
The LED chip 2 is arranged at first crystal bonding area 111, and in the present embodiment, the LED chip 2 is multiple, LED
Electrical connection logical relation is provided between chip 2, such that it is able to realize that single-order drives or multistage driving.
The box dam 4 includes the first box dam 41 and the second box dam 42, and first box dam 41 is in closed hoop structure, is arranged
In the front of the substrate 1 and surround first crystal bonding area 111.First box dam 41 is made up of box dam glue, the box dam
Glue is white.A diameter of 0.4 ~ 1.0mm of first box dam.The utility model makes described first and encloses using white box dam glue
Dam, for improving the reflectivity of LED COB devices, the width of the box dam dam body is set to 0.4 ~ 1.0mm, if the box dam
The width of dam body is less than 0.4mm, then box dam is too small with the adhesion of the substrate, easily comes off, the reliability of LED COB devices
Difference, if the width of the box dam dam body is more than 1.0mm, takes the excessive area of the substrate, is unfavorable for LED COB devices
Miniaturization Design；Second box dam 42 is arranged at a pair of couple of the substrate 1 in regular or erose closing structure
On angle and surround second crystal bonding area 112.
The packing colloid can be transparent enclosure colloid, or the packing colloid for being mixed with fluorescent material, this enforcement
In example, the packing colloid is made up of transparent silica gel and fluorescent material, and fluorescent material is uniformly distributed in inside the transparent silica gel.
The utility model may be contained within the LED chip and driving chip and rectification chip on the substrate, drive core
Piece and rectification chip drive LED chip so that LED chip can normal work, LED COB devices of the present utility model are installed
In application end, without the need for additionally mounted driving means, the installation process of application end is enormously simplify, and reduce the installation of application end
The Miniaturization Design of part, more conducively application end.
Compared with prior art, the beneficial effects of the utility model are：
1st, the LED COB devices that the utility model is provided, the LED chip and driving chip and rectification chip are respectively provided with
On the substrate, driving chip and rectification chip drive LED chip so that LED chip can normal work, by this practicality newly
The LED COB devices of type are installed on application end, without the need for additionally mounted driving means, enormously simplify the installation process of application end,
And reduce the installing component of application end, the more conducively Miniaturization Design of application end.
2nd, the LED COB devices that the utility model is provided, the surface of first crystal bonding area is provided with high reflection layer, is used for
The reflectivity of LED COB devices is improved, the light extraction efficiency of the LED COB devices is improved, in addition, white box dam glue makes described
First box dam, further increases the reflectivity of LED COB devices.
The above is preferred embodiment of the present utility model, it is noted that for the ordinary skill of the art
For personnel, on the premise of without departing from the utility model principle, some improvements and modifications can also be made, these improve and moisten
Decorations are also considered as protection domain of the present utility model.
Claims (9)
1. a kind of LED COB devices, it is characterised in that including substrate, at least one LED chip, driving chip and rectification chip,
Box dam and packing colloid, the LED chip is arranged on the substrate, and the box dam includes the first box dam and the second box dam,
The LED chip is arranged in first box dam, and the driving chip and rectification chip are arranged in second box dam, institute
State packing colloid and be filled in the box dam and cover the LED chip in box dam, driving chip and rectification chip.
2. LED COB devices according to claim 1, it is characterised in that the front of the substrate be provided with crystal bonding area and
Electrode district；
The crystal bonding area includes the first crystal bonding area and the second crystal bonding area, and first crystal bonding area is located at the central position of the substrate
Put；
Second crystal bonding area be distributed in a pair of the substrate it is diagonal on.
3. LED COB devices according to claim 2, it is characterised in that the electrode district is to be arranged at the substrate just
The metal level in face.
4. LED COB devices according to claim 3, it is characterised in that the metal level is provided with two, respectively
The another pair of one metal level and second metal layer, the first metal layer and second metal layer respectively positioned at the substrate is diagonal
On.
5. LED COB devices according to claim 2, it is characterised in that the surface of first crystal bonding area is provided with height
Reflecting layer, the reflectivity of the high reflection layer is higher than 98%.
6. LED COB devices according to claim 2, it is characterised in that first crystal bonding area is in closed hoop structure,
Its a diameter of 11mm.
7. LED COB devices according to claim 1, it is characterised in that first box dam is made up of white box dam glue,
A diameter of 0.4 ~ 1.0mm of first box dam.
8. LED COB devices according to claim 1, it is characterised in that the substrate is ceramic substrate, rectangular, its
Size is 19*19mm.
9. LED COB devices according to claim 1, it is characterised in that the packing colloid is by transparent silica gel and fluorescence
Powder is constituted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621069811.8U CN206163515U (en) | 2016-09-22 | 2016-09-22 | LEDCOB device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621069811.8U CN206163515U (en) | 2016-09-22 | 2016-09-22 | LEDCOB device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206163515U true CN206163515U (en) | 2017-05-10 |
Family
ID=58651147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621069811.8U Active CN206163515U (en) | 2016-09-22 | 2016-09-22 | LEDCOB device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206163515U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109671831A (en) * | 2018-11-01 | 2019-04-23 | 佛山市中昊光电科技有限公司 | A kind of full spectrum COB light source |
| CN111211212A (en) * | 2020-03-17 | 2020-05-29 | 宁波升谱光电股份有限公司 | LED device and preparation method thereof |
-
2016
- 2016-09-22 CN CN201621069811.8U patent/CN206163515U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109671831A (en) * | 2018-11-01 | 2019-04-23 | 佛山市中昊光电科技有限公司 | A kind of full spectrum COB light source |
| CN111211212A (en) * | 2020-03-17 | 2020-05-29 | 宁波升谱光电股份有限公司 | LED device and preparation method thereof |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
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| CP02 | Change in the address of a patent holder |
Address after: Unit 404, 4th floor, building 3, area a, Hantian science and Technology City, 17 Shenhai Road, Guicheng Street, Nanhai District, Foshan City, Guangdong Province, 528225 Patentee after: FOSHAN EVERCORE OPTOELECTRONIC TECHNOLOGY CO.,LTD. Address before: 528200 room A304, building a, Chongxian building (R & D building), Nanhai software technology park, Shishan town, Nanhai District, Foshan City, Guangdong Province Patentee before: FOSHAN EVERCORE OPTOELECTRONIC TECHNOLOGY CO.,LTD. |