CN213816134U - Semiconductor packaging carrier plate - Google Patents
Semiconductor packaging carrier plate Download PDFInfo
- Publication number
- CN213816134U CN213816134U CN202023308410.2U CN202023308410U CN213816134U CN 213816134 U CN213816134 U CN 213816134U CN 202023308410 U CN202023308410 U CN 202023308410U CN 213816134 U CN213816134 U CN 213816134U
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- installation
- encapsulation
- chip
- support plate
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Abstract
The utility model discloses a semiconductor packaging support plate, including the installation chip, the installation chip outside is provided with the encapsulation frame, the installation chip outside is provided with the wire, the wire bottom is provided with the connection footing, the connection footing bottom is provided with the encapsulation support plate, be provided with the encapsulation glue film in the encapsulation support plate, the installation chip bottom is provided with the heat-conducting plate, encapsulation support plate top is provided with the circuit layer, the circuit layer inboard is provided with the heating panel, the heating panel outside is provided with the installation heelpiece, the installation heelpiece outside is provided with the spread groove, the installation chip passes through wire and connection footing electric connection, the encapsulation frame is made through the plastic envelope technology by epoxy molding compound, connection footing and spread groove welding, the solder is pure tin or tin alloy; through the arrangement of the semiconductor packaging carrier plate, the purposes of increasing the connection strength and improving the heat dissipation efficiency can be achieved.
Description
Technical Field
The utility model relates to a semiconductor package technical field specifically is a semiconductor package support plate.
Background
The semiconductor product is soldered on a PCB (Printed Circuit Board) using tin to achieve Circuit connection. Since the device heats up during use, both the device and the PCB board expand under the influence of heat. Due to the fact that the thermal expansion coefficient difference between the PCB and the device is large, certain internal stress exists, and the service life of the device on the PCB is further influenced.
At present, a plurality of packaging structures exist in a semiconductor packaging system, the packaging structures are respectively suitable for different application and production process systems, the traditional SOP packaging is convenient to use and is suitable for a red glue production process and a solder paste production process, but the packaging structures have poor heat dissipation conditions and very limited application power density.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to prior art's weak point, provide a semiconductor package support plate to reach and increased joint strength, improved radiating efficiency's purpose.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a semiconductor package support plate, includes the installation chip, the installation chip outside is provided with the encapsulation frame, the installation chip outside is provided with the wire, the wire bottom is provided with the connection footing, connection footing bottom is provided with the encapsulation support plate, be provided with the encapsulation glue film in the encapsulation support plate, installation chip bottom is provided with the heat-conducting plate, encapsulation support plate top is provided with the circuit layer, circuit layer inboard is provided with the heating panel, the heating panel outside is provided with the installation heelpiece, the installation heelpiece outside is provided with the spread groove.
As the utility model discloses a preferred technical scheme, the installation chip passes through the wire and is connected footing electric connection.
As the preferred technical scheme of the utility model, the encapsulation frame is made through the plastic envelope technology by the epoxy plastic envelope material.
As the utility model discloses a preferred technical scheme, the connection footing and spread groove welding, the solder is pure tin or tin alloy.
As the utility model discloses an optimized technical scheme, the heat-conducting plate size and the size looks adaptation of cooling plate, the heat-conducting plate corresponds the setting with the cooling plate.
As the utility model discloses an optimal technical scheme, the installation chip is through connecting footing and spread groove electric connection, it is provided with a plurality of groups with the spread groove to connect the footing, it corresponds the setting with the spread groove to connect the footing.
Compared with the prior art, the utility model provides a semiconductor package support plate possesses following beneficial effect:
1. the semiconductor packaging support plate is manufactured by the epoxy plastic packaging material through the packaging outer frame through the plastic packaging process, compared with airtight metal and ceramic packaging, the semiconductor packaging support plate has the advantages of light weight, simple structure, good chemical corrosion resistance, good electrical insulation performance, high mechanical strength and the like, prevents the electrical performance from being reduced and dense due to the corrosion of impurities in the air to the circuit of a chip, can adopt the plastic packaging process, is convenient in process and convenient for automatic processing, improves the packaging efficiency and reduces the cost;
2. the semiconductor packaging carrier plate is welded with the connecting feet and the connecting grooves, and the solder is pure tin or tin alloy, so that the semiconductor packaging carrier plate is convenient to use and can be combined with most metals; the size of the heat conducting plate is matched with that of the heat radiating plate, and the heat conducting plate and the heat radiating plate are correspondingly arranged, so that effective heat radiation can be performed, and the service life can be prolonged; the installation chip is through connecting footing and spread groove electric connection, and the connection footing is provided with a plurality of groups with the spread groove, and the connection footing corresponds the setting with the spread groove, improves semiconductor package's structural connection intensity, has improved the use reliability.
Drawings
FIG. 1 is a schematic view of the main structure of the present invention;
fig. 2 is a schematic diagram of the package carrier structure of the present invention.
In the figure: 1. mounting a chip; 2. packaging the outer frame; 3. a wire; 4. connecting bottom feet; 5. packaging a carrier plate; 6. packaging the adhesive layer; 7. a heat conducting plate; 8. a circuit layer; 9. a heat dissipation plate; 10. mounting a bottom cushion; 11. and connecting the grooves.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, in this embodiment: the utility model provides a semiconductor package support plate, including installation chip 1, installation chip 1 outside is provided with encapsulation frame 2, installation chip 1 outside is provided with wire 3, the 3 bottom of wire is provided with connection footing 4, connection footing 4 bottom is provided with encapsulation support plate 5, be provided with encapsulation glue film 6 in the encapsulation support plate 5, installation chip 1 bottom is provided with heat-conducting plate 7, encapsulation support plate 5 top is provided with circuit layer 8, circuit layer 8 inboard is provided with heating panel 9, the heating panel 9 outside is provided with installation heelpiece 10, the installation heelpiece 10 outside is provided with spread groove 11.
In the embodiment, the mounting chip 1 is electrically connected with the connecting feet 4 through the wires 3, so that the mounting connection of the mounting chip 1 is facilitated; the packaging outer frame 2 is made of epoxy plastic packaging material through a plastic packaging process, and compared with airtight metal and ceramic packaging, the packaging outer frame has the advantages of light weight, simple structure, good chemical corrosion resistance, good electrical insulation performance, high mechanical strength and the like, prevents the electrical performance from being reduced and dense due to the corrosion of impurities in the air on the circuit of the chip, can adopt the plastic packaging process, is convenient in process and convenient for automatic processing, improves the packaging efficiency and reduces the cost; the connecting feet 4 are welded with the connecting grooves 11, and the solder is pure tin or tin alloy, so that the device is convenient to use and can be combined with most metals; the size of the heat conducting plate 7 is matched with that of the heat radiating plate 9, and the heat conducting plate 7 and the heat radiating plate 9 are arranged correspondingly, so that effective heat radiation can be carried out, and the service life is prolonged; installation chip 1 is through connecting footing 4 and spread groove 11 electric connection, and connecting footing 4 is provided with a plurality of groups with spread groove 11, and connecting footing 4 corresponds the setting with spread groove 11, sets up the structural connection intensity that improves semiconductor package like this, has improved the use reliability.
The utility model discloses a theory of operation and use flow: when the mounting structure is used, the mounting chip 1 is electrically connected with the connecting feet 4 through the wires 3, so that the mounting connection of the mounting chip 1 is facilitated; the packaging outer frame 2 is made of epoxy plastic packaging material through a plastic packaging process, and compared with airtight metal and ceramic packaging, the packaging outer frame has the advantages of light weight, simple structure, good chemical corrosion resistance, good electrical insulation performance, high mechanical strength and the like, prevents the electrical performance from being reduced and dense due to the corrosion of impurities in the air to the circuit of the chip, can adopt the plastic packaging process, is convenient in process and convenient for automatic processing, improves the packaging efficiency and reduces the cost; the connecting feet 4 are welded with the connecting grooves 11, and the solder is pure tin or tin alloy, so that the connecting device is convenient to use and can be combined with most metals; the size of the heat conducting plate 7 is matched with that of the heat radiating plate 9, and the heat conducting plate 7 and the heat radiating plate 9 are arranged correspondingly, so that the heat can be effectively radiated, and the service life can be prolonged; installation chip 1 is through connecting footing 4 and spread groove 11 electric connection, and connecting footing 4 is provided with a plurality of groups with spread groove 11, and connecting footing 4 corresponds the setting with spread groove 11, improves semiconductor package's structural connection intensity, has improved the use reliability.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A semiconductor package carrier is characterized in that: including installation chip (1), installation chip (1) outside is provided with encapsulation frame (2), installation chip (1) outside is provided with wire (3), wire (3) bottom is provided with connection footing (4), connection footing (4) bottom is provided with encapsulation support plate (5), be provided with encapsulation glue film (6) in encapsulation support plate (5), installation chip (1) bottom is provided with heat-conducting plate (7), encapsulation support plate (5) top is provided with circuit layer (8), circuit layer (8) inboard is provided with heating panel (9), the heating panel (9) outside is provided with installation heelpiece (10), installation heelpiece (10) outside is provided with spread groove (11).
2. The semiconductor package carrier of claim 1, wherein: the mounting chip (1) is electrically connected with the connecting feet (4) through the wires (3).
3. The semiconductor package carrier of claim 1, wherein: the packaging outer frame (2) is made of epoxy plastic packaging material through a plastic packaging process.
4. The semiconductor package carrier of claim 1, wherein: the connecting feet (4) are welded with the connecting grooves (11), and the solder is pure tin or tin alloy.
5. The semiconductor package carrier of claim 1, wherein: the size of the heat conducting plate (7) is matched with that of the heat dissipation plate (9), and the heat conducting plate (7) and the heat dissipation plate (9) are correspondingly arranged.
6. The semiconductor package carrier of claim 1, wherein: the mounting chip (1) is electrically connected with the connecting grooves (11) through connecting feet (4), the connecting feet (4) and the connecting grooves (11) are provided with a plurality of groups, and the connecting feet (4) correspond to the connecting grooves (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023308410.2U CN213816134U (en) | 2020-12-31 | 2020-12-31 | Semiconductor packaging carrier plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023308410.2U CN213816134U (en) | 2020-12-31 | 2020-12-31 | Semiconductor packaging carrier plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213816134U true CN213816134U (en) | 2021-07-27 |
Family
ID=76948077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023308410.2U Active CN213816134U (en) | 2020-12-31 | 2020-12-31 | Semiconductor packaging carrier plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213816134U (en) |
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2020
- 2020-12-31 CN CN202023308410.2U patent/CN213816134U/en active Active
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