CN211929533U - High-voltage bulb lamp COB light source device with bidirectional heat conduction - Google Patents
High-voltage bulb lamp COB light source device with bidirectional heat conduction Download PDFInfo
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- CN211929533U CN211929533U CN202020355113.4U CN202020355113U CN211929533U CN 211929533 U CN211929533 U CN 211929533U CN 202020355113 U CN202020355113 U CN 202020355113U CN 211929533 U CN211929533 U CN 211929533U
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Abstract
The utility model provides a high-pressure ball bubble lamp COB light source device with two-way heat conduction, include: the mirror surface aluminum substrate is fixedly provided with an insulating layer on the upper surface; the insulating layer is provided with a die bonding area; the positive electrode circuit layer is fixedly arranged on the upper surface of the insulating layer; the negative electrode circuit layer is fixedly arranged on the upper surface of the insulating layer; the solid crystal region is also positioned between the positive circuit layer and the negative circuit layer; the LED chip group is fixedly arranged in the die bonding area; the sapphire is fixedly arranged in the solid crystal area; the fluorescent ceramic layer covers the LED chip group and the sapphire; the LED chip group comprises one hundred to two hundred LED chips which are connected in series, a positive lead of the LED chip group is connected with a positive circuit layer, a negative lead of the LED chip group is connected with a negative circuit layer, a plurality of sapphires are embedded in the arrangement of the LED chips, and the mirror surface aluminum substrate is fixedly arranged in a lamp body of the bulb lamp. The utility model has the advantages that: the utility model embeds sapphire in the arrangement of LED chips, and uses the fluorescent ceramic packaging technology to realize the effect of bidirectional heat conduction; the service life is prolonged.
Description
[ technical field ] A method for producing a semiconductor device
The utility model relates to a COB light source equipment specifically relates to a high-pressure ball bubble lamp COB light source device with two-way heat conduction.
[ background of the invention ]
COB light source is a high light efficiency integrated surface light source technology which directly pastes LED chips on a mirror surface metal substrate with high light reflection rate. The LED bulb lamp is in a bulb shape which is used by people, namely, a sphere shape, and the LED chip is selected as an internal light source.
[ Utility model ] content
The to-be-solved technical problem of the utility model lies in providing a high-pressure ball bubble lamp COB light source device with two-way heat conduction, and the heat conduction radiating effect is good.
The utility model discloses a realize like this: a high-pressure ball bubble lamp COB light source device with two-way heat conduction includes:
the mirror surface aluminum substrate is fixedly provided with an insulating layer on the upper surface; the insulating layer is provided with a die bonding area;
the positive circuit layer is fixedly arranged on the upper surface of the insulating layer;
the negative electrode circuit layer is fixedly arranged on the upper surface of the insulating layer; the solid crystal region is also positioned between the positive electrode circuit layer and the negative electrode circuit layer;
the LED chip group is fixedly arranged in the die bonding area;
the sapphire is fixedly arranged in the solid crystal area;
the fluorescent ceramic layer covers the LED chip group and the sapphire;
the LED light bulb lamp is characterized in that the LED chip group comprises one hundred to two hundred LED chips which are connected in series, a positive lead of the LED chip group is connected with the positive circuit layer, a negative lead of the LED chip group is connected with the negative circuit layer, a plurality of sapphires are embedded in the arrangement of the LED chips, the mirror surface aluminum substrate is fixedly arranged in a lamp body of the bulb lamp, and the reflection rate of the mirror surface aluminum substrate is greater than 98%.
Further, the LED chip groups are three, the LED chips connected in series in each LED chip group are one hundred and eighteen, and the sapphire is thirty-six.
Further, the insulating layer is a BT material insulating layer.
Further, the positive circuit layer is provided with a positive power supply connecting end and a positive lead connecting end, the positive lead of the LED chip set is connected with the positive lead connecting end, the negative circuit layer is provided with a negative power supply connecting end and a negative lead connecting end, and the negative lead of the LED chip set is connected with the negative lead connecting end.
Further, the die bonding area is circular, and the connecting end of the anode lead and the connecting end of the cathode lead are circular arc-shaped.
The utility model has the advantages that: the utility model embeds sapphire in the arrangement of LED chips, and uses the fluorescent ceramic packaging technology to realize the effect of bidirectional heat conduction; the utility model discloses the ball bubble lamp radiating effect of preparation is good, and used voltage is high when luminous, and the electric current of production is low, effectively reduces calorific capacity of power, has improved life.
[ description of the drawings ]
The invention will be further described with reference to the following examples with reference to the accompanying drawings.
Fig. 1 is the utility model discloses a high-pressure ball bubble lamp COB light source device's with two-way heat conduction structure schematic diagram.
FIG. 2 is a schematic diagram of the position of sapphire in the die bonding area of FIG. 1 with the LED chip set removed
Fig. 3 is a schematic diagram illustrating the specification of the mirror aluminum substrate of the present invention.
Fig. 4 is a schematic diagram of a circuit layer on the mirror-surface aluminum substrate of the present invention.
The labels in the figure are: the LED mirror surface aluminum substrate comprises a mirror surface aluminum substrate 1, a solid crystal region 11, an LED chip group 2, sapphire 3, an anode power supply connecting end 4, an anode lead connecting end 5, a cathode power supply connecting end 6, a cathode lead connecting end 7 and a temperature detection end 8.
[ detailed description ] embodiments
The embodiment of the utility model provides a through providing a high-pressure ball bubble lamp COB light source device with two-way heat conduction, solved among the prior art the ball bubble lamp technical problem that dispels the heat poor, realized the good long service life's of heat dissipation technical effect.
The embodiment of the utility model provides an in technical scheme for solving above-mentioned problem, the general thinking is as follows: the LED light source structure is characterized in that a mirror surface aluminum substrate is used as a light source substrate, sapphire is embedded in the arrangement of LED chips in a solid crystal region, a fluorescent ceramic packaging technology is used, and the light source substrate is arranged in a lamp body of a bulb lamp.
For better understanding of the above technical solutions, the following detailed descriptions will be provided in conjunction with the drawings and the detailed description of the embodiments.
Referring to fig. 1 to 4, the present invention provides a preferred embodiment of a COB light source device of a high-pressure bulb lamp with bidirectional heat conduction. The utility model discloses a: the mirror surface aluminum substrate 1 is fixedly provided with an insulating layer on the upper surface; the insulating layer is provided with a die bonding area 11; the die bonding area 11 is used for mounting the LED chip and the sapphire 3; the positive circuit layer is fixedly arranged on the upper surface of the insulating layer; the negative electrode circuit layer is fixedly arranged on the upper surface of the insulating layer; the solid crystal region 11 is also positioned between the positive electrode circuit layer and the negative electrode circuit layer; the LED chip group 2 is fixedly arranged in the die bonding area 11; the sapphire 3 is fixedly arranged in the solid crystal area 11; namely, the LED chip group in the die bonding area and the sapphire are directly contacted with the mirror surface aluminum substrate; the fluorescent ceramic layer covers the LED chip group 2 and the sapphire 3; the fluorescent ceramic is a transparent ceramic material, has the advantages of both crystal and glass, and has the advantages of high thermal conductivity, strong light irradiation resistance, high optical output performance and the like.
The LED chip group 2 comprises LED chips which are connected in series, a positive lead of the LED chip group 2 is connected with the positive circuit layer, a negative lead of the LED chip group 2 is connected with the negative circuit layer, a plurality of sapphires 3 are embedded in the arrangement of the LED chips, and the sapphires 3 can absorb heat generated by the adjacent LED chips and transmit the heat to the mirror aluminum substrate 1 and the fluorescent ceramic chip to realize up-and-down bidirectional heat conduction; meanwhile, heat generated by the LED chip is absorbed by the mirror aluminum substrate 1. The mirror surface aluminum substrate 1 is fixedly arranged in a bulb lamp body, and the reflection rate of the mirror surface aluminum substrate 1 is more than 98%; the radiating effect of the bulb lamp is improved.
The number of the LED chip groups 2 is three, one hundred and eighteen LED chips are connected in series in each LED chip group 2, and the number of the sapphire chips 3 is thirty-six. One hundred and eighteen LED chips connected in series are used for increasing the power supply voltage used during light emitting; the three LED chip groups 2 are connected in parallel, so that the power supply current used in the light emitting process is reduced, the heat productivity of the power supply is effectively reduced, and the service life is prolonged.
The insulating layer is a BT material insulating layer. The BT material is thermosetting resin formed by taking Bismaleimide (BMD) and triazine as main resin components and adding epoxy resin, polyphenylene ether resin (PPE) or allyl compound and the like as modified components, and is applied to a printed circuit board.
The positive circuit layer has positive power supply link 4 and anodal pin-out terminal 5, the anodal lead wire of LED chipset 2 with anodal pin-out terminal 5 is connected, the negative circuit layer has negative power supply link 6 and negative pin-out terminal 7, the negative lead wire of LED chipset 2 with negative pin-out terminal 7 is connected. The cathode circuit layer is also provided with a temperature detection end 8 for detecting the temperature of the mirror surface aluminum substrate 1 during working. The positive electrode circuit layer and the negative electrode circuit layer can adopt copper foils. And insulating materials are laid on the positive electrode circuit layer and the negative electrode circuit layer.
The LED chip adopts Pry BXCD2630-D5-L1, and the size is as follows: 26 x 30 x 5.9 mil; emission wavelength: 450-455 nm; the starting voltage: 2.8-2.9V, power 245-255 mW.
The die bonding area 11 is circular, and the anode lead connecting end 5 and the cathode lead connecting end 7 are circular arcs. The surface of the mirror aluminum substrate 1 is provided with a white ink layer with high reflectivity, and the solid crystal region 11, the anode power supply connecting end 4, the anode lead connecting end 5, the cathode power supply connecting end 6 and the cathode lead connecting end 7 are exposed. In fig. 3: l1-47 mm, L2-47 mm, L3-6.7 mm, L4-6.7 mm, L5-3.5 mm, L6-3.8 mm, L7-7 mm, D1-29 mm, D2-30.6 mm, D3-29.6 mm; tolerance ± 0.15 mm. The size of the mirror surface aluminum substrate 1 is matched with the specification of bulb lamps on the market. The finished mirror aluminum substrate 1 has a thickness of 1cm and is resistant to 3 KV.
The utility model discloses work: the positive power supply connection area and the negative power supply connection area are connected with a power supply, three LED chip sets 2 which are connected in parallel in the die bonding area 11, and one hundred and eighteen LED chips which are connected in series in each LED chip set 2 start to emit light; compared with the traditional bulb lamp, the utility model has high voltage and low current, effectively reduces the heat productivity of the power supply and prolongs the service life; the sapphire 3 can absorb heat generated by adjacent LED chips and transmit the heat to the mirror aluminum substrate 1 and the fluorescent ceramic plate, so that up-and-down bidirectional heat conduction is realized; meanwhile, heat generated by the LED chip is absorbed by the mirror aluminum substrate 1.
Although specific embodiments of the present invention have been described, it will be understood by those skilled in the art that the specific embodiments described are illustrative only and are not limiting upon the scope of the invention, and that equivalent modifications and variations can be made by those skilled in the art without departing from the spirit of the invention, which is to be limited only by the claims appended hereto.
Claims (5)
1. The utility model provides a high-pressure ball bubble lamp COB light source device with two-way heat conduction which characterized in that includes:
the upper surface of the mirror aluminum substrate is fixedly provided with an insulating layer; the insulating layer is provided with a die bonding area;
the positive circuit layer is fixedly arranged on the upper surface of the insulating layer;
the negative electrode circuit layer is fixedly arranged on the upper surface of the insulating layer; the solid crystal region is also positioned between the positive electrode circuit layer and the negative electrode circuit layer;
the LED chip group is fixedly arranged in the die bonding area;
the sapphire is fixedly arranged in the solid crystal area;
the fluorescent ceramic layer covers the LED chip group and the sapphire;
the LED light bulb lamp is characterized in that the LED chip group comprises one hundred to two hundred LED chips which are connected in series, a positive lead of the LED chip group is connected with the positive circuit layer, a negative lead of the LED chip group is connected with the negative circuit layer, a plurality of sapphires are embedded in the arrangement of the LED chips, the mirror surface aluminum substrate is fixedly arranged in a lamp body of the bulb lamp, and the reflection rate of the mirror surface aluminum substrate is greater than 98%.
2. The COB light source device with the bidirectional heat conduction high-pressure bulb lamp is characterized in that the number of the LED chip groups is three, the number of the LED chips connected in series in each LED chip group is one hundred and eighteen, and the number of the sapphire is thirty-six.
3. The COB light source device with the bidirectional heat conduction high-pressure bulb lamp as claimed in claim 1, wherein the insulation layer is a BT material insulation layer.
4. The COB light source device with the bidirectional heat conduction high-voltage bulb lamp as claimed in claim 1, wherein the positive circuit layer has a positive power connection end and a positive lead connection end, the positive lead of the LED chip set is connected with the positive lead connection end, the negative circuit layer has a negative power connection end and a negative lead connection end, and the negative lead of the LED chip set is connected with the negative lead connection end.
5. The COB light source device with the bidirectional heat conduction high-pressure bulb lamp as claimed in claim 4, wherein the die bonding region is circular, and the positive lead connecting end and the negative lead connecting end are circular arcs.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020355113.4U CN211929533U (en) | 2020-03-19 | 2020-03-19 | High-voltage bulb lamp COB light source device with bidirectional heat conduction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020355113.4U CN211929533U (en) | 2020-03-19 | 2020-03-19 | High-voltage bulb lamp COB light source device with bidirectional heat conduction |
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| Publication Number | Publication Date |
|---|---|
| CN211929533U true CN211929533U (en) | 2020-11-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020355113.4U Active CN211929533U (en) | 2020-03-19 | 2020-03-19 | High-voltage bulb lamp COB light source device with bidirectional heat conduction |
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| Country | Link |
|---|---|
| CN (1) | CN211929533U (en) |
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- 2020-03-19 CN CN202020355113.4U patent/CN211929533U/en active Active
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