CN212851525U

CN212851525U - SMD electronic components

Info

Publication number: CN212851525U
Application number: CN202021604523.4U
Authority: CN
Inventors: 顾志红
Original assignee: Shenzhen Zhihuaxin Electronics Co ltd
Current assignee: Shenzhen Zhihuaxin Electronics Co ltd
Priority date: 2020-08-05
Filing date: 2020-08-05
Publication date: 2021-03-30
Anticipated expiration: 2030-08-05

Abstract

The utility model discloses a SMD electronic components, including base plate, tooth knot, inoxidizing coating, chip, conducting strip, protective cover and absorption paster, the tooth is detained and is located the both sides of base plate, the inoxidizing coating is located the top of base plate, the chip is located the inside of base plate, the conducting strip is located the bottom of base plate, the protective cover is located the top of base plate, it is located to adsorb the paster the bottom of base plate, the base plate includes the radiating groove, the radiating groove is located one side of base plate, the protective cover includes the protecting groove, the protecting groove is located the bottom of protective cover, the protective cover with base plate hinge fixed connection, the inoxidizing coating with base plate bolt fixed connection. The utility model discloses not only have the effect of being convenient for protect and radiating, but also have the effect of being convenient for adsorb fixedly and signal indication, be fit for using widely.

Description

SMD electronic components

Technical Field

The utility model relates to an electronic components field particularly, relates to a SMD electronic components.

Background

The existing chip electronic components have small size, small power, small capacity, low voltage and the like, and are manufactured by electrodes on two ends of a ceramic cylinder, the components have unified size standard and mature surface mounting technology, most of the large size, large power, large capacity, high voltage and other electronic components currently adopt plug-in vertical encapsulated products with low price, the miniaturization and chip mounting of the products are the development trend of electronic products, the large size, large power, large capacity, high voltage and other electronic components currently adopt two leads oppositely welded on two sides of a chip electronic component, and plastic-packaged chip products are formed by plastic packaging and twice bending, chip-mounted diodes, chip-mounted TVS tubes, chip-mounted rectifier bridges and the like on the market are the type of process for producing the chip-mounted products, and the type of products have mature process.

However, the traditional patch type electronic component can generate a large amount of high temperature after working for a long time, is difficult to dissipate heat, has poor protection effect, cannot be adsorbed and fixed with a circuit board, and can not meet the requirements of people gradually.

An effective solution to the problems in the related art has not been proposed yet.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a SMD electronic components to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: including base plate, tooth knot, inoxidizing coating, chip, conducting strip, protective cover and absorption paster, the tooth is detained and is located the both sides of base plate, the inoxidizing coating is located the top of base plate, the chip is located the inside of base plate, the conducting strip is located the bottom of base plate, the protective cover is located the top of base plate, the absorption paster is located the bottom of base plate, the base plate includes the radiating groove, the radiating groove is located one side of base plate, the protective cover includes the protective groove, the protective groove is located the bottom of protective cover, the protective cover with base plate hinge fixed connection, the inoxidizing coating with base plate bolt fixed connection.

Furthermore, the heat dissipation grooves are a plurality of, and the heat conduction sheets are fixedly connected with the substrate.

Furthermore, the tooth buckles are a plurality of and are fixedly connected with the base plate through bolts.

Further, the chip is fixedly connected with the substrate through a bolt, and the protective layer is sleeved with the chip.

Furthermore, the protective cover is made of transparent glass.

Furthermore, the adsorption patches are a plurality of, and the adsorption patches are fixedly connected with the substrate in an adsorption manner.

Furthermore, the top end of the base plate is also provided with a signal lamp, and the signal lamp is fixedly connected with the base plate through a bolt.

Compared with the prior art, the utility model discloses following beneficial effect has:

(1) the utility model relates to an among the SMD electronic components, set up inoxidizing coating, protective cover and guard slot, can play the effect of the protection of being convenient for.

(2) The utility model relates to an among SMD electronic components, set up radiating groove and conducting strip, play the radiating effect of being convenient for.

(3) The utility model relates to an among the SMD electronic components, set up the signal lamp and adsorbed the paster, play the signal display of being convenient for and adsorb fixed effect.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an embodiment of a surface mount electronic component according to the present invention;

fig. 2 is a schematic diagram of an internal structure of a patch-type electronic component embodiment according to the present invention.

Reference numerals:

1. a substrate; 101. a heat sink; 2. tooth buckling; 3. a protective layer; 4. a chip; 5. a heat conductive sheet; 6. a signal lamp; 7. a protective cover; 701. a protective bath; 8. and adsorbing the patch.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, rather than all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative work belong to the protection scope of the present invention based on the embodiments of the present invention.

In the description of the present invention, it should be noted that the terms "top", "bottom", "one side", "the other side", "front", "back", "middle part", "inside", "top", "bottom", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of description and simplification of the description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Please refer to fig. 1-2, according to the embodiment of the present invention, a chip-mounted electronic component, including a substrate 1, a tooth buckle 2, an armor layer 3, a chip 4, a heat conducting fin 5, a protective cover 7 and an adsorption patch 8, the tooth buckle 2 is located at two sides of the substrate 1, the armor layer 3 is located at the top end of the substrate 1, the chip 4 is located inside the substrate 1, the heat conducting fin 5 is located at the bottom end of the substrate 1, the protective cover 7 is located at the top end of the substrate 1, the adsorption patch 8 is located at the bottom end of the substrate 1, the substrate 1 includes a heat sink 101, the heat sink 101 is located at one side of the substrate 1, the protective cover 7 includes a protective sink 701, the protective sink 701 is located at the bottom of the protective cover 7, the protective cover 7 is fixedly connected with a.

According to the above scheme of this embodiment, traditional electronic components radiating effect is relatively poor, is a plurality of through radiating groove 101, and conducting strip 5 and base plate 1 fixed connection can play the radiating effect of heat conduction of being convenient for.

According to the above scheme of this embodiment, tooth detain 2 is a plurality of, and tooth detain 2 and base plate 1 bolt fixed connection can play the effect of being convenient for to fix.

According to the above scheme of this embodiment,

chip

4 and 1 bolt fixed connection of base plate, inoxidizing coating 3 cup joints with chip 4, can play the effect of the protection chip of being convenient for.

According to the above-mentioned scheme of this embodiment, traditional electronic components can't dustproof and waterproof, adopts transparent glass material to constitute through protective cover 7, can play the dustproof and waterproof effect of being convenient for and being convenient for observe.

According to the above scheme of this embodiment, adsorption patch 8 is a plurality of, and adsorption patch 8 adsorbs fixed connection with base plate 1, can play the effect of being convenient for adsorb fixedly.

According to the above-mentioned scheme of this embodiment, the unable signal indication of traditional electronic components still is equipped with signal lamp 6 through the top of base plate 1, and

signal lamp

6 and 1 bolted connection of base plate can play the effect of the signal indication of being convenient for.

Principle of operation

When the protective cover is specifically applied, the protective cover 3, the protective cover 7 and the protective groove 701 are arranged, the protective cover 7 is made of transparent glass materials, and therefore the electronic component can be dustproof and waterproof during working, observation is convenient, and the effect of convenient protection is achieved; the heat dissipation groove 101 and the heat conducting fins 5 are arranged, so that the effect of facilitating heat dissipation is achieved after the electronic component works for a long time; the signal lamp 6 is arranged, so that the effect of signal indication is facilitated when the electronic component works; the adsorption paster 8 is arranged, so that the effect of convenient adsorption and fixation is achieved.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The paster type electronic component is characterized by comprising a substrate (1), a tooth buckle (2), an protective layer (3), a chip (4), a heat conducting fin (5), a protective cover (7) and an adsorption paster (8), wherein the tooth buckle (2) is positioned on two sides of the substrate (1), the protective layer (3) is positioned on the top end of the substrate (1), the chip (4) is positioned in the substrate (1), the heat conducting fin (5) is positioned on the bottom end of the substrate (1), the protective cover (7) is positioned on the top end of the substrate (1), the adsorption paster (8) is positioned on the bottom end of the substrate (1), the substrate (1) comprises a heat dissipation groove (101), the heat dissipation groove (101) is positioned on one side of the substrate (1), the protective cover (7) comprises a protective groove (701), and the protective groove (701) is positioned on the bottom of the protective cover (7), the protective cover (7) is fixedly connected with the substrate (1) through a hinge, and the protective cover (3) is fixedly connected with the substrate (1) through bolts.

2. The surface mount electronic component according to claim 1, wherein the number of the heat dissipation grooves (101) is several, and the thermal conductive sheet (5) is fixedly connected to the substrate (1).

3. The surface mount electronic component according to claim 1, wherein the number of the tooth fasteners (2) is several, and the tooth fasteners (2) are fixedly connected with the substrate (1) by bolts.

4. The surface mount electronic component according to claim 1, wherein the chip (4) is fixedly connected to the substrate (1) by a bolt, and the protective layer (3) is sleeved on the chip (4).

5. The surface mount electronic component according to claim 1, wherein the protective cover (7) is made of transparent glass.

6. The surface mount electronic component according to claim 1, wherein the number of the suction patches (8) is several, and the suction patches (8) are fixedly connected to the substrate (1) by suction.

7. The surface mount electronic component according to claim 1, wherein a signal lamp (6) is further disposed on a top end of the substrate (1), and the signal lamp (6) is fixedly connected to the substrate (1) by a bolt.