CN209029356U - A kind of integrated-type module with shock-absorbing function - Google Patents
A kind of integrated-type module with shock-absorbing function Download PDFInfo
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- CN209029356U CN209029356U CN201822181921.9U CN201822181921U CN209029356U CN 209029356 U CN209029356 U CN 209029356U CN 201822181921 U CN201822181921 U CN 201822181921U CN 209029356 U CN209029356 U CN 209029356U
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- frame
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- plastic middle
- fixedly installed
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Abstract
The integrated-type module with shock-absorbing function that the utility model discloses a kind of, including plastic middle-frame, cooling fin, connecting groove, integration module ontology, temperature sensor, circuit board, heat-conducting glue, damping spring seat, rubber slab, reinforcing rib, ceramic wafer, gasket, external electrode, support plate, substrate, mounting-positioning holes, becket, epoxy cover board, fixed card slot and fixation kit, the center of top of the substrate is fixedly installed with plastic middle-frame, the inside bottom of the plastic middle-frame is filled with rubber slab, the top two sides of the rubber slab are fixedly installed with damping spring seat, and the outside of damping spring seat is filled with heat-conducting glue, circuit board is fixedly installed at the top of the damping spring seat, the center of top of the circuit board is fixedly installed with integration module ontology, and the two sides of integration module ontology are provided with temperature sensor, the integrated-type Module, compact, structure is simple, has good structural stability and impact resistance.
Description
Technical field
The utility model relates to integration module field, specially a kind of integrated-type module with shock-absorbing function.
Background technique
Integration module is a kind of electronic device or component；Using certain technique, transistor needed for a circuit,
The elements such as diode, resistance, capacitor and inductance and wiring interconnection together, are produced on a fritter or a few fritter semiconductor wafers or Jie
On matter substrate, it is then encapsulated in a shell, becomes the modular structure with required circuit function；It is in the prior art integrated
Pattern block, when in use, since inside when being impacted, is easy to make containing more electronic component so that shock resistance effect is poor
It is damaged at electronic component, so that the normal work of integration module is influenced, meanwhile, integration module in the prior art, installation is fixed
Effect is poor, and structural stability is weak, installing and dismounting inconvenience, and therefore, designing a kind of integrated-type module with shock-absorbing function is
It is necessary to.
Utility model content
The integrated-type module with shock-absorbing function that the purpose of this utility model is to provide a kind of.
The purpose of this utility model can be achieved through the following technical solutions:
A kind of integrated-type module with shock-absorbing function, including plastic middle-frame, cooling fin, connecting groove, integration module ontology,
Temperature sensor, circuit board, heat-conducting glue, damping spring seat, rubber slab, reinforcing rib, ceramic wafer, gasket, external electrode, support
Plate, substrate, mounting-positioning holes, becket, epoxy cover board, fixed card slot and fixation kit, the center of top of the substrate are fixed
Plastic middle-frame is installed, the inside bottom of the plastic middle-frame is filled with rubber slab, and the top two sides of the rubber slab are fixed
Damping spring seat is installed, and the outside of damping spring seat is filled with heat-conducting glue, the top of the damping spring seat is fixedly mounted
There is circuit board, the center of top of the circuit board is fixedly installed with integration module ontology, and the two sides setting of integration module ontology
There is temperature sensor, the top of the integration module ontology is filled with cooling fin, is provided with several at the top of the plastic middle-frame
Ceramic wafer is provided with external electrode at the top of the ceramic wafer, gasket is socketed on the outside of the external electrode, the substrate
Bottom center be provided with epoxy cover board, the bottom surrounding of the substrate offers fixed card slot, the four of the epoxy cover board
It is provided with fixation kit week, the fixation kit includes fixing seat, fixed fixture block, limited block and limit spring, the fixing seat
Inside limit spring is installed, fixed fixture block is installed at the top of the limit spring, and fixed fixture block pass through fixing seat with
Fixed card slot is cooperatively connected.
As a further solution of the present invention: the top two sides of the substrate offer mounting-positioning holes, and pacify
The inside of dress location hole is fixedly installed with becket.
As a further solution of the present invention: the two sides of the plastic middle-frame are fixedly mounted there are two support plate,
And the bottom of support plate is fixedly connected with substrate.
As a further solution of the present invention: offering reinforcing rib at the top of the plastic middle-frame, and ceramic wafer is equal
Between reinforcing rib.
As a further solution of the present invention: the top of the plastic middle-frame, cooling fin and ceramic wafer offers
Connecting groove, the external electrode pass through connecting groove and connect with integration module ontology ontology.
As a further solution of the present invention: being socketed with limited block on the outside of the fixed fixture block.
The utility model has the beneficial effects that the integrated-type module, in use, limited block is pulled, so that fixed fixture block squeezes
Epoxy cover board is placed on the bottom of substrate by limit spring, so that fixing seat is connect with fixed card slot, unclamps limited block, limit
Spring resets, and pushes the inside of fixed fixture block insertion fixed card slot, fixes so that epoxy cover board be installed；It shakes
When, vibration can be effectively relieved in damping spring seat and rubber slab, improve the shock resistance effect of plastic middle-frame；Reinforcing rib and support plate
The structural stability of plastic middle-frame can be effectively improved；The integrated-type module, compact, structure is simple, has good knot
Structure stability and impact resistance.
Detailed description of the invention
In order to facilitate the understanding of those skilled in the art, the utility model will be further described below with reference to the accompanying drawings.
Fig. 1 is the utility model overall structure diagram；
Fig. 2 is the schematic diagram of internal structure of the plastic middle-frame of the utility model
Fig. 3 is the bottom view of the utility model；
Fig. 4 is the structural schematic diagram of the fixation kit of the utility model；
In figure: 1, plastic middle-frame；2, cooling fin；3, connecting groove；4, integration module ontology；5, temperature sensor；6, circuit
Plate；7, heat-conducting glue；8, damping spring seat；9, rubber slab；10, reinforcing rib；11, ceramic wafer；12, gasket；13, external electrode；14,
Support plate；15, substrate；16, mounting-positioning holes；17, becket；18, epoxy cover board；19, fixed card slot；20, fixation kit；
21, fixing seat；22, fixed fixture block；23, limited block；24, limit spring.
Specific embodiment
The technical solution of the utility model is clearly and completely described below in conjunction with embodiment, it is clear that described
Embodiment be only the utility model a part of the embodiment, instead of all the embodiments.Based on the reality in the utility model
Example is applied, all other embodiment obtained by those of ordinary skill in the art without making creative efforts all belongs to
In the range of the utility model protection.
As shown in Figs 1-4, a kind of integrated-type module with shock-absorbing function, including plastic middle-frame 1, cooling fin 2, connecting groove
3, integration module ontology 4, temperature sensor 5, circuit board 6, heat-conducting glue 7, damping spring seat 8, rubber slab 9, reinforcing rib 10, ceramics
Plate 11, external electrode 13, support plate 14, substrate 15, mounting-positioning holes 16, becket 17, epoxy cover board 18, is fixed gasket 12
Card slot 19 and fixation kit 20, the center of top of substrate 15 are fixedly installed with plastic middle-frame 1, and the inside bottom of plastic middle-frame 1 is filled out
Filled with rubber slab 9, the top two sides of rubber slab 9 are fixedly installed with damping spring seat 8, and the outside filling of damping spring seat 8
There is heat-conducting glue 7, the top of damping spring seat 8 is fixedly installed with circuit board 6, and the center of top of circuit board 6 is fixedly installed with integrated
Module body 4, and the two sides of integration module ontology 4 are provided with temperature sensor 5, the top of integration module ontology 4 is filled with scattered
Backing 2 is provided with several ceramic wafers 11 at the top of plastic middle-frame 1, and the top of ceramic wafer 11 is provided with external electrode 13, external electricity
The outside of pole 13 is socketed with gasket 12, and the bottom center of substrate 15 is provided with epoxy cover board 18, and the bottom surrounding of substrate 15 is equal
Fixed card slot 19 is offered, the surrounding of epoxy cover board 18 is provided with fixation kit 20, and fixation kit 20 includes fixing seat 21, fixes
Fixture block 22, limited block 23 and limit spring 24, the inside of fixing seat 21 are equipped with limit spring 24, the top peace of limit spring 24
Equipped with fixed fixture block 22, and fixed fixture block 22 passes through fixing seat 21 and fixed card slot 19 is cooperatively connected.
As a further solution of the present invention: the top two sides of substrate 15 offer mounting-positioning holes 16, and pacify
The inside of dress location hole 16 is fixedly installed with becket 17.
As a further solution of the present invention: the two sides of plastic middle-frame 1 are fixedly mounted, there are two support plates 14, and
The bottom of support plate 14 is fixedly connected with substrate 15.
As a further solution of the present invention: the top of plastic middle-frame 1 offers reinforcing rib 10, and ceramic wafer 11 is equal
Between reinforcing rib 10.
As a further solution of the present invention: the top of plastic middle-frame 1, cooling fin 2 and ceramic wafer 11 offers
Connecting groove 3, external electrode 13 pass through connecting groove 3 and connect with 4 ontology of integration module ontology.
As a further solution of the present invention: the outside of fixed fixture block 22 is socketed with limited block 23.
Working principle of the utility model is: in use, epoxy cover board 18 will be fixed on base by fixation kit 20
The bottom of plate 15 pulls limited block 23, so that fixed fixture block 22 squeezes limit spring 24, epoxy cover board 18 is placed on substrate 15
Bottom unclamp limited block 23 so that fixing seat 21 is connect with fixed card slot 19, limit spring 24 resets, and pushes fixation
Fixture block 22 is inserted into the inside of fixed card slot 19, fixes so that epoxy cover board 18 be installed, and passes through mounting-positioning holes 16 using screw
With becket 17, is fixed so that substrate 15 be installed, by extraneous wire intertwist in the outside of external electrode 13, tighten external electrode
13, so that external electrode 13 passes through gasket 12 and ceramic wafer 11 is fixed, so that external electrode 13 passes through connecting groove 3 and integrates
Module body 4 connects, and 4 turn-on current of integration module ontology works normally after making circuit board 6 and integrated module body 4, temperature
Sensor 5 being capable of temperature inside actual induction plastic middle-frame 1；When shaking, damping spring seat 8 and rubber slab 9 can have
Effect alleviates vibration, improves the shock resistance effect of plastic middle-frame 1；Reinforcing rib 10 and support plate 14 can effectively improve plastic middle-frame 1
Structural stability；Cooling fin 2 and heat-conducting glue 7 can be improved heat dissipation effect.
The preferred embodiment in the utility model disclosed above is only intended to help to illustrate the utility model.Preferred embodiment is simultaneously
There is no the details that detailed descriptionthe is all, also not limiting the utility model is only the specific embodiment.Obviously, according to this theory
The content of bright book can make many modifications and variations.These embodiments are chosen and specifically described to this specification, is in order to preferably
The principles of the present invention and practical application are explained, so that skilled artisan be enable to better understand and utilize this
Utility model.The utility model is limited only by the claims and their full scope and equivalents.
Claims (6)
1. a kind of integrated-type module with shock-absorbing function, which is characterized in that including plastic middle-frame (1), cooling fin (2), wiring
Slot (3), integration module ontology (4), temperature sensor (5), circuit board (6), heat-conducting glue (7), damping spring seat (8), rubber slab
(9), reinforcing rib (10), ceramic wafer (11), gasket (12), external electrode (13), support plate (14), substrate (15), installation positioning
Hole (16), becket (17), epoxy cover board (18), fixed card slot (19) and fixation kit (20), the top of the substrate (15)
Center is fixedly installed with plastic middle-frame (1), and the inside bottom of the plastic middle-frame (1) is filled with rubber slab (9), the rubber slab
(9) top two sides are fixedly installed with damping spring seat (8), and the outside of damping spring seat (8) is filled with heat-conducting glue (7),
It is fixedly installed with circuit board (6) at the top of the damping spring seat (8), the center of top of the circuit board (6) is fixedly installed with
Integration module ontology (4), and the two sides of integration module ontology (4) are provided with temperature sensor (5), the integration module ontology
(4) top is filled with cooling fin (2), is provided with several ceramic wafers (11), the ceramic wafer at the top of the plastic middle-frame (1)
(11) it is provided at the top of external electrode (13), is socketed with gasket (12), the substrate on the outside of the external electrode (13)
(15) bottom center is provided with epoxy cover board (18), and the bottom surrounding of the substrate (15) offers fixed card slot (19),
The surrounding of the epoxy cover board (18) is provided with fixation kit (20), and the fixation kit (20) includes fixing seat (21), fixes
The inside of fixture block (22), limited block (23) and limit spring (24), the fixing seat (21) is equipped with limit spring (24), described
It is equipped at the top of limit spring (24) fixed fixture block (22), and fixed fixture block (22) pass through fixing seat (21) and fixed card slot
(19) it is cooperatively connected.
2. a kind of integrated-type module with shock-absorbing function according to claim 1, which is characterized in that the substrate (15)
Top two sides offer mounting-positioning holes (16), and the inside of mounting-positioning holes (16) is fixedly installed with becket (17).
3. a kind of integrated-type module with shock-absorbing function according to claim 1, which is characterized in that the plastic middle-frame
(1) two sides are fixedly mounted there are two support plate (14), and the bottom of support plate (14) is fixedly connected with substrate (15).
4. a kind of integrated-type module with shock-absorbing function according to claim 1, which is characterized in that the plastic middle-frame
(1) it is offered at the top of reinforcing rib (10), and ceramic wafer (11) is respectively positioned between reinforcing rib (10).
5. a kind of integrated-type module with shock-absorbing function according to claim 1, which is characterized in that the plastic middle-frame
(1), the top of cooling fin (2) and ceramic wafer (11) offers connecting groove (3), and the external electrode (13) passes through connecting groove
(3) it is connect with integration module ontology (4) ontology.
6. a kind of integrated-type module with shock-absorbing function according to claim 1, which is characterized in that the fixed fixture block
(22) limited block (23) are socketed on the outside of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822181921.9U CN209029356U (en) | 2018-12-25 | 2018-12-25 | A kind of integrated-type module with shock-absorbing function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822181921.9U CN209029356U (en) | 2018-12-25 | 2018-12-25 | A kind of integrated-type module with shock-absorbing function |
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| Publication Number | Publication Date |
|---|---|
| CN209029356U true CN209029356U (en) | 2019-06-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822181921.9U Active CN209029356U (en) | 2018-12-25 | 2018-12-25 | A kind of integrated-type module with shock-absorbing function |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110265380A (en) * | 2019-06-27 | 2019-09-20 | 罗瑞琪 | A kind of peripheral apparatus ic chip package structure |
-
2018
- 2018-12-25 CN CN201822181921.9U patent/CN209029356U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110265380A (en) * | 2019-06-27 | 2019-09-20 | 罗瑞琪 | A kind of peripheral apparatus ic chip package structure |
| CN110265380B (en) * | 2019-06-27 | 2020-10-23 | 广东高普达集团股份有限公司 | Peripheral equipment integrated circuit chip packaging structure |
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