CN218353002U

CN218353002U - SMD radiator structure

Info

Publication number: CN218353002U
Application number: CN202222573214.0U
Authority: CN
Inventors: 郭剑波
Original assignee: Shenzhen Hicoil Electronic Co ltd
Current assignee: Shenzhen Hicoil Electronic Co ltd
Priority date: 2022-09-27
Filing date: 2022-09-27
Publication date: 2023-01-20
Anticipated expiration: 2032-09-27

Abstract

The utility model discloses a patch element radiator structure, including the radiator main part, the radiator main part includes base and fixing base, and the base sets up on the fixing base, is provided with cavity and bottom chamber in the fixing base, is provided with the movable block in the cavity, is provided with a plurality of bellyings on the movable block, be provided with a plurality of connecting holes on the fixing base, connecting hole and cavity switch on mutually, insert in the connecting hole and be fixed with the connecting pipe, set up connecting channel in the connecting pipe, connecting channel's one end and connecting hole switch on, the bottom of connecting pipe is formed with thickening portion, sets up aggravating the chamber in the thickening portion, sets up a plurality of exhaust holes on the connecting pipe; the cavity is not communicated with the bottom cavity, and a cooling material is arranged in the bottom cavity. When the utility model is used, the heat dissipation effect of the patch element can be improved, so that the patch element is not easy to damage; when the patch element is used, when the patch element is arranged in long-time sports equipment such as a sound box or an automobile, the stability is good, and the patch element is not easy to loosen.

Description

SMD radiator structure

Technical Field

The utility model relates to a radiator field, concretely relates to patch element radiator structure.

Background

The chip component packaging form is a packaging form of a semiconductor device. The SMT involves a large variety of parts, and has various styles, so that a plurality of standards which are common in the industry are formed, mainly including chip capacitance and resistance, and the like; there are many variations that are still undergoing, especially for IC type parts, the packaging format of which varies and is overwhelming, and the conventional leaded package is undergoing the brunt of the new generation of packaging formats (BGA, FLIP CHIP, etc.), and the sub-standard parts are elaborated with the worker C type parts in this section.

At present, a plurality of chip components in electronic equipment are often damaged due to untimely heat dissipation, and the problem is difficult to solve.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that a can solve the paster element radiator structure of above-mentioned problem.

The utility model discloses a realize through following technical scheme: a patch element radiator structure comprises a radiator main body, wherein the radiator main body comprises a base and a fixed seat, the base is arranged on the fixed seat, a cavity and a bottom cavity are arranged in the fixed seat, a movable block is arranged in the cavity, a plurality of protrusions are arranged on the movable block, a plurality of connecting holes are arranged on the fixed seat, the connecting holes are communicated with the cavity, a connecting pipe is fixedly inserted into each connecting hole, a connecting channel is arranged in each connecting pipe, one end of each connecting channel is communicated with the corresponding connecting hole, a thickened part is formed at the bottom of each connecting pipe, a weighted cavity is arranged in each thickened part, and a plurality of exhaust holes are formed in each connecting pipe; the cavity is not communicated with the bottom cavity, and a cooling material is arranged in the bottom cavity.

As preferred technical scheme, the base is made for the metal of heat conduction, is provided with the mounting groove on the base, and the fixing base inserts to the mounting groove internal fixation.

As a preferred technical scheme, the thickened part and the connecting pipe are both made of colloid materials, and the thickened part and the connecting pipe are of an integrated structure.

As a preferred technical scheme, a weighting substance is stored in the weighting cavity.

As the preferred technical scheme, the movable block is made of elastic colloid material, a sealing cavity is arranged in the movable block, and helium is stored in the sealing cavity.

As the preferred technical scheme, a separation plate is arranged between the cavity and the bottom cavity, a plurality of openings are formed in the separation plate, an elastic layer is arranged at the openings, a stirring rod is arranged in the elastic layer, and one end of the stirring rod is inserted into the cooling material.

As preferred technical scheme, the fixing base is made for the metal of heat conduction, and the surface of fixing base is provided with waterproof coating.

The beneficial effects of the utility model are that: when the utility model is used, the heat dissipation effect of the patch element can be improved, so that the patch element is not easy to damage; when the patch element is used, when the patch element is arranged in long-time sports equipment such as a sound box or an automobile, the stability is good, and the patch element is not easy to loosen.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is an installation view of the heat sink of the present invention;

fig. 2 is a cross-sectional view of the heat sink of the present invention;

fig. 3 is a structural diagram of the movable block of the present invention.

Detailed Description

All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.

This specification includes any features disclosed in the appended claims, abstract and drawings, which are, unless expressly stated otherwise, replaceable with other equivalent or similarly purposed alternative features. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.

In the description of the present invention, it is to be understood that the terms "one end", "the other end", "the outside", "upper", "inside", "horizontal", "coaxial", "central", "end", "length", "outer end", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, in the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

The use of terms herein such as "upper," "above," "lower," "below," and the like in describing relative spatial positions is for the purpose of facilitating description to describe one element or feature's relationship to another element or feature as illustrated in the figures. The spatially relative positional terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented 90 degrees or at other orientations and the spatially relative descriptors used herein interpreted accordingly.

In the present invention, unless otherwise explicitly specified or limited, the terms "set", "coupled", "connected", "penetrating", "plugging", and the like are to be understood in a broad sense, and may be, for example, fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

As shown in fig. 1 to 3, the heat sink includes a heat sink main body 1, the heat sink main body 1 includes a base 100 and a fixing seat 101, the base 100 is disposed on the fixing seat 101, a cavity 2 and a bottom cavity 3 are disposed in the fixing seat 101, a movable block 5 is disposed in the cavity 2, a plurality of protrusions 6 are disposed on the movable block 5, a plurality of connecting holes 7 are disposed on the fixing seat 101, the connecting holes 7 are communicated with the cavity 2, a connecting pipe 8 is inserted and fixed in the connecting holes 7, a connecting passage 800 is disposed in the connecting pipe 8, one end of the connecting passage 800 is communicated with the connecting holes 7, a thickened portion 9 is formed at the bottom of the connecting pipe 8, a weighted cavity is disposed in the thickened portion 9, and a plurality of exhaust holes 801 are disposed on the connecting pipe 8; the cavity 2 and the bottom cavity 3 are not communicated, and a cooling material 10 is arranged in the bottom cavity 3. The connecting pipe can be fixed by waterproof glue.

Wherein, the base 100 is made for the metal of heat conduction, is provided with the mounting groove on the base 100, and fixing base 101 inserts to the mounting groove internal fixation. The fixing seat is fixed on the PCB through heat-conducting glue.

Wherein, thickened portion 9 and connecting pipe 8 all adopt the colloid material to make, and thickened portion 9 and connecting pipe 8 structure as an organic whole.

Wherein, the weighting substance 11 such as sand is stored in the weighting cavity, and the PCB board can be added.

Wherein, the movable block 5 is made of elastic colloid material, a sealing cavity is arranged in the movable block 5, and helium is stored in the sealing cavity. So that the movable block is in a suspended state for a long time and is similar to a balloon structure.

Wherein, be provided with division board 12 between cavity 2 and the end cavity 3, division board and base formula structure as an organic whole, be provided with a plurality of openings on the division board 12, the opening part is provided with elastic layer 13, is provided with puddler 16 in the elastic layer 13, and the one end of puddler 16 inserts to cooling material 10 in. Elastic colloid material of elastic layer, puddler are the plastics and make, and puddler and elastic layer are all fixed through waterproof glue.

Wherein, fixing base 101 is made for the metal of heat conduction, and the surface of fixing base 101 is provided with waterproof coating. The fixed seat and the base can be welded and fixed.

When the technical scheme is used, the patch components are installed on the PCB 300, the radiator is also arranged on the PCB, and the base and the fixed seat of the radiator can absorb heat on the PCB.

The technical scheme can be applied to equipment which is in motion for a long time such as an automobile, and the whole radiator and the weighting part press the PCB, so that the PCB and the electrical appliance element are more stably installed.

When the device is used, equipment such as an automobile and the like is easy to generate vibration sense in a working state, air flow is easy to generate in a motion state of driving the movable block provided with the lug, and the air flow is discharged outwards through the connecting channel and the connecting hole of the connecting pipe and acts on the PCB and the surface mounted device to dissipate heat and remove dust.

The cooling material can be water, plays the effect of coolant liquid, is convenient for discharge the heat to electrical components on PCB board and the PCB board, and elastic layer and puddler can do benefit to the motion of coolant liquid to the coolant liquid stirring when the motion, do benefit to the heat absorption to the PCB board.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the creative work should be covered within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope defined by the claims.

Claims

1. A patch element radiator structure which characterized in that: the heat radiator comprises a heat radiator main body (1), wherein the heat radiator main body (1) comprises a base (100) and a fixed seat (101), the base (100) is arranged on the fixed seat (101), a cavity (2) and a bottom cavity (3) are arranged in the fixed seat (101), a movable block (5) is arranged in the cavity (2), a plurality of protrusions (6) are arranged on the movable block (5), a plurality of connecting holes (7) are formed in the fixed seat (101), the connecting holes (7) are communicated with the cavity (2), a connecting pipe (8) is inserted and fixed into the connecting holes (7), a connecting channel (800) is arranged in the connecting pipe (8), one end of the connecting channel (800) is communicated with the connecting holes (7), a thickened part (9) is formed at the bottom of the connecting pipe (8), a weighting cavity is arranged in the thickened part (9), and a plurality of exhaust holes (801) are formed in the connecting pipe (8); the cavity (2) and the bottom cavity (3) are not communicated, and a cooling material (10) is arranged in the bottom cavity (3).

2. A patch element heat sink structure according to claim 1, wherein: the base (100) is made of heat-conducting metal, an installation groove is formed in the base (100), and the fixing seat (101) is inserted into the installation groove to be fixed.

3. A patch element heat sink structure according to claim 1, wherein: the thickened part (9) and the connecting pipe (8) are both made of colloid materials, and the thickened part (9) and the connecting pipe (8) are of an integrated structure.

4. A patch element heat sink structure according to claim 1, wherein: the weighting cavity is stored with weighting material (11).

5. A patch element heat sink structure according to claim 1, wherein: the movable block (5) is made of elastic colloid material, a sealing cavity is arranged in the movable block (5), and helium is stored in the sealing cavity.

6. A patch element heat sink structure according to claim 1, wherein: an isolation plate (12) is arranged between the cavity (2) and the bottom cavity (3), a plurality of openings are formed in the isolation plate (12), an elastic layer (13) is arranged at each opening, a stirring rod (16) is arranged in the elastic layer (13), and one end of each stirring rod (16) is inserted into the cooling material (10).

7. A patch element heat sink structure according to claim 1, wherein: the fixing seat (101) is made of heat-conducting metal, and a waterproof coating is arranged on the surface of the fixing seat (101).