CN116314050A - Multi-chip packaging module and method - Google Patents
Multi-chip packaging module and method Download PDFInfo
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- CN116314050A CN116314050A CN202310573532.3A CN202310573532A CN116314050A CN 116314050 A CN116314050 A CN 116314050A CN 202310573532 A CN202310573532 A CN 202310573532A CN 116314050 A CN116314050 A CN 116314050A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
Abstract
The invention discloses a multi-chip packaging module and a multi-chip packaging method. According to the invention, a plurality of packaging units are spliced to be packaged, the lower packaging unit is conveniently taken out during subsequent maintenance, the plurality of packaging units are mutually spliced to be positioned by adopting the second shallow opening and the positioning sheet, so that the packaging units are conveniently separated from each other, and the packaging units can be separated only by cutting off the first bonding lead when the maintenance is performed, so that the middle or lower packaging units are conveniently maintained; the invention is provided with the plurality of heat conducting plates at the surface positions of the first chip and the second chip in the packaging unit, the heat conducting plates can transfer and radiate heat through the heat radiating component, the heat radiating effect of the internal chip is ensured, the problem that the heat of the chip at the inner side of the multi-chip package is difficult to radiate at present is solved, and the heat radiating quality is ensured.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to a multi-chip packaging module and a multi-chip packaging method.
Background
The chip package module is a shell for mounting semiconductor integrated circuit chips, plays roles of placing, fixing, sealing, protecting chips and enhancing electrothermal performance, and is also a bridge for communicating the world inside the chips with external circuits, namely, joints on the chips are connected to pins of the package shell by wires, and the pins are connected with other devices by wires on a printed board. Therefore, packaging plays an important role in CPU and other LSI integrated circuits, and a semiconductor package using a lead frame as a chip carrier, such as a quad flat semiconductor package or a quad flat non-pin semiconductor package, is manufactured by adhering the semiconductor chip to a lead frame having a carrier and a plurality of pins, electrically connecting contact pads on the surface of the chip and the corresponding pins by a plurality of bonding wires, and then encapsulating the chip and the bonding wires with an encapsulant (plastic shell) to form a semiconductor package, wherein the multi-chip package module encapsulates a plurality of groups of chips in the same shell for reducing the occupied area of the chip, and an important indicator for measuring whether a chip packaging technology is advanced or not is the ratio of the chip area to the packaged area.
In this regard, the chinese patent application publication No. CN102832189a discloses a multi-chip package structure and a method for packaging the same. The multi-chip packaging structure and the packaging method thereof comprise the following steps: n chips are sequentially stacked and arranged on the slide table; and each chip partially covers the lower chip so as to expose the bonding pad of the lower chip; the second bonding wire connects the bonding pad on one of the chips to the bonding pad on the other chip.
The multi-chip packaging structure and the packaging method thereof adopt a stacking mode to stack the power device chip and the control circuit chip, reduce the packaging area, but increase the stacking thickness, and have the following defects in the multi-chip packaging stack: when maintenance is carried out, the chip positioned in the middle is difficult to take out, the covered chips are required to be sequentially taken down from the top, and the taking-out mode is troublesome; and when the multi-chip package at present, only rely on the shell to dispel the heat, the shell can only provide better radiating effect to the top chip generally, there is not heat conduction structure between chip and the shell that is located middle part and bottom, lead to the heat dissipation quality poor, and this multi-chip package structure and encapsulation method have further increased the height of piling up, have aggravated the burden that the shell dispel the heat more, are difficult to guarantee better radiating effect.
For this reason, we propose a multi-chip package module and method for solving the above-mentioned problems.
Disclosure of Invention
The present invention is directed to a multi-chip package module and a method thereof, so as to solve the problems set forth in the background art.
In order to achieve the above purpose, the present invention provides the following technical solutions: the multi-chip packaging module comprises a packaging shell, a bottom plate and a plurality of packaging units arranged in the packaging shell, wherein the packaging units comprise a carrying platform, the top surface of the carrying platform is adhered with a first heat-conducting plate, the top surface of the first heat-conducting plate is adhered with a first chip, two sides of the first heat-conducting plate are respectively and vertically fixedly connected with two insulating side strips, a separation sheet is fixedly connected between the top surfaces of the two insulating side strips, the two insulating side strips are contacted with two sides of the first chip, the separation sheet is contacted with the top surface of the first chip, the separation sheet and the two insulating side strips are of an integrated structure, the top surface of the separation sheet is adhered with a second chip, the top surface of the second chip is adhered with a third heat-conducting plate, a through groove is formed in the separation sheet horizontally, and the second heat-conducting plate is horizontally inserted in the through groove;
the heat radiation assembly comprises a main heat conducting plate and two contact heat conducting plates, a top embedding opening is formed in the top surface of the enclosure, two side embedding openings are formed in the inner side wall of the enclosure, the main heat conducting plate is embedded and connected in the top embedding opening, the two side embedding openings are fixedly connected with the two side heat conducting plates respectively, the two side heat conducting plates are in contact with the main heat conducting plate, two first I-shaped strips are fixedly connected with two ends of the first heat conducting plate respectively, two second I-shaped strips are fixedly connected with two ends of the second heat conducting plate respectively, two third I-shaped strips are fixedly connected with two ends of the third heat conducting plate respectively, a plurality of I-shaped grooves are formed in one side of the contact heat conducting plate horizontally, a plurality of I-shaped grooves are connected with the first I-shaped strips, the second I-shaped strips and the third I-shaped strips in a sliding manner on a plurality of packaging units in an inserting manner, and the contact heat conducting plates are far away from one side of the I-shaped grooves to be in contact with the side heat conducting plates.
Preferably, the plurality of packaging units are vertically arranged, two first shallow openings are formed in the top surface of the bottom plate, two second shallow openings are formed in the isolation top plate, two positioning sheets are fixedly connected to the bottom surface of the slide holder, the two positioning sheets on the lowest packaging unit are adhered to the two first shallow openings, and the other two positioning sheets on the packaging unit are inserted into the two second shallow openings on the packaging unit below.
Preferably, the inner top surface of the enclosure is uniformly provided with a plurality of strip-shaped embedded openings, the strip-shaped embedded openings are communicated with the top embedded openings, a plurality of heat conducting fins are fixedly connected in the strip-shaped embedded openings respectively, a plurality of heat conducting fins are contacted with the main heat conducting plate, and the bottom ends of the heat conducting fins are contacted with the top surface of the isolation top plate on the packaging unit positioned at the top.
Preferably, the bottom surface of the enclosure is fixedly connected with a bottom frame, the bottom frame and the enclosure are of an integrated structure, the bottom frame is sleeved on the periphery of the bottom plate, surface fixing of two sides of the bottom plate is embedded with the end parts of a plurality of main pins, two sides of the bottom frame are positioned at the bottom surfaces of the positions of the plurality of main pins to form a plurality of reserved openings, and the main pins are positioned at the inner sides of the reserved openings.
Preferably, the top surfaces of two sides of the slide holder are respectively fixedly embedded with two first welding pads, two sides of the slide holder are respectively fixedly embedded with a plurality of sub-pin ends, the sub-pins are electrically connected with the first welding pads, the sub-pins are fixedly connected with one end of a first bonding lead at the bottom surface of the outside of the slide holder and are electrically connected with the top surface of the main pin, and the other end of the first bonding lead is fixedly connected with the top surface of the main pin.
Preferably, the top surface of one side of the first chip is fixedly embedded with a second welding pad, the second welding pad is fixedly connected with and electrically connected with a plurality of second bonding leads, and the bottom ends of the second bonding leads are fixedly connected with and electrically connected with the surface of one of the first welding pads.
Preferably, the top surface of one side of the second chip, which is close to the second bonding pad, is fixedly embedded with a third bonding pad, the top surface of one side, which is far away from the third bonding pad, of the second chip is fixedly embedded with a fourth bonding pad, the third bonding pad is fixedly connected with and electrically connected with a plurality of third bonding wires, the bottom ends of the third bonding wires are fixedly connected with and electrically connected with the second bonding pad, the fourth bonding pad is fixedly connected with and electrically connected with a plurality of fourth bonding wires, and the bottom ends of the fourth bonding wires are fixedly connected with and electrically connected with the surface of one of the first bonding pads.
Preferably, a plurality of rotating holes are formed in the side wall of the bottom surface of the enclosure perpendicularly, the rotating rod is connected in the rotating holes in a rotating mode, the bottom surface of the rotating rod is fixedly connected with a circular plate, two sector plates are fixedly connected to the side wall of the bottom end of the circular plate, a plurality of insertion holes are formed in the position, right below the plurality of rotating holes, of the top surface of the bottom plate respectively, the circular plate and the two sector plates are inserted into the insertion holes, two sector plates are fixedly connected to the inner side wall of the top surface of the insertion hole, and the bottom surfaces of the two sector plates are respectively contacted with the top surfaces of the two sector plates.
Preferably, a plurality of flaring are respectively arranged at the positions right above a plurality of rotating holes on the top surface of the edge of the enclosure, the top end of the rotating rod is fixedly connected with a cross screw head, the cross screw head is rotationally connected in the flaring, a fan-shaped groove is arranged on the side wall of the rotating hole, a vertical plate is fixedly connected with the side wall of the rotating rod, the vertical plate is slidably connected in the fan-shaped groove, one side, far away from the rotating rod, of the vertical plate is made of rubber, and the vertical plate is matched in the fan-shaped groove in a process mode.
The invention also provides a multi-chip packaging module and a method, comprising the following steps:
step one: preparing a plurality of power device type chips and a plurality of control circuit chips which need to be packaged, taking the power device type chips as first chips, taking the control circuit chips as second chips, bonding a first heat conduction plate on the top surface of a slide holder, bonding the first chips on the top surface of the first heat conduction plate, bonding integrated insulating side strips and two ends of a separation sheet on two sides of the top surface of the first heat conduction plate, enabling the separation sheet to contact the top surface of the first chips, ensuring that a second welding pad on the first chips is positioned on the outer side of the separation sheet during bonding, bonding the second chips on the top surface of the separation sheet, bonding a third heat conduction plate on the top surface of the second chips, bonding a separation top plate on the top surface of the third heat conduction plate, and finally inserting the second heat conduction plate into a through groove on the separation sheet;
step two: a bonding wire is connected between a second bonding pad on the first chip and a first bonding pad on one side of the stage, a bonding wire is connected between a third bonding pad on the second chip and a second bonding pad on the first chip, and a bonding wire is connected between a fourth bonding pad on the second chip and a first bonding pad on the other side of the stage, so that the manufacture of the packaging unit is completed;
step three: arranging the plurality of packaging units vertically to each other so that the positioning sheet and the second shallow opening are spliced and positioned, bonding the positioning sheet of the lowest packaging unit to the first shallow opening on the top surface of the bottom plate, and then connecting bonding leads between sub pins of the plurality of packaging units and main pins on the bottom plate;
step four: the two contact type heat-conducting plates are arranged on the I-shaped strips at the ends of the plurality of heat-conducting plates, then the sealing shell is covered, and the rotating rod is screwed to fix the sealing shell by using the sector plates, so that the sealing is completed.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, a plurality of packaging units are spliced to be packaged, the lower packaging unit is conveniently taken out during subsequent maintenance, the plurality of packaging units are mutually spliced to be positioned by adopting the second shallow opening and the positioning sheet, so that the packaging units are conveniently separated from each other, and the packaging units can be separated only by cutting off the first bonding lead when the maintenance is performed, so that the middle or lower packaging units are conveniently maintained; the invention is provided with the plurality of heat conducting plates at the surface positions of the first chip and the second chip in the packaging unit, the heat conducting plates can transfer and radiate heat through the heat radiating component, the heat radiating effect of the internal chip is ensured, the problem that the heat of the chip at the inner side of the multi-chip package is difficult to radiate at present is solved, and the heat radiating quality is ensured.
Drawings
FIG. 1 is a schematic diagram of a main structure of a first embodiment of the present invention;
FIG. 2 is a schematic diagram of the explosive structure of the main body in the first and second embodiments of the present invention;
FIG. 3 is a schematic view of the bottom structure of the enclosure in the first and second embodiments of the present invention;
FIG. 4 is a schematic view showing a cut-away structure of a main body in the first and second embodiments of the present invention;
FIG. 5 is a schematic diagram showing a cut-away structure of a package unit according to a first and second embodiment of the present invention;
FIG. 6 is a schematic view of an exploded view of a package unit according to a first and second embodiments of the present invention;
FIG. 7 is an enlarged schematic view of the structure of FIG. 5A according to the present invention;
FIG. 8 is an enlarged schematic view of the structure of FIG. 5B according to the present invention;
FIG. 9 is a schematic view showing a cut-away structure at the edge of the enclosure in a third embodiment of the invention;
FIG. 10 is an enlarged schematic view of the structure of FIG. 9C according to the present invention;
FIG. 11 is a schematic view showing a sectional structure of a turning rod and a turning hole according to a third embodiment of the present invention.
In the figure: 1. an enclosure; 2. a bottom plate; 3. a packaging unit; 4. a heat dissipation assembly; 11. a bottom frame; 12. reserving a port; 13. a top embedding opening; 14. a strip-shaped embedding opening; 15. a side-embedded opening; 16. a turning hole; 17. flaring; 18. a rotating rod; 19. a circular plate; 110. a sector plate; 111. a cross screw head; 112. a fan-shaped groove; 113. a riser; 21. a main pin; 22. a first shallow opening; 23. a jack; 24. a fan-shaped baffle; 31. a slide holder; 32. a first heat-conducting plate; 33. a first chip; 34. insulating side bars; 35. a spacer; 36. a through groove; 37. a second heat-conducting plate; 38. a second chip; 39. a third heat-conducting plate; 310. an isolation top plate; 311. a second shallow opening; 312. positioning the sheet; 313. a first I-shaped strip; 314. a second I-shaped strip; 315. a third I-shaped strip; 316. a first bonding pad; 317. a sub-pin; 318. a first bonding wire; 319. a second bonding pad; 320. a second bonding wire; 321. a third bonding pad; 322. a third bonding wire; 323. a fourth pad; 324. a fourth bonding wire; 41. a heat conducting plate; 42. a heat conduction fin; 43. a side heat-conducting plate; 44. a contact type heat conductive plate; 45. an I-shaped groove.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1:
referring to fig. 1-6, the present invention provides a technical solution: the multi-chip packaging module comprises a packaging shell 1, a bottom plate 2 and a plurality of packaging units 3 arranged in the packaging shell 1, wherein each packaging unit 3 comprises a carrying platform 31, a first heat-conducting plate 32 is adhered to the top surface of the carrying platform 31, a first chip 33 is adhered to the top surface of the first heat-conducting plate 32, two insulating side strips 34 are respectively and vertically fixedly connected to two sides of the first heat-conducting plate 32, a separation sheet 35 is fixedly connected between the top surfaces of the two insulating side strips 34, the two insulating side strips 34 are contacted with two sides of the first chip 33, the separation sheet 35 is contacted with the top surface of the first chip 33, the separation sheet 35 and the two insulating side strips 34 are of an integrated structure, a second chip 38 is adhered to the top surface of the separation sheet 35, a third heat-conducting plate 39 is adhered to the top surface of the separation top plate 310, a through groove 36 is horizontally arranged in the separation sheet 35, the second heat-conducting plate 37 is horizontally inserted in the through groove 36, the packaging unit 3 is packaged in a mode of splicing mode by adopting the plurality of packaging units 3, and the lower packaging units 3 are conveniently taken out during subsequent maintenance;
the heat dissipation assembly 4 is arranged in the enclosure 1, the heat dissipation assembly 4 comprises a main heat conduction plate 41 and two contact type heat conduction plates 44, the top surface of the enclosure 1 is provided with a top embedding opening 13, the inner side wall of the enclosure 1 is provided with two side embedding openings 15, the top embedding opening 13 is internally fixedly embedded with the main heat conduction plate 41, the two side embedding openings 15 are respectively fixedly connected with the two side heat conduction plates 43, the two side heat conduction plates 43 contact the main heat conduction plate 41, the two ends of the first heat conduction plate 32 are respectively fixedly connected with the two first I-shaped strips 313, the two ends of the second heat conduction plate 37 are respectively fixedly connected with the two second I-shaped strips 314, the two ends of the third heat conduction plate 39 are respectively fixedly connected with the two third I-shaped strips 315, one side of the contact type heat conduction plate 44 is horizontally provided with a plurality of I-shaped grooves 45, the plurality of I-shaped strips 313, the second I-shaped strips 314 and the third I-shaped strips 315 are connected on the plurality of packaging units 3 in a sliding manner, the contact type heat conduction plates 44 are far away from one side of the I-shaped grooves 45, the heat conduction plates are arranged on the surface of each chip, the heat conduction plates are connected with the two side heat conduction plates 32, the contact type heat conduction plates are connected with the contact type heat conduction plates 44, heat conduction plates can be generated at the sides of the chips and the chips are located at the positions of the main heat dissipation positions of the chips 41, and the heat dissipation effect is guaranteed.
Example 2:
referring to fig. 2-8, in a second embodiment of the present invention, based on the previous embodiment, a plurality of packaging units 3 are vertically arranged, two first shallow openings 22 are formed on the top surface of the bottom plate 2, two second shallow openings 311 are formed on the top isolation plate 310, two positioning sheets 312 are fixedly connected to the bottom surface of the stage 31, two positioning sheets 312 on the packaging unit 3 at the lowest position are adhered to the two first shallow openings 22, two positioning sheets 312 on the rest of the packaging units 3 are inserted into the two second shallow openings 311 on the packaging unit 3 at the lower position, the packaging units 3 are positioned by the second shallow openings 311 and the positioning sheets 312, and separation between the plurality of packaging units 3 is convenient and maintenance is convenient.
The inner side top surface of the enclosure 1 is uniformly provided with a plurality of strip-shaped embedded openings 14, the strip-shaped embedded openings 14 are communicated with the top embedded opening 13, a plurality of heat conducting fins 42 are fixedly connected to the strip-shaped embedded openings 14 respectively, the plurality of heat conducting fins 42 are contacted with the main heat conducting plate 41, the bottom ends of the plurality of heat conducting fins 42 are contacted with the top surface of the isolation top plate 310 on the packaging unit 3 positioned at the top end, and the heat conducting area is increased through the heat conducting fins 42.
The bottom surface of the enclosure 1 is fixedly connected with a bottom frame 11, the bottom frame 11 and the enclosure 1 are of an integrated structure, the bottom frame 11 is sleeved on the periphery of the bottom plate 2, the two sides of the bottom plate 2 are fixedly embedded with the end parts of a plurality of main pins 21, two sides of the bottom frame 11 are positioned at the positions of the plurality of main pins 21, a plurality of reserved openings 12 are formed in the bottom surface of the bottom frame 11, and the main pins 21 are positioned at the inner sides of the reserved openings 12.
The top surfaces of two sides of the stage 31 are respectively fixedly embedded with two first welding pads 316, two sides of the stage 31 are respectively fixedly embedded with the ends of a plurality of sub-pins 317, the sub-pins 317 are electrically connected with the first welding pads 316, the sub-pins 317 are fixedly connected with the outer bottom surface of the stage 31 and are electrically connected with one end of a first bonding wire 318, and the other end of the first bonding wire 318 is fixedly connected with the top surface of the main pin 21.
The top surface of one side of the first chip 33 is fixedly embedded with the second bonding pad 319, and the second bonding pad 319 is fixedly connected with and electrically connected with a plurality of second bonding wires 320, and the bottom ends of the plurality of second bonding wires 320 are fixedly connected with and electrically connected with the surface of one of the first bonding pads 316.
The top surface of one side of the second chip 38 close to the second bonding pad 319 is fixedly embedded with the third bonding pad 321, the top surface of one side of the second chip 38 far away from the third bonding pad 321 is fixedly embedded with the fourth bonding pad 323, the third bonding pad 321 is fixedly connected with and electrically connected with a plurality of third bonding wires 322, the bottom ends of the third bonding wires 322 are fixedly connected with and electrically connected with the second bonding pad 319, the fourth bonding pads 323 are fixedly connected with and electrically connected with a plurality of fourth bonding wires 324, the bottom ends of the fourth bonding wires 324 are fixedly connected with and electrically connected with the surface of one of the first bonding pads 316, the electric connection between the two chips is realized through a plurality of bonding wires, and the electric connection between the two chips and the main pins 21 is in a naked shape, so that the connection operation of the bonding wires is convenient.
Example 3:
referring to fig. 9-11, in a third embodiment of the present invention, based on the above two embodiments, the bottom side wall of the enclosure 1 is vertically provided with a plurality of rotating holes 16, the rotating holes 16 are rotationally connected with the rotating rod 18, the bottom surface of the rotating rod 18 is fixedly connected with the circular plate 19, the bottom side wall of the circular plate 19 is fixedly connected with two sector plates 110, the top surface of the bottom plate 2 is located right below the plurality of rotating holes 16, a plurality of insertion holes 23 are respectively provided with the circular plate 19 and the two sector plates 110, the inner side wall of the top surface of the insertion hole 23 is fixedly connected with two sector plates 24, the bottom surfaces of the two sector plates 24 respectively contact the top surfaces of the two sector plates 110, when the rotating rod 18 rotates, the positions of the two sector plates 110 can be changed, when the sector plates 110 are located right below the sector plates 24, the enclosure 1 is fixed, and when the enclosure 1 is rotated out of the position right below the sector plates 24, the enclosure 1 can be removed.
The top surface of the edge of the enclosure 1 is positioned right above a plurality of rotating holes 16, a plurality of flaring 17 are respectively arranged, the top end of a rotating rod 18 is fixedly connected with a cross screw head 111, the cross screw head 111 is rotationally connected in the flaring 17, the side wall of the rotating hole 16 is provided with a fan-shaped groove 112, the side wall of the rotating rod 18 is fixedly connected with a vertical plate 113, the vertical plate 113 is slidingly connected in the fan-shaped groove 112, one side of the vertical plate 113 far away from the rotating rod 18 is made of rubber, the vertical plate 113 is in technological fit in the fan-shaped groove 112, and the vertical plate 113 plays a limiting role in the fan-shaped groove 112 during rotation.
Example 4:
a fourth embodiment of the present invention provides a multi-chip package module and method based on the three embodiments, including the following steps:
step one: preparing a plurality of power device type chips and a plurality of control circuit chips to be packaged, taking the power device type chips as a first chip 33, taking the control circuit chips as a second chip 38, bonding a first heat-conducting plate 32 on the top surface of a carrying platform 31, bonding the first chip 33 on the top surface of the first heat-conducting plate 32, bonding both ends of an integrated insulating side strip 34 and a separation sheet 35 on both sides of the top surface of the first heat-conducting plate 32, enabling the separation sheet 35 to contact the top surface of the first chip 33, ensuring that a second welding pad 319 on the first chip 33 is positioned outside the separation sheet 35 during bonding, bonding a second chip 38 on the top surface of the separation sheet 35, bonding a third heat-conducting plate 39 on the top surface of the second chip 38, bonding a separation top plate 310 on the top surface of the third heat-conducting plate 39, and finally inserting the second heat-conducting plate 37 into a through groove 36 on the separation sheet 35;
step two: bonding wires are connected between the second bonding pad 319 on the first chip 33 and the first bonding pad 316 on one side of the stage 31, bonding wires are connected between the third bonding pad 321 on the second chip 38 and the second bonding pad 319 on the first chip 33, bonding wires are connected between the fourth bonding pad 323 on the second chip 38 and the first bonding pad 316 on the other side of the stage 31, and the manufacture of the packaging unit 3 is completed;
step three: the plurality of packaging units 3 are arranged vertically to each other, so that the positioning sheet 312 and the second shallow openings 311 are spliced and positioned, the positioning sheet 312 of the lowest packaging unit 3 is adhered to the first shallow opening 22 on the top surface of the bottom plate 2, and then bonding wires are connected between the sub-pins 317 of the plurality of packaging units 3 and the main pins 21 on the bottom plate 2.
Step four: the two contact type heat-conducting plates 44 are installed by sliding the two contact type grooves 45 of the two contact type heat-conducting plates 44 onto the I-shaped strips at the ends of the plurality of heat-conducting plates, then the enclosure 1 is covered, and the rotating rod 18 is screwed to fix the enclosure 1 by the sector plate 110, so that the packaging is completed.
Example 5:
referring to fig. 1-11, a fifth embodiment of the present invention is based on the above four embodiments, and the packaging mode of the present invention is as follows: preparing a plurality of power device type chips and a plurality of control circuit chips to be packaged, taking the power device type chips as a first chip 33, taking the control circuit chips as a second chip 38, bonding a first heat-conducting plate 32 on the top surface of a carrying platform 31, bonding the first chip 33 on the top surface of the first heat-conducting plate 32, bonding both ends of an integrated insulating side strip 34 and a separation sheet 35 on both sides of the top surface of the first heat-conducting plate 32, enabling the separation sheet 35 to contact the top surface of the first chip 33, ensuring that a second welding pad 319 on the first chip 33 is positioned outside the separation sheet 35 during bonding, bonding a second chip 38 on the top surface of the separation sheet 35, bonding a third heat-conducting plate 39 on the top surface of the second chip 38, bonding a separation top plate 310 on the top surface of the third heat-conducting plate 39, and finally inserting the second heat-conducting plate 37 into a through groove 36 on the separation sheet 35; bonding wires are connected between the second bonding pad 319 on the first chip 33 and the first bonding pad 316 on one side of the stage 31, bonding wires are connected between the third bonding pad 321 on the second chip 38 and the second bonding pad 319 on the first chip 33, bonding wires are connected between the fourth bonding pad 323 on the second chip 38 and the first bonding pad 316 on the other side of the stage 31, and the manufacture of the packaging unit 3 is completed; arranging the plurality of packaging units 3 vertically to each other, splicing and positioning the positioning sheet 312 and the second shallow opening 311, bonding the positioning sheet 312 of the lowest packaging unit 3 on the first shallow opening 22 on the top surface of the bottom plate 2, and then connecting bonding wires between the sub pins 317 of the plurality of packaging units 3 and the main pins 21 on the bottom plate 2; the method comprises the steps that the I-shaped grooves 45 of the two contact type heat-conducting plates 44 are slipped onto I-shaped strips at the end parts of the plurality of heat-conducting plates, the two contact type heat-conducting plates 44 are installed, then the sealing shell 1 is covered, the rotating rod 18 is screwed to fix the sealing shell 1 by using the sector plate 110, and sealing is completed, in the invention, the plurality of sealing units 3 are adopted for sealing in a splicing mode, the lower sealing units 3 are conveniently taken out during subsequent maintenance, the plurality of sealing units 3 are conveniently positioned by adopting the second shallow openings 311 and the positioning thin sheets 312 during mutual splicing, mutual separation is convenient, and the sealing units 3 can be separated only by cutting off the first bonding leads 318 during maintenance, so that the sealing units 3 at the middle part or the lower part are conveniently maintained; the invention sets a plurality of heat-conducting plates on the surfaces of the first chip 33 and the second chip 38 in the packaging unit 3, the heat-conducting plates can transfer heat to dissipate heat through the heat-dissipating component 4, so that the heat-dissipating effect of the internal chip is ensured, the problem that the heat of the chip on the inner side of the multi-chip package is difficult to dissipate at present is solved, and the heat-dissipating quality is ensured.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a multicore piece encapsulation module, includes enclosure (1), bottom plate (2) and sets up a plurality of encapsulation units (3) in enclosure (1), its characterized in that:
the packaging unit (3) comprises a carrying platform (31), a first heat-conducting plate (32) is bonded on the top surface of the carrying platform (31), a first chip (33) is bonded on the top surface of the first heat-conducting plate (32), two insulating side strips (34) are vertically and fixedly connected to two sides of the first heat-conducting plate (32), a separation sheet (35) is fixedly connected between the top surfaces of the two insulating side strips (34), the two insulating side strips (34) are contacted with two sides of the first chip (33), the separation sheet (35) is contacted with the top surface of the first chip (33), the separation sheet (35) and the two insulating side strips (34) are of an integrated structure, a second chip (38) is bonded on the top surface of the separation sheet (35), a third heat-conducting plate (39) is bonded on the top surface of the third heat-conducting plate (39), a through groove (36) is horizontally formed in the separation sheet (35), and a second heat-conducting plate (37) is horizontally inserted in the through groove (36);
the heat dissipation assembly is characterized in that a heat dissipation assembly (4) is arranged in the enclosure (1), the heat dissipation assembly (4) comprises a main heat conduction plate (41) and two contact heat conduction plates (44), a top embedded opening (13) is formed in the top surface of the enclosure (1), two side embedded openings (15) are formed in the inner side wall of the enclosure (1), the main heat conduction plate (41) is fixedly embedded in the top embedded opening (13), two side embedded openings (15) are fixedly connected with two side heat conduction plates (43) respectively, two side heat conduction plates (43) are in contact with the main heat conduction plate (41), two first I-shaped strips (313) are fixedly connected with two ends of a first heat conduction plate (32) respectively, two second I-shaped strips (314) are fixedly connected with two ends of a second heat conduction plate (37) respectively, two third I-shaped strips (315) are fixedly connected with two ends of a third I-shaped strip (39), a plurality of I-shaped grooves (45) are formed in one side of the contact heat conduction plates (44), and a plurality of first I-shaped strips (314) and second I-shaped heat conduction plates (43) are slidingly inserted in a plurality of packaging units (3), and the first I-shaped strips (43) are far away from the first I-shaped strips (313).
2. The multi-chip package module of claim 1, wherein: the packaging units (3) are vertically arranged, two first shallow openings (22) are formed in the top surface of the bottom plate (2), two second shallow openings (311) are formed in the isolation top plate (310), two positioning sheets (312) are fixedly connected to the bottom surface of the slide holder (31), the two positioning sheets (312) on the packaging unit (3) located at the lowest position are adhered to the two first shallow openings (22), and the two positioning sheets (312) on the rest packaging unit (3) are inserted into the two second shallow openings (311) on the packaging unit (3) located below.
3. The multi-chip package module of claim 1, wherein: the inner side top surface of the enclosure (1) is uniformly provided with a plurality of strip-shaped embedded openings (14), the strip-shaped embedded openings (14) are communicated with the top embedded openings (13), a plurality of strip-shaped embedded openings (14) are fixedly connected with a plurality of heat conducting fins (42) respectively, a plurality of the heat conducting fins (42) are contacted with the main heat conducting plate (41), and the bottom ends of the heat conducting fins (42) are contacted with the top surface of an isolation top plate (310) on the packaging unit (3) positioned at the top end.
4. The multi-chip package module of claim 1, wherein: the bottom surface rigid coupling underframe (11) of capsule (1), underframe (11) and capsule (1) are integrated into one piece structure, underframe (11) cup joint in bottom plate (2) week side, bottom plate (2) both sides fixed surface scarf joint a plurality of main pin (21) tip, a plurality of reserved openings (12) are offered to underframe (11) both sides are located a plurality of main pin (21) position bottoms, main pin (21) are located reserved opening (12) inboard.
5. The multi-chip package module of claim 4, wherein: two first welding pads (316) are respectively fixed and embedded on the top surfaces of two sides of the carrying platform (31), a plurality of sub-pin (317) end parts are respectively fixed and embedded on two sides of the carrying platform (31), the sub-pin (317) is electrically connected with the first welding pads (316), the sub-pin (317) is positioned on the outer bottom surface of the carrying platform (31) and fixedly connected with one end of a first bonding lead (318), and the other end of the first bonding lead (318) is fixedly connected with the top surface of a main pin (21).
6. The multi-chip package module of claim 5, wherein: the top surface of one side of the first chip (33) is fixedly embedded with a second welding pad (319), the second welding pad (319) is fixedly connected with and electrically connected with a plurality of second bonding wires (320), and the bottom ends of the second bonding wires (320) are fixedly connected with and electrically connected with the surface of one of the first welding pads (316).
7. The multi-chip package module of claim 6, wherein: the second chip (38) is close to a third bonding pad (321) fixedly embedded on the top surface of one side of the second bonding pad (319), a fourth bonding pad (323) is fixedly embedded on the top surface of one side of the second chip (38) away from the third bonding pad (321), the third bonding pad (321) is fixedly connected with and electrically connected with a plurality of third bonding leads (322), the bottom ends of the third bonding leads (322) are fixedly connected with and electrically connected with a second bonding pad (319), the fourth bonding pad (323) is fixedly connected with and electrically connected with a plurality of fourth bonding leads (324), and the bottom ends of the fourth bonding leads (324) are fixedly connected with and electrically connected with the surface of one of the first bonding pads (316).
8. The multi-chip package module of claim 1, wherein: the novel rotary disc type solar cell is characterized in that a plurality of rotating holes (16) are formed in the side wall of the bottom face of the enclosure (1) perpendicularly, the rotating rod (18) is connected in the rotating holes (16) in a rotating mode, a circular plate (19) is fixedly connected to the bottom face of the rotating rod (18), two sector plates (110) are fixedly connected to the side wall of the bottom end of the circular plate (19), a plurality of insertion holes (23) are formed in the position, right below the plurality of rotating holes (16), of the top face of the bottom plate (2), the circular plate (19) and the two sector plates (110) are inserted into the insertion holes (23), two sector plates (24) are fixedly connected to the inner side wall of the top face of the insertion holes (23), and the bottom faces of the two sector plates (24) are respectively contacted with the top faces of the two sector plates (110).
9. The multi-chip package module of claim 8, wherein: the edge top surface of the enclosure (1) is positioned right above a plurality of rotating holes (16) and is provided with a plurality of flaring (17) respectively, the top end of the rotating rod (18) is fixedly connected with a cross screw head (111), the cross screw head (111) is rotationally connected in the flaring (17), the side wall of the rotating hole (16) is provided with a fan-shaped groove (112), the side wall of the rotating rod (18) is fixedly connected with a vertical plate (113), the vertical plate (113) is slidably connected in the fan-shaped groove (112), one side, far away from the rotating rod (18), of the vertical plate (113) is made of rubber, and the vertical plate (113) is in technical fit in the fan-shaped groove (112).
10. A multi-chip package module according to any of claims 1-9, the method comprising the steps of:
step one: preparing a plurality of power device type chips and a plurality of control circuit chips to be packaged, taking the power device type chips as a first chip (33), taking the control circuit chips as a second chip (38), bonding a first heat-conducting plate (32) on the top surface of a carrying platform (31), bonding the first chip (33) on the top surface of the first heat-conducting plate (32), bonding both ends of an integrated insulating side bar (34) and a separation sheet (35) on both sides of the top surface of the first heat-conducting plate (32), enabling the separation sheet (35) to contact the top surface of the first chip (33), ensuring that a second welding pad (319) on the first chip (33) is positioned outside the separation sheet (35) during bonding, bonding the second chip (38) on the top surface of the separation sheet (35), bonding a third heat-conducting plate (39) on the top surface of the second chip (38), bonding a separation top plate (310) on the top surface of the third heat-conducting plate (39), and finally inserting the second heat-conducting plate (37) into a through groove (36) on the separation sheet (35);
step two: bonding wires are connected between a second bonding pad (319) on the first chip (33) and a first bonding pad (316) on one side of the carrier (31), bonding wires are connected between a third bonding pad (321) on the second chip (38) and a second bonding pad (319) on the first chip (33), bonding wires are connected between a fourth bonding pad (323) on the second chip (38) and a first bonding pad (316) on the other side of the carrier (31), and manufacturing of the packaging unit (3) is completed;
step three: arranging the packaging units (3) vertically to each other, splicing and positioning the positioning sheet (312) and the second shallow opening (311), bonding the positioning sheet (312) of the lowest packaging unit (3) on the first shallow opening (22) on the top surface of the bottom plate (2), and then connecting bonding leads between the sub pins (317) of the packaging units (3) and the main pins (21) on the bottom plate (2);
step four: the two contact type heat-conducting plates (44) are installed by sliding the I-shaped grooves (45) of the two contact type heat-conducting plates (44) onto the I-shaped strips at the ends of the plurality of heat-conducting plates, then the sealing shell (1) is covered, and the rotating rod (18) is screwed to fix the sealing shell (1) by utilizing the sector plate (110), so that the sealing is completed.
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| JPH0555398A (en) * | 1991-08-22 | 1993-03-05 | Fujitsu Ltd | Semiconductor device |
| US20090261472A1 (en) * | 2008-04-21 | 2009-10-22 | Infineon Technologies Ag | Power Semiconductor Module with Pressure Element and Method for Fabricating a Power Semiconductor Module with a Pressure Element |
| CN201393355Y (en) * | 2009-03-25 | 2010-01-27 | 扬州科光技术发展有限公司 | Controller of high power electric vehicle |
| CN109346442A (en) * | 2018-10-10 | 2019-02-15 | 唐燕 | It is a kind of be easy to radiate chip-packaging structure and its packaging method |
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2023
- 2023-05-22 CN CN202310573532.3A patent/CN116314050B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0555398A (en) * | 1991-08-22 | 1993-03-05 | Fujitsu Ltd | Semiconductor device |
| US20090261472A1 (en) * | 2008-04-21 | 2009-10-22 | Infineon Technologies Ag | Power Semiconductor Module with Pressure Element and Method for Fabricating a Power Semiconductor Module with a Pressure Element |
| CN201393355Y (en) * | 2009-03-25 | 2010-01-27 | 扬州科光技术发展有限公司 | Controller of high power electric vehicle |
| CN109346442A (en) * | 2018-10-10 | 2019-02-15 | 唐燕 | It is a kind of be easy to radiate chip-packaging structure and its packaging method |
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