CN216354172U

CN216354172U - IC packaging support plate with accurate positioning

Info

Publication number: CN216354172U
Application number: CN202123121753.2U
Authority: CN
Inventors: 史岱平; 周宇; 徐文峰
Original assignee: Shenzhen Tianxin Jizhi Electronics Co ltd
Current assignee: Shenzhen Tianxin Jizhi Electronics Co ltd
Priority date: 2021-12-14
Filing date: 2021-12-14
Publication date: 2022-04-19
Anticipated expiration: 2031-12-14

Abstract

The utility model discloses an IC packaging carrier plate with accurate positioning, which comprises a substrate and a PCB (printed Circuit Board) arranged on the substrate, wherein one side of the substrate, which is close to the PCB, is connected with a detachable limiting frame; the bottom of the PCB is connected with a heat-conducting piece, and a heat-radiating piece used for installing the heat-conducting piece and radiating heat of the heat-conducting piece is arranged in the base plate; according to the utility model, the heat dissipation part can be fixedly installed, the heat of the PCB can be timely guided into the heat dissipation part by the heat conduction part, the heat of the heat conduction part is discharged into the heat dissipation cavity and can be timely discharged from the heat dissipation holes, heat accumulation is reduced, after the PCB is fixed on the substrate, the position of the PCB can be further fixed by the limiting frame, and meanwhile, the limiting frame can further position a chip installed on the PCB, so that the subsequent packaging of the IC is facilitated.

Description

IC packaging support plate with accurate positioning

Technical Field

The utility model relates to the technical field of chips, in particular to an IC packaging carrier plate with accurate positioning.

Background

The package is a package in which circuit pins on a silicon chip are wired to external terminals for connection to other devices. The chip is not only used for mounting, fixing, sealing, protecting the chip and enhancing the electric heating performance, but also connected to pins of the packaging shell through the connection points on the chip by leads, and the pins are connected with other devices through the leads on the printed circuit board, thereby realizing the connection of the internal chip and an external circuit.

The shell comprises a carrier plate for bearing the chip and a cover shell covered on the carrier plate. In an IC package carrier disclosed in CN212750887U, a heat dissipation chamber is disposed in a carrier body, so that the heat of a conductive copper layer and a chip can be effectively dissipated without affecting the insulation of the carrier body.

However, in the package carrier, the heat dissipation chamber is disposed in the carrier body, and although the heat dissipation material in the heat dissipation chamber can rapidly absorb the heat dissipated by the conductive copper layer and the chip, the heat is still accumulated in the carrier due to the limitation of the closed carrier, which affects the use. In view of the above problems, an IC package carrier with accurate positioning is proposed.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to an IC package carrier with accurate positioning, so as to solve the problems mentioned in the background art.

In order to achieve the purpose, the utility model provides the following technical scheme:

an IC packaging carrier plate with accurate positioning comprises a substrate and a PCB arranged on the substrate, wherein a detachable limiting frame is connected to one side of the substrate, which is close to the PCB;

the PCB comprises a PCB body, wherein the bottom of the PCB body is connected with a heat conducting piece, and a heat radiating piece used for installing the heat conducting piece and radiating heat of the heat conducting piece is arranged in the base plate.

As a further scheme of the utility model, the heat conducting piece comprises a plurality of groups of uniformly arranged heat conducting fins, and the heat conducting fins are connected to one side of the PCB close to the substrate.

As a further scheme of the utility model, the heat dissipation part comprises a heat dissipation cavity arranged in the substrate, the top of the heat dissipation cavity is provided with an opening in butt joint with the heat conducting part, the opening is communicated with the heat dissipation cavity, and the side wall of the substrate is provided with heat dissipation holes communicated with the heat dissipation cavity.

As a further scheme of the utility model, a plurality of groups of uniformly arranged pin grooves are arranged on two sides of the limiting frame, and one side of each pin groove, which is far away from the substrate, is communicated with the outside.

As a further scheme of the utility model, the bottom of the limiting frame is contacted with the top of the substrate, the inner wall of the limiting frame is contacted with the outer wall of the PCB, and four groups of positioning holes are arranged on the limiting frame.

As a further aspect of the utility model, the bottom of the PCB board is connected to the top of the substrate by solder.

As a further scheme of the utility model, the substrate and the limiting frame are both made of insulating materials.

Compared with the prior art, the utility model has the beneficial effects that:

according to the utility model, the heat conducting piece at the bottom of the PCB can guide the heat of the PCB into the heat dissipation piece in time, and then the heat dissipation piece can dissipate the heat in time;

the heat dissipation part can mount and fix the heat conduction part, and meanwhile, the heat of the heat conduction part is discharged into the heat dissipation cavity and can be discharged from the heat dissipation holes in time, so that heat accumulation is reduced;

according to the utility model, the PCB is stably fixed on the substrate, the position of the PCB can be further fixed by the limiting frame, and meanwhile, the chip arranged on the PCB can be further positioned by the limiting frame.

Drawings

Fig. 1 is a schematic structural diagram of an IC package carrier with accurate positioning.

Fig. 2 is a schematic diagram of a disassembled structure of an IC package carrier with accurate positioning.

Fig. 3 is a schematic structural diagram of a substrate in an IC package carrier with accurate positioning.

Fig. 4 is a schematic diagram of a PCB structure of an IC package carrier with accurate positioning.

Fig. 5 is a schematic structural diagram of a positioning frame in an IC package carrier with accurate positioning.

In the figure: 100-substrate, 101-heat dissipation cavity, 102-heat dissipation hole;

200-PCB board, 201-heat conducting fin;

300- -limit frame, 301- -locating hole, 302- -pin slot.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-5, in an embodiment of the present invention, an IC package carrier with accurate positioning includes a substrate 100 and a PCB 200 mounted on the substrate 100, wherein a detachable limiting frame 300 is connected to a side of the substrate 100 close to the PCB 200;

the bottom of the PCB 200 is connected with a heat conducting member, and a heat dissipating member for mounting the heat conducting member and dissipating heat of the heat conducting member is disposed in the substrate 100;

the heat conducting part can guide the heat of the PCB 200 into the heat dissipation part in time, and then the heat dissipation part can dissipate the heat in time.

The heat conducting piece comprises a plurality of groups of heat conducting fins 201 which are uniformly arranged, and the heat conducting fins 201 are connected to one side of the PCB 200 close to the substrate 100; the heat of the PCB 200 and the chip connected to the PCB 200 can be led out in time through the heat-conducting fin 201;

the heat dissipation member comprises a heat dissipation cavity 101 arranged in a substrate 100, the top of the heat dissipation cavity 101 is provided with an opening in butt joint with the heat conducting member, the opening is communicated with the heat dissipation cavity 101, and the side wall of the substrate 100 is provided with a heat dissipation hole 102 communicated with the heat dissipation cavity 101;

the conducting strip 201 is inserted into the heat dissipation cavity 101 from the opening, after the conducting strip 201 is inserted, the position of the PCB 200 can be preliminarily fixed, the heat conducted by the conducting strip 201 enters the heat dissipation cavity 101, and then the heat can be discharged from the heat dissipation hole 102 in time, so that the heat accumulation is reduced.

The bottom of the PCB 200 is connected to the top of the substrate 100 by solder, and the PCB 200 can be soldered to the top of the substrate 100.

A plurality of groups of uniformly arranged pin slots 302 are arranged on two sides of the limiting frame 300, and one side of each pin slot 302, which is far away from the substrate 100, is communicated with the outside; the size and number of the pin slots 302 on the limiting frame 300 can be set according to actual conditions, and the connected pins of the chip can be led out from the pin slots 30.

The bottom of the limiting frame 300 is contacted with the top of the substrate 100, the inner wall of the limiting frame 300 is contacted with the outer wall of the PCB 200, and four groups of positioning holes 301 are arranged on the limiting frame 300; the positioning holes 301 can be connected with solder, and then the limiting frame is welded on the substrate 100, or the positioning holes 301 are connected with screws to fix the limiting frame 300 on the substrate 100.

The substrate 100 and the limiting frame 300 are made of insulating materials, and stable packaging of the chip is facilitated.

The working principle of the utility model is as follows: the conducting strip 201 is pegged graft in heat dissipation chamber 101 from the opening part, the back is pegged graft to conducting strip 201, the position of PCB board 200 can tentatively be fixed simultaneously, later can weld PCB board 200 at base plate 100 top, connect spacing frame 300 at base plate 100 top again, can connect IC on the PCB board 20, the heat of PCB board 200 and the chip of connecting on PCB board 200 can in time be derived to heat dissipation chamber 101 through conducting strip 201, later can in time discharge from louvre 102, it is piled up to reduce the heat.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof.

Claims

1. An IC package carrier with accurate positioning comprises a substrate (100) and a PCB (200) arranged on the substrate (100);

the method is characterized in that: one side of the base plate (100) close to the PCB (200) is connected with a detachable limiting frame (300);

the bottom of the PCB (200) is connected with a heat conducting piece, and a heat radiating piece used for installing the heat conducting piece and radiating heat of the heat conducting piece is arranged in the substrate (100).

2. The IC package carrier of claim 1, wherein: the heat conducting piece comprises a plurality of groups of heat conducting fins (201) which are uniformly arranged, and the heat conducting fins (201) are connected to one side, close to the substrate (100), of the PCB (200).

3. The IC package carrier of claim 2, wherein: the heat dissipation piece comprises a heat dissipation cavity (101) arranged in a substrate (100), the top of the heat dissipation cavity (101) is provided with an opening in butt joint with a heat conduction piece, the opening is communicated with the heat dissipation cavity (101), and the side wall of the substrate (100) is provided with a heat dissipation hole (102) communicated with the heat dissipation cavity (101).

4. The IC package carrier of claim 1, wherein: the limiting frame (300) is provided with a plurality of groups of uniformly arranged pin grooves (302) on two sides, and one side, far away from the substrate (100), of each pin groove (302) is communicated with the outside.

5. The IC package carrier board according to claim 4, wherein: the bottom of the limiting frame (300) is in contact with the top of the substrate (100), the inner wall of the limiting frame (300) is in contact with the outer wall of the PCB (200), and four groups of positioning holes (301) are formed in the limiting frame (300).

6. The IC package carrier of claim 1, wherein: the bottom of the PCB (200) is connected with the top of the substrate (100) through solder.

7. The IC package carrier of claim 1, wherein: the substrate (100) and the limiting frame (300) are made of insulating materials.