CN212136422U

CN212136422U - Miniaturized module IC heat dissipation base station structure of PCB board

Info

Publication number: CN212136422U
Application number: CN202021452471.3U
Authority: CN
Inventors: 陈平
Original assignee: Chengdu Xuguang Technology Co ltd
Current assignee: Chengdu Xuguang Technology Co ltd
Priority date: 2020-07-22
Filing date: 2020-07-22
Publication date: 2020-12-11
Anticipated expiration: 2030-07-22

Abstract

The utility model discloses a miniaturized module IC heat dissipation base station structure of PCB board arranges the PCB board in and plants the supplementary IC heat dissipation in miniaturized module IC position. A radiating base station connected with a PCB copper substrate is arranged on the surface B of the PCB where the miniaturized module IC is inserted; the heat dissipation base station is of a U-shaped enclosure structure. Adopt the utility model discloses a structure can not use present conventional heat dissipation device of IC just can effectively solve the overheated problem of module system actual work like expensive materials such as metal fin, heat conduction silicone grease, reduces IC actual operating temperature, reduces product design cost, and energy saving and consumption reduction to electrical apparatus simultaneously suppresses global temperature rising trend and has showing the effect.

Description

Miniaturized module IC heat dissipation base station structure of PCB board

Technical Field

The utility model belongs to electronic equipment, especially PCB printed circuit board makes field.

Background

In recent years, with the continuous development of semiconductor technology, the density of integrated circuits is higher and the size is smaller; the household electrical appliance equipment which is used in large quantity in real life is formed by assembling a plurality of modules and metal structures. For example, an electronic tuner of a television or a set top box is widely applied to WIFI and BT modules such as the internet and the internet of things, and integrated circuits are widely used, when equipment runs in a high-speed mode, due to the fact that the power consumption of a chip is large, heat dissipation under natural conditions cannot meet the requirements of a complete machine manufacturer on the working temperature of the chip, and therefore other modes need to be considered to meet the requirements of the complete machine manufacturer on the working temperature of the chip. The television or set top box electronic tuner on the market at present is applied to WIFI and BT modules of the internet, the internet of things and the like, and the heat dissipation problem of an IC is solved by adding expensive materials such as metal heat dissipation fins, heat conduction silicone grease and the like; however, the television or the set top box electronic tuner is applied to WIFI and BT modules such as the internet, the internet of things and the like, and has small volume, so that heat dissipation of an IC is not facilitated, and poor phenomena such as IC displacement and the like are caused when the temperature of the IC is too high; fig. 1 shows a conventional heat dissipation design of a conventional integrated block, wherein the integrated block is inserted into a T-face (element mounting face) of a PCB, and a heat-conducting silicone grease is applied to the surface of the integrated block to adhere a heat-dissipating aluminum block.

SUMMERY OF THE UTILITY MODEL

In view of the above insufficiency of the prior art, the purpose of the present invention is to design a miniaturized module IC heat dissipation structure for PCB board, which is convenient and low-cost to realize the heat dissipation function.

The purpose of the utility model is realized like this.

A PCB miniaturized module IC heat dissipation base station structure is arranged at the position of a PCB where a miniaturized module IC is inserted to assist IC heat dissipation. A radiating base station connected with a PCB copper substrate is arranged on the surface B of the PCB where the miniaturized module IC is inserted; the heat dissipation base station is of a U-shaped enclosure structure.

By adopting the structure of the heat dissipation base platform, the surface layer and the bottom layer of the PCB are the most ideal heat dissipation space for improving the heat dissipation performance. More exposed copper areas on the surface of the PCB have larger area for heat conduction, and simultaneously have greater flexibility, and provide more sufficient heat dissipation space in high-power-consumption devices. Through increase PCB top layer and bottom dew copper area, increase the soldering paste coating around the IC, because the soldering paste is the metallic property after through current-carrying welding process, metallic material thermal conductivity is the best, and IC gives off the heat flow fast through heat dissipation base station metal level, provides splendid heat dissipation route for the IC heat dissipation to reach the effect for the quick reduce temperature of IC.

Drawings

Figure 1 is a prior art solution.

Fig. 2 is a front view of the embodiment of the present invention.

Fig. 3 is a side view of fig. 2.

Fig. 4 is a partially enlarged view of the portion K of fig. 3.

Detailed Description

Referring to fig. 2, fig. 3 and fig. 4, it can be seen that the heat dissipation base structure of the miniaturized module IC of the PCB is disposed at the position where the miniaturized module IC is inserted into the PCB to assist the heat dissipation of the IC. On the surface B of the PCB, a part of the copper substrate Cb is covered with a solder resist ink film Mb. A radiating base station S connected with a PCB copper substrate Cb is arranged on the surface B of the PCB where the miniaturized module IC is inserted; the heat dissipation base station S is of a U-shaped enclosure structure. The integrated circuit J welds in the T face, increases the heat dissipation base station of horseshoe shape at integrated circuit welding opposite face B face integrated circuit body periphery, and the narrowest department width of base station is greater than 0.8mm, and heat dissipation base station area is greater than integrated circuit body surface area, and the heat dissipation base station must avoid the heat dissipation via hole of integrated circuit body below, through current-carrying welding process after, makes IC can the quick effect of lowering the temperature.

The area of the heat dissipation base station is slightly larger than the projection area of the inserted miniaturized module IC, and is generally 1.2-1.5 of the area; the thickness of the heat dissipation base station is related to the base station material actually adopted, the base station material can adopt a conventional metal sheet block, and can also be obtained by using liquid solder to flow and solidify during welding, and the thickness of the base station is preferably more than 2 mm.

Adopt as the size shown in figure 2 the utility model discloses the structure compares with current heat conduction silica gel, works after 3 minutes the utility model discloses the structure is than the IC surface temperature low 3 ~ 5 ℃ of traditional scheme.

Claims

1. A PCB board miniaturization module IC heat dissipation base station structure, place PCB board insert miniaturization module IC position assist IC heat dissipation, characterized by that, set up a heat dissipation base station linking with PCB board copper base plate in B side of PCB board insert miniaturization module IC position; the heat dissipation base station is of a U-shaped enclosure structure.

2. The PCB board miniaturized modular IC heat dissipation base structure of claim 1, wherein the area of the heat dissipation base is 1.2-1,5 of the projected area of the inserted miniaturized modular IC; the thickness of heat dissipation base station is greater than 2 mm.