CN113677087A - High-heat-dissipation SMT and processing method thereof - Google Patents
High-heat-dissipation SMT and processing method thereof Download PDFInfo
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- CN113677087A CN113677087A CN202110960972.5A CN202110960972A CN113677087A CN 113677087 A CN113677087 A CN 113677087A CN 202110960972 A CN202110960972 A CN 202110960972A CN 113677087 A CN113677087 A CN 113677087A
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- 238000003672 processing method Methods 0.000 title claims abstract description 10
- 230000017525 heat dissipation Effects 0.000 claims abstract description 99
- 238000010438 heat treatment Methods 0.000 claims abstract description 18
- 238000009434 installation Methods 0.000 claims abstract description 3
- 229910000679 solder Inorganic materials 0.000 claims description 12
- 238000005476 soldering Methods 0.000 claims description 11
- 238000012545 processing Methods 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims 4
- 230000000694 effects Effects 0.000 abstract description 2
- 238000004377 microelectronic Methods 0.000 abstract description 2
- 238000013021 overheating Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 8
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 8
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 8
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 8
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 3
- 239000000956 alloy Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a high-heat-dissipation SMT and a processing method thereof, and belongs to the technical field of semiconductor microelectronics. Including first PCB board, second PCB board, heating panel, insulating layer, heat dissipation cover and components and parts, the heating panel setting is between first PCB board and second PCB board, the inside heat dissipation channel that is provided with of heating panel, the heat dissipation channel correspondence sets up the below at the installation components and parts position, the heat dissipation channel is the setting of continuous S type, between first PCB board and the heating panel, all be provided with the insulating layer between second PCB board and the heating panel, components and parts paste the dress at the upper surface of first PCB board, the heat dissipation cover is installed first PCB board upper surface. The invention has good heat dissipation effect and can effectively avoid the condition that the double-layer circuit board is burnt due to overheating.
Description
Technical Field
The invention relates to the technical field of semiconductor microelectronics, in particular to a high-heat-dissipation SMT and a processing method thereof.
Background
SMT refers to a surface mount technology, which is the most popular technology and process in the electronic assembly industry, and is a Circuit connection technology in which a leadless or short-lead surface mount component (SMC/SMD, which is called a chip component in chinese) is mounted on the surface of a Printed Circuit Board (PCB) or the surface of another substrate, and then soldered or assembled by means of reflow soldering or dip soldering.
In recent years, with the development of the fields of mobile information products, household electrical appliance products, green illumination and the like, a great number of important components such as rectifier bridges, diodes, voltage stabilizing tubes and the like are used for matched electronic products, and higher requirements are put forward on the lightness, thinness, smallness and compactness of the components; however, as the packaging size of electronic devices is getting smaller and smaller, the power consumption of electronic components is increasing, which leads to the problem of heat dissipation of devices getting more and more important, especially for double-layer and multi-layer circuit boards, after assembly, because most of the circuit boards are combined together in a back-to-back manner or only one layer of simple aluminum alloy plate is used for close-together in a separated manner, the assembly relationship and the simple structure of the heat dissipation assembly lead to poor heat dissipation effect and slow heat dissipation speed.
Therefore, how to provide a high heat dissipation SMT and a processing method thereof becomes a problem to be solved by those skilled in the art.
Disclosure of Invention
In view of the above, the present invention provides a high heat dissipation SMT and a processing method thereof. The high-heat-dissipation SMT and the processing method thereof are simple in processing process and can effectively solve the heat dissipation problem of the PCB.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a high heat dissipation SMT, includes first PCB board, second PCB board, heating panel, insulating layer, heat exchanger and components and parts that dispel the heat, the heating panel sets up between first PCB board and second PCB board, the inside heat dissipation channel that is provided with of heating panel, the heat dissipation channel corresponds the below that sets up at the installation components and parts position, the heat dissipation channel is the setting of continuous S type, between first PCB board and the heating panel all be provided with the insulating layer between second PCB board and the heating panel, the dress is pasted at the upper surface of first PCB board to components and parts, the heat exchanger that dispels the heat is installed first PCB board upper surface.
Furthermore, the components are arranged on the edges of two sides of the first PCB and are arranged longitudinally.
Further, the protection casing is the aluminum alloy material, the protection casing corresponds the components and parts installing zone and is provided with radiating fin, the central point of protection casing puts and is provided with radiator fan.
Furthermore, the inside corresponding position with components and parts of protection casing is provided with corresponding boss, be provided with the thermal phase heat dissipation pad between boss and the components and parts.
Furthermore, a miniature heat dissipation fan is arranged at the position of an air inlet of the heat dissipation channel, and an outlet of the heat dissipation channel is correspondingly arranged below the component.
Further, first PCB board and second PCB board are provided with the louvre, set up heat-conducting glue in the louvre, heat-conducting glue links to each other with the heating panel.
A high heat dissipation SMT processing method comprises the following steps:
a. cutting and processing the first PCB and the second PCB substrate, and punching;
b. printing a current board, wherein during engineering programming, the positions of components are arranged at the edge position of the PCB, and the components are arranged longitudinally;
c. solder paste printing, namely demolding the solder paste through a steel plate hole to contact the solder paste and printing the solder paste on a substrate;
d. processing the paster, and manufacturing components required by the double-layer circuit board;
e. wave soldering, namely soldering the components to the first PCB by adopting selective wave soldering;
f. cleaning the first PCB and the second PCB, and cleaning welding residues harmful to human bodies;
g. assembling the first PCB and the second PCB on the heat dissipation plate;
h. and installing a heat dissipation cover on the first PCB.
Furthermore, the heat dissipation channels of the heat dissipation plate are correspondingly arranged in the longitudinal arrangement area of the components.
Furthermore, the heat dissipation cover is correspondingly provided with heat dissipation fins at the arrangement position of the components, and a heat dissipation fan is arranged at the central position of the heat dissipation cover.
The invention has the beneficial effects that:
1) according to the invention, the heat dissipation plate is arranged between the double-layer PCBs, and the S-shaped heat dissipation channel is arranged in the heat dissipation plate, so that the heat dissipation area is increased, and the double-layer PCBs can be subjected to heat dissipation.
2) The SMT components are longitudinally arranged on the edge of the first PCB, so that the components are convenient to dissipate heat, and meanwhile, the components are longitudinally arranged, so that the heat dissipation device is convenient to arrange.
3) According to the invention, the heat dissipation cover is arranged above the first PCB, and the heat dissipation cover is contacted with the component through the heat-variable phase heat dissipation pad, so that the heat dissipation of the first PCB in the SMT is further increased, and the first PCB is prevented from being burnt.
Drawings
FIG. 1 is a schematic view of the main structure of the present invention.
FIG. 2 is a top view of the present invention.
Fig. 3 is a front view of the present invention.
FIG. 4 is a diagram of a first PCB of the present invention.
Fig. 5 is a schematic view of the internal structure of the heat dissipation cover of the present invention.
Fig. 6 is a sectional view of the heat radiating plate of the present invention.
1-a first PCB board; 2-a second PCB board; 3-a heat dissipation plate; 4-an insulating layer; 5-a heat dissipation cover; 6-boss; 7-a heat dissipation fan; 8-a miniature heat dissipation fan; 9-heat dissipation channel; 10-heat dissipation holes; 11-heat dissipation fins; 12-components.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Example 1
As shown in fig. 1-6, the invention provides a high heat dissipation SMT, comprising a first PCB 1, a second PCB 2, a heat dissipation plate 3, an insulating layer 4, a heat dissipation cover 5 and a component 12, wherein the heat dissipation plate 3 is disposed between the first PCB 1 and the second PCB 2, a heat dissipation channel 9 is disposed inside the heat dissipation plate 3, the heat dissipation channel 9 is correspondingly disposed below a position where the component is mounted, the heat dissipation channel 9 is in a continuous S-shaped configuration, a micro heat dissipation fan 8 is disposed at an air inlet of the heat dissipation channel 9, an outlet of the heat dissipation channel is correspondingly disposed at a side surface of the heat dissipation plate 3 below the component, the insulating layer 4 is disposed between the first PCB 1 and the heat dissipation plate 3 and between the second PCB 2 and the heat dissipation plate 3, and can perform the functions of insulating and protecting the PCBs, the heat dissipation plate 3 can dissipate heat of the first PCB 1 and the second PCB 2 to prevent the component 12 from failing due to overheating, electronic equipment' S reliable performance descends, and heat dissipation channel 9 is the S type setting, can increase the flow area of cold wind in heat dissipation channel 9, can make the PCB board effectively cool down, and components and parts 12 below sets up the gas outlet, can take away a large amount of heats of components and parts 12 in the exhaust gas, and components and parts 12 longitudinal arrangement pastes the edge at the upper surface both sides of first PCB board 1, and heat exchanger 5 is installed first PCB board upper surface.
The protection casing 5 is the aluminum alloy material, and the protection casing 5 corresponds the components and parts installing zone and is provided with radiating fin 11, is provided with the thermal change looks heat dissipation pad between protection casing 5 and the components and parts 12, and the central point of protection casing 5 puts and is provided with radiator fan 7.
The invention provides a high-heat-dissipation SMT processing method, which comprises the following steps:
a. cutting and processing the first PCB 1 and the second PCB 2 template, and punching;
b. printing a current board, and arranging the positions of the components at the edge of the PCB during engineering programming, wherein the components 12 are longitudinally arranged;
c. solder paste printing, namely demolding the solder paste through a steel plate hole to contact the solder paste and printing the solder paste on a substrate;
d. processing the paster, and manufacturing components 12 required by the double-layer circuit board;
e. wave soldering, namely soldering the component 12 to the first PCB 1 by adopting selective wave soldering;
f. cleaning the first PCB 1 and the second PCB 2, and cleaning welding residues harmful to human bodies;
g. assembling a first PCB (printed circuit board) 1 and a second PCB 2 on a heat dissipation plate, wherein a heat dissipation channel 9 of the heat dissipation plate 3 is correspondingly arranged in a longitudinal arrangement area of components 12, the heat dissipation channel 9 is arranged in an S shape, and a micro heat dissipation fan 8 is arranged at an air inlet of the heat dissipation plate;
h. a heat dissipation cover 5 is installed on the first PCB 1, heat dissipation fins 11 are correspondingly arranged on the heat dissipation cover 5 at the arrangement position of the components, and a heat dissipation fan 7 is installed at the central position of the heat dissipation cover 5.
According to the invention, the heat dissipation plate 3 is arranged between the double-layer PCBs, the S-shaped heat dissipation channel 9 is arranged in the heat dissipation plate 3, the heat dissipation area is increased, the double-layer PCBs can be dissipated, the SMT components are longitudinally arranged at the edge of the first PCB 2, the components 12 can be further absorbed and dissipated by natural convection and heat dissipation fins, the cooling of the components is promoted, and the double-layer PCBs are prevented from being burnt.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any minor modifications, equivalent changes and modifications made to the above embodiment according to the technical spirit of the present invention are within the technical scope of the present invention.
Claims (9)
1. A high heat dissipation SMT which characterized in that: including first PCB board, second PCB board, heating panel, insulating layer, heat dissipation cover and components and parts, the heating panel sets up between first PCB board and second PCB board, the inside heat dissipation channel that is provided with of heating panel, the heat dissipation channel corresponds the below that sets up at the installation components and parts position, the heat dissipation channel is the setting of continuous S type, between first PCB board and the heating panel all be provided with the insulating layer between second PCB board and the heating panel, components and parts paste the dress at the upper surface of first PCB board, the heat dissipation cover is installed first PCB board upper surface.
2. An SMT according to claim 1, wherein the components are mounted on edges of the first PCB board on opposite sides of the first PCB board, the components being arranged in a longitudinal direction.
3. An SMT according to claim 2, wherein the protective cover is made of an aluminum alloy, heat dissipation fins are disposed on the protective cover corresponding to the component mounting area, and a heat dissipation fan is disposed at a central position of the protective cover.
4. An SMT according to claim 1, wherein corresponding bosses are disposed at positions corresponding to the components inside the protective cover, and thermal phase change heat dissipation pads are disposed between the bosses and the components.
5. An SMT according to claim 1, wherein a micro heat dissipation fan is disposed at an air inlet of the heat dissipation channel, and an outlet of the heat dissipation channel is correspondingly disposed below the component.
6. An SMT according to claim 1, wherein the first PCB and the second PCB are provided with heat dissipation holes, heat conducting glue is disposed in the heat dissipation holes, and the heat conducting glue is connected to the heat dissipation plate.
7. A high heat dissipation SMT processing method is characterized by comprising the following steps:
a. cutting and processing the first PCB and the second PCB substrate, and punching;
b. printing a current board, wherein during engineering programming, the positions of components are arranged at the edge position of the PCB, and the components are arranged longitudinally;
c. solder paste printing, namely demolding the solder paste through a steel plate hole to contact the solder paste and printing the solder paste on a substrate;
d. processing the paster, and manufacturing components required by the double-layer circuit board;
e. wave soldering, namely soldering the components to the first PCB by adopting selective wave soldering;
f. cleaning the first PCB and the second PCB, and cleaning welding residues harmful to human bodies;
g. assembling the first PCB and the second PCB on the heat dissipation plate;
h. and installing a heat dissipation cover on the first PCB.
8. An SMT according to claim 7, wherein the heat dissipation channels of the heat dissipation plate are correspondingly disposed in a longitudinal component arrangement region.
9. An SMT according to claim 7, wherein the heat sink has heat sink fins corresponding to the component arrangement positions, and a heat sink fan is mounted at a center of the heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110960972.5A CN113677087A (en) | 2021-08-20 | 2021-08-20 | High-heat-dissipation SMT and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110960972.5A CN113677087A (en) | 2021-08-20 | 2021-08-20 | High-heat-dissipation SMT and processing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN113677087A true CN113677087A (en) | 2021-11-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110960972.5A Pending CN113677087A (en) | 2021-08-20 | 2021-08-20 | High-heat-dissipation SMT and processing method thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5831828A (en) * | 1993-06-03 | 1998-11-03 | International Business Machines Corporation | Flexible circuit board and common heat spreader assembly |
| CN106535481A (en) * | 2016-12-08 | 2017-03-22 | 苏州长风航空电子有限公司 | Method for pasting heat dissipating board |
| CN210670726U (en) * | 2019-09-27 | 2020-06-02 | 无锡凯盟威电子科技有限公司 | Multilayer PCB heat radiation structure |
| CN212786009U (en) * | 2020-08-06 | 2021-03-23 | 东莞兴强线路板有限公司 | Printed circuit board with good heat dissipation performance |
| CN112867231A (en) * | 2020-12-28 | 2021-05-28 | 安徽展新电子有限公司 | Do benefit to radiating multilayer printed circuit board |
-
2021
- 2021-08-20 CN CN202110960972.5A patent/CN113677087A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5831828A (en) * | 1993-06-03 | 1998-11-03 | International Business Machines Corporation | Flexible circuit board and common heat spreader assembly |
| CN106535481A (en) * | 2016-12-08 | 2017-03-22 | 苏州长风航空电子有限公司 | Method for pasting heat dissipating board |
| CN210670726U (en) * | 2019-09-27 | 2020-06-02 | 无锡凯盟威电子科技有限公司 | Multilayer PCB heat radiation structure |
| CN212786009U (en) * | 2020-08-06 | 2021-03-23 | 东莞兴强线路板有限公司 | Printed circuit board with good heat dissipation performance |
| CN112867231A (en) * | 2020-12-28 | 2021-05-28 | 安徽展新电子有限公司 | Do benefit to radiating multilayer printed circuit board |
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| PB01 | Publication | ||
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Application publication date: 20211119 |
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| RJ01 | Rejection of invention patent application after publication |