CN219372670U - Be applied to quick installation radiator unit of PCB plug-in components pin - Google Patents

Abstract

The utility model relates to the field of heat dissipation structures, in particular to a fast-mounting heat dissipation assembly applied to pins of a PCB (printed circuit board) plug-in unit. Comprises a shell; the insulation heat-conducting rubber sleeve is arranged in one end of the shell, and pin holes convenient for pins to be inserted are formed in the insulation heat-conducting rubber sleeve; the heat conduction copper pipe is arranged at the other end of the shell, one end of the heat conduction copper pipe is positioned in the shell, and the other end of the heat conduction copper pipe extends out of the surface of the shell and is fixedly connected with the radiating fin. The heat dissipation device has the advantages that the realization mode is uniform, the pins of the discrete devices can be utilized for realizing quick installation aiming at different direct-insertion electronic components, the heat generated by the discrete devices can be led out to the external radiating fins through the pins and the contact surface, and the quick heat dissipation of different discrete devices is realized.

Description

Be applied to quick installation radiator unit of PCB plug-in components pin

Technical Field

The utility model relates to the field of heat dissipation structures, in particular to a fast-mounting heat dissipation assembly applied to pins of a PCB (printed circuit board) plug-in unit.

Background

The electronic circuit industry has very strict requirements on heat dissipation of devices, the parameter performance of the devices is changed due to temperature change, the overall operation performance of a system is further affected, and the devices are burnt even due to serious poor heat dissipation, so that heat dissipation is very important for the electronic devices.

The electronic device is divided into a patch type and a discrete type, the patch type element is directly attached to the surface of the PCB substrate, and the discrete type element is connected with the PCB through a pin penetrating the PCB. For chip of chip type electronic device (CPU, etc.), its upper surface is flat, and heat dissipation is carried out by adopting heat conduction silicone grease to connect with heat sink directly.

However, for discrete devices, i.e. direct-insert devices, because the shapes of the devices are different, it is difficult to find a complete plane to radiate heat, so at present, air cooling is mostly adopted for radiating modes of direct-insert devices, and some large-scale transformer devices radiate heat by adopting a water cooling system, but installation of fans and water cooling radiators cannot be realized for miniaturized application occasions with limited space structures. At present, the heat conductivity of the PCB substrate can be increased by researching the material of the PCB substrate, so that the heat dissipation performance of the system is improved, but the PCB cost is high due to the mode, and the popularization is difficult.

With the continuous development of high-energy electronic products such as new energy automobiles and high-voltage charging piles, the increase of power density of integrated circuits, and the high-power electronic devices such as direct-insert inductors, capacitors, transformers, mos tubes and the like welded on a PCB (printed circuit board) have serious signs of heating, and because the direct-insert electronic devices have different shapes and uneven heights, uniform cooling fins are difficult to manufacture, so that the cooling of the direct-insert electronic devices becomes an urgent problem to be solved in the electronic circuit industry.

Disclosure of Invention

The utility model aims to overcome the defects in the prior art, and provides a rapid installation heat dissipation assembly applied to pins of a PCB plug-in unit, which has unified implementation form, can realize rapid installation aiming at different direct-insertion electronic components by using pins of a discrete component, and can lead out heat generated by the discrete component to an external heat sink through the pins and a contact surface so as to realize rapid heat dissipation of different discrete components.

The technical scheme of the utility model is as follows: a quick-mounting heat dissipation assembly applied to PCB plug-in pins is characterized by comprising

A housing;

the insulation heat-conducting rubber sleeve is arranged in one end of the shell, and pin holes convenient for pins to be inserted are formed in the insulation heat-conducting rubber sleeve;

the heat conduction copper pipe is arranged at the other end of the shell, one end of the heat conduction copper pipe is positioned in the shell, and the other end of the heat conduction copper pipe extends out of the surface of the shell and is fixedly connected with the radiating fin.

In the utility model, the heat dissipation component is arranged on the back surface of the circuit substrate, and the discrete device to be cooled is arranged on the circuit substrate.

Pins of the discrete device to be cooled penetrate through the circuit substrate and are inserted into the insulating heat-conducting rubber sleeve, and the pins are soldered with the circuit substrate.

The size of one side of the shell facing the circuit substrate is larger than that of the other side of the shell, and the side of the shell facing the circuit substrate is contacted with the circuit substrate.

A plurality of cooling fins are arranged according to the number of the pins;

holes are formed in positions, corresponding to the positions of the pins, of the radiating fins, the end portions of the heat conducting copper tubes are inserted into the holes, and the radiating fins are fixedly connected with the heat conducting copper tubes through interference fit.

The shell is fixedly connected with the circuit substrate in a welding mode.

The beneficial effects of the utility model are as follows:

(1) The heat dissipation assembly is small in size, and can be installed in a smaller space compared with the existing air-cooled heat dissipation assembly;

(2) The method and the device perform quick heat dissipation of the discrete components in a unified form, so that a complex structure of a traditional heat dissipation fin for the discrete components is avoided;

(3) The heat radiation component is arranged on the back of the circuit board, so that the back heat radiation of the circuit board is realized, and the heat radiation component can be suitable for the design with the special structure requirement of bottom heat radiation;

(4) In the contact process of the heat dissipation component and the circuit substrate provided with the discrete heat dissipation component, heat on the discrete heat dissipation component is quickly transferred to the heat dissipation fin through the pins and the contact surface between the heat dissipation component and the circuit substrate, so that the quick heat dissipation of the discrete heat dissipation component is realized.

Drawings

FIG. 1 is a schematic perspective view of the present utility model;

FIG. 2 is a schematic top view of the present utility model;

FIG. 3 is a schematic view of the cross-sectional structure of the A-A direction of FIG. 2;

fig. 4 is a first schematic structural diagram of a central air-conditioning centralized control host circuit board with the heat dissipation assembly in embodiment 1;

fig. 5 is a second schematic structural diagram of a central air-conditioning centralized control host circuit board with the heat dissipating assembly in embodiment 1.

In the figure: 1, a shell; 2, insulating heat-conducting rubber sleeves; 3, a heat conduction copper pipe; 4 pin holes; 5 a circuit substrate; 6, a heat dissipation assembly; 7, radiating fins; 8 separate type devices to be cooled.

Detailed Description

In order that the above-recited objects, features and advantages of the present utility model will become more readily apparent, a more particular description of the utility model will be rendered by reference to the appended drawings.

In the following description, specific details are set forth in order to provide a thorough understanding of the present utility model. The present utility model may be embodied in many other forms than those herein described, and those skilled in the art may readily devise numerous other arrangements that do not depart from the spirit of the utility model. Therefore, the present utility model is not limited by the specific embodiments disclosed below.

As shown in fig. 1 to 3, the rapid installation heat dissipation assembly applied to a pin of a PCB plug-in unit according to the present utility model includes a housing 1, an insulating heat conduction rubber sleeve 2 and a heat conduction copper tube 3, wherein the housing 1 is cylindrical, in this embodiment, a size of one end of the housing 1 facing a device to be heat-dissipated is larger than a size of the other end of the housing, and a contact area between the housing 1 and the device to be heat-dissipated is increased by increasing a size of one end of the housing, so as to improve a heat dissipation effect of the device to be heat-dissipated.

An insulating heat-conducting rubber sleeve 2 is arranged inside one end of the shell 1, a pin hole 4 is formed in the insulating heat-conducting rubber sleeve 2, and pins of the discrete device to be cooled are inserted into the pin hole 4. The insulating heat-conducting rubber sleeve 2 is made of heat-conducting silica gel materials, has elasticity and can be suitable for pins with different diameters of the discrete heat-dissipating device. After the pins are inserted into the heat dissipation assembly, heat exchange is performed through the contact area between the pins and the insulating heat conduction rubber sleeve 2.

And a heat conduction copper pipe 3 is arranged in the other end of the corresponding shell 1. One end of the heat conduction copper pipe 3 is fixedly arranged in the shell 1, and the other end of the heat conduction copper pipe 3 extends out of the shell 1 and is used for being connected with the radiating fin 7. One or a plurality of heat dissipation components 6 are arranged according to the specific arrangement of the pins, holes are drilled on the heat dissipation fins 7 according to the specific positions of the pins, the end parts of the heat conduction copper tubes 3 are inserted into the holes of the heat dissipation fins 7, and the fixed connection between the heat conduction copper tubes 3 and the heat dissipation fins 7 is realized through interference fit. By the contact between the heat conduction copper pipe 3 and the radiating fins 7, the heat of the discrete device to be radiated is quickly transferred to the radiating fins 7.

In the use process, pins of the discrete electronic device are inserted into pin holes 4 at one end of the shell 1, and a heat conduction copper pipe 3 at the other end of the shell 1 is connected with the radiating fins 7. Through the pins and the heat dissipation assembly, the heat of the discrete electronic device is quickly transmitted to the radiating fins, and the heat dissipation of the discrete electronic device is realized.

Example 1

As shown in fig. 5, the heat dissipation assembly in this embodiment is applied to a circuit board in a central air conditioner centralized control host. In this embodiment, the discrete device to be cooled 8 required to be cooled by the central air conditioner centralized control host is arranged on the circuit substrate 5. Pins carried by the discrete type device 8 to be heat-dissipated pass through the circuit substrate 5 and are fixedly welded on the circuit substrate 5 through soldering tin. Pins of the discrete heat dissipation device 8 extend beyond the surface of the circuit substrate 5 by a certain distance. And the same number of heat dissipation components 6 are connected according to the number of pins of the discrete heat dissipation devices 8.

Pins of the discrete heat-dissipation device 8 to be cooled are respectively inserted into the corresponding insulating heat-conducting rubber sleeves 2 of the heat-dissipation assembly, pin holes 4 are formed in the insulating heat-conducting rubber sleeves 2, the pins are inserted into the pin holes 4, heat exchange is conducted through contact between the pins and the insulating heat-conducting rubber sleeves 2 and between the shell 1 and the circuit substrate 5, and heat dissipation and cooling of the pins are achieved. The heat conduction copper pipe 3 at the other end of the heat radiation component is fixedly connected with the heat radiation fin 7, and heat of the discrete heat radiation device 8 is rapidly transferred to the heat radiation fin 7 through the heat radiation component, so that heat radiation of the discrete heat radiation device is realized.

The circuit substrate 5 can remove the solder mask around the pins in the circuit design, so that the copper surface of the circuit substrate 5 is exposed, and the diameter of the exposed copper sheet is consistent with the size of the thicker end of the shell 1. The exposed copper sheet is in contact with the top surface of the thicker end of the housing 1, so that the heat conduction area is increased, and the heat dissipation assembly 6 can be connected with the circuit substrate 5 in a welding manner.

The rapid installation heat dissipation assembly applied to the pins of the PCB plug-in unit provided by the utility model is described in detail above. The principles and embodiments of the present utility model have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the method of the present utility model and its core ideas. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the utility model can be made without departing from the principles of the utility model and these modifications and adaptations are intended to be within the scope of the utility model as defined in the following claims. The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (6)

1. A quick-mounting heat dissipation assembly applied to PCB plug-in pins is characterized by comprising

A housing;

the insulation heat-conducting rubber sleeve is arranged in one end of the shell, and pin holes convenient for pins to be inserted are formed in the insulation heat-conducting rubber sleeve;

the heat conduction copper pipe is arranged at the other end of the shell, one end of the heat conduction copper pipe is positioned in the shell, and the other end of the heat conduction copper pipe extends out of the surface of the shell and is fixedly connected with the radiating fin.

2. The quick-mount heat sink assembly for a pin of a PCB package of claim 1,

the heat dissipation component is arranged on the back surface of the circuit substrate, and the discrete device to be heat-dissipated is arranged on the circuit substrate.

3. The quick-mount heat sink assembly for a pin of a PCB package of claim 2,

pins of the discrete device to be cooled penetrate through the circuit substrate and are inserted into the insulating heat-conducting rubber sleeve, and the pins are soldered with the circuit substrate.

4. The quick-mount heat sink assembly for a pin of a PCB package of claim 1,

the size of one side of the shell facing the circuit substrate is larger than that of the other side of the shell, and the side of the shell facing the circuit substrate is contacted with the circuit substrate.

5. The quick-mount heat sink assembly for a pin of a PCB package of claim 1,

a plurality of cooling fins are arranged according to the number of the pins;

holes are formed in positions, corresponding to the positions of the pins, of the radiating fins, the end portions of the heat conducting copper tubes are inserted into the holes, and the radiating fins are fixedly connected with the heat conducting copper tubes through interference fit.

6. The quick-mount heat sink assembly for a pin of a PCB package of claim 2,

the shell is fixedly connected with the circuit substrate in a welding mode.