CN217160294U - Metal substrate electronic component with radiator - Google Patents

Abstract

The utility model provides a metal substrate electronic components with radiator, including the radiator, radiator and electronic components's metal substrate direct contact. Compared with the prior art, the utility model discloses a with radiator and metal substrate direct contact, the heat that makes the heat source tube core produce directly conducts to the fin through the metal substrate, and the scheme of conducting to the radiator through the plastic package with current tube core heat compares, because the coefficient of heat conductivity of metal is tens of times or even hundreds of times of plastics, the utility model discloses an electronic components can distribute away the heat that the tube core produced by very efficient, has avoided electronic components to lose efficacy because of high temperature. The radiator is designed into the radiating fins, and the radiating fins are simple to process, do not need die processing and are low in production cost. The radiating fin does not need a support column and a screw, has light dead weight when radiating the same heat, does not generate overlarge stress on a PCB (printed circuit board) due to the screw fastening and the overweight of the radiator, and has more excellent vibration resistance.

Description

Metal substrate electronic component with radiator

Technical Field

The utility model relates to an electron device heat dissipation technical field especially relates to a metal substrate electronic components with radiator.

Background

In recent years, with miniaturization, integration, and modularization of electronic products, the mounting density of electronic components has increased, and the effective heat dissipation area has decreased. Therefore, the thermal design of high power electronic components and the board-level heat dissipation of circuit boards are receiving much attention. It is directly related to the reliability of the product. When the heat dissipation design is solved, the heat dissipation performance and the cost of the heat dissipation device are considered, and meanwhile, the production and manufacturing costs of the product are reduced to the maximum extent. Conventional printed board substrates such as FR4 and CEM3 are poor conductors of heat, are insulated from layers, and do not dissipate heat. The local heating of the electronic equipment is not eliminated, so that the high-temperature failure of electronic components is caused.

The purpose of PCB heat dissipation design is to adopt appropriate measures and methods to reduce the temperature of components and parts and the temperature of PCB, so that the system can normally work at an appropriate temperature and cannot fail due to high temperature. The temperature of the electronic components with high heat consumption during working depends on whether the adopted heat dissipation scheme can efficiently dissipate heat. Heat is transferred primarily by conduction, convection, and radiation. The existing heat dissipation scheme of the electronic component is shown in fig. 1, a heat sink is arranged on a plastic packaging surface of the electronic component, and the heat sink is mounted and fixed on a PCB through a heat sink support column and screws. The main path of heat transfer is the tube core (heat source) of the electronic component → the plastic package of the electronic component → the radiator → ambient air, and because the heat dissipation of the plastic package is poor, the heat of the tube core of the electronic component cannot be quickly dissipated, so that the high-temperature failure of the electronic component is caused.

Therefore, how to solve the problem of high-temperature failure of the electronic components, namely, how to rapidly lead and dissipate the heat of the electronic components, is the key.

SUMMERY OF THE UTILITY MODEL

To the not enough of above-mentioned prior art among the electronic components heat dispersion, the utility model aims to provide a metal substrate electronic components with radiator, it can distribute away electronic components's heat fast, avoids electronic components high temperature inefficacy.

The utility model provides a pair of metal substrate electronic components with radiator, including the radiator, radiator and electronic components's metal substrate direct contact.

Through with radiator and metal substrate direct contact, the heat that makes the heat source tube core produce directly conducts to the fin through the metal substrate, compares with the scheme that current tube core heat passes through plastic packaging conduction to radiator, because the coefficient of heat conductivity of metal is tens of times or even hundreds of times of plastics, consequently the utility model discloses a metal substrate electronic components with radiator can distribute away the heat that the tube core produced by the very efficient, has avoided electronic components to lose efficacy because of high temperature.

Preferably, the heat sink comprises a heat sink, the heat sink being in direct contact with the metal substrate. The radiator is designed into the radiating fins, and the radiating fins are easy to process, do not need die processing, and are low in production cost, so that the cost of electronic components is reduced.

Preferably, at least a portion of the heat sink is in direct contact with the metal substrate, and at least a portion of the heat sink is exposed to air.

Preferably, the part of the heat sink, which is in direct contact with the metal substrate, is of a flat plate structure, so that the heat sink and the metal substrate can be tightly attached to each other to facilitate heat conduction therebetween;

preferably, the part of the radiating fin exposed to the air has a flat plate structure, a wave-shaped structure or a combined structure of the flat plate structure and the wave-shaped structure; the wavy structure of the part of the radiating fin exposed to the air can increase the contact area of the radiating fin and the ambient air, thereby improving the radiating efficiency.

Preferably, the heat sink is of an L-shaped structure or a U-shaped structure.

Preferably, the radiating fin is a metal sheet, and the heat of the electronic component can be quickly radiated by utilizing the excellent heat-conducting property of metal.

Preferably, the heat sink is a copper sheet, and the copper sheet has excellent thermal conductivity and electrical conductivity.

Preferably, the heat sink is integrally connected with the metal substrate and/or the PCB by welding. Because the fin installation does not need support column and screw when fixed, the dead weight is light when giving off the same heat, can not produce too big stress to the PCB board because of screw fastening and radiator itself are overweight, has more outstanding shock resistance.

Compared with the prior art, the utility model provides a metal substrate electronic components with radiator is through the metal substrate direct contact with radiator and electrical components, and the heat that makes the heat source tube core produce directly conducts to the fin through the metal substrate, compares with the scheme that current tube core heat conducted to the radiator through the plastic packaging, because the coefficient of heat conduction of metal is the tens of times of plastics or even hundreds of times, consequently the utility model discloses a metal substrate electronic components with radiator can very the efficient distribute away the heat that the tube core produced, has avoided electronic components because of high temperature inefficacy. The radiator is designed into the radiating fins, and the radiating fins are easy to process, do not need die processing, and are low in production cost, so that the cost of electronic components is reduced. The radiating fin is preferably a metal sheet, and the heat of the electronic component can be quickly radiated by utilizing the excellent heat-conducting property of metal. And when the radiating fin is installed and fixed, a supporting column and a screw are not needed, the dead weight is light when the same heat is radiated, overlarge stress can not be generated on the PCB due to the fact that the screw is fastened and the radiator is overweight, and the radiating fin has more excellent vibration resistance.

The above-mentioned technical characteristics can be combined in various suitable ways or replaced by equivalent technical characteristics as long as the purpose of the invention can be achieved.

Drawings

The invention will be described in more detail hereinafter on the basis of non-limiting examples only and with reference to the accompanying drawings. Wherein:

fig. 1 is a heat dissipation scheme of a conventional electronic component;

fig. 2 is a schematic structural diagram of a metal substrate electronic component with a heat sink according to an embodiment of the present invention;

fig. 3 to 7 are schematic structural views of various cooling fins provided by the present invention.

Description of reference numerals:

1. a metal substrate; 2. a die; 3. plastic packaging; 4. a PCB board; 5. a heat sink; 6. a support pillar; 7. a screw; 8. and a heat sink.

Detailed Description

For making the purpose, technical solution and advantages of the present invention clearer, it will be right below that the technical solution of the present invention is clearly and completely described, based on the specific embodiments of the present invention, all other embodiments obtained by the ordinary skilled person in the art without creative work belong to the scope protected by the present invention.

The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element preceding the word covers the element listed after the word, and does not exclude the possibility that other elements are also covered. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.

In the present disclosure, when a specific device is described as being located between a first device and a second device, there may or may not be intervening devices between the specific device and the first device or the second device. When a particular device is described as being coupled to other devices, that particular device may be directly coupled to the other devices without intervening devices or may be directly coupled to the other devices with intervening devices.

All terms (including technical or scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs unless specifically defined otherwise. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

As shown in fig. 2, the metal substrate electronic component with a heat sink provided by the present invention includes a heat sink and a metal substrate electronic component, and the heat sink is preferably a heat sink 8. The heat sink 8 is in direct contact with the metal substrate 1 of the electronic component, and the main path of heat transfer of the heat dissipation scheme of the metal substrate electronic component with the heat sink 8 is as follows: the heat generated by the die 2 is conducted to the metal substrate 1 and then conducted to the heat sink 8 through the metal substrate 1, and the heat on the heat sink 8 is transferred to the ambient air by convection and radiation. In above-mentioned heat dissipation path, the heat that heat source tube core 2 produced is through 1 conduction to fin 8 of metal substrate, compares with the scheme that 2 heats of current tube core conduct to radiator 5 through plastic packaging 3, because the coefficient of heat conductivity of metal is the dozens of times or even hundreds of times of plastics, consequently the utility model discloses a metal substrate electronic components with radiator can distribute away the heat that tube core 2 produced by the very efficient, has avoided electronic components to lose efficacy because of high temperature.

The radiating fins 8 are preferably of a U-shaped structure; the metal substrate electronic component comprises a tube core 2, a metal substrate 1, a plastic package 3 and a PCB 4; the tube core 2 is arranged on the metal substrate 1, the plastic package 3 is used for wrapping the tube core 2, the bottom surface of the metal substrate 1 is directly contacted with the middle part of the U-shaped radiating fin 8, and the U-shaped radiating fin 8 is fixed on the PCB 4. Preferably, the U-shaped heat sink 8 is soldered to the metal substrate 1 and then to the PCB 4. The two flanks of the U-shaped heat sink 8 are exposed to the ambient air, and the heat on the two flanks of the heat sink 8 is taken away by the flowing ambient air, so that heat dissipation is achieved. The radiating fins 8 are easy to process, die processing is not needed, and production cost is low, so that the cost of electronic components is reduced. And when the radiating fin 8 is installed and fixed, the supporting column 6 and the screw 7 are not needed, the self weight is light when the same heat is radiated, overlarge stress on the PCB 4 due to screw fastening and overweight of the radiator is avoided, and the radiating fin has more excellent vibration resistance.

The heat sink 8 is preferably a metal plate made of metal material, such as copper plate, aluminum alloy plate, etc. The excellent heat-conducting property of the metal is utilized, so that the heat of the electronic component can be quickly radiated.

The heat sink 8 may be designed into a U-shaped structure, and the heat sink 8 may be designed into other structures according to the heat quantity actually required to be dissipated by the electronic component, and fig. 3 to 7 schematically show some forms, such as an L-shaped structure, a U-shaped structure with an upper portion reduced, or a combination form of the U-shaped structure with the upper portion reduced and the L-shaped structure, or a combination form of the U-shaped structure with the upper portion reduced and a wave-shaped structure. When the structure of the heat sink 8 is designed, the part of the heat sink 8 in direct contact with the metal substrate 1 is preferably a flat plate structure, so that the heat sink 8 and the metal substrate 1 can be tightly attached to each other to facilitate heat conduction therebetween; it is preferable that the portion of the heat sink 8 exposed to the air has a wave-like structure, so that the contact area of the heat sink 8 with the ambient air can be increased, thereby improving the heat dissipation efficiency.

Finally, it should be noted that: the above embodiments and examples are only used to illustrate the technical solution of the present invention, but not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments and examples, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments or examples may still be modified, or some of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the embodiments or examples of the present invention.

Claims (10)

1. The metal substrate electronic component with the radiator is characterized by comprising the radiator and the metal substrate electronic component, wherein the metal substrate electronic component comprises a tube core and a metal substrate, the tube core is arranged on the metal substrate, and the radiator is in direct contact with the metal substrate of the electronic component.

2. A metal substrate electronic component with a heat spreader as recited in claim 1, wherein the heat spreader comprises a heat sink, the heat sink being in direct contact with the metal substrate.

3. A metal substrate electronic component with a heat spreader as recited in claim 2, wherein at least a portion of the heat spreader is in direct contact with the metal substrate, and at least a portion of the heat spreader is exposed to air.

4. A metal substrate electronic component with a heat sink as recited in claim 3, wherein a portion of the heat sink in direct contact with the metal substrate is of a flat plate structure.

5. The device as claimed in claim 3, wherein the portion of the heat sink exposed to air has a flat structure, a corrugated structure or a combination of a flat structure and a corrugated structure.

6. The device as claimed in claim 4, wherein the portion of the heat sink exposed to air has a flat structure, a corrugated structure or a combination of a flat structure and a corrugated structure.

7. A metal substrate electronic component with a heat spreader as recited in claim 3, wherein the heat spreader is of an L-shaped configuration or a U-shaped configuration.

8. A metal substrate electronic component with heat spreader as claimed in any one of claims 2-7, wherein the heat spreader is a metal sheet.

9. A metal substrate electronic component with heat spreader as recited in claim 8, wherein the heat spreader is a copper sheet.

10. The metal-substrate electronic component with the heat sink as claimed in any one of claims 2 to 7, wherein the heat sink is integrally connected to the metal substrate and/or the PCB of the electronic component by soldering.

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