CN219107782U

CN219107782U - High heat conduction PCB circuit board

Info

Publication number: CN219107782U
Application number: CN202320132902.5U
Authority: CN
Inventors: 甘良平
Original assignee: Yunfeng Electronic Technology Shenzhen Co ltd
Current assignee: Yunfeng Electronic Technology Shenzhen Co ltd
Priority date: 2023-02-07
Filing date: 2023-02-07
Publication date: 2023-05-30
Anticipated expiration: 2033-02-07

Abstract

The utility model belongs to the technical field of PCB (printed circuit board), in particular to a high-heat-conductivity PCB, wherein a carbon fiber heat-conducting film for heat conduction is adhered and fixed on the lower surface of a PCB circuit substrate, an aluminum foil plate for heat dissipation is adhered on the lower surface of the carbon fiber heat-conducting film, a heat dissipation fin is welded on the lower surface of the aluminum foil plate, a heat dissipation pipe is welded at the lower end of the heat dissipation fin, a heat dissipation fan for air exhaust is arranged in the heat dissipation pipe, a heat conduction strip for heat conduction is welded on the upper surface of the carbon fiber heat-conducting film, a heat conduction groove is formed in the lower surface of the PCB circuit substrate, and the heat conduction strip is arranged in the heat conduction groove; the carbon fiber heat conducting film is fixed through the bonding of the lower surface of the PCB circuit substrate, the heat conducting strip integrally formed on the upper surface of the carbon fiber heat conducting film is arranged in the heat conducting groove formed on the lower surface of the PCB circuit substrate, and the purpose of heat diffusion of the PCB circuit substrate is achieved by utilizing the heat conductivity of the carbon fiber heat conducting film and the heat conducting strip.

Description

High heat conduction PCB circuit board

Technical Field

The utility model belongs to the technical field of PCB (printed circuit board), and particularly relates to a high-heat-conductivity PCB.

Background

PCB circuit boards are one of the important components of the electronics industry. Almost every electronic device, as small as an electronic watch, a calculator, as large as a computer, a communication electronic device, a military weapon system, has only electronic components such as an integrated circuit, and a printed board is used for electrically interconnecting the respective components. The printed circuit board consists of an insulating base plate, connecting wires and bonding pads for assembling and welding electronic elements, and has the dual functions of a conductive circuit and the insulating base plate. The wiring device can replace complex wiring, realizes electric connection among elements in a circuit, simplifies assembly and welding work of electronic products, reduces wiring workload in a traditional mode, and greatly lightens labor intensity of workers; and the whole volume is reduced, the product cost is reduced, and the quality and the reliability of the electronic equipment are improved.

Because many electronic components have been installed on the PCB circuit board, because the work of different electronic components causes the heat that electronic components produced difficult diffusion, causes the heat to gather at the PCB circuit board, and the problem that damages easily when the PCB circuit board is overheated.

Therefore, the PCB circuit board with high heat conductivity is designed through the carbon fiber heat conducting film and the heat conducting strip, meanwhile, the heat radiating area is increased by adopting the aluminum foil plate and the heat radiating fins, and the air flow is increased by adopting the heat radiating fan.

Disclosure of Invention

To solve the problems set forth in the background art. The utility model provides a high-heat-conductivity PCB.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a high heat conduction PCB circuit board, includes PCB circuit substrate to and PCB circuit substrate upper surface fixed's printed circuit layer, PCB circuit substrate's lower surface bonding is fixed with the carbon fiber heat conduction membrane that is used for heat conduction, carbon fiber heat conduction membrane's lower surface bonding has the aluminium foil board that is used for radiating, the lower surface welding of aluminium foil board has radiating fin, radiating fin lower extreme welding has the cooling tube, install the radiator fan that is used for the exhaust in the cooling tube, carbon fiber heat conduction membrane's upper surface welding has the heat conduction strip that is used for heat conduction, the heat conduction groove has been seted up to PCB circuit substrate's lower surface, and the heat conduction strip is installed in the heat conduction groove.

As a preferred technical scheme of the high-heat-conductivity PCB, the heat conducting strip is of a cylinder structure, the heat conducting groove is a strip-shaped groove, and the cross sections of the heat conducting strip and the heat conducting groove are isosceles trapezoids.

As a preferable technical scheme of the high-heat-conductivity PCB, six heat conducting strips and heat conducting grooves are arranged at equal intervals, and the heat conducting strips and the heat conducting grooves are in one-to-one correspondence.

As a preferred technical scheme of the high-heat-conductivity PCB, eleven radiating fins welded on the surface of the aluminum foil plate are arranged at equal intervals.

As a preferable technical scheme of the high-heat-conductivity PCB, the radiating fins are umbrella-shaped corrugated plate members, and the radiating pipes are welded at the lowest part of the lower ends of the radiating fins.

Compared with the prior art, the utility model has the beneficial effects that: the carbon fiber heat conducting film is fixed through the bonding of the lower surface of the PCB circuit substrate, the heat conducting strip integrally formed on the upper surface of the carbon fiber heat conducting film is arranged in the heat conducting groove formed on the lower surface of the PCB circuit substrate, the purpose of heat diffusion of the PCB circuit substrate is achieved by utilizing the heat conductivities of the carbon fiber heat conducting film and the heat conducting strip, the aluminum foil plate bonded on the lower surface of the carbon fiber heat conducting film and the radiating fins welded on the lower surface of the aluminum foil plate are beneficial to increasing the contact area with air when the PCB circuit substrate radiates heat, the radiating pipes welded at the lower ends of the radiating fins and the radiating fan arranged in the radiating pipes are convenient for the air around the radiating fins to diffuse outwards under the action of the radiating fan, so that the radiating efficiency of the PCB circuit substrate is improved, and the purpose of high heat conduction of the PCB circuit board is achieved.

Drawings

The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:

FIG. 1 is a schematic diagram of the structure of the present utility model;

fig. 2 is a schematic diagram of a three-dimensional structure of an aluminum foil plate and a radiating fin in the utility model;

fig. 3 is a schematic perspective view of a carbon fiber heat conducting film and a heat conducting strip according to the present utility model;

fig. 4 is a schematic perspective view of a PCB circuit board according to the present utility model;

in the figure: 1. a PCB circuit substrate; 2. a printed circuit layer; 3. a carbon fiber heat conductive film; 4. an aluminum foil plate; 5. a heat radiation fin; 6. a heat radiating pipe; 7. a heat radiation fan; 8. a heat conducting strip; 9. a heat conducting groove.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Examples

Referring to fig. 1-4, the present utility model provides a technical solution: the utility model provides a high heat conduction PCB circuit board, including PCB circuit substrate 1, and PCB circuit substrate 1 upper surface fixed's printed circuit layer 2, PCB circuit substrate 1's lower surface bonding is fixed with the carbon fiber heat conduction membrane 3 that is used for heat conduction, carbon fiber heat conduction membrane 3's lower surface bonding has the aluminium foil board 4 that is used for radiating, the lower surface welding of aluminium foil board 4 has fin 5, fin 5 lower extreme welding has cooling tube 6, install the cooling fan 7 that is used for the exhaust in the cooling tube 6, carbon fiber heat conduction membrane 3's upper surface welding has the heat conduction strip 8 that is used for heat conduction, heat conduction groove 9 has been seted up to PCB circuit substrate 1's lower surface, and heat conduction strip 8 installs in heat conduction groove 9.

In this embodiment, the carbon fiber heat conducting film 3 is adhered and fixed on the lower surface of the PCB circuit substrate 1, the heat conducting strips 8 integrally formed on the upper surface of the carbon fiber heat conducting film 3 are installed in the heat conducting grooves 9 formed on the lower surface of the PCB circuit substrate 1, the purpose of heat diffusion of the PCB circuit substrate 1 is achieved by utilizing the heat conductivities of the carbon fiber heat conducting film 3 and the heat conducting strips 8, the aluminum foil plate 4 adhered on the lower surface of the carbon fiber heat conducting film 3, the heat radiating fins 5 welded on the lower surface of the aluminum foil plate 4 are beneficial to increasing the contact area with air when the PCB circuit substrate 1 radiates heat, the heat radiating pipes 6 welded on the lower ends of the heat radiating fins 5, and the heat radiating fans 7 installed inside the heat radiating pipes 6 are convenient for the air around the heat radiating fins 5 to diffuse outwards under the action of the heat radiating fans 7, the heat radiating efficiency of the PCB circuit substrate 1 is improved, and the purpose of high heat conduction of the PCB circuit substrate is achieved.

Specifically, the heat conducting strip 8 is of a column structure, the heat conducting groove 9 is a strip-shaped groove, and the cross sections of the heat conducting strip 8 and the heat conducting groove 9 are isosceles trapezoids.

Specifically, the equal interval of heat conduction strip 8 and heat conduction groove 9 is provided with six, and heat conduction strip 8 and heat conduction groove 9 one-to-one.

Specifically, eleven radiating fins 5 welded on the surface of the aluminum foil plate 4 are arranged at equal intervals.

Specifically, the radiating fins 5 are umbrella-shaped corrugated plate members, and the radiating pipes 6 are welded at the lowest part of the lower ends of the radiating fins 5.

The working principle and the using flow of the utility model are as follows: during production, the heat conducting grooves 9 are formed in the lower surface of the PCB circuit substrate 1 at equal intervals, the heat conducting strips 8 integrally formed on the upper surface of the carbon fiber heat conducting film 3 are adhered in the heat conducting grooves 9, so that the carbon fiber heat conducting film 3 is adhered on the lower surface of the PCB circuit substrate 1, the printed circuit layer 2 is fixed on the upper surface of the PCB circuit substrate 1, the eleven radiating fins 5 are welded on the lower surface of the aluminum foil plate 4 at equal intervals, the radiating pipes 6 are welded on the lower ends of the radiating fins 5, the radiating fan 7 is arranged in the radiating pipes 6, the aluminum foil plate 4 is adhered on the lower surface of the carbon fiber heat conducting film 3, when the heat radiating fan is connected with an external power supply, heat generated by the PCB circuit substrate 1 is diffused on the aluminum foil plate 4 through the heat conducting strips 8 and the carbon fiber heat conducting film 3, and when the radiating fan 7 is connected with the external power supply, air around the aluminum foil plate 4 and the radiating fins 5 flows under the action of the radiating fan 7, and then the heat is radiated on the aluminum foil plate 4 and the radiating fins 5.

Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims

1. The utility model provides a high heat conduction PCB circuit board, includes PCB circuit substrate (1) to and fixed printed circuit layer (2) of surface on PCB circuit substrate (1), its characterized in that: the utility model discloses a PCB circuit substrate, including PCB circuit substrate (1), carbon fiber heat conduction membrane (3) that are used for heat conduction, the lower surface bonding of carbon fiber heat conduction membrane (3) has aluminum foil board (4) that are used for radiating, the lower surface welding of aluminum foil board (4) has radiating fin (5), radiating fin (5) lower extreme welding has cooling tube (6), install in cooling tube (6) and be used for radiating fan (7), the upper surface welding of carbon fiber heat conduction membrane (3) has heat conduction strip (8) that are used for heat conduction, heat conduction groove (9) have been seted up to the lower surface of PCB circuit substrate (1), and heat conduction strip (8) are installed in heat conduction groove (9).

2. The high thermal conductivity PCB of claim 1, wherein: the heat conducting strip (8) is of a column structure, the heat conducting groove (9) is a strip-shaped groove, and cross sections of the heat conducting strip (8) and the heat conducting groove (9) are isosceles trapezoids.

3. The high thermal conductivity PCB of claim 2, wherein: six heat conducting strips (8) and heat conducting grooves (9) are arranged at equal intervals, and the heat conducting strips (8) and the heat conducting grooves (9) are in one-to-one correspondence.

4. The high thermal conductivity PCB of claim 1, wherein: eleven radiating fins (5) welded on the surface of the aluminum foil plate (4) are arranged at equal intervals.

5. The high thermal conductivity PCB of claim 4, wherein: the radiating fins (5) are umbrella-shaped corrugated plate members, and the radiating pipes (6) are welded at the lowest positions of the lower ends of the radiating fins (5).