CN215121301U

CN215121301U - Double-layer heat dissipation circuit board

Info

Publication number: CN215121301U
Application number: CN202120714175.4U
Authority: CN
Inventors: 吴瑜
Original assignee: Guangdetongling Electron Co ltd
Current assignee: Guangdetongling Electron Co ltd
Priority date: 2021-04-08
Filing date: 2021-04-08
Publication date: 2021-12-10
Anticipated expiration: 2031-04-08

Abstract

The utility model discloses a double-layer heat dissipation circuit board, which belongs to the field of electronic components and comprises a mounting plate, a first heat dissipation plate, a second heat dissipation plate, a heat conduction rubber gasket, heat conduction silica gel, a high-power element, a low-power element and a fixing bolt, wherein the second heat dissipation plate is welded at the side edge of the upper surface of the mounting plate, a positioning hole is arranged on the mounting plate, the high-power element and the low-power element are arranged on the positioning hole, the high-power element is arranged at the edge of the mounting plate, the heat conduction silica gel is filled between the second heat dissipation plate and the high-power element, the second heat dissipation plate is arranged at the upper end of the second heat dissipation plate, the heat conduction rubber gasket is adhered at the lower end of the mounting plate, the first heat dissipation plate is adhered at the corresponding side of the lower end of the mounting plate, the first heat dissipation fan is arranged at the corresponding side of the high-power element, the utility model discloses simple structure, the circuit board heat dissipation of being convenient for.

Description

Double-layer heat dissipation circuit board

Technical Field

The utility model relates to a circuit board specifically is a double-deck heat dissipation circuit board belongs to the electronic components field.

Background

A circuit board, also called a printed circuit board, is a provider of electrical connection of electronic components, is a support body of the electronic components, is a carrier of the electrical connection of the electronic components, has been developed for more than 100 years, and is mainly designed by a layout design, the main advantage of adopting the circuit board is that errors of wiring and assembly are greatly reduced, the automation level and the production labor rate are improved, the printed circuit board is often limited by the problems of heating and heat dissipation in the using process, but the traditional heat dissipation printed circuit board has a plurality of problems, is inconvenient to use, can not realize high-efficiency heat dissipation guarantee of the circuit board while not well installing and supporting the gas of the circuit board, can not maintain good external heat conduction and heat dissipation on the bottom and the side surface, can not realize all-round heat dissipation guarantee, has a single structure, and has small heat dissipation contact area, thereby can not ensure the sufficiency of heat dissipation, the high-efficiency heat dissipation performance of the body is guaranteed without a special heat dissipation layer, and then the circuit board cannot be guaranteed to have good heat dissipation performance, so that the operation efficiency of the circuit board is low, the failure rate is high, and the maintenance burden of personnel is invisibly increased.

Chinese patent publication No. CN210042353U discloses a double-layer heat-dissipating circuit board, which is characterized in that a support frame is arranged to mount electronic devices in support legs and electronic devices on the top surface of the support frame in a stacked manner, the stacked mounting height is not higher than that of a transformer, the length of a connecting line between the electronic devices on the top surface of the support frame and the transformer is shortened, the component mounting on the whole PCB is reduced, and a heating device is mounted on a mounting frame, but the heat dissipated by the electronic devices cannot be dissipated quickly.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a double-deck heat dissipation circuit board realizes double-deck heat dissipation circuit board heat dissipation function through upper and lower two-layer heat abstractor that all sets up.

The purpose of the utility model can be realized by the following technical scheme: the utility model provides a double-deck radiating circuit board, includes mounting panel, heat conduction cushion, heat conduction silica gel, high power component, small power component and gim peg, the marginal welding of mounting panel upper surface has the second heating panel, a plurality of locating hole has been seted up on the mounting panel, correspond on the locating hole and install high power component and small power component, high power component is located mounting panel edge, it has heat conduction silica gel to fill between second heating panel and the high power component, second heat extraction fan is installed to second heating panel upper end, the gim peg runs through mounting panel and first heating panel and is fixed with the base, it has the heat conduction cushion to fill between mounting panel and the first heating panel, first heat extraction fan is installed to mounting panel lower extreme both sides.

Further, first heating panel comprises a plurality of heat dissipation part, dovetail sliding groove has been seted up to heat dissipation part one end, the heat dissipation part other end install with dovetail sliding groove complex dovetail slider, heat dissipation part side-mounting has the heat dissipation wing.

Furthermore, the first heat-discharging fans are divided into two groups, one group is a guiding fan, the other group is a blowing fan, and the first heat-discharging fans and the heat-dissipating fins of the first heat-dissipating plate form a ninety-degree included angle.

Further, the second heat dissipation plate has two to four fins facing the outside of the mounting plate.

Furthermore, the second heat extraction fan has a plurality of, the flabellum of second heat extraction fan makes progress, first heat extraction fan upper end covers there is heat-resisting dust screen.

Furthermore, the lower ends of the leads of the high-power element and the low-power element are welded with heat dissipation copper pins.

Furthermore, the first heat dissipation plate and the second heat dissipation plate are made of aluminum alloy materials.

Further, scribble heat conduction silica gel between forked tail spout and the forked tail slider.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses when using, the mounting panel upper end is through installation second heating panel and second heat extraction fan, second heat extraction fan is installed on the second heating panel, the second heating panel has 2-4 and correspond the installation, can install the heat extraction flabellum directly over high power component, the direction of flabellum is upwards, be convenient for get rid of the heat fast because of the quality of hot-air is lighter, second heat extraction fan top covers has heat-resisting dust screen, prevent that the top dust from dropping the entering, high power component design is installed in mounting panel border position in addition, and with the second heating panel between pack have heat conduction silica gel, be convenient for distribute away the heat fast.

2. The utility model discloses install first heating panel at the mounting panel lower extreme, it has the heat conduction cushion to fill between mounting panel and the first heating panel, and first heat dissipation fan is installed in the corresponding of mounting panel lower extreme edge, and first heat dissipation fan has two sets ofly, and a set of induced air fan that is, another a set of fan that is, blows away the heat fast when making things convenient for the electronic components heat to transmit on the first heating panel.

3. The first heat dissipation plate is composed of a plurality of heat dissipation parts, a dovetail sliding groove is formed in one end of each heat dissipation part, a dovetail sliding block is installed at the other end of each heat dissipation part, and heat dissipation fins are installed on the side faces of the heat dissipation parts, so that the heat dissipation parts can be installed additionally as required, the first heat dissipation plate is combined more flexibly, and the heat dissipation plate is suitable for requirements of different occasions.

Drawings

In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.

FIG. 1 is an overall front sectional view of the present invention;

FIG. 2 is a schematic view of the installation of the first heat removal fan of the present invention;

FIG. 3 is a cross-sectional view of the mounting plate of the present invention;

fig. 4 is a schematic view of the heat dissipation part of the present invention.

In the figure: 1. mounting a plate; 2. a fixing bolt; 3. a first heat dissipation plate; 4. a heat-conducting rubber pad; 5. heat conducting silica gel; 6. positioning holes; 7. a second heat removal fan; 8. a second heat dissipation plate; 9. a high-power element; 10. a first heat removal fan; 31. a dovetail chute; 32. a dovetail slide block; 33. heat dissipation fins; 35. a heat dissipating component; 61. a heat dissipation copper pin; 91. and a low power element.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1-4, a double-layer heat dissipation circuit board includes a mounting plate 1, a first heat dissipation plate 3, a second heat dissipation plate 8, a first heat dissipation fan 10, a second heat dissipation fan 7, a heat conduction rubber pad 4, heat conduction silica gel 5, a high-power component 9, a small-power component 91 and a fixing bolt 2, wherein the edge of the upper surface of the mounting plate 1 is welded with the second heat dissipation plate 8, two to four second heat dissipation plates 8 are provided, when there are more high-power components 9, more second heat dissipation plates 8 are required, fins of the second heat dissipation plate 8 point in a direction opposite to the center of the mounting plate 1, so as to dissipate heat to the outside, a plurality of positioning holes 6 are provided on the mounting plate 1, the high-power components 9 and the small-power components 91 are installed on the edge of the mounting plate 1, the high-power components 9 generate large heat, and are installed at the edge position close to the second heat dissipation plate 8 so as to dissipate heat conveniently, the lower ends of the leads of the high-power element 9 and the low-power element 91 are welded with heat dissipation copper pins 61, so that heat can be conveniently conducted to the first heat dissipation plate 3, the heat-conducting silica gel 5 is filled between the second heat-dissipating plate 8 and the high-power element 9, so that a heat-conducting medium is arranged between the second heat-dissipating plate 8 and the high-power element 9, the heat dissipation is more rapid, the upper end of the second heat radiation plate 8 is provided with a plurality of second heat radiation fans 7, can be installed right above the high-power element 9, is convenient for fast heat extraction, the fan blade of the second heat extraction fan 7 is upward, the hot air is light and is convenient for upward heat extraction, the installation plate 1 is not easy to be stained with dust, the upper end of the first heat exhaust fan 10 is covered with a heat-resistant dustproof net to prevent dust on the upper part from falling off, the fixing bolt 2 penetrates through the mounting plate 1 and the first heat dissipation plate 3 and is fixed with the base, and the lower end of the mounting plate 1 is bonded with a heat-conducting rubber pad 4;

the lower extreme of heat conduction cushion 4 bonds and has first heating panel 3, first heating panel 3 comprises a plurality of heat dissipation part 35, forked tail spout 31 has been seted up to heat dissipation part 35 one end, forked tail slider 32 is installed to the heat dissipation part 35 other end, and the interconnect between the heat dissipation part 35 of being convenient for, heat dissipation wing 33 is installed to heat dissipation part 35 bottom surface, is convenient for dispel the heat.

The corresponding side-mounting of 1 lower extreme of mounting panel has first heat extraction fan 10, makes things convenient for the heat dissipation in mounting panel 1 bottom, first heat extraction fan 10 has two sets ofly and one of them group is for leading the fan, and another group is the blast fan, increases the circulation of air between the heat dissipation wing 33, first heat extraction fan 10 is ninety degrees contained angles with the heat dissipation wing 33 of first heating panel 3.

More preferably, the first heat dissipation plate 3 and the second heat dissipation plate 8 are made of aluminum alloy, and the aluminum alloy is light, low in price and good in heat conduction performance.

More preferably, heat-conducting silica gel 5 is coated between the dovetail sliding groove 31 and the dovetail sliding block 32 to fill the gap and increase the heat-conducting performance.

The working principle is as follows: the utility model discloses when using, at first, with the reasonable setting of high-power component 9 at 1 border position of mounting panel, low-power component 91 installs in suitable position, weld second heating panel 8 in 1 border position of mounting panel, pour heat conduction silica gel 5 into between high-power component 9 and the second heating panel 8, wait to solidify the back and weld heat dissipation copper foot 61 and glue heat conduction cushion 4 under high-power component 9 and low-power component 91 on the terminal lead, then glue first heating panel 3 at 4 another sides of heat conduction cushion, and install two sets of first heat extraction fans 10 on heat dissipation wing 33 vertical direction, a set of induced fan that is, a set of fan that is the blast fan, then utilize gim peg 2 to run through mounting panel 1 and first heating panel 3 and fix it on the base.

Then, the first heat dissipation fan 10 is mounted on the second heat dissipation plate 8, and the heat dissipation fan blade can be independently arranged right above the high-power component 9, and the circuit board is mounted.

While one embodiment of the present invention has been described in detail, the description is only a preferred embodiment of the present invention, and should not be considered as limiting the scope of the present invention. All the equivalent changes and improvements made according to the application scope of the present invention should still fall within the patent coverage of the present invention.

Claims

1. A double-layer heat dissipation circuit board comprises a mounting plate (1), a heat conduction rubber cushion (4), heat conduction silica gel (5), a high-power element (9), a small-power element (91) and a fixing bolt (2), wherein a second heat dissipation plate (8) is welded at the edge of the upper surface of the mounting plate (1), a plurality of positioning holes (6) are formed in the mounting plate (1), the high-power element (9) and the small-power element (91) are correspondingly installed on the positioning holes (6), the high-power element (9) is located at the edge of the mounting plate (1), the double-layer heat dissipation circuit board is characterized in that the heat conduction silica gel (5) is filled between the second heat dissipation plate (8) and the high-power element (9), a second heat dissipation fan (7) is installed at the upper end of the second heat dissipation plate (8), and the fixing bolt (2) penetrates through the mounting plate (1) and the first heat dissipation plate (3) and is fixed with a base, the heat-conducting rubber mat (4) is filled between the mounting plate (1) and the first heat-radiating plate, and the first heat-radiating fan (10) is installed on two sides of the lower end of the mounting plate (1).

2. The double-layer heat dissipation circuit board according to claim 1, wherein the first heat dissipation plate (3) is composed of a plurality of heat dissipation parts (35), one end of each heat dissipation part (35) is provided with a dovetail sliding groove (31), the other end of each heat dissipation part (35) is provided with a dovetail sliding block (32) matched with the dovetail sliding groove (31), and the side surface of each heat dissipation part (35) is provided with a heat dissipation fin (33).

3. The double-layered heat dissipating circuit board according to claim 1, wherein the first heat dissipating fans (10) are two groups and one group is a guiding fan and the other group is a blowing fan, and the first heat dissipating fan (10) is at an angle of ninety degrees to the heat dissipating fins (33) of the first heat dissipating plate (3).

4. A double-layered heat-dissipating circuit board according to claim 1, wherein the second heat-dissipating plate (8) has two to four fins, and the fins of the second heat-dissipating plate (8) face the outside of the mounting board (1).

5. The double-layer heat dissipation circuit board of claim 1, wherein the number of the second heat dissipation fans (7) is several, the fan blades of the second heat dissipation fans (7) are upward, and the upper ends of the first heat dissipation fans (10) are covered with a heat-resistant dust screen.

6. The double-layer heat-dissipation circuit board as recited in claim 1, wherein the lower ends of the leads of the high-power component (9) and the low-power component (91) are soldered with heat-dissipation copper pins (61).

7. The double-layer heat dissipation circuit board as claimed in claim 1, wherein the first heat dissipation plate (3) and the second heat dissipation plate (8) are made of aluminum alloy.

8. The double-layer heat dissipation circuit board of claim 2, wherein a heat conductive silicone (5) is coated between the dovetail sliding groove (31) and the dovetail sliding block (32).