CN108135075A - A kind of high heat conduction printed circuit board - Google Patents

Abstract

The invention discloses a printed circuit board with high thermal conductivity, which comprises a circuit board layer, a heat-conducting insulating layer and a metal bottom layer arranged sequentially from top to bottom, the circuit board layer is provided with a positioning platform for soldering electronic components, the The lower surface of the metal bottom layer is covered with a thermally conductive adhesive layer, and the lower surface of the thermally conductive adhesive layer is covered with a heat dissipation layer. The lower surface of the heat dissipation layer is provided with a number of heat dissipation fins; For a good metal bottom layer, there is also a heat dissipation layer under the metal bottom layer. The heat dissipation layer is provided with a number of heat dissipation fins that increase the contact area with the air, so that the heat dissipation effect is better.

Description

A high thermal conductivity printed circuit board

technical field

The invention relates to the technical field of printed circuit boards, in particular to a high thermal conductivity printed circuit board.

Background technique

Printed Circuit Board (PCB) is one of the important parts of the electronics industry. PCB can provide fixed and assembled mechanical support for electronic components, and can realize electrical connection between electronic components. Almost every kind of electronic equipment, ranging from electronic watches and calculators to computers, communication electronic equipment, and military weapon systems, as long as there are electronic components such as integrated circuits, printed circuit boards are used for the electrical interconnection between them. .

With the development of integration technology and microelectronic packaging technology, the total power density of electronic components continues to increase, while the physical size of electronic components and electronic equipment tends to be smaller and miniaturized, and the heat generated rapidly accumulates, leading to integration The heat flux around the device is also increasing, and the high temperature environment has a great impact on the performance of electronic components and equipment, which requires more efficient thermal control solutions. Therefore, the heat dissipation problem of electronic components has evolved into a major focus of current electronic components and electronic equipment manufacturing.

Contents of the invention

In order to overcome the shortcomings of the above-mentioned prior art, the present invention provides a high thermal conductivity printed circuit board with improved thermal conductivity of the product.

In order to achieve the above object, the technical scheme adopted in the present invention is:

A printed circuit board with high thermal conductivity, comprising a circuit board layer, a thermally conductive insulating layer and a metal bottom layer arranged in sequence from top to bottom, the circuit board layer is provided with a positioning platform for soldering of electronic components, and the lower surface of the metal bottom layer A heat-conducting adhesive layer is pasted, and a heat dissipation layer is pasted on the lower surface of the heat-conducting adhesive layer, and a plurality of heat dissipation fins are arranged on the lower surface of the heat dissipation layer.

As a further improvement of the above solution, the heat dissipation layer and the heat dissipation fins are made of metal, the heat dissipation fins are evenly arranged, and there are gaps between the heat dissipation fins.

As a further improvement of the above solution, the heat dissipation fins are integrally formed with the heat dissipation layer.

As a further improvement of the above solution, a number of heat dissipation through holes are provided on the upper surface of the heat dissipation layer, and the heat dissipation through holes pass through the heat dissipation layer.

As a further improvement of the above solution, the thermally conductive insulating layer is Pi thermally conductive glue.

Beneficial effects of the present invention:

The present invention is a high heat conduction printed circuit board. The circuit board layer is also coated with a metal bottom layer with good heat dissipation performance, and a heat dissipation layer is arranged under the metal bottom layer. Fins for better heat dissipation.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly describe the drawings that need to be used in the description of the embodiments. Apparently, the drawings described are only some of the embodiments of the present invention, not all of them. Those skilled in the art can also obtain other designs and drawings based on these drawings without creative work:

Fig. 1 is a schematic structural diagram of a preferred embodiment of the present invention.

Detailed ways

The idea, specific structure and technical effects of the present invention will be clearly and completely described below in conjunction with the embodiments and accompanying drawings, so as to fully understand the purpose, features and effects of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, rather than all of them. Based on the embodiments of the present invention, other embodiments obtained by those skilled in the art without creative efforts belong to The protection scope of the present invention.

Referring to Fig. 1 , a printed circuit board with high thermal conductivity includes a circuit board layer 1, a thermally conductive insulating layer 2 and a metal bottom layer 3 arranged sequentially from top to bottom. The thermally conductive insulating layer 2 is Pi thermally conductive adhesive, and Pi itself is a A material with high temperature resistance and good insulation, with a dielectric strength > 4KV/mil, which can improve the withstand voltage characteristics of double-sided circuit boards and meet the withstand voltage requirements of high-end products. The circuit board layer 1 is equipped with soldering capacitors The lower surface of the metal bottom layer 3 is coated with a thermally conductive adhesive layer 5 , and the lower surface of the thermally conductive adhesive layer 5 is coated with a heat dissipation layer 6 .

The upper surface of the heat dissipation layer 6 is provided with some heat dissipation through holes 8, the heat dissipation through holes 8 pass through the heat dissipation layer 6, and the lower surface of the heat dissipation layer 6 is provided with some heat dissipation fins 7, the heat dissipation fins 7 and the heat dissipation layer 6 are integrally formed, the heat dissipation layer 6 and the heat dissipation fins 7 are made of metal, the heat dissipation fins 7 are evenly arranged, and there are gaps between the heat dissipation fins 7 .

The heat dissipation of the metal bottom layer 3 can absorb the heat generated by the circuit board layer 1. A heat dissipation layer 6 is also arranged below the metal bottom layer 3. The heat dissipation layer 6 is provided with some heat dissipation fins 7 that increase the contact area with the air, so that the heat dissipation effect is better. it is good. The heat dissipation vias 8 on the heat dissipation layer 6 can dissipate the heat inside the heat dissipation layer 6 and the metal bottom layer 3 , which greatly improves the heat dissipation rate.

The above is a specific description of the preferred embodiments of the present invention, but the invention is not limited to the described embodiments, and those skilled in the art can also make various equivalent modifications or replacements without violating the spirit of the present invention. , these equivalent modifications or replacements are all included within the scope defined by the claims of the present application.

Claims (5)

1. a kind of high heat conduction printed circuit board, it is characterised in that：Including from top to bottom set gradually board layer (1), heat conduction Insulating layer (2) and metal back layer (3) are provided with the positioning table (4) for holding electronic component welding on the board layer (1), described Metal back layer (3) lower surface is covered with heat-conducting glue layer (5), and the lower surface of the heat-conducting glue layer (5) is covered with heat dissipating layer (6), institute The lower surface for stating heat dissipating layer (6) is provided with several radiating fins (7).

2. high heat conduction printed circuit board according to claim 1, it is characterised in that：The heat dissipating layer (6) and radiating fin (7) equal metal product, the radiating fin (7) are uniformly arranged, and there are gaps between radiating fin (7).

3. high heat conduction printed circuit board according to claim 1, it is characterised in that：The radiating fin (7) and heat dissipating layer (6) it is integrally formed.

4. high heat conduction printed circuit board according to claim 1, it is characterised in that：The upper surface of the heat dissipating layer (6) is set Several thermal vias (8) are equipped with, the thermal vias (8) penetrates through the heat dissipating layer (6).

5. high heat conduction printed circuit board according to claim 1, it is characterised in that：The thermally conductive insulating layer (2) is led for Pi Hot glue.