CN218416771U

CN218416771U - Circuit board and electronic equipment

Info

Publication number: CN218416771U
Application number: CN202221696110.2U
Authority: CN
Inventors: 毛红斌; 张楠赓
Original assignee: Canaan Creative Co Ltd
Current assignee: Canaan Creative Co Ltd
Priority date: 2022-04-02
Filing date: 2022-07-01
Publication date: 2023-01-31
Anticipated expiration: 2032-07-01
Also published as: CN115151023A

Abstract

The embodiment of the application provides a circuit board and electronic equipment, wherein, the circuit board includes: a main substrate; the auxiliary substrate is arranged on one side of the main substrate, and a first component is arranged on one side of the auxiliary substrate, which is deviated from the main substrate; and a heat conduction portion, at least a part of which is provided between the main substrate and the first component, for conducting heat generated by the first component to the main substrate. According to the circuit board of the embodiment of the application, the requirement on the heat dissipation capacity of the auxiliary substrate is lowered, the selection range of the material or the type of the auxiliary substrate is widened, and therefore the application range of the circuit board is enlarged.

Description

Circuit board and electronic equipment

The present application claims priority of chinese patent application having application number 2022103513850, entitled "circuit board and electronic device", filed at 2.4.2022 by the chinese patent office, the entire contents of which are incorporated herein by reference. The present application claims priority of chinese patent application having application number 2022207728560, entitled "circuit board and electronic device", filed on 2/4/2022 by the chinese patent office, the entire contents of which are incorporated herein by reference.

Technical Field

The application relates to the technical field of circuits, in particular to a circuit board and electronic equipment.

Background

In the related art, an epoxy glass cloth laminated board (FR-4 board) with good flame resistance is disposed in a circuit board, and the heat dissipation effect of a heating element disposed on the epoxy glass cloth laminated board is poor due to poor heat dissipation capability of the epoxy glass cloth laminated board.

SUMMERY OF THE UTILITY MODEL

Embodiments of the present application provide a circuit board and an electronic device to solve or alleviate one or more technical problems in the prior art.

As an aspect of the embodiments of the present application, an embodiment of the present application provides a circuit board, including:

a main substrate;

the auxiliary substrate is arranged on one side of the main substrate, and a first component is arranged on one side of the auxiliary substrate, which is deviated from the main substrate;

and a heat conduction portion, at least a part of which is provided between the main substrate and the first component, for conducting heat generated by the first component to the main substrate.

According to the circuit board of this application embodiment, can utilize the heat conduction portion to conduct the heat that first component produced to main base plate, and then utilize the heat-sinking capability of main base plate to give off the heat to the realization utilizes the first component of main base plate on to the auxiliary base plate to dispel the heat. Therefore, the auxiliary substrate can adopt a substrate with weaker heat dissipation capability, and the main substrate can adopt a substrate with stronger heat dissipation capability, so that the requirement on the heat dissipation capability of the auxiliary substrate is reduced, the selection range of the material or the type of the auxiliary substrate is expanded, and the application range of the circuit board is enlarged.

In one embodiment, at least part of the heat conducting portion and the sub-substrate jointly define a heat conducting through hole, and openings at two ends of the heat conducting through hole are respectively arranged towards the first component and the main substrate. Thus, heat generated by the first component can be conducted to the primary substrate through the thermally conductive via.

In one embodiment, the openings at both ends of the heat conductive through hole extend to the surface of the first component facing the primary substrate and the surface of the primary substrate facing the secondary substrate, respectively. Therefore, the heat generated by the first component can be directly conducted to the main substrate through the heat conducting through hole, and the heat conducting efficiency is further improved.

In one embodiment, a heat conducting medium is contained within the heat conducting through-hole. Therefore, heat generated by the second component can be conducted to the first substrate through the heat conducting medium, the heat conduction capacity of the heat conducting part is further improved, and the heat dissipation effect on the first component is further improved.

In one embodiment, the heat-conducting portion includes a first heat-conducting member provided on a side of the sub-board facing the first component, and a second heat-conducting member provided on a side of the sub-board facing the main board, and the heat-conducting through-hole is defined by the first heat-conducting member, the sub-board, and the second heat-conducting member. From this, first heat-conducting piece and second heat-conducting piece can set up alone, have reduced the processing degree of difficulty to carry out the heat transfer through the heat conduction through-hole of injecing jointly.

In one embodiment, the heat conducting portion further includes a third heat conducting member, the third heat conducting member is disposed on a side of the main substrate facing the sub-substrate, and the third heat conducting member is connected to the second heat conducting member. From this, not only can pass through the heat conduction of third heat-conducting piece with the heat of second heat-conducting piece to main base plate, still realized that the connection of sub-base plate on main base plate is fixed, promoted installation convenience.

In one embodiment, the openings at the two ends of the heat conducting through hole respectively extend to the surface of the first component facing the sub-substrate and the surface of the third heat conducting member facing the sub-substrate. Therefore, heat generated by the first component can be directly transferred to the third heat-conducting piece through the heat-conducting through hole and is transferred to the main substrate through the third heat-conducting piece, and the heat transfer efficiency between the first component and the third heat-conducting piece is improved.

In one embodiment, the first heat-conducting member, the second heat-conducting member and the third heat-conducting member are pads, and the second heat-conducting member and the third heat-conducting member are welded together. Therefore, the first heat-conducting member, the second heat-conducting member and the third heat-conducting member can be formed by preset bonding pads on the main substrate and the sub-substrate, and the heat-conducting part can be formed only by welding and connecting the bonding pads on the main substrate and the sub-substrate without separately processing the main substrate and the sub-substrate.

In one embodiment, at least one of the solder paste provided on the first heat-conducting member, the solder paste provided on the second heat-conducting member, and the solder paste provided on the third heat-conducting member forms a heat-conducting medium accommodated in the heat-conducting through-hole. Therefore, a heat-conducting medium does not need to be arranged in the heat-conducting through hole independently, and the processing efficiency of the circuit board is improved.

In one embodiment, the heat conducting through hole comprises a heat conducting layer arranged on the inner wall surface of the heat conducting through hole. Therefore, the heat conduction efficiency between the first component and the main substrate is further improved, and the heat dissipation effect of the first component is further improved.

In one embodiment, the material of the thermally conductive layer comprises copper. Therefore, the heat conduction layer can be processed by utilizing a through hole copper plating technology, and the processing convenience of the heat conduction layer is improved.

In one embodiment, the diameter of the thermally conductive vias is 0.20 to 0.30mm. Therefore, the heat conduction efficiency between the first heat conduction member and the second heat conduction member is ensured, and the distribution uniformity of the plurality of heat conduction through holes on the auxiliary substrate is also ensured.

In one embodiment, the heat conducting portion includes a heat conductor, at least a portion of which penetrates the sub-substrate, and both ends of which are in contact with the first component and the main substrate, respectively. Therefore, the heat generated by the first component can be directly conducted to the main substrate through the heat conductor, and the heat dissipation efficiency of the first component is improved.

In one embodiment, the sub-substrate is provided with a receiving through-hole, and at least part of the heat conductor is arranged through the receiving through-hole. Thereby, the connection fixation of the heat conductor between the first component and the main substrate is achieved.

In one embodiment, the heat conductor includes a first heat conduction split body, a second heat conduction split body and a third heat conduction split body, the first heat conduction split body is located between the first component and the auxiliary substrate, the second heat conduction split body is located between the auxiliary substrate and the main substrate, the third heat conduction split body is accommodated in the accommodation through hole, and two ends of the third heat conduction split body are respectively connected with the first heat conduction split body and the second heat conduction split body. Through setting up first heat conduction components of a whole that can function independently and second heat conduction components of a whole that can function independently, increased the area of contact of heat conductor with first component and with main substrate to, hold in holding the third heat conduction components of a whole that can function independently in the through-hole through the setting, realized the heat-conduction between first heat conduction components of a whole that can function independently and the second heat conduction components of a whole that can function independently, so that the heat that makes first component conduct to first heat conduction components of a whole that can function independently can conduct to second heat conduction components of a whole that can function independently through third heat conduction components of a whole that can function independently, and then with heat conduction to main substrate by first component. Thus, the efficiency of heat conduction between the first element and the main substrate is improved.

In one embodiment, the first heat conduction sub-body, the second heat conduction sub-body and the third heat conduction sub-body are an integrated body, and the first heat conduction sub-body, the second heat conduction sub-body and the third heat conduction sub-body are solder paste. Therefore, in the process of mounting the auxiliary substrate on the main substrate, at least part of the soldering paste can form the heat-conducting medium in the heat-conducting through hole, and the step of independently arranging the heat-conducting medium in the heat-conducting through hole is omitted, so that the processing efficiency of the circuit board is improved.

In one embodiment, the outer surface of the second heat conduction sub-body is provided with a heat conduction layer. Therefore, the heat conduction efficiency between the first component and the main substrate is improved, and the heat dissipation effect of the first component is further improved.

In one embodiment, the primary substrate is spaced apart from the secondary substrate. Therefore, the gap between the main substrate and the auxiliary substrate can be utilized to dissipate heat of the auxiliary substrate or the components on the main substrate, and the heat dissipation efficiency is improved.

In one embodiment, the heat dissipation capability of the primary substrate is greater than the heat dissipation capability of the secondary substrate. This makes it possible to provide the main board with the capability of dissipating heat from the sub board.

In one embodiment, a projected area of the sub-substrate on the main substrate is smaller than an area of the main substrate. Therefore, the heat dissipation capacity of the main substrate is larger than that of the auxiliary substrate according to the surface area factor of the substrates, so that the first component on the auxiliary substrate can be guaranteed to dissipate heat through the main substrate.

In one embodiment, the primary substrate is a metal-based copper-clad plate, and the secondary substrate is an epoxy glass cloth laminated plate. Through the embodiment, the main substrate has better heat dissipation capacity, and the auxiliary substrate has better heat resistance and working stability. Therefore, the circuit board provided by the embodiment of the application can be suitable for the environment with higher working temperature, heat generated by the first component on the auxiliary substrate is conducted to the main substrate through the heat conducting part, and heat dissipation of the first component can be realized, so that the working reliability of the first component is ensured.

In one embodiment, the primary substrate is provided with a plurality of second components, and at least some of the metal members are disposed between adjacent second components. Thereby, the heat dissipation effect of the second component can be improved.

In one embodiment, the metal part is used for dissipating heat of and/or reducing a voltage drop between two adjacent connected components. Therefore, the working stability and reliability of the second component are improved.

In one embodiment, the metal member is multiple, the spacing between at least part of the adjacent second components is gradually increased, and the size of the metal member between at least part of the adjacent second components is gradually increased. In this way, even in the case of an increasing distance between at least some adjacent second components, a heat dissipation effect for the second components can be ensured.

In one embodiment, a plurality of metal pieces with different sizes are arranged between at least part of adjacent second components. Thereby, the plurality of differently sized metal pieces may improve the voltage drop effect for adjacent second components.

In one embodiment, under the condition that the circuit board is located in the heat dissipation channel, the size of the metal piece close to the first end of the heat dissipation channel is smaller than that of the metal piece close to the second end of the heat dissipation channel, wherein the distance between the first end and the air inlet of the heat dissipation channel is smaller than the distance between the second end and the air inlet. Therefore, the heat dissipation effect of the second component close to the first end of the heat dissipation channel is close to that of the second component close to the second end of the heat dissipation channel, the uniformity of the heat dissipation effect is ensured, and the temperature concentration of the local second component is avoided. In one embodiment, the size of at least a portion of the metal members located in the middle region is larger than the size of at least a portion of the metal members located in the at least one end region in the first or second direction of the primary substrate. Therefore, the defect that the second component in the middle area is poor in heat dissipation effect is overcome, and the uniformity of the heat dissipation effect is further improved.

In one embodiment, the metallic article comprises at least one of a sheet of copper and a sheet of aluminum. Therefore, the heat conduction efficiency of the metal piece is improved, and the material cost of the metal piece is reduced.

As another aspect of the embodiments of the present application, an electronic device is provided, which includes a heat dissipation channel, and one or more circuit boards as in the above embodiments of the present application, where the circuit boards are disposed in the heat dissipation channel.

According to the technical scheme of the embodiment of the application, the requirement on the heat dissipation capacity of the auxiliary substrate is lowered, the selection range of the material or the type of the auxiliary substrate is widened, and therefore the application range of the circuit board is enlarged.

The foregoing summary is provided for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present application will be readily apparent by reference to the drawings and following detailed description.

Drawings

In the drawings, like reference characters designate like or similar parts or elements throughout the several views unless otherwise specified. The figures are not necessarily to scale. It is appreciated that these drawings depict only some embodiments in accordance with the disclosure and are therefore not to be considered limiting of its scope.

FIG. 1 illustrates a side cross-sectional view of a circuit board according to an embodiment of the present application;

FIG. 2 illustrates a side cross-sectional view of a circuit board having a thermally conductive via containing a thermally conductive medium therein according to an embodiment of the present application;

FIG. 3 illustrates a side cross-sectional view of a thermal conductor of a circuit board according to an embodiment of the present application;

FIG. 4 shows a schematic view of a first heat-conducting member in a side of a secondary base plate facing away from a primary base plate according to an embodiment of the present application;

fig. 5 is a schematic view showing a second heat-conductive member in a side of the sub-base plate facing the main base plate according to an embodiment of the present application;

fig. 6 is a schematic view showing a third heat-conductive member in a side of the primary base plate toward the secondary base plate according to the embodiment of the present application;

FIG. 7 is a schematic top view of the circuit board without the working chip and the copper sheet attached thereto according to the embodiment of the present disclosure;

FIG. 8 isbase:Sub>A schematic cross-sectional view A-A of FIG. 7 (after attaching the working chip and the copper sheet);

FIG. 9 is a schematic diagram of an embodiment of a solder layer of a circuit board according to an embodiment of the present application;

fig. 10 is a schematic structural diagram of an embodiment of a solder layer of a circuit board according to an embodiment of the present application.

Description of reference numerals:

a circuit board 20;

a conductive layer 100;

a solder layer 200; a weld layer body 210; a first side edge 210a; a second side edge 210b; a third side 210c; a fourth side 210d; a first body end 211; a second body end 212; an exhaust gap 220; an open end 220a;

a second component 300;

a metal piece 400;

a main substrate 500;

an insulating and heat conducting layer 600;

a sub-substrate 700; the accommodation through-hole 700a; a first component 710; a bonding pad 720;

a heat conduction portion 800; a thermally conductive via 800a; a heat transfer medium 800b; a first heat-conductive member 810; a second thermally conductive member 820; a third heat-conductive member 830; a thermal conductor 840; a first heat-conducting split 841; a second thermally conductive sub-body 842; a third thermally conductive sub-body 843.

Detailed Description

In the following, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present application. Accordingly, the drawings and description are to be regarded as illustrative in nature, and not as restrictive.

A circuit board 20 according to an embodiment of the present application is described below with reference to fig. 1 to 10.

As shown in fig. 1, the circuit board 20 according to the embodiment of the present application includes a main substrate 500, a sub-substrate 700, and a heat conduction portion 800.

Specifically, the sub board 700 is provided on one side of the main board 500, and the first component 710 is provided on the side of the sub board 700 facing away from the main board 500. At least a portion of the heat conduction portion 800 is provided between the primary substrate 500 and the first component 710 for conducting heat generated by the first component 710 to the primary substrate 500.

In addition, a second component may be provided on the main substrate 500.

In other descriptions of the present application, the primary substrate 500 may be referred to as a first substrate, the secondary substrate 700 may be referred to as a second substrate, and the heat conductive portion 800 may be referred to as a heat dissipation portion.

In the embodiment of the present application, the number of the first components 710 disposed on the sub substrate 700 may be one or more, and the number of the second components disposed on the main substrate 500 may be one or more, which is not particularly limited in the embodiment of the present application.

Further, the number of the heat conduction portion 800 may be one or more. For example, the heat conduction portion 800 may be one provided corresponding to the plurality of first components 710, that is, at least a portion of the heat conduction portion 800 is provided between the plurality of first components 710 and the primary base plate 500. For another example, the heat conduction portion 800 may be provided in a plurality that is provided in one-to-one correspondence with the plurality of first components 710, that is, at least a portion of each heat conduction portion 800 is provided between the corresponding first component 710 and the main substrate 500.

The first component 710 and the second component may be any electronic components. The first component 710 may be a component with a large heat generation amount, such as a power chip or a power MOS transistor; the second component may be a working chip, such as a computational chip that provides computational power, or the second component may be a control chip.

In one example, the sub substrate 700 is provided with lead holes for the leads of the first component 710 to pass through and electrically connected to the main substrate 500.

In the embodiment of the present application, the heat conducting portion 800 may be made of any material having a heat conducting property, such as copper or tin.

In one example, the projected shape of the heat conduction part 800 on the sub substrate 700 is set corresponding to the projected shape of the first component 710 on the sub substrate 700. For example: the projection shape of the heat conduction portion 800 on the sub-substrate 700 is rectangular, and the projection shape of the first element 710 on the sub-substrate 700 is also rectangular. Preferably, a projected area of the heat conduction part 800 on the sub-substrate 700 covers a projected area of the first element 710 on the sub-substrate 700.

Further, the edges of the thermal conduction portion 800 escape the leads of the first component 710. The leads are used for connection with the main substrate 500 and/or the sub-substrate 700, and thus, the provision can prevent the heat conduction portion 800 from affecting the connection of the first component 710 with the main substrate 500 (or the sub-substrate 700).

According to the circuit board 20 of the embodiment of the present application, by providing the heat conduction portion 800 at least partially between the main substrate 500 and the first component 710, the heat generated by the first component 710 can be conducted to the main substrate 500 by the heat conduction portion 800, and then the heat can be dissipated by the heat dissipation capability of the main substrate 500, so that the first component 710 on the sub-substrate 700 can be dissipated by the main substrate 500. Therefore, the sub-substrate 700 may be a substrate with a weak heat dissipation capability, and the main substrate 500 may be a substrate with a strong heat dissipation capability, so that the requirement on the heat dissipation capability of the sub-substrate 700 is reduced, the selection range of the material or the type of the sub-substrate 700 is widened, and the application range of the circuit board 20 is enlarged.

Example one

As shown in fig. 1, in one embodiment, at least a portion of the heat conduction portion 800 defines a heat conduction through-hole 800a together with the sub-substrate 700, and openings at both ends of the heat conduction through-hole 800a are respectively disposed toward the first component 710 and the main substrate 500. Herein, the "heat conductive through-hole" may also be called a "heat dissipation through-hole".

For example, a portion of the heat conduction portion 800 is located between the first component 710 and the primary substrate 500, or the entire heat conduction portion 800 may be located between the first component 710 and the primary substrate 500.

More specifically, the thermal conduction part 800 may include a first portion between the sub-substrate 700 and the first element 710 and a second portion between the sub-substrate 700 and the main substrate 500. The first portion, the sub-substrate 700, and the second portion collectively define a thermally conductive via 800a that extends through the first portion, the sub-substrate 500, and the second portion.

The openings of both ends of the heat conductive through-hole 800a are respectively directed toward the first component 710 and the main substrate 500 to make conduction between the first component 710 and the main substrate 500 through the heat conductive through-hole 800a. "on" is understood to mean that the first component 710 and the main substrate 500 can conduct heat.

In the embodiment of the present application, the number of the heat conducting through holes 800a corresponding to any one of the first components 710 may be one or more. When the number of the heat conductive through holes 800a corresponding to any one first component 710 is plural, the projection positions of the plural heat conductive through holes 800a corresponding to the first component 710 on the sub-substrate 700 are all located within the projection region of the first component 710 on the sub-substrate 700.

With the above embodiment, the heat generated from the first component 710 may be conducted to the primary base plate 500 through the heat conductive through-hole 800a.

In one embodiment, the openings at both ends of the heat conductive through hole 800a extend to the surface of the first component 710 facing the primary substrate 500 and the surface of the primary substrate 500 facing the secondary substrate 700, respectively.

Illustratively, an opening at an upper end of the heat conductive through hole 800a is formed at an upper surface of the first portion of the heat conductive part 800, and the upper surface of the first portion is attached to a lower surface of the first component 710, such that the opening at the upper end of the heat conductive through hole 800a extends to the lower surface of the first component 710. An opening at the lower end of the heat conductive through hole 800a is formed at the lower surface of the second portion of the heat conductive portion 800, and the lower surface of the second portion is attached to the upper surface of the main substrate 500 such that the opening at the lower end of the heat conductive through hole 800a extends to the surface of the main substrate 500 facing the sub substrate 700.

Thus, it can be ensured that heat generated from the first component 710 can be directly conducted to the primary base plate 500 through the heat conductive through-hole 800a, further improving heat conduction efficiency.

In one embodiment, the heat conducting through hole 800a accommodates a heat conducting medium 800b therein.

For example, the heat conducting medium 800b may fill a part of the space in the heat conducting through hole 800a, or fill the whole space in the heat conducting through hole 800a, and the arrangement manner of the heat conducting medium 800b in the heat conducting through hole 800a is not particularly limited in the embodiments of the present application.

Preferably, the heat conducting medium 800b extends along the length direction of the heat conducting through hole 800a, and both ends of the heat conducting medium 800b extend to openings at the upper and lower ends of the heat conducting through hole 800a, respectively. Thus, heat generated from the first component 710 may be conducted to the primary substrate 500 through the heat transfer medium 800b in the heat transfer through-hole 800a.

The heat transfer medium 800b may be made of any material having a good heat transfer property, for example, copper or tin.

According to the above embodiment, the heat conducting medium 800b is disposed in the heat conducting through hole 800a, and the heat generated by the second component 710 can be conducted to the first substrate 500 through the heat conducting medium 800b, so that the heat conducting capability of the heat conducting portion 800 is further improved, and the heat dissipation effect on the first component 710 is further improved.

As shown in fig. 1, in one embodiment, the heat conduction portion 800 includes a first heat conduction member 810 and a second heat conduction member 820, the first heat conduction member 810 is disposed on a side of the sub-substrate 700 facing the first component 710, the second heat conduction member 820 is disposed on a side of the sub-substrate 700 facing the main substrate 500, and the heat conduction through hole 800a is defined by the first heat conduction member 810, the sub-substrate 700, and the second heat conduction member 820.

It should be noted that, in other examples of the embodiments of the present application, the first heat conduction element 810 may be referred to as a first heat dissipation element, and the second heat conduction element 820 may be referred to as a second heat dissipation element.

Illustratively, the first and second heat-

conductive members

810 and 820 are respectively located at opposite sides of the sub-substrate 700. The first thermal conductive member 810 is fixedly connected to a side of the sub-substrate 700 facing the first component 710, that is, a side of the sub-substrate 700 away from the main substrate 500, and the first thermal conductive member 810 is located between the first component 710 and the sub-substrate 700. The second thermal conduction member 820 is fixedly connected to a side of the sub-substrate 700 facing away from the second component 710, that is, a side of the sub-substrate 700 facing the main substrate 500, and is located between the sub-substrate 700 and the main substrate 500.

The first heat-conducting member 810, the sub-substrate 700, and the second heat-conducting member 820 together define a heat-conducting through-hole 800a penetrating through the first heat-conducting member 810, the sub-substrate 700, and the second heat-conducting member 820, so that the first component 710 and the main substrate 500 are electrically connected through the heat-conducting through-hole 800a.

In one specific example, the thermal via hole 800a may be processed on the sub-substrate 700 provided with the first and second

thermal conduction members

810 and 820 before the first component 710 is mounted on the sub-substrate 700. After the heat conduction through hole 800a is processed, the first component 710 is soldered to the first heat conduction member 810, so as to mount the first component 710 on the sub-substrate 700. Then, the second heat conduction member 820 on the sub-substrate 700 is soldered to a predetermined position on the main substrate 500 to achieve the mounting of the sub-substrate 700 on the main substrate 500.

In the embodiment of the present application, the thickness of the first and second heat-conducting

members

810 and 820 is not particularly limited, and may be set by those skilled in the art according to the actual situation.

According to the above embodiment, the first and second heat

conductive members

810 and 820 may be separately provided, reducing the difficulty of processing the heat conductive part 800. Conduction between the first component 710 and the main substrate 500 is achieved by the heat conductive through-hole 800a, and mounting of the first component 710 on the sub-substrate 700 is achieved by providing the first heat conductive member 810, and mounting of the sub-substrate 700 on the main substrate is achieved by providing the second heat conductive member 820.

As shown in fig. 1, in one embodiment, the heat conduction part 800 further includes a third heat conduction member 830, the third heat conduction member 830 is disposed on the side of the main substrate 500 facing the sub-substrate 700, and the third heat conduction member 830 is connected to the second heat conduction member 820.

Illustratively, the third thermal conduction member 830 on the primary substrate 500 corresponds to the second thermal conduction member 820 on the secondary substrate 700 in size and position, respectively, and the third thermal conduction member 830 and the second thermal conduction member 820 may be connected by welding or other methods.

The material of the third thermal conductive member 830 may be the same as or similar to the material of the first thermal conductive member 810 or the second thermal conductive member 820, and may be, for example, copper or tin.

In addition, in the embodiment of the present application, the height dimension of the third heat-conducting member 830 is not particularly limited, and may be specifically set by a person skilled in the art according to actual situations.

According to the above embodiment, by providing the third heat conduction member 830 connected to the second heat conduction member 820 on the main substrate 500, not only the heat of the second heat conduction member 820 can be conducted to the main substrate 500, but also the connection fixation of the sub-substrate 700 on the main substrate 500 is achieved.

As shown in fig. 1, in one embodiment, openings at both ends of the heat conductive through hole 800a extend to a surface of the first component 710 facing the sub-substrate 700 and a surface of the third heat conductive member 830 facing the sub-substrate 700, respectively.

Illustratively, an opening at an upper end of the heat conductive through hole 800a is formed on an upper surface of the first heat conductive member 810, and the upper surface of the first heat conductive member 810 is attached to a lower surface of the first component 710, such that the opening at the upper end of the heat conductive through hole 800a extends to the first component 710. An opening at the lower end of the heat conduction through hole 800a is formed on the lower surface of the second heat conduction member 820, and the lower surface of the second heat conduction member 820 is attached to the upper surface of the third heat conduction member 830, so that the opening at the lower end of the heat conduction through hole 800a extends to the third heat conduction member 830.

With the above-described embodiment, heat generated from the first component 710 is directly conducted to the third component 830 through the thermal via 800a, and is conducted to the main substrate 500 through the third component 830.

In one embodiment, the first thermal conductive member 810, the second thermal conductive member 820, and the third thermal conductive member 830 are pads, and the second thermal conductive member 820 and the third thermal conductive member 830 are welded.

The first thermal member 810, the second thermal member 820, and the third thermal member 830 according to one specific example of the present application will be described below with reference to fig. 4 to 6.

Fig. 4 shows a partial schematic view of a side of the sub board 700 facing away from the main board 500. As shown in fig. 4, three first pads are disposed on a side of the sub-substrate 700 away from the main substrate 500, the first pads are arranged side by side and spaced apart from each other, each first pad is shaped like a long strip, and two first pads on the left side and the right side together form a first heat conducting element 810. A plurality of heat conduction through holes 800a are formed on the two first pads on the left side and the right side respectively, and the plurality of heat conduction through holes 800a on the first pad on the left side or the right side are arranged at equal intervals along the length direction of the first pad.

Further, a plurality of pads 720 are preset on the side of the sub-board 700 facing away from the main board 500, the shapes of the plurality of pads 720 may be the same or different, and the arrangement of the plurality of pads 720 may be arbitrary. Wherein at least one of the plurality of pads 720 forms a first thermal conductor 810. For example, among the three elongated pads 720 arranged side by side, the two elongated pads 720 located on both sides collectively form the first heat conductive member 810.

Fig. 5 shows a partial schematic view of a side of the sub board 700 facing the main board 500. As shown in fig. 5, a side of the sub-substrate 700 facing the main substrate 500 is provided with two second pads spaced apart from each other, and the two second pads together form a second heat conductive member 820. A plurality of heat conducting through holes 800a are formed on the two second bonding pads respectively, and the plurality of heat conducting through holes 800a on each second bonding pad are arranged at equal intervals in the length direction of the second bonding pad.

Fig. 6 is a partial schematic view illustrating a side of the primary substrate 500 facing the secondary substrate 700, and as shown in fig. 6, two third pads are disposed on the side of the primary substrate 500 facing the secondary substrate 700, and the positions and shapes of the two third pads correspond to those of the two second pads, respectively.

In the embodiments of the present application, the pad may adopt various technical solutions known to those skilled in the art now and in the future, and the structure, shape and size of the pad are not particularly limited in the embodiments of the present application.

In one embodiment, at least one of the solder paste disposed on the first heat conductive member 810, the solder paste disposed on the second heat conductive member 820, and the solder paste disposed on the third heat conductive member 830 forms the heat conductive medium 800b accommodated in the heat conductive through hole 800a.

In other words, the heat transfer medium 800b formed to be accommodated in the heat transfer through hole 800a may be solder paste originating from any one of the first heat conductive member 810, the second heat conductive member 820, and the third heat conductive member 830, or may be solder paste originating from two or three of them.

In one example, the pad includes a cured layer and a solder paste layer formed of solder paste, the solder paste layer overlying an outer surface of the cured layer. The cured layer of the first thermal conductor 810 is formed on the side of the sub-substrate 700 facing away from the main substrate 800, the cured layer of the second thermal conductor 820 is formed on the side of the sub-substrate 700 facing the main substrate 500, and the cured layer of the third thermal conductor 830 is formed on the side of the main substrate 500 facing the sub-substrate 700.

Preferably, the solidified layer and the solder paste layer are made of materials with different melting points respectively. The material of the solder paste can adopt a material with lower melting point and better heat-conducting property, such as tin and the like; the solidified layer may be made of a material having a relatively high melting point, such as copper.

It should be noted that, during the process of soldering the first component 710 and the first heat conduction member 810, the solder paste of the first heat conduction member 810 melts, and the solder paste in the molten state can flow into the heat conduction through hole 800a, and the solder paste is in a solid state after being cooled in the heat conduction through hole 800a, and the solid solder paste forms at least a part of the heat conduction medium 800b.

In the process of soldering the second heat conduction member 820 and the third heat conduction member 830, the solder paste of the second heat conduction member 820 and the third heat conduction member 830 is melted and cooled to form a solid whole, thereby connecting the second heat conduction member 820 and the third heat conduction member 830 to form a whole structure. It is understood that during the soldering process, the solder paste of the second and third heat-conducting

members

820 and 830 is melted, and the solder paste in a molten state flows into the heat-conducting through-hole 800a, and after the heat-conducting medium in the heat-conducting through-hole 800a is cooled, the solid solder paste forms at least part of the heat-conducting medium 800b.

According to the above embodiment, by soldering the first component 710 with the first heat-conductive member 810 and soldering the second heat-conductive member 820 with the third heat-conductive member 830, the connection fixation of the first component 710 on the sub-board 700 and the connection fixation of the sub-board 700 on the main board 500 are achieved. And, during soldering, the solder paste in an at least partially molten state flows into the heat conductive through hole 800a, and forms a solid heat conductive medium 800b after cooling. Therefore, the heat-conducting medium 800b does not need to be separately arranged in the heat-conducting through hole 800a, and the processing efficiency of the circuit board 20 is improved.

In one embodiment, the inner wall surface of the heat conducting through hole 800a is provided with a heat conducting layer, and the heat conducting layer is made of a heat conducting material.

Optionally, the heat conduction layer may be made of copper, and the heat conduction through hole 800a may be a copper plated hole. The heat conducting layer can be formed by through-hole copper plating technology known to those skilled in the art, and will not be described herein.

Through the above embodiment, the heat generated by the first component 710 is conducted to the second heat-conducting member 820 through the heat-conducting layer on the inner wall of the heat-conducting through hole 800a, thereby improving the heat-conducting efficiency between the first component 710 and the main substrate 500, and further improving the heat-dissipating effect of the first component 710.

In one embodiment, the diameter of the heat conductive through hole 800a is 0.20 to 0.30mm.

It is understood that in the case where the diameter of the heat conductive through-hole 800a is less than 0.20mm, the heat conductive efficiency between the first and second heat

conductive members

810 and 820 is affected to some extent; in the case where the diameter of the heat conductive through hole 800a is greater than 0.30mm, the distribution uniformity of the plurality of heat conductive through holes 800a on the sub-substrate 700 may be affected.

Thus, in order to ensure the heat transfer efficiency of the heat transfer through-holes 800a between the first and second

heat transfer members

810 and 820 while ensuring the distribution uniformity of the plurality of heat transfer through-holes 800a, the diameter of the heat transfer through-holes 800a is suitably set to 0.20 to 0.30mm. Preferably, the diameter of the heat conductive through-hole 800a may be set to 0.25mm.

In one embodiment, the heat conduction portion 800 includes a heat conductor 840, a portion of the heat conductor 840 penetrates the sub-substrate 710, and both ends of the heat conductor 840 are in contact with the first component 710 and the main substrate 500, respectively.

Illustratively, the number of thermal conductors 840 is at least one. For example, one heat conductor 840 may be provided, and one heat conductor 840 is disposed corresponding to the plurality of first components 710 on the sub-substrate 700 to conduct heat generated from the first components 710 to the main substrate 840. For another example, the thermal conductor 840 may be multiple, and one or more thermal conductors 840 may be associated with each first component 710.

Note that, in the embodiments of the present application, the contact area between the thermal conductor 840 and the first component 710 is not particularly limited. For example, the area of the upper end surface of the heat conductor 840 may be greater than or equal to the area of the lower surface of the first component 710, such that the contact area of the heat conductor 840 with the first component 710 is the same as the area of the lower surface of the first component 710. For another example, the area of the upper surface of the thermal conductor 840 may be smaller than the area of the lower surface of the first component 710, such that the contact area between the thermal conductor 840 and the first component 710 is smaller than the area of the lower surface of the first component 710.

The heat conductor 840 may be made of a material with good thermal conductivity, such as copper or tin.

According to the above embodiment, by providing the heat conductor 840 in direct contact with the first component 710 and the main substrate 500, the heat generated by the first component 710 can be directly transferred to the main substrate 500 through the heat conductor 840, thereby improving the heat conduction efficiency and further improving the heat dissipation efficiency of the first component 710.

As shown in fig. 3, in one embodiment, the sub-substrate 700 is provided with a receiving through-hole 700a, and at least a portion of the heat conductor 840 is inserted into the receiving through-hole 700 a.

Illustratively, the receiving through holes 700a are disposed in one-to-one correspondence with the thermal conductors 840, and the receiving through holes 700a penetrate the sub-board 700 in the thickness direction of the sub-board 700, i.e., openings at the upper and lower ends of the receiving through holes 700a are formed at the side surface of the sub-board 700 facing away from the main board 500 and the side surface of the sub-board 700 facing toward the main board 500, respectively, so that the thermal conductors 840 corresponding to the receiving through holes 700a penetrate therethrough, and the upper and lower ends of the thermal conductors 840 are in contact with the first component 710 and the main board 500, respectively.

In a specific example, the receiving through-hole 700a may be defined by a portion of the heat conductive through-hole 800a on the sub-substrate 700 in the aforementioned embodiment.

In addition, the shape of the heat conductor 840 is not particularly limited in the embodiments of the present application, and for example, the shape of the heat conductor 840 may be a columnar shape as shown in fig. 3.

According to the above-described embodiment, the fixation of the heat conductor 840 between the first component 710 and the main substrate 500 is achieved by providing the receiving through-hole corresponding to the heat conductor 840 on the sub substrate 700.

In one embodiment, the heat conductor 840 includes a first heat conductive sub-body 841, a second heat conductive sub-body 842, and a third heat conductive sub-body 843, the first heat conductive sub-body 841 is located between the first component 710 and the sub-substrate 700, the second heat conductive sub-body 842 is located between the sub-substrate 700 and the main substrate 500, and the third heat conductive sub-body 843 is received in the receiving through-hole 800a and has both ends connected to the first heat conductive sub-body 841 and the second heat conductive sub-body 842, respectively.

Illustratively, the first, second and third heat

conductive sub-bodies

841, 842, 843 may be separate pieces of one another and connected by welding to form a unitary structure. The first heat-conducting split 841 is fixed on the side of the sub-substrate 700 away from the main substrate 500, the first heat-conducting split 841 is formed between the first component 710 and the sub-substrate 700, and the upper surface of the first heat-conducting split 841 is attached to the lower surface of the first component 710. The second heat transfer body 842 is fixed to a side of the main substrate 500 facing the sub-substrate 700, and an upper surface of the second heat transfer body 842 is attached to a lower surface of the sub-substrate. The third heat conduction split 843 is accommodated in the accommodation through hole, and the upper end and the lower end of the third heat conduction split 843 are connected to the first heat conduction split 841 and the second heat conduction split 842 respectively.

According to the above-described embodiment, the contact area of the heat conductor with the first component 710 and the main substrate 500 is increased by providing the first and second heat-

transfer division bodies

841 and 842, and the heat conduction between the first and second heat-

transfer division bodies

841 and 842 is achieved by providing the third heat-transfer division body 843 received in the receiving through-hole 700a, so that the heat conducted from the first component to the first heat-transfer division body 841 may be conducted to the second heat-transfer division body 842 through the third heat-transfer division body 843, and the heat may be conducted from the first component 710 to the main substrate 500. Thereby, the efficiency of heat conduction between the first element 710 and the main substrate 500 is improved.

In one embodiment, the first, second and third heat-conducting

split bodies

841, 842 and 843 are an integral piece, and the first, second and third heat-conducting

split bodies

841, 842 and 843 are solder paste.

Illustratively, the heat conduction portion 800 includes a first heat conduction member 810, a second heat conduction member 820, and a third heat conduction member 830, the first heat conduction member 810 is provided on a side of the sub-substrate 700 facing away from the main substrate 500, the second heat conduction member 820 is provided on a side of the sub-substrate 700 facing toward the main substrate 500, and the third heat conduction member 830 is provided on a side of the main substrate 500 facing toward the sub-substrate 700. The first heat conducting piece, the second heat conducting piece and the third heat conducting piece are all bonding pads.

Further, the pad includes a cured layer and a solder paste layer formed of solder paste, the solder paste layer being coated on an outer surface of the cured layer. The solidified layer and the soldering paste layer are respectively made of materials with different melting points. The material of the solder paste can adopt a material with lower melting point and better heat-conducting property, such as tin and the like; the solidified layer may be made of a material having a relatively high melting point, such as copper.

It should be noted that during the process of soldering the first component 710 and the first heat conducting member 810, the solder paste of the first heat conducting member 810 is melted, and the solder paste in the molten state can flow into the heat conducting through hole 800a, and the solder paste is in a solid state after being cooled in the heat conducting through hole 800a, and the solid solder paste forms at least a part of the heat conducting medium 800b.

members

The solder paste on the outer surface of the first heat conduction member 810 forms a first heat conduction split 841, the solder paste in the accommodating through hole 700a forms a second heat conduction split 842, and the solder paste of the second heat conduction member 820 and the third heat conduction member 830 forms a third heat conduction split 843.

Thus, at least a portion of the solder paste may form the heat transfer medium in the heat transfer through-hole 800a in the process of mounting the sub-substrate 700 on the main substrate 500, eliminating a step of separately disposing the heat transfer medium in the heat transfer through-hole 800a, thereby improving the processing efficiency of the circuit board 20.

In one embodiment, the outer surface of the second conductive sub-body 842 is provided with a conductive layer.

For example, the heat conduction layer is formed on an inner wall surface of the receiving through hole 700a and covers an outer surface of the second heat conduction division body 842. In other words, the heat conduction layer is located between the outer surface of the second heat conduction division body 842 and the inner wall surface of the accommodation through-hole 700 a.

Through the above embodiment, the heat of the first heat conduction sub-body 841 can be conducted to the third heat conduction sub-body 843 through the heat conduction layer on the outer surface of the second heat conduction sub-body 842, so that the heat conduction efficiency between the first component 710 and the main substrate 500 is improved, and the heat dissipation effect on the first component 710 is further improved.

Optionally, the material of the thermally conductive layer comprises copper.

Illustratively, the receiving through-hole 700a may be a copper plated hole. The heat conductive layer may be formed using through-hole copper plating techniques known to those skilled in the art and will not be described further herein.

In one embodiment, the main substrate 500 is spaced apart from the sub-substrate 700.

It should be noted that the distance between the primary substrate 500 and the secondary substrate 700 may be specifically set according to actual situations, and this is not specifically limited in the embodiment of the present application.

For example, the primary substrate 500 and the secondary substrate 700 are connected and fixed by welding the second heat-conductive member 820 and the third heat-conductive member 830. Thus, the distance between the primary substrate 500 and the secondary substrate 700 depends on the thickness dimensions of the second and third heat-

conductive members

820 and 830.

Thus, the heat of the sub board 500 or the components on the main board 700 can be dissipated through the gap between the main board 500 and the sub board 700, and the heat dissipation efficiency is improved.

In one embodiment, the heat dissipation capability of the primary substrate is greater than the heat dissipation capability of the secondary substrate.

The main substrate 500 may be a substrate having a high heat dissipation capability, and the sub-substrate 700 may be a substrate having a low heat dissipation capability. For example, the primary substrate 500 may be an aluminum substrate (i.e., a PCB board), and the secondary substrate 700 may be an epoxy glass cloth laminate (i.e., an FR-4 board). By providing the heat conduction portion 800 between the main substrate 500 and the first component 710, heat generated by the first component 710 can be conducted to the main substrate 500 through the heat conduction portion 800, and then dissipated to the sub-substrate 700 through the main substrate 500.

Here, the "heat dissipation capability" may be understood as a capability of the main substrate 500 and the sub-substrate 700 to dissipate heat. The parameters for characterizing the heat dissipation capability may include the shape of the substrate, the length of the substrate, the height of the substrate, the thickness of the substrate, the heat dissipation coefficient of the substrate, the surface area of the substrate, and the like. In the case of comparing the heat dissipation capabilities of the main substrate 500 and the sub-substrate 700, the comparison may be performed by using the same parameters of the main substrate 500 and the sub-substrate 700, by using different parameters of the main substrate 500 and the sub-substrate 700, or by considering a plurality of parameters of the main substrate 500 and the sub-substrate 700.

For example, the larger the surface area of the substrate, the greater the heat dissipation capability, with other parameters being the same; alternatively, when other parameters are the same, the higher the heat dissipation coefficient of the substrate is, the greater the heat dissipation capability is.

In one embodiment, the projected area of the sub-substrate 700 on the main substrate 500 is smaller than the area of the main substrate.

In other words, the size of the sub substrate 700 is smaller than that of the main substrate 500. The size of the substrate is understood to mean the area of the substrate in the plane in which it is located.

It will be appreciated that, with the same other parameters of the substrate, the larger the size of the substrate, the larger the surface area of the substrate, and correspondingly the greater the heat dissipation capability.

Thus, by setting the size of the sub-base 700 to be smaller than that of the main base 500, the heat dissipation capability of the main base 500 is greater than that of the sub-base 700 with respect to the surface area factor of the base, thereby ensuring that the first component 710 on the sub-base 700 can dissipate heat through the main base 500.

In one embodiment, the primary substrate 500 is a metal-based copper clad laminate, and the secondary substrate 700 is an epoxy glass cloth laminate.

It can be understood that the metal-based copper-clad plate has good heat dissipation capability, and generally comprises three layers, namely a circuit layer (copper foil), an insulating layer and a metal base layer. The epoxy glass cloth laminated board has good flame resistance, namely, the epoxy glass cloth laminated board can achieve the self-extinguishing effect through the combustion state, so that the epoxy glass cloth laminated board still has stable mechanical property and dielectric property in a high-temperature environment, but the heat dissipation capability of the epoxy glass cloth laminated board is weak.

With the above embodiment, the main board 500 has a good heat dissipation capability, and the sub board 700 has a good heat resistance and a good operation stability. Therefore, the circuit board 20 according to the embodiment of the present application may be suitable for an environment with a high operating temperature, and the heat generated by the first component 710 on the sub-board 700 may be conducted to the main board 500 through the heat conducting portion 800, so that the heat dissipation of the first component 710 may be realized, thereby ensuring the operational reliability of the first component 710.

Example two

In one embodiment, the primary substrate 500 is provided with a plurality of second components 300, and at least some of the adjacent second components 300 may have metal members 400 disposed therebetween.

Illustratively, the second component 300 may be various computing chips or control chips, and a plurality of computing chips may be arranged in an array. For example, the plurality of second components 300 may be labeled as a second component 300a, a second component 300b, a second component 300c, a second component 300d, and a second component 300e … … in order of their arrangement.

Among them, at least one metal piece 400 may be disposed between some adjacent second components 300, such as only at least one metal piece 400 disposed between the second component 300a and the second component 300b, and at least one metal piece 400 disposed between the second component 300d and the second component 300e, respectively. For another example, at least one metal member 400 is disposed between each adjacent second component 300. The number of the metal members 400 is not limited in this embodiment.

Illustratively, the metal member 400 may be a copper sheet or an aluminum sheet, and the metal member 400 may be welded on the primary substrate 500.

In one embodiment, the metal piece 400 is used to dissipate heat of the connected adjacent two second components 300 and/or reduce a voltage drop between the connected adjacent two second components 300.

It can be understood that, as the working efficiency of the second component 300 is higher and higher, the heat generation amount of the second component 300 is also higher and higher, and the metal piece 400 can dissipate the heat of the second component 300 connected thereto. Further, the metallic article 400 may also reduce the voltage drop before the adjacent second component 300. In addition, metal part 400 may also reduce line power loss. Thus, the operational stability and reliability of the second component 300 are improved.

In one embodiment, in at least some of the metal members 400, the size of the metal member 400 is positively correlated to the distance between adjacent second components 300 connected by the metal member 400.

For example, along the first direction X, the pitch between at least some adjacent second components 300 gradually increases, such as the pitch p1 is smaller than the pitch p2, and the pitch p2 is smaller than the pitch p3. Accordingly, the size of the metal part 400 between at least some adjacent second components 300 gradually increases, that is, the size of the metal part 400 disposed at the pitch p2 is larger than that of the metal part 400 disposed at the pitch p1, and the size of the metal part 400 disposed at the pitch p3 is larger than that of the metal part 400 disposed at the pitch p 2. The first direction X may be a direction in which the plurality of second components 300 are arranged, and the direction in which the plurality of second components 300 are arranged may be the same as or different from a heat dissipation wind direction of a heat dissipation channel in which the circuit board 20 is located.

It should be noted that "gradually" in this embodiment indicates a trend, but is not limited to sequential changes, and there may be a negative correlation or no correlation between the size of a part of the metal member 400 and the distance between adjacent second components 300 connected thereto.

As another example, if the distances between some adjacent second components 300 are equal, the sizes of the corresponding metal pieces 400 are equal.

For another example, along the first direction X, the distance between the adjacent second components 300 may gradually decrease, and accordingly, the size of the metal member 400 disposed between the adjacent second components 300 gradually decreases.

In this embodiment, "gradually" indicates a trend, but the trend is not limited to sequential change, and the pitches between some adjacent second components 300 along the first direction X may be the same.

Illustratively, the first direction X is a direction in which portions of the second components 300 are connected in series. For example, when the main substrate 500 is placed in the heat dissipation channel, the first direction X may be a direction perpendicular to a heat dissipation wind direction of the heat dissipation channel, or may be a direction parallel to the heat dissipation wind direction of the heat dissipation channel. The embodiments of the present application are not limited.

Illustratively, the dimension of the metal piece 400 may be the dimension of the metal piece 400 in the relative direction between two adjacent second components 300 connected thereto.

In one embodiment, at least a portion of the metal pieces 400 are the same size. That is, there are portions of metal piece 400 that are the same size. In a specific example, in at least some adjacent second components 300, the distance between any two adjacent second components 300 is equal, one metal component 400 is disposed between any two adjacent second components, and the sizes of the metal components 400 are the same.

In one embodiment, a plurality of metal members 400 having the same size are disposed between at least some adjacent second components 300.

Illustratively, in at least some adjacent second components 300, a plurality of metal pieces 400 are disposed between any two adjacent second components, and the sizes of the metal pieces 400 in the opposite directions of the corresponding two adjacent second components are all equal.

In one embodiment, a plurality of metal pieces 400 having different sizes are disposed between at least some adjacent second components 300.

Illustratively, in at least some adjacent second components 300, a plurality of metal pieces 400 are disposed between any two adjacent second components, and the sizes of the metal pieces 400 in the relative directions of the corresponding two adjacent second components are different.

In one embodiment, as shown in fig. 8, the thickness of the metallic article 400 may be less than the thickness of the second component 300.

EXAMPLE III

In one embodiment, under the condition that the circuit board is located in the heat dissipation channel, the size of the metal piece close to the first end of the heat dissipation channel is smaller than that of the metal piece close to the second end of the heat dissipation channel, wherein the distance between the first end and the air inlet of the heat dissipation channel is smaller than the distance between the second end and the air inlet.

Illustratively, one end of the main substrate 500, at which the second components 300 are arranged more closely, is disposed near the first end of the heat dissipation channel, and one end of the second components 300, at which the second components are arranged more sparsely, is disposed at the second end of the heat dissipation channel, so as to balance the heat dissipation effect of each second component 300, ensure the working stability of each second component 300, and ensure the working stability of the whole circuit.

Accordingly, in the case that the heat dissipation efficiency of the first end of the heat dissipation channel is higher than that of the second end of the heat dissipation channel, the size of the metal member 400 near the first end of the heat dissipation channel is smaller than that of the metal member 400 near the second end of the heat dissipation channel.

Therefore, the heat dissipation effect of the second component 300 close to the first end of the heat dissipation channel is close to that of the second component 300 close to the second end of the heat dissipation channel, so that the uniformity of the heat dissipation effect is ensured, and the temperature concentration of the local second component 300 is avoided.

Example four

In one embodiment, in the first or second direction of the primary base plate 500, the size of at least a portion of the metal member 400 located in the middle region is larger than the size of at least a portion of the metal member 400 located in the at least one end region.

It should be noted that, in the embodiment of the present application, the middle region and the end region (or referred to as end region) are relatively referred to each region on the primary substrate 500. The one end region or both end regions of the main base plate 500 refer to regions located at the ends of the main base plate 500 in the first direction X or the second direction Y, and the "middle region" should be broadly understood in the present application to refer to a region located between both ends of the main base plate 500, and is not limited to being located at the very center region of the main base plate 500. The range size of the one end region, the two end regions, and the middle region is not limited in this embodiment.

In one example, as illustrated in fig. 7, for the primary base plate 500, the middle region may be a region B ', and the end regions may be regions a ' and/or regions C '. In another example, the middle area may be an area close to the center of the primary base plate 500, the end area may be an area far from the center of the primary base plate 500, and the range of the middle area and the range of the end area may or may not have an overlapping portion.

Therefore, the defect that the heat dissipation effect of the second component 300 in the middle area is poor is overcome, and the uniformity of the heat dissipation effect is further improved.

EXAMPLE five

In one embodiment, when the primary base plate 500 is positioned in the heat dissipation channel, the size of at least a portion of the metal member 400 positioned in the middle region is larger than the size of at least a portion of the metal member 400 positioned in the at least one end region in a direction perpendicular to the heat dissipation direction of the heat dissipation channel; along the heat dissipation direction of the heat dissipation channel, the spacing between at least some adjacent second components 300 is gradually increased, and the size of the metal piece between at least some adjacent second components 400 is gradually increased.

In yet another embodiment, when the primary base plate 500 is positioned in the heat dissipation channel, the size of at least a portion of the metal member 400 positioned in the middle region is larger than the size of at least a portion of the metal member 400 positioned in the at least one end region in a direction perpendicular to the heat dissipation direction of the heat dissipation channel; the size of the metal piece close to the first end of the heat dissipation channel is smaller than that of the metal piece close to the second end of the heat dissipation channel, wherein the distance between the first end and the air inlet of the heat dissipation channel is smaller than the distance between the second end and the air inlet.

Example six

Referring to fig. 7 and 8, the circuit board 20 of the embodiment of the present application further includes a conductive layer 100, and the conductive layer 100 may be made of a metal material, such as copper foil. The conductive layer 100 includes a first surface S1 and a second surface S2, wherein the first surface S1 is attached to the second component 300 and the metal member 400, and the main substrate 500 is attached to the second surface S2, specifically, the main substrate 500 is connected to the conductive layer 100 by a thermal compression and lamination through the insulating and heat conducting layer 600.

The main substrate 500 is a PCB, typically an aluminum substrate, and thus has a good heat dissipation effect. After the heat of the second component 300 on the conductive layer 100 is conducted to the main substrate 500 through the insulating and heat conducting layer 600, the heat can be rapidly dissipated, so that the second component 300 on the conductive layer 100 can be rapidly cooled.

The main substrate 500 includes a first direction X and a second direction Y as viewed from the top of the circuit board 20 of fig. 7. The first direction X is perpendicular to the second direction Y. The second component 300 (not shown) is a plurality of components arranged in the first direction X.

In one embodiment, as shown in fig. 7 and 8, the circuit board 20 of the present application further includes a solder layer 200, and the second component 300 and the metal piece 400 are respectively attached to the conductive layer 100 through the solder layer 200. As shown in fig. 7, the welding layer 200 includes a welding layer body 210 and a vent gap 220, wherein the vent gap 210 is disposed on the welding layer body 210.

Illustratively, the metal member 400 is provided with a mounting portion, such as a solder, on a surface adjacent to the conductive layer 100, so that the metal member 400 is attached to the conductive layer 100. The shape of the fitting portion may be adapted to the size of the metal member 400.

According to the application, the second component 300 and the metal piece 400 are attached to the conducting layer 100 through the welding layer 200 with the exhaust gap 220, so that gas generated by solder paste in the welding layer 200 in an elevated temperature region can be discharged, full and bubble-free welding is guaranteed, and excessive solder paste can be prevented from seeping out of the second component 300 and the metal piece 400.

In order to achieve better heat dissipation, the size of the metal part 400 may be larger than that of the first component 300, so that the amount of gas generated by the solder layer 200 in the heating region is more and is less prone to be exhausted. The design of the welding layer 200 can enable gas to be discharged in time, welding quality of a subsequent stage is not affected, and reliability of a product is improved.

As shown in fig. 9 and 10, the vent gap 220 of the weld layer 200 includes an open end 220a, and at the open end 220a, the weld layer body 210 includes a first body end 211 and a second body end 212 that are separated from each other. When the circuit board 20 enters the temperature rise region, a large amount of gas is generated in the solder paste of the solder layer 200 due to the temperature rise, and the large amount of gas is exhausted through the guide of the exhaust gap 220. In more detail, the large amount of gas follows the vent gap 220 and is discharged through the open end 220a located at the rear of the vent gap 220, that is, through the gap between the first body end 211 and the second body end 212 of the welding-layer body 210 to the external atmosphere.

At least one exhaust gap may be provided in the welding layer, or a plurality of exhaust gaps may be provided according to the shape and size of the welding layer. The plurality of exhaust gaps may have a uniform shape and size, may have different shapes and sizes, or may have the same shape and size for some exhaust gaps, which are adjusted according to actual needs, and the present application is not limited thereto.

The shape and number of each solder layer body 210 of the solder layer 200 are set according to the shape and number of the second component 300 and the metal piece 400 to be soldered, and are only exemplified by the embodiments shown in fig. 9 and 10.

As shown in fig. 9, the welding layer main body 210 of the welding layer 200 is rectangular and includes a first side 210a and a second side 210b, the first side 210a and the second side 210b are disposed opposite to each other, and the exhaust gap 220 is disposed between the first side 210a and the second side 210b. Specifically, the exhaust gaps 220 are sequentially disposed on the first side 210a and the second side 210b, and the whole exhaust gaps are fish-bone-shaped. In this embodiment, the exhaust gap 220 is disposed on the first side 210a and the second side 210b, which are relatively long, so as to facilitate timely exhaust. Of course, the exhaust gaps 220 may be disposed on the third and

fourth sides

210c and 210d which are relatively short, or the exhaust gaps 220 may be disposed on the first and

second sides

210a and 210b, and the third and

fourth sides

210c and 210d at the same time, according to the layout and wiring requirements.

In this embodiment, the exhaust gap 220 is a long rectangle, which not only exhausts smoothly, but also is easy to manufacture, but the application is not limited thereto, as long as the exhaust gap 220 has an open end through which the gas is exhausted.

As shown in fig. 10, the weld layer body 210 'of the weld layer 200' is circular, including an edge 210a ', wherein the vent gap 220' extends from the center of the weld layer body 210 'all the way to the edge 210a'. In detail, the exhaust gaps 220' are four in sequence along the outer circumference of the welding layer main body 210', and the shape of the exhaust gaps 220' is a sector.

In this embodiment, the shape of the exhaust gap 220' may be rectangular, trapezoidal, or the like, and the number may be adjusted as needed.

The embodiment of the present application also provides an electronic device, which includes one or more circuit boards 20. The electronic device further comprises a housing for accommodating the circuit board 20. Further, the housing defines the aforementioned heat dissipation channel, for example, at least one end of the heat dissipation channel may be provided with a fan, and the heat dissipation channel may be a heat dissipation channel. The circuit board 20 is disposed in the heat dissipation channel. The embodiment of the present disclosure further provides an electronic device, which includes a heat dissipation channel and the circuit board 20 of the above embodiment of the present disclosure, wherein at least one circuit board is provided, and at least one circuit board 20 is disposed in the heat dissipation channel.

Illustratively, the heat dissipation channel is suitable for circulation of heat dissipation airflow so as to carry out air-cooling heat dissipation on the circuit board through the flowing airflow.

According to the electronic equipment of the embodiment of the present disclosure, by using the circuit board 20 according to the above-mentioned embodiment of the present disclosure, since the heat dissipation capability of the circuit board 20 is better, the working stability and reliability of the electronic equipment are improved.

Other configurations of the electronic device of the above embodiments can be adopted in various technical solutions known by those skilled in the art now and in the future, and are not described in detail here.

In the description of the present specification, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; the connection can be mechanical connection, electrical connection or communication; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature "on," "above" and "over" the second feature may include the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is at a higher level than the second feature. The first feature being "under," "beneath," and "under" the second feature includes the first feature being directly above and obliquely above the second feature, or simply meaning that the first feature is at a lesser level than the second feature.

The above disclosure provides many different embodiments, or examples, for implementing different features of the application. The components and arrangements of specific examples are described above to simplify the present disclosure. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive various changes or substitutions within the technical scope of the present application, and these should be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A circuit board, comprising:

a main substrate;

a heat conduction portion, at least a portion of which is provided between the main substrate and the first component, for conducting heat generated by the first component to the main substrate.

2. The circuit board according to claim 1, wherein at least a portion of the heat-conducting portion and the sub-substrate together define a heat-conducting through-hole, and openings at both ends of the heat-conducting through-hole are respectively disposed toward the first component and the main substrate.

3. The circuit board of claim 2, wherein the openings at the two ends of the heat conducting through hole extend to the surface of the first component facing the primary substrate and the surface of the primary substrate facing the secondary substrate, respectively.

4. The circuit board of claim 2, wherein the thermally conductive via contains a thermally conductive medium therein.

5. The circuit board of claim 2, wherein the thermal conduction portion comprises a first thermal conduction member and a second thermal conduction member, the first thermal conduction member is disposed on a side of the sub-substrate facing the first component, the second thermal conduction member is disposed on a side of the sub-substrate facing the main substrate, and the thermal conduction through-hole is defined by the first thermal conduction member, the sub-substrate, and the second thermal conduction member.

6. The circuit board of claim 5, wherein the heat conduction portion further comprises a third heat conduction member provided on a side of the main substrate facing the sub-substrate, the third heat conduction member being connected to the second heat conduction member.

7. The circuit board of claim 6, wherein the openings at the two ends of the thermal via extend to the surface of the first component facing the sub-substrate and the surface of the third thermal via facing the sub-substrate.

8. The circuit board of claim 6, wherein the first, second and third thermal conductive members are solder pads, and the second and third thermal conductive members are soldered.

9. The circuit board of claim 8, wherein at least one of the solder paste disposed on the first thermal conductive member, the solder paste disposed on the second thermal conductive member, and the solder paste disposed on the third thermal conductive member forms a thermal conductive medium contained within the thermal via.

10. The circuit board of claim 2, wherein the heat conducting through hole comprises a heat conducting layer disposed on an inner wall surface of the heat conducting through hole.

11. The circuit board of claim 10, wherein the material of the thermally conductive layer comprises copper.

12. The circuit board of claim 2, wherein the diameter of the thermal via is 0.20 to 0.30mm.

13. The circuit board according to claim 1, wherein the heat conducting portion includes a heat conductor, at least a portion of which penetrates the sub-substrate, and both ends of which are in contact with the first component and the main substrate, respectively.

14. The circuit board of claim 13, wherein the sub-substrate is provided with a receiving through-hole, and at least a portion of the heat conductor is disposed through the receiving through-hole.

15. The circuit board of claim 14, wherein the thermal conductor includes a first thermal conductor sub-body, a second thermal conductor sub-body and a third thermal conductor sub-body, the first thermal conductor sub-body is located between the first component and the sub-substrate, the second thermal conductor sub-body is located between the sub-substrate and the main substrate, and the third thermal conductor sub-body is received in the receiving through-hole and has two ends respectively connected to the first thermal conductor sub-body and the second thermal conductor sub-body.

16. The circuit board of claim 15, wherein the first, second, and third heat conductive sub-bodies are a unitary piece, and the first, second, and third heat conductive sub-bodies are solder paste.

17. The circuit board of claim 15, wherein the outer surface of the second heat conductive sub-body is provided with a heat conductive layer.

18. The circuit board of claim 17, wherein the material of the thermally conductive layer comprises copper.

19. The circuit board of any one of claims 1 to 18, wherein the primary substrate is spaced apart from the secondary substrate.

20. The circuit board according to any one of claims 1 to 18, wherein the heat dissipation capacity of the primary substrate is greater than the heat dissipation capacity of the secondary substrate.

21. The circuit board of claim 20, wherein a projected area of the sub-substrate on the main substrate is smaller than an area of the main substrate.

22. The circuit board of claim 20, wherein the main substrate is a metal-based copper-clad plate, and the sub-substrate is an epoxy glass cloth laminate.

23. The circuit board of any one of claims 1 to 18, wherein the primary substrate is provided with a plurality of second components, and at least some of the adjacent second components are provided with metal members therebetween.

24. The circuit board according to claim 23, wherein the metal member is configured to dissipate heat of and/or reduce a voltage drop between two adjacent connected components.

25. The circuit board of claim 23, wherein the metal members are a plurality of metal members, at least some of the metal members have gradually increasing spacing between adjacent second components, and at least some of the metal members have gradually increasing size between adjacent second components.

26. The circuit board of claim 23, wherein a plurality of metal members of different sizes are disposed between at least some of the adjacent second components.

27. The circuit board of claim 23, wherein, when the circuit board is located in a heat dissipation channel, a size of the metal member near a first end of the heat dissipation channel is smaller than a size of the metal member near a second end of the heat dissipation channel, and a distance between the first end and an air inlet of the heat dissipation channel is smaller than a distance between the second end and the air inlet.

28. The circuit board of claim 23, wherein at least a portion of the metallic member located in the middle region has a larger dimension than at least a portion of the metallic member located in at least one end region in the first or second direction of the primary substrate.

29. The circuit board of claim 23, wherein the metallic member comprises at least one of a sheet of copper and a sheet of aluminum.

30. An electronic device comprising a heat dissipation channel, and one or more circuit boards as claimed in any one of claims 1 to 29 disposed in the heat dissipation channel.