CN218526489U - High heat dissipation chip plate body structure - Google Patents
High heat dissipation chip plate body structure Download PDFInfo
- Publication number
- CN218526489U CN218526489U CN202222082733.7U CN202222082733U CN218526489U CN 218526489 U CN218526489 U CN 218526489U CN 202222082733 U CN202222082733 U CN 202222082733U CN 218526489 U CN218526489 U CN 218526489U
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- chip
- fixing base
- body structure
- heat dissipation
- high heat
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Abstract
The utility model provides a high heat dissipation chip plate body structure, including the circuit board main part, the fixed chip fixing base that is equipped with in top of circuit board main part, the surface printing of circuit board main part has the circuit, circuit and chip fixing base electric connection, the inside of chip fixing base is inlayed and is equipped with the chip, the fixed a plurality of wiring pins that are equipped with of top equidistance of chip both sides, a plurality of pin welding grooves have all been seted up to the both sides on chip fixing base top. The utility model discloses a through pin welding groove wiring pin welding between chip and the chip fixing base, make the bottom of chip be the fretwork state, replace traditional chip and chip fixing base bottom for sealed setting, and the outer wall of chip is provided with first insulation fin, the inner wall of chip fixing base is provided with the second insulation fin, through the cooperation of first insulation fin and second insulation fin, the effectual radiating efficiency that has improved guarantees the steady operation of chip.
Description
Technical Field
The utility model belongs to the technical field of the chip plate body, a high heat dissipation chip plate body structure is related to.
Background
The chip is a general term for semiconductor device products. The chip is a silicon chip containing integrated circuits, has small volume and is often a part of a computer or other electronic equipment.
When current chip is assembled between with the circuit board, in order to guarantee chip mounting's steadiness, can set up the chip fixing base on the surface of circuit board, with chip package to the inside of chip fixing base after that, but when adopting this kind of mode to install the chip, because chip and chip fixing base encapsulation, the chip bottom contacts with the inside bottom of chip fixing base, influences the heat dissipation of chip easily to influence the life of chip.
Disclosure of Invention
An object of the utility model is to provide a high heat dissipation chip plate body structure to solve the problem that proposes among the above-mentioned background art.
The purpose of the utility model can be realized by the following technical proposal: the utility model provides a high heat dissipation chip plate body structure, includes circuit board main part, the fixed chip fixing base that is equipped with in top of circuit board main part, the surface printing of circuit board main part has the circuit, circuit and chip fixing base electric connection, the inside of chip fixing base is inlayed and is equipped with the chip, the fixed a plurality of wiring pins that are equipped with of top equidistance of chip both sides, a plurality of pin welding groove have all been seted up to the both sides on chip fixing base top, and are a plurality of the wiring pin is inlayed and is established the internal welding who welds the groove to the pin and fix, a plurality of bleeder vents have been seted up to the bottom equidistance of chip fixing base, a plurality of fixed slots have been seted up to the inner wall equidistance of chip fixing base, and are a plurality of the inside of fixed slot all inlays and is equipped with second insulating fin, the fixed a plurality of first insulating fin that are equipped with of outer wall equidistance of chip, first insulating fin is connected with the contact of second insulating fin. The purpose that sets up like this is through pin welding groove wiring pin welding between chip and the chip fixing base, makes the bottom of chip be the fretwork state, replaces traditional chip and chip fixing base bottom for sealed setting, and the outer wall of chip is provided with first insulation fin, and the inner wall of chip fixing base is provided with the second insulation fin, through the cooperation of first insulation fin and second insulation fin, the effectual radiating efficiency that has improved guarantees the steady operation of chip.
In the above-mentioned high heat dissipation chip board structure, a plurality of protective screens are fixed inside the air holes. The purpose of this setting is through the setting of bleeder vent, is convenient for accelerate the surrounding gas flow.
In the above high heat dissipation chip board structure, the size of the second insulating heat sink matches with the inner diameter of the fixing groove. This is done to reduce the gap in which the second insulating heat sink is mounted.
In the above-mentioned high heat dissipation chip board body structure, the inner diameter of the chip fixing seat matches with the size of the chip. The purpose of this arrangement is to enable the chip to be embedded into the chip holder.
In the plate body structure of the high heat dissipation chip, the joint of the chip and the chip fixing seat is coated with the sealant. The purpose of this is to fix the chip.
In the above-mentioned high heat dissipation chip board structure, the first insulating heat sink and the second insulating heat sink are both silicon adhesive tapes. The purpose of this arrangement is to have insulating and high thermal conductivity.
Compared with the prior art, the utility model relates to a high heat dissipation chip plate body structure's advantage does: through pin welding groove wiring pin welding between chip and the chip fixing base, make the bottom of chip be the fretwork state, replace traditional chip and chip fixing base bottom for sealed setting, and the outer wall of chip is provided with first insulation fin, and the inner wall of chip fixing base is provided with the second insulation fin, through the cooperation of first insulation fin and second insulation fin, the effectual radiating efficiency that has improved guarantees the steady operation of chip.
Drawings
Fig. 1 is a schematic structural view of a plate structure of a high heat dissipation chip of the present invention.
Fig. 2 is a schematic view of the chip fixing seat structure of the high heat dissipation chip plate structure of the present invention.
In the figure, 1, a circuit board main body; 2. a chip fixing seat; 3. air holes are formed; 4. a circuit; 5. a pin welding groove; 6. fixing grooves; 7. a chip; 8. a wiring pin; 9. a first insulating heat sink; 10. a second insulating heatsink.
Detailed Description
The following are specific embodiments of the present invention and the accompanying drawings are used to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.
As shown in fig. 1-2, the utility model relates to a high heat dissipation chip plate body structure, including circuit board main part 1, circuit board main part 1's the fixed chip fixing base 2 that is equipped with in top, circuit board main part 1's surface printing has circuit 4, circuit 4 and 2 electric connection of chip fixing base, chip fixing base 2's inside is inlayed and is equipped with chip 7, the fixed a plurality of wiring pins 8 that are equipped with of top equidistance of chip 7 both sides, a plurality of pin welding grooves 5 have all been seted up to the both sides on 2 tops of chip fixing base, a plurality of wiring pins 8 are inlayed and are established to the inside welded fastening of pin welding groove 5, it is connected to make chip 7 and circuit 4, a plurality of bleeder vents 3 have been seted up to the bottom equidistance of chip fixing base 2, a plurality of fixed slots 6 have been seted up to the inner wall equidistance of chip fixing base 2, the inside of a plurality of fixed slots 6 all inlays and is equipped with second insulating fin 10, the fixed a plurality of first insulating fin 9 that is equipped with of outer wall equidistance of chip 7, first insulating fin 9 contacts with second insulating fin 10 and is connected.
As shown in fig. 1 and fig. 2, the utility model relates to a high heat dissipation chip board body structure, the inside of a plurality of bleeder vents 3 is all fixed and is equipped with the protection network, setting through the protection network, reduce the inside that the dust got into chip fixing base 2, the size of second insulating cooling fin 10 and the internal diameter phase-match of fixed slot 6, the internal diameter of chip fixing base 2 and the size phase-match of chip 7, reduce the gap of junction, chip 7 is scribbled with sealed glue with chip fixing base 2's junction, guarantee the fastness of chip mounting, first insulating cooling fin 9 and second insulating cooling fin 10 are the silicon adhesive tape, have insulating and heat conductivility.
In particular, when the high-heat-dissipation chip board body structure is used, firstly, a plurality of second insulating heat-dissipation fins 10 are embedded into fixing grooves 6 formed in the inner wall of a chip fixing seat 2, a plurality of first insulating heat-dissipation fins 9 are bonded with the outer portion of a chip 7, then, the chip 7 is embedded into the chip fixing seat 2, and wiring pins 8 are embedded into pin welding grooves 5, then, artificial welding is carried out on the wiring pins 8, the chip 7 is conducted with circuits 4 on the surface of a circuit board main body 1, assembly of the chip 7 is completed, when the chip 7 works, air holes 3 formed in the bottom of the chip fixing seat 2 and the hollow state of the bottom of the chip 7 improve air flow, and meanwhile, through matching of the first insulating heat-dissipation fins 9 and the second insulating heat-dissipation fins 10, heat dissipation of the chip 7 is effectively improved.
Those not described in detail in this specification are within the skill of the art. The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications, additions and substitutions for the specific embodiments described herein may be made by those skilled in the art without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.
Claims (6)
1. The utility model provides a high heat dissipation chip plate body structure, includes circuit board main part (1), its characterized in that, the fixed chip fixing base (2) that is equipped with in top of circuit board main part (1), the surface printing of circuit board main part (1) has circuit (4), circuit (4) and chip fixing base (2) electric connection, the inside of chip fixing base (2) is inlayed and is equipped with chip (7), the fixed a plurality of wiring pins (8) that are equipped with in top equidistance of chip (7) both sides, a plurality of pin welding groove (5) have all been seted up to the both sides on chip fixing base (2) top, and is a plurality of wiring pin (8) are inlayed and are established the inside welded fastening to pin welding groove (5), a plurality of bleeder vent (3) have been seted up to the bottom equidistance of chip fixing base (2), a plurality of fixed slot (6) have been seted up to the inner wall equidistance of chip fixing base (2), and are a plurality of the inside of chip (6) all inlays and is equipped with second insulating fin (10), the fixed a plurality of first insulating fin (9) that are equipped with the contact insulating fastening piece (10) of outer wall of chip (7).
2. The plate body structure of high heat dissipation chip according to claim 1, wherein a protective net is fixed inside each of the plurality of air holes (3).
3. The plate body structure of high heat dissipation chip according to claim 1, wherein the second insulating heat sink (10) has a size matching the inner diameter of the fixing groove (6).
4. The plate body structure of high heat dissipation chip according to claim 1, wherein the inner diameter of the chip holder (2) matches the size of the chip (7).
5. The plate body structure of high heat dissipation chip according to claim 1, wherein the joint between the chip (7) and the chip holder (2) is coated with a sealant.
6. The board body structure of claim 1, wherein the first insulating heat sink (9) and the second insulating heat sink (10) are both silicon adhesive tapes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222082733.7U CN218526489U (en) | 2022-08-09 | 2022-08-09 | High heat dissipation chip plate body structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222082733.7U CN218526489U (en) | 2022-08-09 | 2022-08-09 | High heat dissipation chip plate body structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218526489U true CN218526489U (en) | 2023-02-24 |
Family
ID=85242833
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222082733.7U Active CN218526489U (en) | 2022-08-09 | 2022-08-09 | High heat dissipation chip plate body structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218526489U (en) |
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2022
- 2022-08-09 CN CN202222082733.7U patent/CN218526489U/en active Active
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