CN214705903U

CN214705903U - Chip packaging structure

Info

Publication number: CN214705903U
Application number: CN202121495771.4U
Authority: CN
Inventors: 柯佳键
Original assignee: Guangdong Kexin Electronics Co ltd
Current assignee: Guangdong Kexin Electronics Co ltd
Priority date: 2021-07-01
Filing date: 2021-07-01
Publication date: 2021-11-12
Anticipated expiration: 2031-07-01

Abstract

The utility model relates to a chip package technical field specifically is a chip package structure, including the encapsulation subassembly, the encapsulation subassembly includes the packaging board base, the top of packaging board base is connected with the chip seal shell, the inside embedding of packaging board base is connected with the encapsulation chip, and the top that belongs to the packaging board base is connected with seal structure, seal structure includes joint strip, the top of packaging board base is connected with joint strip, the top of chip seal shell is connected with the louvre, the top of packaging board base is connected with the inside lining shield cover, the top of inside lining shield cover is connected with the heat conduction copper. The utility model discloses a mutually supporting between the chip seal shell that sets up, inside lining shield cover and the heat conduction copper carries out the seal encapsulation, when the inside of embedded plate is embedded into to the sealed baffle, has increaseed inside leakproofness for sealed effect has obtained the promotion that is showing, has increaseed the protection to the chip, has prolonged the life of chip.

Description

Chip packaging structure

Technical Field

The utility model relates to a chip package technical field specifically is a chip packaging structure.

Background

The package for mounting semiconductor IC chip has the functions of holding, fixing, sealing, protecting chip and strengthening electrothermal performance, and the connection points of bridge chip for connecting the chip inside world and external circuit are connected via wires to the pins of the package, which are connected via wires to other devices on the printed circuit board. Therefore, the package plays an important role for both the CPU and other LSI integrated circuits.

In the encapsulation of mounting, the mode through the viscose is packaged the chip, has protected the chip through the encapsulation, nevertheless encapsulates through the viscose and has the poor problem of sealed effect, when sealed not tight will great shorten the life of chip, also make chip processing speed reduce.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a chip packaging structure to there is the flaw to lead to the problem of the damage of chip in the viscose encapsulation that proposes in solving above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a chip packaging structure comprises a packaging assembly, the packaging assembly comprises a packaging plate base, the top end of the packaging plate base is connected with a chip sealing shell, the packaging plate base is embedded and connected with a packaging chip, the top end of the packaging plate base is connected with a sealing structure, the sealing structure comprises a sealing rubber strip, the top end of the packaging plate base is connected with the sealing rubber strip, the top end of the chip sealing shell is connected with a heat dissipation hole, the top end of the packaging plate base is connected with a lining shielding case, the top end of the lining shielding cover is connected with a heat conducting copper plate, one side of the lining shielding cover is connected with a sealing clapboard, one side of the back face of the chip sealing shell is connected with an inner embedded plate, the inner wall of the lining shielding case is connected with a pin inserting plate, one side of the heat-conducting copper plate is connected with a side plate, and the upper end of the side plate is connected with a connecting plate.

Preferably, the sealing rubber strip surrounds the edge position of the upper surface of the packaging board base, and the tail end of the chip sealing shell is embedded in the sealing rubber strip.

Preferably, the heat dissipation holes are uniformly distributed at the upper end of the chip sealing shell, and a metal mesh is embedded and connected in the heat dissipation holes.

Preferably, the upper end of the inner panel is provided with a groove, a sealing clapboard is embedded and connected in the groove, and the sealing clapboard is arranged in a U shape.

Preferably, the inside embedding of heat conduction copper is connected with heat conduction structure, heat conduction structure includes the heat conduction strip, the inside embedding of heat conduction copper is connected with the heat conduction strip, the end-to-end connection of heat conduction strip has inside lining copper, one side of inside lining copper is connected with the contact thin slice.

Preferably, the lining copper plate is positioned inside the heat conducting strip and the contact sheet, the lining copper plate is wrapped by the heat conducting strip and the contact sheet, and the contact sheet is positioned on the bottom surface of the heat conducting copper plate.

Compared with the prior art, the beneficial effects of the utility model are that:

1. this chip package structure is when encapsulating, through mutually supporting between the chip seal shell that sets up, inside lining shield cover and the heat conduction copper, carries out the seal encapsulation, when the inside of embedded plate is embedded into to the sealed baffle, has increaseed inside leakproofness for sealed effect has obtained the promotion that is showing, has increaseed the protection to the chip, has prolonged the life of chip.

2. This chip package structure provides good heat dissipation under sealed package's prerequisite through being provided with louvre, heat conduction strip, inside lining copper and contact thin slice for the radiating effect of chip is more excellent, converts the high temperature of inside through heat-conducting mode, promotes the efficiency of heat energy conversion, makes the radiating effect more excellent.

Drawings

Fig. 1 is a schematic front view of a cross-sectional structure of the present invention;

FIG. 2 is a schematic view of the three-dimensional connection structure of the connection plate and the side plate of the present invention;

FIG. 3 is a schematic top view of the chip package and the heat dissipation holes of the present invention;

fig. 4 is a schematic side view of the heat conducting strip and the lining copper plate of the present invention.

In the figure: 1. a package assembly; 110. a package board base; 120. a chip sealing shell; 130. packaging the chip; 2. a sealing structure; 210. sealing rubber strips; 220. heat dissipation holes; 230. a lining shield; 240. a heat-conducting copper plate; 250. sealing the partition plate; 260. an inner panel; 270. a pin insertion plate; 280. a connecting plate; 290. a side plate; 3. a heat conducting structure; 310. a heat conducting strip; 320. lining copper plates; 330. the sheet is contacted.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides an embodiment:

a chip packaging structure comprises a packaging assembly 1, the packaging assembly 1 comprises a packaging board base 110, the top end of the packaging board base 110 is connected with a chip sealing shell 120, the packaging board base 110 is connected with a packaging chip 130 in an embedded mode, the top end of the packaging board base 110 is connected with a sealing structure 2, the sealing structure 2 comprises a sealing rubber strip 210, the top end of the packaging board base 110 is connected with the sealing rubber strip 210, the top end of the chip sealing shell 120 is connected with a heat dissipation hole 220, the top end of the packaging board base 110 is connected with a lining shielding cover 230, the top end of the lining shielding cover 230 is connected with a heat conduction copper plate 240, one side of the lining shielding cover 230 is connected with a sealing partition plate 250, one side of the back face of the chip sealing shell 120 is connected with an inner panel 260, the inner wall of the lining shielding cover 230 is connected with a pin insertion plate 270, one side of the heat conduction copper plate 240 is connected with a side plate 290, and the upper end of the side plate 290 is connected with a connecting plate 280, through the inside with chip sealing shell 120 embedding joint strip 210, realized the sealing connection of first layer, strengthened the connection through inside lining shield cover 230 and heat conduction copper 240 once more for it is inseparabler to connect, and then has promoted the degree of tightness of chip package, makes the simple more convenient that encapsulation work becomes simultaneously.

Further, the joint strip 210 surrounds the edge of the upper surface of the package board base 110, the tail end of the chip sealing shell 120 is embedded in the joint strip 210, when the chip sealing shell 120 is embedded in the joint strip 210, the connection is increased, so that the connection is more sealed, the chip sealing shell 120 is embedded in the outer side of the joint strip 210 and the lining shielding case 230 is embedded in the inner side of the chip sealing shell 120, and the chip sealing shell 120 and the lining shielding case 230 are respectively packaged.

Further, louvre 220 evenly distributed is in chip seal shell 120's upper end, and the inside embedding of louvre 220 is connected with the metal mesh, through louvre 220's design, has played the radiating effect, and inside high temperature and outside carry out the conversion between the air current, not only provide good heat dissipation ventilation effect through the metal mesh and can also completely cut off dust.

Furthermore, the upper end of the embedded plate 260 is provided with a groove, the inside of the groove is embedded and connected with the sealing partition plate 250, the sealing partition plate 250 is arranged in a U shape, and after the inner embedded plate 260 at the upper end of the chip sealing shell 120 is embedded into the sealing partition plate 250, the connection is increased, so that the connection between the chip sealing shell 120 and the lining shielding case 230 is tighter.

Further, the inside embedding of heat conduction copper 240 is connected with heat conduction structure 3, heat conduction structure 3 includes heat conduction strip 310, the inside embedding of heat conduction copper 240 is connected with heat conduction strip 310, the end-to-end connection of heat conduction strip 310 has inside lining copper 320, one side of inside lining copper 320 is connected with contact thin slice 330, inside lining copper 320 is located heat conduction strip 310 and contact thin slice 330, heat conduction strip 310 and contact thin slice 330 wrap up inside lining copper 320, contact thin slice 330 is located the bottom surface of heat conduction copper 240, in order to provide good radiating effect, can conduct the heat through heat conduction strip 310, the conversion between cold and hot has been realized to the mode through heat-conduction, heat dissipation and cooling are carried out through heat-conducting mode.

The working principle is as follows: during the packaging operation, the packaged chip 130 is first embedded into the pin insertion plate 270, and the packaged chip 130 is mounted by the connection between the pin insertion plate 270 and the package board base 110, and the packaged chip 130 is packaged after the mounting, the heat-conducting copper plate 240, together with the connection plate 280 and the side plate 290, is first embedded into the inner side of the sealing rubber strip 210, so that the connection plate 280 and the outer wall are tightly attached to the inner wall of the sealing rubber strip 210, the chip package housing 120 is covered on the upper end of the package board base 110 after the attachment, so that the embedded plate 260 on the back of the chip package housing 120 is embedded into the lining shielding cover 230, and further the chip package housing 120 and the heat-conducting copper plate 240 are tightly connected, because the contact sheet 330 inside the heat-conducting copper plate 240 contacts the upper end of the packaged chip 130, the heat generated at the upper end of the packaged chip 130 is finally transferred to the upper end of the heat-conducting copper plate 240 through the transfer, the heat is radiated through the heat radiation holes 220 formed at the upper end of the heat conductive copper plate 240.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. A chip packaging structure comprises a packaging assembly (1), and is characterized in that: the packaging assembly (1) comprises a packaging plate base (110), the top end of the packaging plate base (110) is connected with a chip sealing shell (120), a packaging chip (130) is embedded and connected in the packaging plate base (110), the top end of the packaging plate base (110) is connected with a sealing structure (2), the sealing structure (2) comprises a sealing rubber strip (210), the top end of the packaging plate base (110) is connected with the sealing rubber strip (210), the top end of the chip sealing shell (120) is connected with a heat dissipation hole (220), the top end of the packaging plate base (110) is connected with a lining shielding cover (230), the top end of the lining shielding cover (230) is connected with a heat conduction copper plate (240), one side of the lining shielding cover (230) is connected with a sealing partition plate (250), and one side of the back face of the chip sealing shell (120) is connected with an inner panel (260), the inner wall of the lining shielding case (230) is connected with a pin inserting plate (270), one side of the heat-conducting copper plate (240) is connected with a side plate (290), and the upper end of the side plate (290) is connected with a connecting plate (280).

2. The chip packaging structure according to claim 1, wherein: the sealing rubber strip (210) surrounds the edge position of the upper surface of the packaging board base (110), and the tail end of the chip sealing shell (120) is embedded in the sealing rubber strip (210).

3. The chip packaging structure according to claim 1, wherein: the radiating holes (220) are uniformly distributed at the upper end of the chip sealing shell (120), and a metal mesh is embedded and connected in the radiating holes (220).

4. The chip packaging structure according to claim 1, wherein: the upper end of the inner panel (260) is provided with a groove, a sealing clapboard (250) is embedded and connected in the groove, and the sealing clapboard (250) is arranged in a U shape.

5. The chip packaging structure according to claim 1, wherein: the inside embedding of heat conduction copper (240) is connected with heat conduction structure (3), heat conduction structure (3) are including heat conduction strip (310), the inside embedding of heat conduction copper (240) is connected with heat conduction strip (310), the end-to-end connection of heat conduction strip (310) has inside lining copper (320), one side of inside lining copper (320) is connected with contact thin slice (330).

6. The chip packaging structure according to claim 5, wherein: the lining copper plate (320) is positioned inside the heat conduction strip (310) and the contact sheet (330), the lining copper plate (320) is wrapped by the heat conduction strip (310) and the contact sheet (330), and the contact sheet (330) is positioned on the bottom surface of the heat conduction copper plate (240).