CN208674099U - A kind of novel semi-conductor encapsulated radiating structure - Google Patents
A kind of novel semi-conductor encapsulated radiating structure Download PDFInfo
- Publication number
- CN208674099U CN208674099U CN201821496948.0U CN201821496948U CN208674099U CN 208674099 U CN208674099 U CN 208674099U CN 201821496948 U CN201821496948 U CN 201821496948U CN 208674099 U CN208674099 U CN 208674099U
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- CN
- China
- Prior art keywords
- protective cover
- installation base
- base body
- semiconductor chip
- ventilation hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 71
- 230000001681 protective effect Effects 0.000 claims abstract description 69
- 238000009434 installation Methods 0.000 claims abstract description 57
- 238000009423 ventilation Methods 0.000 claims abstract description 46
- 239000011148 porous material Substances 0.000 claims abstract description 27
- 230000017525 heat dissipation Effects 0.000 claims abstract description 10
- 239000004020 conductor Substances 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 238000003780 insertion Methods 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 claims description 4
- 238000010521 absorption reaction Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000013461 design Methods 0.000 description 13
- 239000000428 dust Substances 0.000 description 7
- 238000005457 optimization Methods 0.000 description 6
- 238000001816 cooling Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of novel semi-conductor encapsulated radiating structures; including installation base body and the semiconductor chip being fixedly mounted in installation base body; the protective cover for covering semiconductor chip is also fixedly installed in the installation base body; multiple upper ventilation holes and lower ventilation hole are respectively arranged on the protective cover and installation base body lateral wall; intercommunicating pore is offered on the installation base body upper surface in the protective cover, and the air flue being connected to intercommunicating pore and lower ventilation hole is offered inside the installation base body.Beneficial effect is: a kind of heat dissipation performance that novel semi-conductor encapsulated radiating structure has had described in the utility model, and encapsulating structure is dismantled, assembles simple and convenient, at low cost, time saving and energy saving, suitable factory scale production.
Description
Technical field
The utility model relates to semiconductor chip fields, and in particular to a kind of novel semi-conductor encapsulated radiating structure.
Background technique
With the continuous development of integrated circuit, the encapsulation requirement of integrated circuit is also higher and higher, and common packaging technology is
Chip is fixed on lead frame, is packaged and wraps up protection to chip by adhesive tape, to realize to semiconductor structure
Encapsulation.However there are problems for this method, wherein most important is heat dissipation problem, because adhesive tape heat dissipation performance is poor, because
The heat generated in this semiconductor chip course of work is difficult to be discharged in time, then leads to chip reduced service life, seals simultaneously
Assembling structure is also easy that buckling deformation occurs because temperature is higher, once encapsulating structure deforms, pine also accordingly occurs in structure
It is dynamic, gap, hole etc. are easily generated, at this point, the impurity such as outside air, dust, steam all can enter encapsulation by gap, hole
Semiconductor chip is destroyed in structure, then semiconductor chip is caused to be scrapped.
Utility model content
The purpose of this utility model is that solve the above-mentioned problems and provides a kind of novel semi-conductor package cooling knot
Structure, poor with the semiconductor chip package heat dissipation performance for solving traditional in the prior art, encapsulating structure is easily deformed, and is lost close
Sealing property leads to problems such as semiconductor chip scrap.Preferred technical solution in many technical solutions provided by the utility model
It can be realized the heat dissipation performance that semiconductor chip package has had, and encapsulating structure is dismantled, assembles simple and convenient, cost
It is low, it is time saving and energy saving, it is suitble to the technical effects such as factory scale production, elaboration as detailed below.
To achieve the above object, the utility model provides following technical scheme:
A kind of novel semi-conductor encapsulated radiating structure provided by the utility model, including installation base body and it is fixedly mounted on peace
The semiconductor chip on matrix is filled, the protective cover for covering semiconductor chip is also fixedly installed in the installation base body,
It is respectively arranged with multiple upper ventilation holes and lower ventilation hole on the protective cover and installation base body lateral wall, is located in the protective cover
Installation base body upper surface on offer intercommunicating pore, offer inside the installation base body and be connected to intercommunicating pore and lower ventilation hole
Air flue；
Be fixedly installed with more absorbing pipes on the protective cover inner wall, the absorbing pipe both ends respectively with upper ventilation hole and company
Through-hole connection, extraneous cool air enters in absorbing pipe through upper ventilation hole or lower ventilation hole carries out hot friendship with the hot-air in protective cover
It changes, to reduce the air themperature in protective cover, completes the heat dissipation to semiconductor chip；
Multiple holding devices are fixedly installed on top surface on the inside of the protective cover, by the holding device by semiconductor chip
It is pressed in installation base body, prevents semiconductor chip play up and down.
As the significant design of this case, the holding device includes the top being fixedly mounted on the inside of protective cover on top surface vertically
Tight spring and it is fixedly mounted on the briquetting for holding out against lower spring end, the briquetting lower surface is pressed on semiconductor chip upper surface.
As the optimization design of this case, semiconductor chip side wall lower end is fixedly installed with multiple pins；The installation
Matrix lower surface is fixedly installed with multiple plug-in type conductor wires, and multiple plug-in type conductor wires pass through installation base body and extend into protective cover
Interior and pin plug connection.
As the optimization design of this case, the installation base body upper surface offers card slot, the protective cover lower end insertion card
It is fixedly connected in slot and with installation base body.
As the optimization design of this case, multiple upper ventilation holes and lower ventilation hole are evenly distributed on outside protective cover and installation base body
On side wall；
Wherein, the central axis of upper ventilation hole and lower ventilation hole is inclined hole, and the minimum point of inclined hole be located at protective cover and
On installation base body lateral wall.
As the optimization design of this case, more absorbing pipes are distributed along the upper surface of semiconductor chip and outer wall；
Wherein, every absorbing pipe includes a heat-exchange tube and the pipe fitting for being fixedly mounted on the heat-exchange tube both ends；It should
Two pipe fittings are inserted into ventilation hole and intercommunicating pore respectively；
Wherein, the pipe fitting of heat-exchange tube lower end is fixed on protective cover inner wall lower end by fixed frame, pacifies when by protective cover
When being attached in installation base body, the pipe fitting of heat-exchange tube lower end is automatically inserted into intercommunicating pore and is tightly connected with intercommunicating pore.
As the optimization design of this case, the heat-exchange tube is made of silver foil or copper foil.
As the optimization design of this case, the shape of the air flue and absorbing pipe is streamlined.
Using above technical scheme, when assembled package structure, first the pin insertion plug-in type of semiconductor chip lower end is led
In electric wire, semiconductor chip is fixed in installation base body by plug-in type conductor wire and pin, when subsequent disassembly will directly draw
Foot is pulled out out of plug-in type conductor wire, and after the installation is completed, protective cover is snapped onto card slot for semiconductor chip, passes through card slot
Realize that protective cover is fixedly connected with installation base body, when subsequent disassembly directly pulls out protective cover out of card slot, disassembly, group
Fill simple and convenient, time saving and energy saving, at low cost, relatively more suitable factory scale production, since absorbing pipe is directly anchored to protective cover
It is interior, and its position is set already, therefore during installing protective cover, absorbing pipe lower end is also automatically inserted into intercommunicating pore,
As long as protective cover installation site is accurate, then absorbing pipe also can accurately be inserted into intercommunicating pore and seal with intercommunicating pore
Connection, in this way, when protective cover takes out out of card slot, absorbing pipe can also be separated with intercommunicating pore when the later period dismantles；After assembling,
Extraneous cool air enters in absorbing pipe through upper ventilation hole or lower ventilation hole carries out heat exchange (semiconductor with the hot-air in protective cover
Can generate heat during chip operation, heat is gathered in protective cover, increases air themperature in protective cover), to reduce protection
Air themperature in cover then completes the heat dissipation to semiconductor chip, guarantees that semiconductor chip operating temperature maintains normal area
Between；And the impurity such as dust, steam in outside air will not fall into protective cover (because there is absorbing pipe, in outside air
Dust, steam only can be in absorbing pipes), the safety of effective protection semiconductor chip, practicability is good.
Beneficial effect is: a kind of thermal diffusivity that novel semi-conductor encapsulated radiating structure has had described in the utility model
Can, and encapsulating structure is dismantled, assembles simple and convenient, at low cost, time saving and energy saving, suitable factory scale production.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the main view of the utility model；
Fig. 2 is the top view of the utility model；
Fig. 3 is the top view for removing protective cover of the utility model；
Fig. 4 is the bottom view of the protective cover of the utility model；
Fig. 5 is the cross-sectional view of Fig. 2 of the utility model；
Fig. 6 is the partial enlarged view of Fig. 5 of the utility model.
The reference numerals are as follows:
1, installation base body；2, protective cover；3, lower ventilation hole；4, upper ventilation hole；5, card slot；6, intercommunicating pore；7, semiconductor core
Piece；8, pin；9, plug-in type conductor wire；10, heat-exchange tube；11, briquetting；12, spring is held out against；13, air flue；14, pipe fitting；
15, fixed frame.
Specific embodiment
To keep the purpose of this utility model, technical solution and advantage clearer, below by the technology to the utility model
Scheme is described in detail.Obviously, the described embodiments are only a part of the embodiments of the utility model, rather than all
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are not before making creative work
Obtained all other embodiment is put, the range that the utility model is protected is belonged to.
Referring to shown in Fig. 1-Fig. 6, a kind of novel semi-conductor encapsulated radiating structure provided by the utility model, including installation base
Body 1 and the semiconductor chip 7 being fixedly mounted in installation base body 1 are also fixedly installed in installation base body 1 for by semiconductor core
The protective cover 2 that piece 7 covers, protective cover 2 and installation base body 1 match the encapsulating structure for being combined into semiconductor chip 7, protective cover 2 and peace
Multiple upper ventilation holes 4 and lower ventilation hole 3 are respectively arranged on dress 1 lateral wall of matrix, in the installation base body 1 in protective cover 2
Intercommunicating pore 7 is offered on surface, and the air flue 13 being connected to intercommunicating pore 7 and lower ventilation hole 3 is offered inside installation base body 1；
Referring to shown in Fig. 1-Fig. 6, being fixedly installed with more absorbing pipes on 2 inner wall of protective cover, absorbing pipe both ends respectively with it is upper
Ventilation hole 4 is connected to intercommunicating pore 7, and extraneous cool air enters in absorbing pipe and in protective cover 2 through upper ventilation hole 4 or lower ventilation hole 3
Hot-air carry out heat exchange, to reduce the air themperature in protective cover 2, the heat dissipation to semiconductor chip 7 is completed, using this
Kind radiating mode wants high compared to traditional radiating mode in 7 lower end of semiconductor chip installation cooling fin, radiating efficiency, because
The air moment is flowed in absorbing pipe, and radiating efficiency is also higher than cooling fin；
Shown in Figure 5, protective cover is fixedly installed with multiple holding devices on 2 inside top surface, will by the holding device
Semiconductor chip 7 is pressed in installation base body 1, prevents about 7 play of semiconductor chip.
As optional embodiment, holding device includes being fixedly mounted on holding out against on 2 inside top surface of protective cover vertically
Spring 12 and it is fixedly mounted on the briquetting 11 for holding out against 12 lower end of spring, 11 lower surface of briquetting is pressed on 7 upper surface of semiconductor chip
On, in this way design, facilitate holding device can the semiconductor chip 7 to various thickness be pressed.
7 side wall lower ends of semiconductor chip are fixedly installed with multiple pins 8；1 lower surface of installation base body is fixedly installed with multiple
Plug-in type conductor wire 9, multiple plug-in type conductor wires 9 are extend into protective cover 2 across installation base body 1 and 8 plug connection of pin, this
Sample design, facilitates installing and dismounting semiconductor chip 7.
1 upper surface of installation base body offers card slot 5, and 2 lower end of protective cover, which is inserted into card slot 5 and is fixed with installation base body 1, to be connected
It connects, designs in this way, facilitate installing and dismounting protective cover 2.
Multiple upper ventilation holes 4 and lower ventilation hole 3 are evenly distributed on 1 lateral wall of protective cover 2 and installation base body；
Wherein, the central axis of upper ventilation hole 4 and lower ventilation hole 3 is inclined hole, and the minimum point of inclined hole is located at protective cover 2
On 1 lateral wall of installation base body, design in this way, primarily to preventing extraneous dust from falling into upper ventilation hole 4 in calm situation
In lower ventilation hole 3, dust is minimized into the probability in upper ventilation hole 4 and lower ventilation hole 3.
More absorbing pipes are distributed along the upper surface of semiconductor chip 7 and outer wall；
Wherein, every absorbing pipe includes a heat-exchange tube 10 and the pipe fitting for being fixedly mounted on 10 both ends of heat-exchange tube
14；Two pipe fittings 14 are inserted into ventilation hole 4 and intercommunicating pore 7 respectively, are designed in this way, and heat-exchange tube 10 and semiconductor are convenient for
Chip 7 carries out heat exchange；
Wherein, the pipe fitting 14 of 10 lower end of heat-exchange tube is fixed on 2 inner wall lower end of protective cover by fixed frame 15, when will protect
When shield 2 is installed in installation base body 1, the pipe fitting 14 of 10 lower end of heat-exchange tube be automatically inserted into intercommunicating pore 7 and with intercommunicating pore 7
It is tightly connected, designs in this way, facilitate installing and dismounting heat exchanger tube.
Heat-exchange tube 10 is made of silver foil or copper foil, and silver foil or copper foil thermal conductivity are high, and thinner thickness, heat transfer rate
Fastly, high-efficient.
The shape of air flue 13 and absorbing pipe is streamlined, design in this way, primarily to by air flue 13 and absorbing pipe pair
The resistance of air-flow flowing minimizes.
Using above technical scheme, when assembled package structure, the pin 8 of 7 lower end of semiconductor chip is first inserted into plug-in type
In conductor wire 9, semiconductor chip 7 is fixed in installation base body 1 by plug-in type conductor wire 9 and pin 8, when subsequent disassembly is straight
It connects and pulls out pin 8 out of plug-in type conductor wire 9, semiconductor chip 7 snaps onto card slot 5 after the installation is completed, by protective cover 2
It is interior, realize that protective cover 2 is fixedly connected with installation base body 1 by card slot 5, when subsequent disassembly directly pulls out protective cover 2 out of card slot 5
Out, it dismantles, assemble simple and convenient, time saving and energy saving, at low cost, relatively more suitable factory scale production, due to absorbing pipe
It is directly anchored in protective cover 2, and its position is set already, therefore during protective cover 2 are installed, absorbing pipe lower end
It is automatically inserted into intercommunicating pore 7, as long as 2 installation site of protective cover is accurate, then absorbing pipe also can the accurately company of insertion
It is tightly connected in through-hole 7 and with intercommunicating pore 7, in this way, when protective cover 2 takes out out of card slot 5, absorbing pipe also can when the later period dismantles
It is separated with intercommunicating pore 7；After assembling, extraneous cool air enters in absorbing pipe through upper ventilation hole 4 or lower ventilation hole 3 and protective cover
Hot-air in 2 carries out heat exchange (can generate heat, heat is gathered in protective cover 2, makes to protect in 7 course of work of semiconductor chip
Air themperature increases in cover 2), to reduce the air themperature in protective cover 2, the heat dissipation to semiconductor chip 7 is then completed, is protected
Card 7 operating temperature of semiconductor chip maintains normal interval；And the impurity such as dust, steam in outside air will not fall into guarantor
(because there is absorbing pipe, the dust, steam in outside air only can be in absorbing pipes), effective protection semiconductor chip 7 in shield 2
Safety, practicability is good.
Above description is only a specific implementation of the present invention, but the protection scope of the utility model is not limited to
In this, anyone skilled in the art within the technical scope disclosed by the utility model, can readily occur in variation
Or replacement, it should be covered within the scope of the utility model.Therefore, the protection scope of the utility model should be with the power
Subject to the protection scope that benefit requires.
Claims (8)
1. a kind of novel semi-conductor encapsulated radiating structure, including installation base body and the semiconductor core being fixedly mounted in installation base body
Piece, it is characterised in that: the protective cover for covering semiconductor chip, the protection are also fixedly installed in the installation base body
Multiple upper ventilation holes and lower ventilation hole, the installation base in the protective cover are respectively arranged on cover and installation base body lateral wall
Intercommunicating pore is offered on body upper surface, and the air flue being connected to intercommunicating pore and lower ventilation hole is offered inside the installation base body；
Be fixedly installed with more absorbing pipes on the protective cover inner wall, the absorbing pipe both ends respectively with upper ventilation hole and intercommunicating pore
Connection, extraneous cool air enters in absorbing pipe through upper ventilation hole or lower ventilation hole carries out heat exchange with the hot-air in protective cover,
To reduce the air themperature in protective cover, the heat dissipation to semiconductor chip is completed；
Multiple holding devices are fixedly installed on top surface on the inside of the protective cover, are compressed semiconductor chip by the holding device
In installation base body, semiconductor chip play up and down is prevented.
2. a kind of novel semi-conductor encapsulated radiating structure according to claim 1, it is characterised in that: the holding device packet
It includes and is fixedly mounted on the inside of protective cover holding out against spring and be fixedly mounted on the briquetting for holding out against lower spring end on top surface vertically, it is described
Briquetting lower surface is pressed on semiconductor chip upper surface.
3. a kind of novel semi-conductor encapsulated radiating structure according to claim 1, it is characterised in that: the semiconductor chip
Side wall lower ends are fixedly installed with multiple pins；The installation base body lower surface is fixedly installed with multiple plug-in type conductor wires, multiple
Plug-in type conductor wire passes through installation base body and extend into protective cover and pin plug connection.
4. a kind of novel semi-conductor encapsulated radiating structure according to claim 1, it is characterised in that: in the installation base body
Surface offers card slot, and the protective cover lower end insertion card slot is interior and is fixedly connected with installation base body.
5. a kind of novel semi-conductor encapsulated radiating structure according to claim 1, it is characterised in that: multiple upper ventilation holes and
Lower ventilation hole is evenly distributed on protective cover and installation base body lateral wall；
Wherein, the central axis of upper ventilation hole and lower ventilation hole is inclined hole, and the minimum point of inclined hole is located at protective cover and installation
On matrix lateral wall.
6. a kind of novel semi-conductor encapsulated radiating structure according to claim 1, it is characterised in that: more absorbing pipes along
The upper surface of semiconductor chip and outer wall distribution；
Wherein, every absorbing pipe includes a heat-exchange tube and the pipe fitting for being fixedly mounted on the heat-exchange tube both ends；This two
Pipe fitting is inserted into ventilation hole and intercommunicating pore respectively；
Wherein, the pipe fitting of heat-exchange tube lower end is fixed on protective cover inner wall lower end by fixed frame, is installed to when by protective cover
When in installation base body, the pipe fitting of heat-exchange tube lower end is automatically inserted into intercommunicating pore and is tightly connected with intercommunicating pore.
7. a kind of novel semi-conductor encapsulated radiating structure according to claim 6, it is characterised in that: the heat-exchange tube is adopted
It is made of silver foil or copper foil.
8. a kind of novel semi-conductor encapsulated radiating structure according to claim 1, it is characterised in that: the air flue and heat absorption
The shape of pipe is streamlined.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821496948.0U CN208674099U (en) | 2018-09-13 | 2018-09-13 | A kind of novel semi-conductor encapsulated radiating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821496948.0U CN208674099U (en) | 2018-09-13 | 2018-09-13 | A kind of novel semi-conductor encapsulated radiating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208674099U true CN208674099U (en) | 2019-03-29 |
Family
ID=65843129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821496948.0U Expired - Fee Related CN208674099U (en) | 2018-09-13 | 2018-09-13 | A kind of novel semi-conductor encapsulated radiating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208674099U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112397398A (en) * | 2020-11-16 | 2021-02-23 | 广东勤天投资有限公司 | Manufacturing method of semiconductor diode chip packaging structure |
-
2018
- 2018-09-13 CN CN201821496948.0U patent/CN208674099U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112397398A (en) * | 2020-11-16 | 2021-02-23 | 广东勤天投资有限公司 | Manufacturing method of semiconductor diode chip packaging structure |
| CN112397398B (en) * | 2020-11-16 | 2021-09-17 | 厦门亨光芯睿科技有限公司 | Manufacturing method of semiconductor diode chip packaging structure |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190329 |
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| CF01 | Termination of patent right due to non-payment of annual fee |