A kind of intelligent wiring box of ventilation and heat
Technical field
The present invention relates to a kind of terminal box, more particularly, to a kind of intelligent wiring box of ventilation and heat.
Background technology
Solar energy industry just worldwide flourishes as a kind of low-carbon regenerative resource, various countries' installation by
Year increases.In the cutting edge technology of photovoltaic, intelligent assembly is a kind of product that intelligent control is dissolved into and is gone in photovoltaic industry, existing
Some intelligent assemblies are usually that PCB (the Printed circuit board printings with intelligent chip are added in common component
Circuit board) intelligent wiring box realize its function.But the existing following technical problem of intelligent wiring box generally existing:Intelligence
Can chip operating temperature it is higher, easily the occasions such as routine work, reliability test because generate heat it is serious and damage even burn,
Explosion.This has become one of an important factor for restricting the development of intelligent wiring box component.
The content of the invention
The present invention is bad for the heat dissipation of intelligent wiring box in the prior art, causes the excessive technology of intelligent chip operating temperature
Problem, there is provided a kind of intelligent wiring box of ventilation and heat, rapid heat dissipation, so as to effectively by the work temperature of low price intelligent chip
Degree, extends the service life of intelligent wiring box.
For this reason, the present invention adopts the following technical scheme that:
A kind of intelligent wiring box of ventilation and heat, including box body (1), box lid (2) and the PCB being arranged in box body (1)
(9);It is characterized in that:Intelligent chip is provided with the PCB (9), PCB (9) is sealed by the good casting glue of heat conductivility (3)
In box body (1), the height of casting glue (3) is less than the height of box body (1) so that in box body, the top formation one of casting glue
Air layer (4), is equipped with the radiator window (5) for connecting the air layer (4) on box lid (2), in box body (1), along the side of box body
Wall is provided with some excessive glue grooves (6), and the height of excessive glue groove (6) is less than the height of box body (1), in excessive glue groove, the side wall of box body
On be provided with the first heat emission hole (7), box body (1) itself does not have bottom.By the good casting glue of heat conductivility, make intelligent core
The amount of heat that piece is sent is transferred to inside wire box, in the air layer above casting glue, and the air themperature in air layer is rapid
Rise, and transferred heat to by the radiator window on box lid outside wire box, the temperature of intelligent chip in terminal box can be effectively reduced
Degree, simultaneously as PCB is wrapped in casting glue, reliability is high;Pass through radiator window and the first heat emission hole in air layer, excessive glue groove
Efficient, good heat dissipation channel, rapid heat dissipation, perfect heat-dissipating are formed between extraneous air.
Further, connection (4) second heat emission hole (8) of air layer is additionally provided with box body.Further enhance scattered
Thermal effect.
Further, the radiator window (5) has some inclined elongates (5a) being set in parallel.Take into account the strong of terminal box
Degree and heat dissipation effect.
Further, the box body (1) is installed in installation panel, and installation panel forms the bottom of box body (1).Box body
(1) itself do not have bottom, in use, being bonded in corresponding installation panel (backboard of such as solar cell) by fluid sealant etc.
On, corresponding installation panel forms the bottom of box body, and box body is interior by casting glue embedding, in this way, in intelligent chip operational process
The heat of generation can be directly delivered to installation panel (backboard of such as solar cell) by the good casting glue of heat dissipation performance,
And without alternating floor box body bottom again, it is more conducive to heat dissipation.
Further, the box body (1) is detachably connected with box lid (2).Easy to check, replace and repair.
To sum up, the present invention is transferred to the amount of heat that intelligent chip is sent by the good casting glue of heat conductivility
In air layer inside wire box, above casting glue, the air themperature in air layer rises rapidly, by the radiator window on box lid,
The first heat emission hole in second heat emission hole and excessive glue groove, good sky is formed between the air layer and extraneous air of terminal box
Flow of air circuit, heat is efficiently delivered to outside wire box, can be effectively reduced the temperature of intelligent chip in terminal box, meanwhile,
Since PCB is wrapped in casting glue, reliability is high.
Brief description of the drawings
Fig. 1 is the structure diagram of the present invention;
Fig. 2 is the diagrammatic cross-section of the present invention;
Fig. 3 is box body structure schematic diagram of the present invention;
Fig. 4 is lid lid structure diagram of the present invention;
In figure, 1 is box body, and 2 be box lid, and 3 be casting glue, and 4 be air layer, and 5 be radiator window, and 5a is inclined elongate, and 6 be excessive
Glue groove, 7 be the first heat emission hole, and 8 be the second heat emission hole, and 9 be PCB.
Embodiment
In order to make those skilled in the art be better understood from the present invention program, below in conjunction with the embodiment of the present invention
Attached drawing, carries out the technical solution in the embodiment of the present invention clear, complete description.
As shown in Figs 1-4, the intelligent wiring box of ventilation and heat of the invention, including box body 1, box lid 2 and it is arranged at box
PCB9 in body 1;Box body 1 is detachably connected with box lid 2, and intelligent chip is provided with the PCB9, and PCB is good by heat conductivility
Good casting glue 3 is encapsulated in box body 1, and in box body 1, some excessive glue grooves 6, the height of excessive glue groove 6 are provided with along the side wall of box body
Degree is less than the height of box body 1, so that the height of casting glue 3 is less than the height of box body 1, it is interior, casting glue 3 upper square in box body 1
Into an air layer 4, the radiator window 5 for connecting the air layer 4 is equipped with box lid 2.Set in excessive glue groove 6, on the side wall of box body
It is equipped with the first heat emission hole 7.On box body 1, the both sides of radiator window 5 be additionally provided with connection 4 second heat emission hole 8 of air layer.
In the present embodiment, the radiator window 5 has some inclined elongate 5a being set in parallel.Excessive glue groove 6 is equipped with 4, sets respectively
In the inner side of four side walls of box body 1, the first heat emission hole 7 is accordingly 4, respectively on four side walls of box body.
The intelligent wiring box of the present invention, box body 1 itself does not have bottom, in use, being bonded in the sun by fluid sealant etc.
On the backboard of energy battery, the backboard of solar cell forms the bottom of box body, and box body is interior by casting glue embedding, in this way, intelligence
The heat produced in chip operational process can be directly delivered to backboard by the good casting glue of heat dissipation performance, and without again every
One layer of box body bottom, is more conducive to heat dissipation.
The present invention ensures the liquid level of casting glue by the height of excessive glue groove first in installation process;By respective amount
Casting glue be put into box body, make after embedding adhesive curing, box lid is covered in box in same plane at the top of its liquid level and excessive glue groove
On body.After intelligent wiring box starts in work, a large amount of heat flows of generation are dissipated by casting glue, air layer, radiator window, first
Hot hole and the second heat emission hole, are promptly diffused into exterior space, so as to be effectively reduced the operating temperature of intelligent chip, raising connects
The performance and used life of wire box.Simultaneously as PCB is wrapped in casting glue, good reliability.
Obviously, described embodiment is only the part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment, should all belong to the scope of protection of the invention.