CN203748105U - Double-face circuit board - Google Patents
Double-face circuit board Download PDFInfo
- Publication number
- CN203748105U CN203748105U CN201420151378.7U CN201420151378U CN203748105U CN 203748105 U CN203748105 U CN 203748105U CN 201420151378 U CN201420151378 U CN 201420151378U CN 203748105 U CN203748105 U CN 203748105U
- Authority
- CN
- China
- Prior art keywords
- substrate
- hole
- wiring board
- louvre
- circuit layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 239000004519 grease Substances 0.000 claims abstract description 6
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 6
- 230000005855 radiation Effects 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
The utility model discloses a double-face circuit board which comprises a circuit board body which comprises a substrate, an upper circuit layer laid above the substrate and a lower circuit layer laid under the substrate. A through hole passing through the front and rear side surfaces of the substrate is arranged in the substrate of the circuit board body, and at least one PTH hole perpendicular to the through hole is arranged in the substrate. The PTH hole passes through the upper surface and the lower surface of the substrate, and the upper circuit layer is conductively connected with the lower circuit layer. The double-face circuit board comprises radiating holes passing through the entire circuit board body, each radiating hole overlapping with the through hole portion. Heat conduction silicone grease is filled in the radiating holes, a heat collecting plate is installed on the upper and lower end surfaces of the radiating holes, and heat radiation fins are uniformly distributed on the heat collecting plate.
Description
Technical field
The utility model relates to a kind of double-sided wiring board, is specifically related to a kind of double-sided wiring board of new structure.
Background technology
The use of circuit board is very general, especially double-sided wiring board, and in use heat dissipation capacity is very large for it, if this part heat can not dissipate the performance that will affect wiring board itself in time; Existing design of offering merely louvre, can not high efficiency and heat radiation; Meanwhile, the upper and lower conductive layers of existing double-sided wiring board is all to interconnect conducting by external connection device, and the design relative complex of external connection device, has also taken space, has defect.
Utility model content
Technical problem to be solved in the utility model is, for above-mentioned deficiency of the prior art, to provide a kind of double-sided wiring board, and it can carry out conducting connection by upper and lower conductive layers, and meanwhile, this double-sided wiring board all has efficient heat-sinking capability.
The utility model solves the technical scheme that its technical problem adopts: a kind of double-sided wiring board, comprise wiring board body, wiring board body comprises substrate, be layed in the upper circuit layer of substrate top and be layed in the lower circuit layer of substrate below, on the substrate of described wiring board body, offer the through hole that runs through substrate front and back sides, on described substrate, offer at least one PTH hole perpendicular to through hole simultaneously; PTH runs through in hole upper surface and the lower surface of substrate, and upper circuit layer is connected with lower circuit layer conducting;
Also include louvre, louvre runs through whole wiring board body, and each louvre all partially overlaps with through hole; In louvre, be filled with heat-conducting silicone grease, louvre upper and lower end face is provided with collecting plate, is evenly equipped with radiating fin on collecting plate.
Further: above-mentioned through hole is rectangular structure, the cross section in described louvre and PTH hole is circle.
Further: on above-mentioned wiring board body, components and parts are installed, a louvre is all offered on the side of each components and parts.
The beneficial effects of the utility model:
The utility model double-sided wiring board, by offering through hole to substrate, form a large heat dissipation channel, meanwhile, on heat dissipation channel, be evenly equipped with louvre, in louvre, by filling heat-conducting silicone grease and louvre collecting plate setting up and down and radiating fin, heat is discharged up and down, therefore upper and lower the and fore-and-aft direction of whole wiring board all has radiating effect, and its heat-sinking capability is higher; Meanwhile, the utility model is electrically connected upper and lower conductive layers by offer PTH hole (plated-through hole) on substrate, and the relatively existing external connection device of this structure is more simple, does not take too much space.
Brief description of the drawings
Fig. 1 is the structural representation of a kind of embodiment of the present utility model.
Description of reference numerals:
The upper circuit layer of 1-, 2-substrate, 3-through hole, circuit layer under 4-, 5-louvre, 6-collecting plate, 7 radiating fins, 8-PTH hole, 9-heat-conducting silicone grease.
Embodiment
Below in conjunction with drawings and Examples, the utility model embodiment is described:
Fig. 1 shows a kind of embodiment of the present utility model, as shown in the figure, a kind of double-sided wiring board of the utility model, comprise wiring board body, wiring board body comprises substrate 2, be layed in the upper circuit layer 1 of substrate 2 tops and be layed in the lower circuit layer 4 of substrate 2 belows, on the substrate 2 of described wiring board body, offer the through hole 3 that runs through substrate 2 front and back sides, on described substrate 2, offer at least one PTH hole 8 perpendicular to through hole 3 simultaneously; Upper surface and the lower surface of substrate 2 run through in PTH hole 8, and upper circuit layer 1 is connected with lower circuit layer 4 conductings;
Also include louvre 5, louvre 5 runs through whole wiring board body, and each louvre 5 all partially overlaps with through hole 3; In louvre 5, be filled with heat-conducting silicone grease 9, louvre 5 upper and lower end faces are provided with collecting plate 6, are evenly equipped with radiating fin 7 on collecting plate 6.
Preferably, above-mentioned through hole 3 is rectangular structure, and the cross section in described louvre 5 and PTH hole 8 is circle.
Preferably, on above-mentioned wiring board body, components and parts are installed, a louvre 5 is all offered on the side of each components and parts.
By reference to the accompanying drawings the utility model preferred implementation is explained in detail above, but the utility model is not limited to above-mentioned execution mode, in the ken possessing those of ordinary skill in the art, can also under the prerequisite that does not depart from the utility model aim, make a variety of changes.
Do not depart from design of the present utility model and scope and can make many other changes and remodeling.Should be appreciated that the utility model is not limited to specific execution mode, scope of the present utility model is defined by the following claims.
Claims (3)
1. a double-sided wiring board, comprise wiring board body, wiring board body comprises substrate (2), be layed in the upper circuit layer (1) of substrate (2) top and be layed in the lower circuit layer (4) of substrate (2) below, it is characterized in that: on the substrate (2) of described wiring board body, offer the through hole (3) that runs through substrate (2) front and back sides, on described substrate (2), offer at least one PTH hole (8) perpendicular to through hole (3) simultaneously; Upper surface and the lower surface of substrate (2) run through in PTH hole (8), and by upper circuit layer (1), conducting is connected with lower circuit layer (4);
Also include louvre (5), louvre (5) runs through whole wiring board body, each louvre (5) all and through hole (3) partially overlap; In louvre (5), be filled with heat-conducting silicone grease (9), louvre (5) upper and lower end face is provided with collecting plate (6), is evenly equipped with radiating fin (7) on collecting plate (6).
2. a kind of double-sided wiring board as claimed in claim 1, is characterized in that: described through hole (3) is rectangular structure, and the cross section of described louvre (5) and PTH hole (8) is circle.
3. a kind of double-sided wiring board as claimed in claim 1, is characterized in that: on described wiring board body, components and parts are installed, a louvre (5) is all offered on the side of each components and parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420151378.7U CN203748105U (en) | 2014-03-31 | 2014-03-31 | Double-face circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420151378.7U CN203748105U (en) | 2014-03-31 | 2014-03-31 | Double-face circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203748105U true CN203748105U (en) | 2014-07-30 |
Family
ID=51347851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420151378.7U Expired - Fee Related CN203748105U (en) | 2014-03-31 | 2014-03-31 | Double-face circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203748105U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106231780A (en) * | 2016-07-28 | 2016-12-14 | 广东欧珀移动通信有限公司 | PCB board and mobile terminal with it |
| CN106714442A (en) * | 2015-11-13 | 2017-05-24 | 建业科技电子（惠州）有限公司 | Multilayer circuit board heat radiating structure |
| CN107889349A (en) * | 2017-12-22 | 2018-04-06 | 珠海欣中祺电子科技有限公司 | A kind of double-sided wiring board |
| CN107949156A (en) * | 2017-12-22 | 2018-04-20 | 珠海欣中祺电子科技有限公司 | A kind of double-sided wiring board |
| CN107949157A (en) * | 2017-12-22 | 2018-04-20 | 珠海快捷中祺电子科技有限公司 | A kind of double-sided wiring board of perfect heat-dissipating |
| CN110868796A (en) * | 2019-12-03 | 2020-03-06 | 杭州中科先进技术研究院有限公司 | High-efficiency low-cost PCB heat dissipation device |
-
2014
- 2014-03-31 CN CN201420151378.7U patent/CN203748105U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106714442A (en) * | 2015-11-13 | 2017-05-24 | 建业科技电子（惠州）有限公司 | Multilayer circuit board heat radiating structure |
| CN106231780A (en) * | 2016-07-28 | 2016-12-14 | 广东欧珀移动通信有限公司 | PCB board and mobile terminal with it |
| CN107889349A (en) * | 2017-12-22 | 2018-04-06 | 珠海欣中祺电子科技有限公司 | A kind of double-sided wiring board |
| CN107949156A (en) * | 2017-12-22 | 2018-04-20 | 珠海欣中祺电子科技有限公司 | A kind of double-sided wiring board |
| CN107949157A (en) * | 2017-12-22 | 2018-04-20 | 珠海快捷中祺电子科技有限公司 | A kind of double-sided wiring board of perfect heat-dissipating |
| CN110868796A (en) * | 2019-12-03 | 2020-03-06 | 杭州中科先进技术研究院有限公司 | High-efficiency low-cost PCB heat dissipation device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140730 Termination date: 20180331 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |