CN203748105U - Double-face circuit board - Google Patents

Double-face circuit board Download PDF

Info

Publication number
CN203748105U
CN203748105U CN201420151378.7U CN201420151378U CN203748105U CN 203748105 U CN203748105 U CN 203748105U CN 201420151378 U CN201420151378 U CN 201420151378U CN 203748105 U CN203748105 U CN 203748105U
Authority
CN
China
Prior art keywords
substrate
hole
wiring board
louvre
circuit layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420151378.7U
Other languages
Chinese (zh)
Inventor
赵勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KUNSHAN WANZHENG PRINTED CIRCUIT BOARD CO Ltd
Original Assignee
KUNSHAN WANZHENG PRINTED CIRCUIT BOARD CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KUNSHAN WANZHENG PRINTED CIRCUIT BOARD CO Ltd filed Critical KUNSHAN WANZHENG PRINTED CIRCUIT BOARD CO Ltd
Priority to CN201420151378.7U priority Critical patent/CN203748105U/en
Application granted granted Critical
Publication of CN203748105U publication Critical patent/CN203748105U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)

Abstract

The utility model discloses a double-face circuit board which comprises a circuit board body which comprises a substrate, an upper circuit layer laid above the substrate and a lower circuit layer laid under the substrate. A through hole passing through the front and rear side surfaces of the substrate is arranged in the substrate of the circuit board body, and at least one PTH hole perpendicular to the through hole is arranged in the substrate. The PTH hole passes through the upper surface and the lower surface of the substrate, and the upper circuit layer is conductively connected with the lower circuit layer. The double-face circuit board comprises radiating holes passing through the entire circuit board body, each radiating hole overlapping with the through hole portion. Heat conduction silicone grease is filled in the radiating holes, a heat collecting plate is installed on the upper and lower end surfaces of the radiating holes, and heat radiation fins are uniformly distributed on the heat collecting plate.

Description

A kind of double-sided wiring board
Technical field
The utility model relates to a kind of double-sided wiring board, is specifically related to a kind of double-sided wiring board of new structure.
Background technology
The use of circuit board is very general, especially double-sided wiring board, and in use heat dissipation capacity is very large for it, if this part heat can not dissipate the performance that will affect wiring board itself in time; Existing design of offering merely louvre, can not high efficiency and heat radiation; Meanwhile, the upper and lower conductive layers of existing double-sided wiring board is all to interconnect conducting by external connection device, and the design relative complex of external connection device, has also taken space, has defect.
Utility model content
Technical problem to be solved in the utility model is, for above-mentioned deficiency of the prior art, to provide a kind of double-sided wiring board, and it can carry out conducting connection by upper and lower conductive layers, and meanwhile, this double-sided wiring board all has efficient heat-sinking capability.
The utility model solves the technical scheme that its technical problem adopts: a kind of double-sided wiring board, comprise wiring board body, wiring board body comprises substrate, be layed in the upper circuit layer of substrate top and be layed in the lower circuit layer of substrate below, on the substrate of described wiring board body, offer the through hole that runs through substrate front and back sides, on described substrate, offer at least one PTH hole perpendicular to through hole simultaneously; PTH runs through in hole upper surface and the lower surface of substrate, and upper circuit layer is connected with lower circuit layer conducting;
Also include louvre, louvre runs through whole wiring board body, and each louvre all partially overlaps with through hole; In louvre, be filled with heat-conducting silicone grease, louvre upper and lower end face is provided with collecting plate, is evenly equipped with radiating fin on collecting plate.
Further: above-mentioned through hole is rectangular structure, the cross section in described louvre and PTH hole is circle.
Further: on above-mentioned wiring board body, components and parts are installed, a louvre is all offered on the side of each components and parts.
The beneficial effects of the utility model:
The utility model double-sided wiring board, by offering through hole to substrate, form a large heat dissipation channel, meanwhile, on heat dissipation channel, be evenly equipped with louvre, in louvre, by filling heat-conducting silicone grease and louvre collecting plate setting up and down and radiating fin, heat is discharged up and down, therefore upper and lower the and fore-and-aft direction of whole wiring board all has radiating effect, and its heat-sinking capability is higher; Meanwhile, the utility model is electrically connected upper and lower conductive layers by offer PTH hole (plated-through hole) on substrate, and the relatively existing external connection device of this structure is more simple, does not take too much space.
Brief description of the drawings
Fig. 1 is the structural representation of a kind of embodiment of the present utility model.
Description of reference numerals:
The upper circuit layer of 1-, 2-substrate, 3-through hole, circuit layer under 4-, 5-louvre, 6-collecting plate, 7 radiating fins, 8-PTH hole, 9-heat-conducting silicone grease.
Embodiment
Below in conjunction with drawings and Examples, the utility model embodiment is described:
Fig. 1 shows a kind of embodiment of the present utility model, as shown in the figure, a kind of double-sided wiring board of the utility model, comprise wiring board body, wiring board body comprises substrate 2, be layed in the upper circuit layer 1 of substrate 2 tops and be layed in the lower circuit layer 4 of substrate 2 belows, on the substrate 2 of described wiring board body, offer the through hole 3 that runs through substrate 2 front and back sides, on described substrate 2, offer at least one PTH hole 8 perpendicular to through hole 3 simultaneously; Upper surface and the lower surface of substrate 2 run through in PTH hole 8, and upper circuit layer 1 is connected with lower circuit layer 4 conductings;
Also include louvre 5, louvre 5 runs through whole wiring board body, and each louvre 5 all partially overlaps with through hole 3; In louvre 5, be filled with heat-conducting silicone grease 9, louvre 5 upper and lower end faces are provided with collecting plate 6, are evenly equipped with radiating fin 7 on collecting plate 6.
Preferably, above-mentioned through hole 3 is rectangular structure, and the cross section in described louvre 5 and PTH hole 8 is circle.
Preferably, on above-mentioned wiring board body, components and parts are installed, a louvre 5 is all offered on the side of each components and parts.
By reference to the accompanying drawings the utility model preferred implementation is explained in detail above, but the utility model is not limited to above-mentioned execution mode, in the ken possessing those of ordinary skill in the art, can also under the prerequisite that does not depart from the utility model aim, make a variety of changes.
Do not depart from design of the present utility model and scope and can make many other changes and remodeling.Should be appreciated that the utility model is not limited to specific execution mode, scope of the present utility model is defined by the following claims.

Claims (3)

1. a double-sided wiring board, comprise wiring board body, wiring board body comprises substrate (2), be layed in the upper circuit layer (1) of substrate (2) top and be layed in the lower circuit layer (4) of substrate (2) below, it is characterized in that: on the substrate (2) of described wiring board body, offer the through hole (3) that runs through substrate (2) front and back sides, on described substrate (2), offer at least one PTH hole (8) perpendicular to through hole (3) simultaneously; Upper surface and the lower surface of substrate (2) run through in PTH hole (8), and by upper circuit layer (1), conducting is connected with lower circuit layer (4);
Also include louvre (5), louvre (5) runs through whole wiring board body, each louvre (5) all and through hole (3) partially overlap; In louvre (5), be filled with heat-conducting silicone grease (9), louvre (5) upper and lower end face is provided with collecting plate (6), is evenly equipped with radiating fin (7) on collecting plate (6).
2. a kind of double-sided wiring board as claimed in claim 1, is characterized in that: described through hole (3) is rectangular structure, and the cross section of described louvre (5) and PTH hole (8) is circle.
3. a kind of double-sided wiring board as claimed in claim 1, is characterized in that: on described wiring board body, components and parts are installed, a louvre (5) is all offered on the side of each components and parts.
CN201420151378.7U 2014-03-31 2014-03-31 Double-face circuit board Expired - Fee Related CN203748105U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420151378.7U CN203748105U (en) 2014-03-31 2014-03-31 Double-face circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420151378.7U CN203748105U (en) 2014-03-31 2014-03-31 Double-face circuit board

Publications (1)

Publication Number Publication Date
CN203748105U true CN203748105U (en) 2014-07-30

Family

ID=51347851

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420151378.7U Expired - Fee Related CN203748105U (en) 2014-03-31 2014-03-31 Double-face circuit board

Country Status (1)

Country Link
CN (1) CN203748105U (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106231780A (en) * 2016-07-28 2016-12-14 广东欧珀移动通信有限公司 Pcb board and there is its mobile terminal
CN106714442A (en) * 2015-11-13 2017-05-24 建业科技电子(惠州)有限公司 Multilayer circuit board heat radiating structure
CN107889349A (en) * 2017-12-22 2018-04-06 珠海欣中祺电子科技有限公司 A kind of double-sided wiring board
CN107949157A (en) * 2017-12-22 2018-04-20 珠海快捷中祺电子科技有限公司 A kind of double-sided wiring board of perfect heat-dissipating
CN107949156A (en) * 2017-12-22 2018-04-20 珠海欣中祺电子科技有限公司 A kind of double-sided wiring board
CN110868796A (en) * 2019-12-03 2020-03-06 杭州中科先进技术研究院有限公司 High-efficiency low-cost PCB heat dissipation device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106714442A (en) * 2015-11-13 2017-05-24 建业科技电子(惠州)有限公司 Multilayer circuit board heat radiating structure
CN106231780A (en) * 2016-07-28 2016-12-14 广东欧珀移动通信有限公司 Pcb board and there is its mobile terminal
CN107889349A (en) * 2017-12-22 2018-04-06 珠海欣中祺电子科技有限公司 A kind of double-sided wiring board
CN107949157A (en) * 2017-12-22 2018-04-20 珠海快捷中祺电子科技有限公司 A kind of double-sided wiring board of perfect heat-dissipating
CN107949156A (en) * 2017-12-22 2018-04-20 珠海欣中祺电子科技有限公司 A kind of double-sided wiring board
CN110868796A (en) * 2019-12-03 2020-03-06 杭州中科先进技术研究院有限公司 High-efficiency low-cost PCB heat dissipation device

Similar Documents

Publication Publication Date Title
CN203748105U (en) Double-face circuit board
CN203243595U (en) A pcb structure
CN205071462U (en) Multilayer circuit board heat conduction radiation structure
JP2011023528A5 (en)
CN203748106U (en) Novel heat-radiation circuit board
CN209402925U (en) A kind of two-side radiation device of pcb board
CN206452607U (en) A kind of PCB printed circuit boards with heat sinking function
CN207369392U (en) A kind of folder paper tinsel base circuit board with heat sink material
CN203788546U (en) Heat dissipating PCB
CN205283932U (en) Heat dissipating PCB
CN201594949U (en) PCB with embedded radiating structure
CN210670726U (en) Multilayer PCB heat radiation structure
CN203896582U (en) High-efficiency heat radiation type PCB
CN203722987U (en) Simple heat radiation structure of multiple power devices
CN206251432U (en) A kind of high efficiency and heat radiation FPC
CN202841681U (en) Printed circuit board (PCB) possessing heat dissipation function
CN205051965U (en) Compound heat conduction circuit board
CN206402530U (en) A kind of low-power consumption type printed circuit board (PCB)
CN201976337U (en) Heat-dissipation printed circuit board (PCB)
CN205179511U (en) Power electronic component circuit board of high heat dissipating ability
CN203352940U (en) Novel circuit board
CN203120370U (en) Heat dissipation structure of model airplane motor controller
CN206742282U (en) A kind of high-power heat-dissipation SMT copper bases
CN208227408U (en) A kind of wiring board conducive to heat dissipation
CN202068675U (en) Commutation through hole of printed circuit board

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140730

Termination date: 20180331

CF01 Termination of patent right due to non-payment of annual fee