CN203748106U - Novel heat-radiation circuit board - Google Patents

Novel heat-radiation circuit board Download PDF

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Publication number
CN203748106U
CN203748106U CN201420151380.4U CN201420151380U CN203748106U CN 203748106 U CN203748106 U CN 203748106U CN 201420151380 U CN201420151380 U CN 201420151380U CN 203748106 U CN203748106 U CN 203748106U
Authority
CN
China
Prior art keywords
heat
circuit board
hole
collecting plate
heat radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420151380.4U
Other languages
Chinese (zh)
Inventor
赵勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KUNSHAN WANZHENG PRINTED CIRCUIT BOARD CO Ltd
Original Assignee
KUNSHAN WANZHENG PRINTED CIRCUIT BOARD CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KUNSHAN WANZHENG PRINTED CIRCUIT BOARD CO Ltd filed Critical KUNSHAN WANZHENG PRINTED CIRCUIT BOARD CO Ltd
Priority to CN201420151380.4U priority Critical patent/CN203748106U/en
Application granted granted Critical
Publication of CN203748106U publication Critical patent/CN203748106U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model discloses a novel heat-radiation circuit board which has excellent and reliable heat radiation effect and comprises a circuit board body. A heat radiation through hole is arranged in the circuit board body, and the hole wall of the heat radiation through hole is coated with heat conduction silicone grease. A heat radiation fan is installed on the top end of the heat radiation through hole, and the circuit board body comprises a bottom substrate which is covered with a heat collecting plate. The heat collecting plate is covered by a circuit board, and vertically and horizontally staggered heat pipes are arranged in the heat collecting plate. The vertically and horizontally heat pipes are uniformly arranged.

Description

A kind of heat sinking circuit board
Technical field
The utility model relates to circuit board technology field, is specifically related to a kind of from cooling circuit board.
Background technology
Circuit board is a kind of circuit circuit board, its surface is covered with circuit, meanwhile, by connection components and parts, whole circuit board can produce heat in the time of work, and along with the functional structure of circuit board becomes increasingly complex, its heat dissipation capacity is also increasing, that on traditional circuit board, offers through hole cannot realize secure heat dissipation from radiating mode, therefore needs a kind of circuit board that can realize good secure heat dissipation effect badly.
Utility model content
Technical problem to be solved in the utility model is, for above-mentioned deficiency of the prior art, to provide a kind of heat sinking circuit board, and it has good reliable radiating effect.
The utility model solves the technical scheme that its technical problem adopts: a kind of heat sinking circuit board, comprise circuit board body, on circuit board body, offer heat radiation through hole, on the hole wall of heat radiation through hole, be coated with heat-conducting silicone grease, the top of heat radiation through hole is provided with cooling fan;
The substrate that foregoing circuit plate body comprises bottom, covers one deck collecting plate on substrate, the top of collecting plate covers wiring board;
Above-mentioned collecting plate is built-in with crisscross heat pipe, is respectively longitudinal heat pipe and the horizontal heat pipe of evenly arranging.
Further: the quantity of above-mentioned heat radiation through hole is two, its shape of cross section is rectangle.
Further: above-mentioned collecting plate is aluminium sheet, and aluminium sheet has certain thickness, and aluminium sheet inside is equipped with crisscross heat pipe.
The beneficial effects of the utility model:
A kind of heat sinking circuit board of the utility model, its circuit board body comprises three layers, and middle one deck is collecting plate, and the effect of collecting plate is that the heat of whole circuit board body is collected reliably, is finally discharged by the heat radiation through hole of circuit board; Good heat-radiating effect of the present utility model is better to be embodied in described collecting plate and to be built-in with heat pipe, can high efficiency absorb heat, meanwhile, on heat radiation through hole, cooling fan is installed, and can increase the speed of heat radiation, and reliable radiating effect is provided.
Brief description of the drawings
Fig. 1 is the plan structure schematic diagram of circuit board body in the utility model;
Fig. 2 is that the heat radiation through hole in Fig. 1 is installed the cross-sectional view after cooling fan.
Description of reference numerals:
10-circuit board body, 11-substrate, 12-collecting plate, the longitudinal heat pipe of 121-, the horizontal heat pipe of 122-, 13-wiring board; The 20-through hole that dispels the heat, 30-heat-conducting silicone grease, 40-cooling fan.
Embodiment
Below in conjunction with drawings and Examples, the utility model embodiment is described:
Fig. 1 and Fig. 2 show a kind of embodiment of the present utility model, as shown in the figure, a kind of heat sinking circuit board of the utility model, comprise circuit board body 10, on circuit board body 10, offer heat radiation through hole 20, on the hole wall of heat radiation through hole 20, be coated with heat-conducting silicone grease 30, the top of heat radiation through hole 20 is provided with cooling fan 40;
The substrate 11 that foregoing circuit plate body 10 comprises bottom, covers one deck collecting plate 12 on substrate 11, the top of collecting plate 12 covers wiring board 13;
Above-mentioned collecting plate 12 is built-in with crisscross heat pipe, is respectively longitudinal heat pipe 121 and the horizontal heat pipe 122 of evenly arranging.
Preferably, the quantity of above-mentioned heat radiation through hole is two, and its shape of cross section is rectangle.
Preferably, above-mentioned collecting plate 12 is aluminium sheet, and aluminium sheet has certain thickness, and aluminium sheet inside is equipped with crisscross heat pipe.
By reference to the accompanying drawings the utility model preferred implementation is explained in detail above, but the utility model is not limited to above-mentioned execution mode, in the ken possessing those of ordinary skill in the art, can also under the prerequisite that does not depart from the utility model aim, make a variety of changes.
Do not depart from design of the present utility model and scope and can make many other changes and remodeling.Should be appreciated that the utility model is not limited to specific execution mode, scope of the present utility model is defined by the following claims.

Claims (3)

1. a heat sinking circuit board, it is characterized in that: comprise circuit board body (10), on circuit board body (10), offer heat radiation through hole (20), on the hole wall of heat radiation through hole (20), be coated with heat-conducting silicone grease (30), the top of heat radiation through hole (20) is provided with cooling fan (40);
The substrate (11) that foregoing circuit plate body (10) comprises bottom, the upper one deck collecting plate (12) that covers of substrate (11), the top of collecting plate (12) covers wiring board (13);
Above-mentioned collecting plate (12) is built-in with crisscross heat pipe, is respectively longitudinal heat pipe (121) and the horizontal heat pipe (122) of evenly arranging.
2. a kind of heat sinking circuit board as claimed in claim 1, is characterized in that: the quantity of described heat radiation through hole is two, its shape of cross section is rectangle.
3. a kind of heat sinking circuit board as claimed in claim 1, is characterized in that: described collecting plate (12) is aluminium sheet, and aluminium sheet has certain thickness, and aluminium sheet inside is equipped with crisscross heat pipe.
CN201420151380.4U 2014-03-31 2014-03-31 Novel heat-radiation circuit board Expired - Fee Related CN203748106U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420151380.4U CN203748106U (en) 2014-03-31 2014-03-31 Novel heat-radiation circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420151380.4U CN203748106U (en) 2014-03-31 2014-03-31 Novel heat-radiation circuit board

Publications (1)

Publication Number Publication Date
CN203748106U true CN203748106U (en) 2014-07-30

Family

ID=51347852

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420151380.4U Expired - Fee Related CN203748106U (en) 2014-03-31 2014-03-31 Novel heat-radiation circuit board

Country Status (1)

Country Link
CN (1) CN203748106U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105338792A (en) * 2015-11-16 2016-02-17 余原生 Heat conducting structure of heat pipe and preparation process thereof
CN105722310A (en) * 2016-03-22 2016-06-29 成都普诺科技有限公司 PCB with relatively good heat emission effect
CN109644553A (en) * 2018-10-31 2019-04-16 北京比特大陆科技有限公司 Circuit board and supercomputer equipment

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105338792A (en) * 2015-11-16 2016-02-17 余原生 Heat conducting structure of heat pipe and preparation process thereof
CN105722310A (en) * 2016-03-22 2016-06-29 成都普诺科技有限公司 PCB with relatively good heat emission effect
CN109644553A (en) * 2018-10-31 2019-04-16 北京比特大陆科技有限公司 Circuit board and supercomputer equipment
CN109644553B (en) * 2018-10-31 2021-10-08 北京比特大陆科技有限公司 Circuit board and super computing device

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140730

Termination date: 20180331