CN207783269U - A kind of HDI high-density lamination circuit boards - Google Patents
A kind of HDI high-density lamination circuit boards Download PDFInfo
- Publication number
- CN207783269U CN207783269U CN201820034569.3U CN201820034569U CN207783269U CN 207783269 U CN207783269 U CN 207783269U CN 201820034569 U CN201820034569 U CN 201820034569U CN 207783269 U CN207783269 U CN 207783269U
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- China
- Prior art keywords
- wiring board
- plate
- board ontology
- circuit boards
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003475 lamination Methods 0.000 title claims abstract description 17
- 239000002274 desiccant Substances 0.000 claims description 9
- 238000009413 insulation Methods 0.000 claims description 3
- 230000017105 transposition Effects 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
The utility model discloses a kind of HDI high-density lamination circuit boards, belong to wiring board technology field.Including wiring board ontology；Wiring board ontology includes the tertiary circuit plate arranged successively from lower to upper, second insulating layer, the second wiring board, the first insulating layer, first line plate；It further include the fixing device for fixing circuit board ontology；Fixing device includes two pieces of top fixing plates being oppositely arranged, the vertical fixed plate being oppositely arranged and bottom plate.HDI high-density lamination circuit boards provided by the utility model, by the way that fixing device is arranged, fixing device includes two pieces of top fixing plates, two pieces of vertical fixed plates and bottom plate；Effectively wiring board ontology can be fixed, prevent the intrinsic structure of wiring board from transposition occurs, to ensure the performance of wiring board.
Description
Technical field
The utility model is related to wiring board technology fields, more particularly to a kind of HDI high-density lamination circuit boards.
Background technology
A kind of high-frequency microwaves of Chinese patent literature publication number CN205408274U print HDI wiring boards, including wiring board sheet
Body, the wiring board ontology include intermediate double-sided circuit substrate, insulating layer, single-sided circuit board, heat-conducting layer；The two-sided electricity in centre
Base board is insulating layer, single-sided circuit board, insulating layer, heat-conducting layer respectively to both sides；The heat emission hole is through wiring board ontology.
Insulating layer and heat emission hole is arranged due to reasonably designing in the patent in assist side, improve the insulation performance of wiring board and dissipate
Thermal effect；But it lacks corresponding fixing device so that the structure of wiring board is easy to happen transposition, to influence the work(of wiring board
Energy.
Utility model content
In order to overcome the deficiencies of existing technologies, the technical problem to be solved by the utility model is to propose a kind of HDI high
Density lamination circuit board, by the way that fixing device is arranged, fixing device includes top fixing plate, vertical fixed plate and bottom plate；Energy
It is enough that effectively wiring board ontology is fixed, prevent the intrinsic structure of wiring board from transposition occurs, to ensure wiring board
Performance.
For this purpose, the utility model uses following technical scheme：
A kind of HDI high-density lamination circuit boards provided by the utility model, including wiring board ontology；The wiring board ontology
Including tertiary circuit plate, second insulating layer, the second wiring board, the first insulating layer, the first line plate arranged successively from lower to upper；
The upper surface of first insulating layer is connect with the lower surface bonds of the first line plate, the lower surface of first insulating layer
With the upper surface bonding connection of second wiring board；The upper table of the lower surface and the second insulating layer of second wiring board
Face bonding connection；The upper surface bonding connection of the lower surface of the second insulating layer and the tertiary circuit plate；Further include being used for
The fixing device of the fixed wiring board ontology；The fixing device includes two pieces of top fixing plates being oppositely arranged, sets relatively
The vertical fixed plate and bottom plate set；The top of the vertical fixed plate is fixedly connected with one end of the top fixing plate, institute
The bottom end for stating vertical fixed plate is fixedly connected with the upper surface of the bottom plate；The inside of the vertical fixed plate and the wiring board
The two side of ontology is bonded；The lower surface of the top fixing plate is bonded with the upper surface at wiring board ontology both ends；It is described
The upper surface of bottom plate is bonded with the bottom of the wiring board ontology；By the top fixing plate, the vertical fixed plate and bottom
Plate forms a vessel；The wiring board ontology is located in the vessel.
Preferably, the wiring board ontology further includes the wearing layer being located in the vessel；The wearing layer upper surface
Both ends are connect with the lower surface bonds of the top fixing plate, the upper table of the lower surface of the wearing layer and the first line plate
Face bonding connection.
Preferably, the wiring board ontology further includes the desiccant layer being located in the vessel；The desiccant layer it is upper
Surface is connect with the lower surface bonds of the tertiary circuit plate, and the lower surface of the desiccant layer and the upper surface of the bottom plate are viscous
It connects in succession.
Preferably, two vertical heat emission holes being oppositely arranged are offered on the wiring board ontology；The heat emission hole passes through
Wear the wiring board ontology.
Preferably, further include two screws being oppositely arranged；The screw includes nut and stud；The stud
The wearing layer is run through in one end, and the other end of the stud is fixed through the bottom of the top fixing plate and the nut to be connected
It connects；The lower surface at the nut both ends is bonded with the upper surface of the top fixing plate.
Preferably, further include the non-slipping block for being fixed on the bottom base plate；The non-slipping block bottom is provided with non-slip texture.
The beneficial effects of the utility model are：
HDI high-density lamination circuit boards provided by the utility model, by the way that fixing device is arranged, fixing device includes top
Fixed plate, vertical fixed plate and bottom plate；Effectively wiring board ontology can be fixed, prevent wiring board intrinsic
Transposition occurs for structure, to ensure the performance of wiring board.
Description of the drawings
Fig. 1 is the structural schematic diagram for the HDI high-density lamination circuit boards that specific embodiment of the present invention provides.
In figure：1, wiring board ontology；2, first line plate；3, the second wiring board；4, tertiary circuit plate；5, the first insulation
Layer；6, second insulating layer；7, fixing device；71, top fixing plate；72, vertical fixed plate；73, bottom plate；8, wearing layer；9, it does
Drying prescription layer；10, heat emission hole；11, non-slipping block；12, non-slip texture；13, screw.
Specific implementation mode
Further illustrate the technical solution of the utility model below with reference to the accompanying drawings and specific embodiments.
Show to Fig. 1 exemplaries a kind of structural schematic diagram of HDI high-density lamination circuit boards provided by the utility model.
As shown in Figure 1, a kind of HDI high-density lamination circuit boards include wiring board ontology 1, wiring board ontology 1 includes from lower to upper successively
Tertiary circuit plate 4, second insulating layer 6, the second wiring board 3, the first insulating layer 5, the first line plate 2 of arrangement；First insulating layer 5
Upper surface connect with the lower surface bonds of first line plate 2, the upper table of the lower surface of the first insulating layer 5 and the second wiring board 3
Face bonding connection；The lower surface of second wiring board 3 and the upper surface bonding connection of second insulating layer 6；The following table of second insulating layer 6
The upper surface bonding connection in face and tertiary circuit plate 4；It further include the fixing device 7 for fixing circuit board ontology 1；Fixing device
7 include two pieces of top fixing plates 71 being oppositely arranged, the vertical fixed plate 72 being oppositely arranged and bottom plate 73；Vertical fixed plate
72 top is fixedly connected with one end of top fixing plate 71, and the bottom end of vertical fixed plate 72 is fixed with the upper surface of bottom plate 73 to be connected
It connects；The inside of vertical fixed plate 72 is bonded with the two side of wiring board ontology 1；The lower surface of top fixing plate 71 and wiring board sheet
The upper surface at 1 both ends of body is bonded；The upper surface of bottom plate 73 is bonded with the bottom of wiring board ontology 1；By top fixing plate 71, vertically
Fixed plate 72 and bottom plate 73 form a vessel；Wiring board ontology 1 is located in vessel.Specifically, on assist side ontology 1
The fixing device 7 being made of top fixing plate 71, vertical fixed plate 72 and bottom plate 73 is set, the bottom of wiring board ontology 1 with
Bottom plate 73 is bonded, and the inside of vertical fixed plate 72 is bonded with the two side of wiring board ontology 1, the lower surface of top fixing plate 71 and
1 surface of wiring board ontology is bonded；The top of vertical fixed plate 72 is fixedly connected with one end of top fixing plate 71, vertical fixed plate
72 bottom end is fixedly connected with 73 upper surface of bottom plate；Top fixing plate 71, vertical fixed plate 72 and bottom plate 73, which form one, to be held
Chamber, wiring board ontology 1 are located in vessel, wiring board ontology 1 are fixed, and prevent the structure in wiring board ontology 1 from transposition occurs, from
And ensure that the performance of wiring board ontology 1 is complete.
Further, wiring board ontology 1 further includes the wearing layer 8 being located in vessel；The both ends and top of 8 upper surface of wearing layer
The lower surface bonds of portion's fixed plate 71 connect, the lower surface of wearing layer 8 and the upper surface bonding connection of first line plate 2.Pass through
Wearing layer 8 is set, can prevent external force from causing to wear to wiring board ontology 1, to ensure the function of wiring board ontology 1 not by scarce
It loses.
Further, wiring board ontology 1 further includes the desiccant layer 9 being located in vessel；The upper surface of desiccant layer 9 and the
The lower surface bonds of three wiring boards 4 connect, the lower surface of desiccant layer 9 and the upper surface bonding connection of bottom plate 73.What is be arranged is dry
Drying prescription layer 9 can absorb the moisture in air, maintain the aridity of wiring board ontology 1, prevent moisture in wiring board ontology 1
Circuit cause the function of Effect of Short Circuit wiring board.
Further, the vertical heat emission hole 10 of two be oppositely arranged is offered on wiring board ontology 1；Heat emission hole 10 runs through
Wiring board ontology 1.Specifically, wiring board ontology 1 work a period of time after, inside will will produce heat, by be arranged dissipate
Hot hole 10 can carry out heat conduction to wiring board ontology 1, prevent from damaging wiring board ontology 1 because of temperature overheating.
Further, further include two screws 13 being oppositely arranged；Screw 13 includes nut 131 and stud 132；Spiral shell
Wearing layer 8 is run through in one end of column 132, and 132 other end of stud is fixedly connected through top fixing plate 71 with the bottom of nut 131；
The lower surface at 131 both ends of nut is bonded with the upper surface of top fixing plate 71.By the way that screw 13 is arranged, screw 13 includes nut
131 and stud 132, stud 132 runs through top fixing plate 71 and wearing layer 8, and bottom end and the wearing layer 8 of stud 132 are fixed
Connection, the top of stud 132 are fixedly connected with nut 131, the upper surface of the lower surface and top fixing plate 71 at 131 both ends of nut
Fitting, can further be fixed wiring board ontology 1, to prevent the structure in wiring board ontology 1 from transposition occurs.
Further, further include the non-slipping block 12 for being fixed on 73 bottom of bottom plate；12 bottom of non-slipping block is provided with non-slip texture
121.By the way that non-slipping block 12 is arranged, the skid resistance of wiring board can be promoted, to prevent wiring board from moving；In non-slipping block
12 bottoms setting non-slip texture 121 further improves the skid resistance of wiring board.
The utility model is described with reference to the preferred embodiments, and those skilled in the art know, is not departing from this reality
In the case of with novel spirit and scope, various changes or equivalence replacement can be carried out to these features and embodiment.This reality
It is not limited to the particular embodiment disclosed with novel, other embodiments fallen into claims hereof all belong to
In the range of the utility model protection.
Claims (6)
1. a kind of HDI high-density lamination circuit boards, including wiring board ontology (1), the wiring board ontology (1) includes from lower to upper
Tertiary circuit plate (4), second insulating layer (6), the second wiring board (3), the first insulating layer (5), the first line plate arranged successively
(2)；The upper surface of first insulating layer (5) is connect with the lower surface bonds of the first line plate (2), first insulation
The upper surface bonding connection of the lower surface and second wiring board (3) of layer (5)；The lower surface of second wiring board (3) with
The upper surface bonding connection of the second insulating layer (6)；The lower surface of the second insulating layer (6) and the tertiary circuit plate
(4) upper surface bonding connection, it is characterised in that：
It further include the fixing device (7) for fixing the wiring board ontology (1)；
The fixing device (7) includes two pieces of top fixing plates (71) being oppositely arranged, two pieces of vertical fixed plates being oppositely arranged
(72) and bottom plate (73)；
The top of the vertical fixed plate (72) is fixedly connected with one end of the top fixing plate (71), the vertical fixed plate
(72) bottom end is fixedly connected with the upper surface of the bottom plate (73)；
The inside of the vertical fixed plate (72) is bonded with the two side of the wiring board ontology (1)；
The lower surface of the top fixing plate (71) is bonded with the upper surface at wiring board ontology (1) both ends；
The upper surface of the bottom plate (73) is bonded with the bottom of the wiring board ontology (1)；
The top fixing plate (71), the vertical fixed plate (72) and bottom plate (73) form a vessel；
The wiring board ontology (1) is located in the vessel.
2. HDI high-density lamination circuit boards according to claim 1, it is characterised in that：
The wiring board ontology (1) further includes the wearing layer (8) being located in the vessel；
The both ends of wearing layer (8) upper surface are connect with the lower surface bonds of the top fixing plate (71), the wearing layer
(8) the upper surface bonding connection of lower surface and the first line plate (2).
3. HDI high-density lamination circuit boards according to claim 1, it is characterised in that：
The wiring board ontology (1) further includes the desiccant layer (9) being located in the vessel；
The upper surface of the desiccant layer (9) is connect with the lower surface bonds of the tertiary circuit plate (4), the desiccant layer
(9) the upper surface bonding connection of lower surface and the bottom plate (73).
4. HDI high-density lamination circuit boards according to claim 1, it is characterised in that：
The vertical heat emission hole (10) of two be oppositely arranged is offered on the wiring board ontology (1)；
The heat emission hole (10) runs through the wiring board ontology (1).
5. HDI high-density lamination circuit boards according to claim 2, it is characterised in that：
Further include two screws (13) being oppositely arranged；
The screw (13) includes nut (131) and stud (132)；
The wearing layer (8) is run through in one end of the stud (132), and stud (132) other end is fixed through the top
Plate (71) is fixedly connected with the bottom of the nut (131)；
The lower surface at nut (131) both ends is bonded with the upper surface of the top fixing plate (71).
6. HDI high-density lamination circuit boards according to claim 1, it is characterised in that：
It further include the non-slipping block (11) for being fixed on the bottom plate (73) bottom；
Non-slipping block (11) bottom is provided with non-slip texture (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820034569.3U CN207783269U (en) | 2018-01-09 | 2018-01-09 | A kind of HDI high-density lamination circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820034569.3U CN207783269U (en) | 2018-01-09 | 2018-01-09 | A kind of HDI high-density lamination circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207783269U true CN207783269U (en) | 2018-08-28 |
Family
ID=63224118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820034569.3U Expired - Fee Related CN207783269U (en) | 2018-01-09 | 2018-01-09 | A kind of HDI high-density lamination circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207783269U (en) |
-
2018
- 2018-01-09 CN CN201820034569.3U patent/CN207783269U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180828 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |