CN206402530U - A kind of low-power consumption type printed circuit board (PCB) - Google Patents

A kind of low-power consumption type printed circuit board (PCB) Download PDF

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Publication number
CN206402530U
CN206402530U CN201720132166.8U CN201720132166U CN206402530U CN 206402530 U CN206402530 U CN 206402530U CN 201720132166 U CN201720132166 U CN 201720132166U CN 206402530 U CN206402530 U CN 206402530U
Authority
CN
China
Prior art keywords
layer
circuit board
pcb
printed circuit
ventilation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201720132166.8U
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Chinese (zh)
Inventor
刘裕和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fengshun County Sheng Electronics Co Ltd
Original Assignee
Fengshun County Sheng Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fengshun County Sheng Electronics Co Ltd filed Critical Fengshun County Sheng Electronics Co Ltd
Priority to CN201720132166.8U priority Critical patent/CN206402530U/en
Application granted granted Critical
Publication of CN206402530U publication Critical patent/CN206402530U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses printed-board technology field it is a kind of can under high temperature environment steady operation low-power consumption type printed circuit board (PCB), including board base layer, ceramic substrate is provided with the top of the board base layer, conductive layer is provided with the top of the ceramic substrate, the bottom of the board base layer is provided with HB plate flame-retardant layers, the bottom of the carbon fiber heat dissipating layer is provided with ventilation copper plate layer, the inner chamber of the ventilation copper plate layer is evenly arranged with ventilation duct, using ceramic substrate, reduce cost, reduce layer, reduce thermal resistance, and fine thermolysis is played to printed circuit board (PCB) by the ventilation duct in carbon fiber heat dissipating layer and ventilation copper plate layer, reduce temperature during printed circuit board (PCB) work, flattening can be applied to, the limited application scenarios in space such as miniaturization, breach the defect that traditional like product can not be used in high temperature environment, it is low in energy consumption, the normal work of circuit board can be ensured.

Description

A kind of low-power consumption type printed circuit board (PCB)
Technical field
The utility model is related to printed-board technology field, specially a kind of low-power consumption type printed circuit board (PCB).
Background technology
Printed circuit board, also known as printed circuit board (PCB), are the suppliers of electronic component electrical connection.Its development has The history of more than 100 years;It is mainly designed to layout design;It is to greatly reduce wiring and fill using the major advantage of circuit board The mistake matched somebody with somebody, improves the gentle productive labor rate of Automated water.But existing printed circuit board (PCB) is sufficiently bulky due to itself, And volume further increases after being assembled on device, causes traditional printed circuit board (PCB) in spaces such as flattening, miniaturizations It is easy to limited under limited application scenarios and can not uses, its power consumption is excessive, because power consumption is excessive, can cause a series of serious The problems such as temperature rise or even short-circuit component, electric power is also wasted, the theory of existing energy-conserving and environment-protective is not met.
At present, because the inner space of many electric equipment products is very limited, component power is big and more intensive, environment is held Continuous temperature is high;The heat dispersion of existing printed circuit board (PCB) is poor, commonly relies on increase outside heat sink, radiator fan etc. and enters Row forced air convection radiates, and adds overall power consumption, and accelerate aging, the deformation of circuit board in itself.
In view of it is mentioned above the problem of, the utility model designs a kind of low-power consumption type printed circuit board (PCB), to solve above-mentioned carry To the problem of.
Utility model content
The purpose of this utility model is to provide a kind of low-power consumption type printed circuit board (PCB), to solve to carry in above-mentioned background technology The traditional printed circuit board (PCB) gone out the spaces such as flattening, miniaturization it is limited, continue to be easy under the application scenarios such as high temperature by Limit and can not use, its power consumption is excessive, because power consumption is excessive, the problem of causing a series of serious, also wastes electric power, does not meet The problem of theory of existing energy-conserving and environment-protective.
To achieve the above object, the utility model provides following technical scheme:
Ceramics are provided with the top of a kind of low-power consumption type printed circuit board (PCB), including board base layer, the board base layer Conductive layer is provided with the top of basic unit, the ceramic substrate, the bottom of the board base layer is provided with HB plate flame-retardant layers, described The bottom of HB plate flame-retardant layers is provided with carbon fiber heat dissipating layer, and the bottom of the carbon fiber heat dissipating layer is provided with ventilation copper plate layer, institute The inner chamber for stating ventilation copper plate layer is evenly arranged with ventilation duct.
It is preferred that, the conductive layer is copper facing conductive layer, and the inner chamber of the conductive layer is evenly arranged with micropore.
It is preferred that, the ventilation duct is tubular structure.
It is preferred that, it is provided with protection film layer at the top of the conductive layer.
It is preferred that, it is provided with silica gel adhesive linkage between the carbon fiber heat dissipating layer and ventilation copper plate layer.
Compared with prior art, the beneficial effects of the utility model are:This kind of low-power consumption type printed circuit board (PCB) is using ceramics Basic unit, reduces cost, reduces layer, reduces thermal resistance, and by the ventilation duct in carbon fiber heat dissipating layer and ventilation copper plate layer to print Printed circuit board plays fine thermolysis, and cross-ventilation is produced from circuit board inside, reduces temperature during printed circuit board (PCB) work Degree, need not rely upon additional fan or fan backing is radiated, and can be applied to flattening, to minimize electrical equipment, environment lasting Keep the limited application scenarios in space such as high temperature equipment, breach traditional like product can not in the confined space, continue The defect used in hot environment, board structure of circuit is compact, working stability, and small volume is easy to use, is adapted to volume production, low in energy consumption, It can fully ensure that circuit board being capable of normal work under high temperature environment.
Brief description of the drawings
Fig. 1 is the utility model structural representation.
In figure:1 board base layer, 2 ceramic substrates, 3 conductive layers, 4HB plates flame-retardant layer, 5 carbon fiber heat dissipating layers, 6 ventilation copper Flaggy, 7 ventilation ducts.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made The every other embodiment obtained, belongs to the scope of the utility model protection.
Referring to Fig. 1, a kind of low-power consumption type printed circuit board (PCB) that the utility model is provided, including board base layer 1, it is described The top of board base layer 1 is provided with ceramic substrate 2, and the top of the ceramic substrate 2 is provided with conductive layer 3, the circuit board The bottom of basic unit 1 is provided with HB plates flame-retardant layer 4, and the bottom of the HB plates flame-retardant layer 4 is provided with carbon fiber heat dissipating layer 5, the carbon The bottom of fiber heat dissipating layer 5 is provided with ventilation copper plate layer 6, and the inner chamber of the ventilation copper plate layer 6 is evenly arranged with ventilation duct 7.
Wherein, the conductive layer 3 is copper facing conductive layer, and the inner chamber of the conductive layer 3 is evenly arranged with micropore, with radiating Effect, the ventilation duct 7 be tubular structure, be easy to radiating, the top of the conductive layer 3 is provided with protection film layer, to conduction Layer 3 plays a protective role, and is provided with silica gel adhesive linkage between the carbon fiber heat dissipating layer 5 and ventilation copper plate layer 6, is easy to carbon fiber Connection between heat dissipating layer 5 and ventilation copper plate layer 6.
Operation principle:Board base layer 1 uses ceramic substrate 2, reduces cost, reduces layer, reduces thermal resistance, and pass through carbon Ventilation duct 7 in fiber heat dissipating layer 5 and ventilation copper plate layer 6 plays fine thermolysis to printed circuit board (PCB), inside circuit board Cross-ventilation is produced, temperature during printed circuit board (PCB) work is reduced so that printed circuit board (PCB) realizes low energy consumption, meets existing section Energy environmental protection concept, plays a part of protection to printed circuit board (PCB), and HB plates flame-retardant layer 4 plays fire-retardant well make to printed circuit board (PCB) With.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art, It is appreciated that these embodiments can be carried out in the case where not departing from principle of the present utility model and spirit a variety of changes, repaiies Change, replace and modification, scope of the present utility model is defined by the appended claims and the equivalents thereof.

Claims (5)

1. a kind of low-power consumption type printed circuit board (PCB), including board base layer (1), it is characterised in that:The board base layer (1) Top, which is provided with the top of ceramic substrate (2), the ceramic substrate (2), is provided with conductive layer (3), the board base layer (1) Bottom be provided with HB plates flame-retardant layer (4), the bottom of the HB plates flame-retardant layer (4) is provided with carbon fiber heat dissipating layer (5), the carbon The bottom of fiber heat dissipating layer (5) is provided with ventilation copper plate layer (6), and the inner chamber of the ventilation copper plate layer (6) is evenly arranged with ventilation Manage (7).
2. a kind of low-power consumption type printed circuit board (PCB) according to claim 1, it is characterised in that:The conductive layer (3) is plating Copper conductive layer, the inner chamber of the conductive layer (3) is evenly arranged with micropore.
3. a kind of low-power consumption type printed circuit board (PCB) according to claim 1, it is characterised in that:The ventilation duct (7) is pipe Shape structure.
4. a kind of low-power consumption type printed circuit board (PCB) according to claim 1, it is characterised in that:The top of the conductive layer (3) Portion is provided with protection film layer.
5. a kind of low-power consumption type printed circuit board (PCB) according to claim 1, it is characterised in that:The carbon fiber heat dissipating layer (5) it is provided with silica gel adhesive linkage between ventilation copper plate layer (6).
CN201720132166.8U 2017-02-14 2017-02-14 A kind of low-power consumption type printed circuit board (PCB) Expired - Fee Related CN206402530U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720132166.8U CN206402530U (en) 2017-02-14 2017-02-14 A kind of low-power consumption type printed circuit board (PCB)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720132166.8U CN206402530U (en) 2017-02-14 2017-02-14 A kind of low-power consumption type printed circuit board (PCB)

Publications (1)

Publication Number Publication Date
CN206402530U true CN206402530U (en) 2017-08-11

Family

ID=59515444

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201720132166.8U Expired - Fee Related CN206402530U (en) 2017-02-14 2017-02-14 A kind of low-power consumption type printed circuit board (PCB)

Country Status (1)

Country Link
CN (1) CN206402530U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109392239A (en) * 2018-09-29 2019-02-26 江苏芯力特电子科技有限公司 A kind of heat-resisting flame-retardant ceramic printed-circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109392239A (en) * 2018-09-29 2019-02-26 江苏芯力特电子科技有限公司 A kind of heat-resisting flame-retardant ceramic printed-circuit board
CN109392239B (en) * 2018-09-29 2021-01-08 江苏芯力特电子科技有限公司 Heat-resistant flame-retardant ceramic printed circuit board

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170811

Termination date: 20220214

CF01 Termination of patent right due to non-payment of annual fee