CN109392239A - A kind of heat-resisting flame-retardant ceramic printed-circuit board - Google Patents
A kind of heat-resisting flame-retardant ceramic printed-circuit board Download PDFInfo
- Publication number
- CN109392239A CN109392239A CN201811146393.1A CN201811146393A CN109392239A CN 109392239 A CN109392239 A CN 109392239A CN 201811146393 A CN201811146393 A CN 201811146393A CN 109392239 A CN109392239 A CN 109392239A
- Authority
- CN
- China
- Prior art keywords
- layer
- heat
- printed
- retardant
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
Abstract
The invention discloses a kind of heat-resisting flame-retardant ceramic printed-circuit boards, including ceramic substrate, the metallic circuit that is printed on ceramic substrate upper layer, are laid on metallic circuit upper layer equipped with clear dope layer, the refractory layer for being laid on ceramic substrate lower layer, the flame-retardant layer for being laid on refractory layer lower layer.A kind of heat-resisting flame-retardant ceramic printed-circuit board of the invention realizes heat-proof combustion-resistant performance, increases the security performance of printed circuit board by the effect of refractory layer and flame-retardant layer；Meanwhile the present invention is equipped with clear dope layer composite ceramics nanometer tungsten oxide, can effectively realize the heat-proof quality outside metallic circuit, improves the heat resistance of printed circuit board entirety.
Description
Technical field
The present invention relates to a kind of heat-resisting flame-retardant ceramic printed-circuit boards, belong to printed-board technology field.
Background technique
Ceramic substrate, which refers to, to be bonded directly to aluminium oxide or aluminium nitride ceramic substrate surface by copper foil at high temperature (single side is double
Face) on special process plate, the system of circuit board is applied to due to having many advantages, such as chemical corrosion resistance, applicable mechanical strength
Make.But in use there may be poor heat resistance, when the temperature is excessively high may occur burning etc. security risks.
Summary of the invention
The technical problem to be solved by the present invention is to overcome the deficiencies of existing technologies, a kind of heat-resisting flame-retardant ceramics print is provided
Printed circuit board realizes heat-proof combustion-resistant performance, increases the security performance of printed circuit board.
In order to solve the above technical problems, the present invention provides a kind of heat-resisting flame-retardant ceramic printed-circuit board, including ceramic base
Plate, the metallic circuit for being printed on ceramic substrate upper layer, be laid on metallic circuit upper layer equipped with clear dope layer, be laid on ceramic base
The refractory layer of plate lower layer, the flame-retardant layer for being laid on refractory layer lower layer.
Preferably, the clear dope layer is composite ceramics nanometer tungsten oxide.
Preferably, the component of the refractory layer and the parts by weight of each component are as follows: 60 ~ 80 parts of polyester resin, 30 ~ 40 parts
Epoxy acrylate, 2 ~ 5 parts of surfactants.
Preferably, the component of the flame-retardant layer and the parts by weight of each component are as follows: 60 ~ 80 parts of polyester resin, 10 ~ 20 parts
Polypropylene carbonate, 2 ~ 5 parts of surfactants.
Preferably, the polyester resin is polyethylene terephthalate.
Preferably, the surfactant is methacrylic acid polyoxyethylene enester.
Preferably, the metallic circuit is printed on ceramic substrate by metal paste and is obtained.
Preferably, metal paste is one of copper or aluminium.
Advantageous effects of the invention: a kind of heat-resisting flame-retardant ceramic printed-circuit board of the invention, by heat-resisting
The effect of layer and flame-retardant layer realizes heat-proof combustion-resistant performance, increases the security performance of printed circuit board；Meanwhile the present invention is equipped with thoroughly
Bright dope layer composite ceramics nanometer tungsten oxide can effectively realize the heat-proof quality outside metallic circuit, and it is whole to improve printed circuit board
The heat resistance of body.
Detailed description of the invention
Fig. 1 is the schematic diagram of heat-resisting flame-retardant ceramic printed-circuit board of the invention；
Appended drawing reference is as follows:
1, ceramic substrate；2, metal circuit board；3, clear dope layer；4, refractory layer；5, flame-retardant layer.
Specific embodiment
The invention will be further described below in conjunction with the accompanying drawings.Following embodiment is only used for clearly illustrating the present invention
Technical solution, and not intended to limit the protection scope of the present invention.
As shown in Figure 1, a kind of heat-resisting flame-retardant ceramic printed-circuit board, including ceramic substrate 1, it is printed on ceramic substrate 1
The metallic circuit on upper layer is laid on the refractory layer that metallic circuit upper layer is equipped with clear dope layer 3, is laid on 1 lower layer of ceramic substrate
4, it is laid on the flame-retardant layer 5 of 4 lower layer of refractory layer.
By the effect of refractory layer and flame-retardant layer, realizes heat-proof combustion-resistant performance, increase the security performance of printed circuit board.
Embodiment 1
As shown in Figure 1, a kind of heat-resisting flame-retardant ceramic printed-circuit board, including ceramic substrate 1, it is printed on 1 upper layer of ceramic substrate
Metallic circuit, be laid on metallic circuit upper layer equipped with clear dope layer 3, be laid on 1 lower layer of ceramic substrate refractory layer 4, paving
It is located at the flame-retardant layer 5 of 4 lower layer of refractory layer.Clear dope layer 3 is composite ceramics nanometer tungsten oxide.The component and each group of refractory layer 4
The parts by weight divided are as follows: 60 parts of polyethylene terephthalate, 30 parts of epoxy acrylate, 2 parts of methacrylic acid polyoxies
Change vinyl acetate.The component of flame-retardant layer 5 and the parts by weight of each component are as follows: 80 parts of polyethylene terephthalate, 20 parts poly-
Propene carbonate, 5 parts of methacrylic acid polyoxyethylene enesters.Metallic circuit is printed on ceramic substrate 1 by metal paste and is obtained,
Metal paste is copper.
Embodiment 2
As shown in Figure 1, a kind of heat-resisting flame-retardant ceramic printed-circuit board, including ceramic substrate 1, it is printed on 1 upper layer of ceramic substrate
Metallic circuit, be laid on metallic circuit upper layer equipped with clear dope layer 3, be laid on 1 lower layer of ceramic substrate refractory layer 4, paving
It is located at the flame-retardant layer 5 of 4 lower layer of refractory layer.Clear dope layer 3 is composite ceramics nanometer tungsten oxide.The component and each group of refractory layer 4
The parts by weight divided are as follows: 80 parts of polyethylene terephthalate, 40 parts of epoxy acrylate, 5 parts of methacrylic acid polyoxies
Change vinyl acetate.The component of flame-retardant layer 5 and the parts by weight of each component are as follows: 60 parts of polyethylene terephthalate, 10 parts poly-
Propene carbonate, 2 parts of methacrylic acid polyoxyethylene enesters.Metallic circuit is printed on ceramic substrate 1 by metal paste and is obtained,
Metal paste is aluminium.
Embodiment 3
As shown in Figure 1, a kind of heat-resisting flame-retardant ceramic printed-circuit board, including ceramic substrate 1, it is printed on 1 upper layer of ceramic substrate
Metallic circuit, be laid on metallic circuit upper layer equipped with clear dope layer 3, be laid on 1 lower layer of ceramic substrate refractory layer 4, paving
It is located at the flame-retardant layer 5 of 4 lower layer of refractory layer.Clear dope layer 3 is composite ceramics nanometer tungsten oxide.The component and each group of refractory layer 4
The parts by weight divided are as follows: 70 parts of polyethylene terephthalate, 35 parts of epoxy acrylate, 3 parts of methacrylic acid polyoxies
Change vinyl acetate.The component of flame-retardant layer 5 and the parts by weight of each component are as follows: 70 parts of polyethylene terephthalate, 15 parts poly-
Propene carbonate, 3 parts of methacrylic acid polyoxyethylene enesters.Metallic circuit is printed on ceramic substrate 1 by metal paste and is obtained,
Metal paste is aluminium.
A kind of heat-resisting flame-retardant ceramic printed-circuit board of the invention is realized by the effect of refractory layer 4 and flame-retardant layer 5
Heat-proof combustion-resistant performance increases the security performance of printed circuit board；Meanwhile the present invention is equipped with 3 composite ceramics nanometer of clear dope layer
Tungsten oxide can effectively realize the heat-proof quality outside metallic circuit, improve the heat resistance of printed circuit board entirety.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, without departing from the technical principles of the invention, several improvement and deformations can also be made, these improvement and deformations
Also it should be regarded as protection scope of the present invention.
Claims (8)
1. a kind of heat-resisting flame-retardant ceramic printed-circuit board, characterized in that including ceramic substrate, be printed on ceramic substrate upper layer
Metallic circuit, be laid on metallic circuit upper layer equipped with clear dope layer, be laid on ceramic substrate lower layer refractory layer, be laid on it is resistance to
The flame-retardant layer of thermosphere lower layer.
2. heat-resisting flame-retardant ceramic printed-circuit board according to claim 1, characterized in that the clear dope layer is multiple
Close ceramic nano tungsten oxide.
3. heat-resisting flame-retardant ceramic printed-circuit board according to claim 1, characterized in that the component of the refractory layer and
The parts by weight of each component are as follows: 60 ~ 80 parts of polyester resin, 30 ~ 40 parts of epoxy acrylate, 2 ~ 5 parts of surfactants.
4. heat-resisting flame-retardant ceramic printed-circuit board according to claim 1, characterized in that the component of the flame-retardant layer and
The parts by weight of each component are as follows: 60 ~ 80 parts of polyester resin, 10 ~ 20 parts of polypropylene carbonate, 2 ~ 5 parts of surfactants.
5. heat-resisting flame-retardant ceramic printed-circuit board according to claim 3 or 4, characterized in that the polyester resin is
Polyethylene terephthalate.
6. heat-resisting flame-retardant ceramic printed-circuit board according to claim 3 or 4, characterized in that the surfactant
For methacrylic acid polyoxyethylene enester.
7. heat-resisting flame-retardant ceramic printed-circuit board according to claim 1, characterized in that the metallic circuit is by metal
Slurry is printed on ceramic substrate and obtains.
8. heat-resisting flame-retardant ceramic printed-circuit board according to claim 7, characterized in that metal paste is in copper or aluminium
One kind.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811146393.1A CN109392239B (en) | 2018-09-29 | 2018-09-29 | Heat-resistant flame-retardant ceramic printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811146393.1A CN109392239B (en) | 2018-09-29 | 2018-09-29 | Heat-resistant flame-retardant ceramic printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109392239A true CN109392239A (en) | 2019-02-26 |
| CN109392239B CN109392239B (en) | 2021-01-08 |
Family
ID=65419020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811146393.1A Active CN109392239B (en) | 2018-09-29 | 2018-09-29 | Heat-resistant flame-retardant ceramic printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109392239B (en) |
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| CN108207089A (en) * | 2016-12-20 | 2018-06-26 | 无锡深南电路有限公司 | A kind of method for cancelling communication IC Metal Substrate support plate copper block oxides |
| CN207560443U (en) * | 2017-11-21 | 2018-06-29 | 深圳市恒讯通电子有限公司 | A kind of composite circuit board |
| US20180206328A1 (en) * | 2017-01-17 | 2018-07-19 | Northrop Grumman Systems Corporation | Alloy bonded graphene sheets for enhanced thermal spreaders |
| CN108419358A (en) * | 2018-03-09 | 2018-08-17 | 生益电子股份有限公司 | A kind of high heat dissipation PCB and preparation method thereof |
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2018
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Patent Citations (13)
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| CN201830547U (en) * | 2010-10-28 | 2011-05-11 | 都江堰市三美科技有限公司 | Ceramic printed circuit board |
| CN104703307A (en) * | 2015-02-10 | 2015-06-10 | 孙庄 | Ceramic heating slice |
| CN205395301U (en) * | 2016-03-07 | 2016-07-27 | 广州乐高建筑科技有限公司 | Anti high temperature flame -resistant resin board |
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| CN108207089A (en) * | 2016-12-20 | 2018-06-26 | 无锡深南电路有限公司 | A kind of method for cancelling communication IC Metal Substrate support plate copper block oxides |
| US20180206328A1 (en) * | 2017-01-17 | 2018-07-19 | Northrop Grumman Systems Corporation | Alloy bonded graphene sheets for enhanced thermal spreaders |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN109392239B (en) | 2021-01-08 |
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