CN206879206U - A kind of novel precise type internal layer interconnection line plate - Google Patents
A kind of novel precise type internal layer interconnection line plate Download PDFInfo
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- CN206879206U CN206879206U CN201720852581.0U CN201720852581U CN206879206U CN 206879206 U CN206879206 U CN 206879206U CN 201720852581 U CN201720852581 U CN 201720852581U CN 206879206 U CN206879206 U CN 206879206U
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- ceramic substrate
- aluminium oxide
- oxide ceramic
- insulating coating
- fixedly installed
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Abstract
The utility model discloses a kind of novel precise type internal layer interconnection line plate, including aluminium oxide ceramic substrate, polyimide copper clad lamination, insulating coating and chip, the aluminium oxide ceramic substrate bottom is fixedly installed insulating coating, the insulating coating bottom is fixedly installed polyimide copper clad lamination, the aluminium oxide ceramic substrate surface is fixedly installed via, the via side, which is fixed, is coated with electroless copper plating, and chip is installed with the top of the via.The utility model is coated with electroless copper plating by aluminium oxide ceramic substrate surface, enhance the thermal conductivity on aluminium oxide ceramic substrate surface, and heat is delivered to radiating groove by electroless copper plating and radiated, mounting hole runs through aluminium oxide ceramic substrate, polyimide copper clad lamination and insulating coating, can effectively by wiring board, caused high temperature be conducted to the fixing device of wiring board by copper bolt at work, with stronger thermal diffusivity, it is adapted to be widely popularized and applied.
Description
Technical field
A kind of wiring board art is the utility model is related to, more particularly to a kind of novel precise type internal layer interconnection line plate.
Background technology
With the rapid development of electronic technology, electronic product also develops towards miniaturization, lighting, high integration direction,
Semiconductor device encapsulation also develops rapidly to more pin fine-pitch, and this requires the corresponding pcb board for carrying semiconductor device
Also miniaturization and densification are wanted.In recent years, it is high to comply with the developing direction of electronic system product " light, thin, short, small "
Density interconnection scheme plate (HDI) industry is also developed rapidly, turns into part with fastest developing speed in the big industries of PCB.Ultra-thin circuit
Plate means that selected core plate is thin, and most thin FR-4 sheet materials are 50um in the market, easily broken easy to break, overetch line, subtract copper cash, be black
Line easy clamp in hole is scrapped, and ultra-thin circuit must also reach most thin, however, reaching in addition to core plate selects most thin core plate to each layer dielectric layer
To it is most thin while, also to meet the multifunctionality of wiring board, to reach quality assurance, extend the life-span, line of the prior art
Road plate function is single, fragile, and it is serious to generate heat, so as to influence the bulk life time of wiring board.It is therefore, it is proposed that a kind of new
Accurate internal layer interconnection line plate.
Utility model content
Main purpose of the present utility model is to provide a kind of novel precise type internal layer interconnection line plate, made pottery by aluminum oxide
Porcelain substrate surface is coated with electroless copper plating, enhances the thermal conductivity on aluminium oxide ceramic substrate surface, and heat is passed through into electroless copper plating
It is delivered to radiating groove to be radiated, mounting hole runs through aluminium oxide ceramic substrate, polyimide copper clad lamination and insulating coating, can be effective
By wiring board, caused high temperature is conducted to the fixing device of wiring board by copper bolt at work, has stronger radiating
Property, it is adapted to be widely popularized and applied, effectively can solves the problems, such as in background technology.
To achieve the above object, the technical scheme that the utility model is taken is：
A kind of novel precise type internal layer interconnection line plate, including aluminium oxide ceramic substrate, polyimide copper clad lamination, insulation painting
Layer and chip, the aluminium oxide ceramic substrate bottom are fixedly installed insulating coating, and the insulating coating bottom is fixedly installed
Polyimide copper clad lamination, the aluminium oxide ceramic substrate surface are fixedly installed via, and the via side is fixed and is coated with chemistry
Heavy copper, the via top are installed with chip, and the chip-side is fixedly installed radiating groove, and the radiating groove both sides are consolidated
Surely mounting hole is provided with, aluminium oxide ceramic substrate surface surrounding is fixedly installed electrical equipment border.
Further, the mounting hole runs through aluminium oxide ceramic substrate, polyimide copper clad lamination and insulating coating.
Further, the aluminium oxide ceramic substrate, polyimide copper clad lamination and insulating coating are connected by polypropylene glue
Connect.
Further, the chip bottom is provided with pin, and pin with via by being weldingly connected.
Further, it is provided with copper bolt in the mounting hole.
Compared with prior art, the utility model has the advantages that：
1. aluminium oxide ceramic substrate, polyimide copper clad lamination are connected with insulating coating by polypropylene glue, wherein aoxidizing
Aluminium ceramic substrate has good electrical insulation performance, excellent solderability and high adhesive strength, and be able to can be lost as pcb board
Various figures are carved, there is high radiating, low thermal resistance, long lifespan, proof voltage.
2. aluminium oxide ceramic substrate surface is coated with electroless copper plating, the thermal conductivity on aluminium oxide ceramic substrate surface is enhanced, and
Heat is delivered into radiating groove by electroless copper plating to be radiated.
3. polyimide copper clad lamination makes copper-clad plate by reinforcing material of glass fabric, there is polyimide copper clad lamination
The excellent combination properties such as glass transition temperature is high, dielectric constant is low, make the present invention have more heat-resisting quantity, can effectively reduce
The present apparatus is influenceed in working condition by environment temperature, improves the operating efficiency of device.
4. being provided with insulating coating among aluminium oxide ceramic substrate and polyimide copper clad lamination, insulating coating can be by aluminum oxide
Ceramic substrate and polyimide copper clad lamination are separated, and insulating coating both sides scribble polypropylene glue, and effectively aluminum oxide can be made pottery
Porcelain substrate and the interconnection of polyimide copper clad lamination high density, while also function to insulation, radiating, the function of antistatic.
5. chip bottom is provided with pin, and pin with via by being weldingly connected, electrical equipment border is used to determine circuit board
Size, component on all circuit boards can effectively remind the work of assembling or maintenance personal's circuit board all no more than the border
Make region position.
6. be provided with copper bolt in mounting hole, wherein mounting hole run through aluminium oxide ceramic substrate, polyimide copper clad lamination and
Insulating coating, can effectively by wiring board, caused high temperature be conducted to the fixing device of wiring board by copper bolt at work
On.
Brief description of the drawings
Fig. 1 is a kind of overall structure diagram of novel precise type internal layer interconnection line plate of the utility model.
Fig. 2 is a kind of left side structure schematic diagram of novel precise type internal layer interconnection line plate of the utility model.
In figure：1st, aluminium oxide ceramic substrate；2nd, polyimide copper clad lamination；3rd, insulating coating；4th, chip；5th, via；6th, change
Learn heavy copper；7th, radiating groove；8th, electrical equipment border；9th, mounting hole.
Embodiment
Technological means, creation characteristic, reached purpose and effect to realize the utility model are easy to understand, below
With reference to embodiment, the utility model is expanded on further.
As shown in Figure 1-2, a kind of novel precise type internal layer interconnection line plate, including aluminium oxide ceramic substrate 1, polyimides
Copper-clad plate 2, insulating coating 3 and chip 4, the bottom of aluminium oxide ceramic substrate 1 are fixedly installed insulating coating 3, the insulation
The bottom of coating 3 is fixedly installed polyimide copper clad lamination 2, and the surface of aluminium oxide ceramic substrate 1 is fixedly installed via 5, institute
State the fixation of the side of via 5 and be coated with electroless copper plating 6, the top of via 5 is installed with chip 4, and the side of chip 4 is fixed and set
Radiating groove 7 is equipped with, the both sides of radiating groove 7 are fixedly installed mounting hole 9, and the surface surrounding of aluminium oxide ceramic substrate 1 is fixed
It is provided with electrical equipment border 8.
Wherein, the mounting hole 9 runs through aluminium oxide ceramic substrate 1, polyimide copper clad lamination 2 and insulating coating 3.
Wherein, the aluminium oxide ceramic substrate 1, polyimide copper clad lamination 2 and insulating coating 3 are connected by polypropylene glue
Connect.
Wherein, the bottom of chip 4 is provided with pin, and pin with via 5 by being weldingly connected.
Wherein, it is provided with copper bolt in the mounting hole 9.
It should be noted that the utility model is a kind of novel precise type internal layer interconnection line plate, during work, aluminum oxide pottery
Porcelain substrate 1, polyimide copper clad lamination 2 and insulating coating 3 are connected by polypropylene glue, and wherein aluminium oxide ceramic substrate 1 has
Good electrical insulation performance, excellent solderability and high adhesive strength, and various figures can be etched as pcb board,
There is high radiating, low thermal resistance, long lifespan, proof voltage, and the surface of aluminium oxide ceramic substrate 1 is coated with electroless copper plating 6, enhancing
The thermal conductivity on the surface of aluminium oxide ceramic substrate 1, and heat is delivered to radiating groove 7 by electroless copper plating and radiated, polyamides
Imines copper-clad plate 2 makes copper-clad plate by reinforcing material of glass fabric, polyimide copper clad lamination 2 is had glass transition temperature
High, the excellent combination property such as dielectric constant is low, makes the present invention have more heat-resisting quantity, can effectively reduce the present apparatus in work
Make to be influenceed by environment temperature during state, improve the operating efficiency of device, aluminium oxide ceramic substrate 1 and polyimide copper clad lamination 2
Centre is provided with insulating coating 3, and insulating coating 3 can separate aluminium oxide ceramic substrate 1 and polyimide copper clad lamination 2, and absolutely
The both sides of edge coating 3 scribble polypropylene glue, effectively can interconnect aluminium oxide ceramic substrate 1 and the high density of polyimide copper clad lamination 2,
Also function to insulation, radiating, the function of antistatic simultaneously, the bottom of chip 4 is provided with pin, and pin with via 5 by being weldingly connected,
Electrical equipment border 8 is used to determining the size of circuit board, and the component on all circuit boards can be reminded effectively all no more than the border
Assembling or the working region position of maintenance personal's circuit board, mounting hole 9 is interior to be provided with copper bolt, and wherein mounting hole 9 runs through
Aluminium oxide ceramic substrate 1, polyimide copper clad lamination 2 and insulating coating 3, can effectively by wiring board, caused high temperature leads at work
Copper bolt is crossed to conduct to the fixing device of wiring board.
The advantages of general principle and principal character of the present utility model and the utility model has been shown and described above.One's own profession
The technical staff of industry is it should be appreciated that the utility model is not restricted to the described embodiments, described in above-described embodiment and specification
Simply illustrate principle of the present utility model, on the premise of the spirit and scope of the utility model is not departed from, the utility model is also
Various changes and modifications are had, these changes and improvements are both fallen within claimed the scope of the utility model.The utility model
Claimed scope is by appended claims and its equivalent thereof.
Claims (5)
1. a kind of novel precise type internal layer interconnection line plate, including aluminium oxide ceramic substrate (1), polyimide copper clad lamination (2), absolutely
Edge coating (3) and chip (4), it is characterised in that：Aluminium oxide ceramic substrate (1) bottom is fixedly installed insulating coating (3),
Insulating coating (3) bottom is fixedly installed polyimide copper clad lamination (2), and aluminium oxide ceramic substrate (1) surface is fixed
Via (5) is provided with, via (5) side, which is fixed, is coated with electroless copper plating (6), and core is installed with the top of the via (5)
Piece (4), chip (4) side are fixedly installed radiating groove (7), and radiating groove (7) both sides are fixedly installed mounting hole
(9), aluminium oxide ceramic substrate (1) surface surrounding is fixedly installed electrical equipment border (8).
A kind of 2. novel precise type internal layer interconnection line plate according to claim 1, it is characterised in that：The mounting hole
(9) aluminium oxide ceramic substrate (1), polyimide copper clad lamination (2) and insulating coating (3) are run through.
A kind of 3. novel precise type internal layer interconnection line plate according to claim 1, it is characterised in that：The aluminum oxide pottery
Porcelain substrate (1), polyimide copper clad lamination (2) and insulating coating (3) are connected by polypropylene glue.
A kind of 4. novel precise type internal layer interconnection line plate according to claim 1, it is characterised in that：The chip (4)
Bottom is provided with pin, and pin is with via (5) by being weldingly connected.
A kind of 5. novel precise type internal layer interconnection line plate according to claim 1, it is characterised in that：The mounting hole
(9) copper bolt is provided with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720852581.0U CN206879206U (en) | 2017-07-14 | 2017-07-14 | A kind of novel precise type internal layer interconnection line plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720852581.0U CN206879206U (en) | 2017-07-14 | 2017-07-14 | A kind of novel precise type internal layer interconnection line plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206879206U true CN206879206U (en) | 2018-01-12 |
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ID=61330278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720852581.0U Active CN206879206U (en) | 2017-07-14 | 2017-07-14 | A kind of novel precise type internal layer interconnection line plate |
Country Status (1)
| Country | Link |
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| CN (1) | CN206879206U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113225901A (en) * | 2021-05-12 | 2021-08-06 | 四川锐宏电子科技有限公司 | Multilayer thick film ceramic-based circuit board and preparation process thereof |
-
2017
- 2017-07-14 CN CN201720852581.0U patent/CN206879206U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113225901A (en) * | 2021-05-12 | 2021-08-06 | 四川锐宏电子科技有限公司 | Multilayer thick film ceramic-based circuit board and preparation process thereof |
| CN113225901B (en) * | 2021-05-12 | 2023-01-10 | 四川锐宏电子科技有限公司 | Multilayer thick film ceramic-based circuit board and preparation process thereof |
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