CN207518936U - A kind of high impedance multilayer insulation metal base circuit board - Google Patents
A kind of high impedance multilayer insulation metal base circuit board Download PDFInfo
- Publication number
- CN207518936U CN207518936U CN201721651362.2U CN201721651362U CN207518936U CN 207518936 U CN207518936 U CN 207518936U CN 201721651362 U CN201721651362 U CN 201721651362U CN 207518936 U CN207518936 U CN 207518936U
- Authority
- CN
- China
- Prior art keywords
- ceramic wafer
- time
- heat
- conducting glue
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model discloses a kind of high impedance multilayer insulation metal base circuit boards, including main body and middle heat-conducting glue layer, the lower end of main body is fixed with metal putting part, metal putting part is fixedly arranged above first time ceramic wafer, the top of first time ceramic wafer is fixed with ceramic wafer on first, the centre position of ceramic wafer is fixed with cooling fin on first time ceramic wafer and first, the top surface of ceramic wafer is fitted with the first solder mask layer on first, the bottom surface of first time ceramic wafer is fitted with the second solder mask layer, metal frame is fixed on the inside of cooling fin, the lower end of ceramic wafer is connected with heat-conducting glue layer on first on first.This kind of high impedance multilayer insulation metal base circuit board, pass through beryllium oxide ceramics plate, can greatly improve ceramic wafer on first, on second ceramic wafer, first time ceramic wafer and second time ceramic wafer heat conductivility, it is convenient for quick heat transfer, suitable for the production and use of high impedance multilayer insulation metal base circuit board, there is good development prospect.
Description
Technical field
The utility model is related to wiring board technology field, specially a kind of high impedance multilayer insulation metal base circuit board.
Background technology
The title of circuit board has：Wiring board, pcb board, aluminum substrate, high frequency plate, PCB, ultra-thin wiring board, ultrathin circuit board,
Print (copper lithographic technique) circuit board etc..Circuit board makes circuit miniaturization, intuitiveization, batch production for permanent circuit and excellent
Change electrical appliance layout to play an important role.
Existing wiring board, it is all that the metallic circuit of wiring board is protected by smearing solder mask that surface, which is all,
But the rigidity of solder mask is poor, easily wears, in the case of passing by online carefully, the heat condition of circuit is also more tight
Weight if cannot radiating treatment effectively be carried out to circuit, can directly contribute the situation of circuit fusing, and safety is poor.
Utility model content
The purpose of this utility model is to provide a kind of high impedance multilayer insulation metal base circuit board, to solve above-mentioned background
The problem of rigidity is poor, easily wears, and safety is poor is proposed in technology.
To achieve the above object, the utility model provides following technical solution：A kind of high impedance multilayer insulation metal base
Road plate, including main body and middle heat-conducting glue layer, the lower end of the main body is fixed with metal putting part, the top of the metal putting part
First time ceramic wafer is fixed with, the top of first time ceramic wafer is fixed with ceramic wafer on first, first time ceramic wafer and institute
The centre position for stating ceramic wafer on first is fixed with cooling fin, and the top surface of ceramic wafer is fitted with the first solder mask on described first
Layer, the bottom surface of first time ceramic wafer is fitted with the second solder mask layer, is fixed with metal frame on the inside of the cooling fin, institute
The lower end for stating ceramic wafer on first is connected with heat-conducting glue layer on first, and First Line is connected on the inside of heat-conducting glue layer on described first
Road plate, the bottom surface of the first line plate are fitted with heat-conducting glue layer on second, and the upper end of the middle heat-conducting glue layer is fixed with second
Upper ceramic wafer, and the lower end of middle heat-conducting glue layer is fixed with second time ceramic wafer, and is connected with above first time ceramic wafer
Heat-conducting glue layer once, the top surface of first time heat-conducting glue layer are fitted with the second wiring board, and the upper end of second wiring board is consolidated
Surely there is second time heat-conducting glue layer.
Preferably, ceramic wafer on described first, ceramic wafer, first time ceramic wafer and second time ceramic wafer on second
It is beryllium oxide ceramics plate.
Preferably, the first solder mask layer and the second solder mask layer respectively with ceramic wafer on described first and
First time ceramic wafer fits closely.
Preferably, the cooling fin and the metal frame are copper metal material, and the cooling fin and the metal frame are tight
Close welding, and cooling fin is equipped with multiple.
Preferably, ceramic wafer is fixedly connected with ceramic wafer on described second by the first line plate on described first,
First time ceramic wafer is fixedly connected with second time ceramic wafer by second wiring board.
Preferably, the metal putting part passes through the second solder mask layer fixing card with first time ceramic wafer
It connects.
Compared with prior art, the beneficial effects of the utility model are：This kind of high impedance multilayer insulation metal base circuit board,
Ceramic wafer on first, ceramic wafer, first time ceramic wafer and second time ceramic wafer are beryllium oxide ceramics plate on second, the first resistance
Solder paste layer of ink and the second solder mask layer fit closely respectively with ceramic wafer on first and first time ceramic wafer, existing circuit
Plate, in the case of passing by online carefully, the heat condition of circuit is also more serious, if cannot effectively be carried out at heat dissipation to circuit
Reason can then directly contribute the situation of circuit fusing, and safety is poor, this kind of high impedance multilayer insulation metal base circuit board passes through oxygen
Change beryllium ceramic wafer, can greatly improve ceramic wafer on first, ceramic wafer, first time ceramic wafer and second time ceramic wafer on second
Heat conductivility, carry out quick heat transfer convenient for the high impedance multilayer insulation metal base circuit board, ceramic wafer and the on first
Ceramic wafer is fixedly connected by first line plate on two, and first time ceramic wafer is fixed with second time ceramic wafer by the second wiring board
Connection, cooling fin and metal frame are copper metal material, and cooling fin is closely welded with metal frame, and cooling fin be equipped with it is multiple, this
Kind of high impedance multilayer insulation metal base circuit board by ceramic wafer on ceramic wafer and second on first jointly to first line plate into
Row is fixed and protection, and passes through first time ceramic wafer and second time ceramic wafer is fixed and protects to the second wiring board jointly,
Middle heat-conducting glue layer then links together ceramic wafer on second and second time ceramic wafer, ceramic wafer on first, ceramic wafer on second,
First time ceramic wafer, second time ceramic wafer and middle heat-conducting glue layer can be convenient for the high impedance multilayer insulation metal base circuit board
Heat transfer to metal frame, and pass through the cooling fin on the outside of metal frame carry out quickly heat dissipation work, and pass through first resistance
Solder paste layer of ink and the second solder mask layer can carry out welding resistance protection to ceramic wafer on first and first time ceramic wafer respectively, effectively carry
The safety of high this kind of high impedance multilayer insulation metal base circuit board and practicability, metal putting part lead to first time ceramic wafer
It crosses the second solder mask layer and fixes clamping, metal putting part can stop that the foreign matter of external environment enters in original paper, so as to protect
Electronic component is protected from the damage of foreign matter, and safety is increased dramatically with service life.
Description of the drawings
Fig. 1 is the utility model overall structure exploded perspective view；
Fig. 2 is the utility model overall structure sectional view；
Fig. 3 is the utility model metal putting part structure diagram.
In figure：1st, main body, ceramic wafer on 2, first, 3, cooling fin, 4, first time ceramic wafer, 5, metal putting part, 6,
One solder mask layer, the 7, second solder mask layer, heat-conducting glue layer on 8, metal frame, 9, first, 10, first line plate, 11, second
Upper heat-conducting glue layer, ceramic wafer on 12, second, 13, middle heat-conducting glue layer, 14, second time ceramic wafer, 15, second time heat-conducting glue layer,
16th, the second wiring board, 17, first time heat-conducting glue layer.
Specific embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
It clearly and completely describes, it is clear that the described embodiments are only a part of the embodiments of the utility model rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are without making creative work
All other embodiments obtained shall fall within the protection scope of the present invention.
It please refers to Fig.1 to 3, the utility model provides a kind of technical solution：A kind of high impedance multilayer insulation metal base circuit
Plate, including ceramic wafer 2 in main body 1, first, cooling fin 3, first time ceramic wafer 4, metal putting part 5, the first solder mask layer 6,
Heat-conducting glue layer 9 on second solder mask layer 7, metal frame 8, first, on first line plate 10, second in heat-conducting glue layer 11, second
It is led under ceramic wafer 12, middle heat-conducting glue layer 13, second time ceramic wafer 14, second time heat-conducting glue layer 15, the second wiring board 16 and first
Hot glue layer 17, the lower end of main body 1 are fixed with metal putting part 5, and metal putting part 5 can stop that the foreign matter of external environment enters original
In part, so as to which electronic component be protected to be protected from the damage of foreign matter, safety is increased dramatically with service life, and metal holds
Put the first time ceramic wafer 4 that be fixedly arranged above of shell 5, the top of first time ceramic wafer 4 is fixed with ceramic wafer 2 on first, under first
The centre position of ceramic wafer 2 is fixed with cooling fin 3 on ceramic wafer 4 and first, and the top surface of ceramic wafer 2 is fitted with the first resistance on first
Solder paste layer of ink 6, the bottom surface of first time ceramic wafer 4 are fitted with the second solder mask layer 7, and the inside of cooling fin 3 is fixed with metal frame
8, this kind of high impedance multilayer insulation metal base circuit board is by ceramic wafer 12 on ceramic wafer 2 and second on first jointly to First Line
Road plate 10 is fixed and protects, and pass through first time ceramic wafer 4 and second time ceramic wafer 14 jointly to the second wiring board 16 into
Row is fixed and protects, and middle heat-conducting glue layer 13 then links together ceramic wafer on second 12 and second time ceramic wafer 14, on first
Ceramic wafer 12, first time ceramic wafer 4, second time ceramic wafer 14 and middle heat-conducting glue layer 13 can be convenient for inciting somebody to action on ceramic wafer 2, second
The heat transfer of the high impedance multilayer insulation metal base circuit board to metal frame 8, and pass through the cooling fin 3 in the outside of metal frame 8 into
Row quickly heat dissipation work, and can be respectively to ceramic wafer on first by the first solder mask layer 6 and the second solder mask layer 7
2 and first time ceramic wafer 4 carry out welding resistance protection, effectively increase the safety of this kind of high impedance multilayer insulation metal base circuit board
With practicability, the lower end of ceramic wafer 2 is connected with heat-conducting glue layer 9 on first on first, and the inside of heat-conducting glue layer 9 is connected on first
First line plate 10, the bottom surface of first line plate 10 are fitted with heat-conducting glue layer 11 on second, and the upper end of middle heat-conducting glue layer 13 is fixed
There are ceramic wafer 12 on second, and the lower end of middle heat-conducting glue layer 13 is fixed with second time ceramic wafer 14, the top of first time ceramic wafer 4
First time heat-conducting glue layer 17 is connected with, the top surface of first time heat-conducting glue layer 17 is fitted with the second wiring board 16, the second wiring board 16
Upper end be fixed with second time heat-conducting glue layer 15, existing wiring board, pass by online it is thin in the case of, the heat condition of circuit
It is more serious, if cannot effectively to circuit carry out radiating treatment, can directly contribute circuit fusing situation, safety compared with
Difference, this kind of high impedance multilayer insulation metal base circuit board by beryllium oxide ceramics plate, can greatly improve ceramic wafer 2 on first,
The heat conductivility of ceramic wafer 12, first time ceramic wafer 4 and second time ceramic wafer 14 on second, convenient for the high impedance multilayer insulation
Metal base circuit board carries out quick heat transfer.
Operation principle：It, should be first to the knot of apparatus main body 1 before this kind of high impedance multilayer insulation metal base circuit board is used
Structure does simple understanding, and ceramic wafer on first 2 is fixed to being bonded first by heat-conducting glue layer 9 on first with first line plate 10,
Ceramic wafer on second 12 with first line plate 10 is fixed by heat-conducting glue layer 11 on second and is bonded, is led followed by under first
First time ceramic wafer 4 with the second wiring board 16 is fixed and is bonded by hot glue layer 17, and second time is made pottery by second time heat-conducting glue layer 15
Porcelain plate 14 is bonded with the fixation of the second wiring board 16, and ceramic wafer on second 12 and second time ceramic wafer 14 are passed through middle heat-conducting glue later
Layer 13 is fixed together, first line plate 10 is fixed jointly by ceramic wafer 12 on ceramic wafer 2 and second on first and
Protection, and pass through first time ceramic wafer 4 and second time ceramic wafer 14 is fixed and protects to the second wiring board 16 jointly, in lead
Hot glue layer 13 then links together ceramic wafer on second 12 and second time ceramic wafer 14, ceramic on ceramic wafer 2, second on first
Plate 12, first time ceramic wafer 4, second time ceramic wafer 14 and middle heat-conducting glue layer 13 can be convenient for high impedance multilayer insulation gold
Belong to the heat transfer of base circuit board to metal frame 8, and the cooling fin 3 for passing through 8 outside of metal frame carries out work of quickly radiating, and
And by the first solder mask layer 6 and the second solder mask layer 7 can respectively to ceramic wafer 2 on first and first time ceramic wafer 4 into
Row welding resistance protect, more than be exactly the entire operation principle of the utility model.
It should be noted that herein, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any this practical relationship or sequence.Moreover, term " comprising ", "comprising" or its any other variant are intended to
Non-exclusive inclusion, so that process, method, article or equipment including a series of elements not only will including those
Element, but also including other elements that are not explicitly listed or further include as this process, method, article or equipment
Intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
Also there are other identical elements in process, method, article or equipment including the element.
While there has been shown and described that the embodiment of the utility model, for the ordinary skill in the art,
It is appreciated that can these embodiments be carried out with a variety of variations in the case of the principle and spirit for not departing from the utility model, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of high impedance multilayer insulation metal base circuit board, including main body (1) and middle heat-conducting glue layer (13), it is characterised in that：
The lower end of the main body (1) is fixed with metal putting part (5), and the metal putting part (5) is fixedly arranged above first time ceramics
Plate (4), the top of first time ceramic wafer (4) are fixed with ceramic wafer on first (2), first time ceramic wafer (4) and described the
The centre position of ceramic wafer (2) is fixed with cooling fin (3) on one, and the top surface of ceramic wafer (2) is fitted with the first resistance on described first
Solder paste layer of ink (6), the bottom surface of first time ceramic wafer (4) are fitted with the second solder mask layer (7), the cooling fin (3)
Inside is fixed with metal frame (8), and the lower end of ceramic wafer (2) is connected with heat-conducting glue layer on first (9) on described first, and described first
First line plate (10) is connected on the inside of upper heat-conducting glue layer (9), the bottom surface of the first line plate (10) is fitted on second
Heat-conducting glue layer (11), the upper end of the middle heat-conducting glue layer (13) are fixed with ceramic wafer on second (12), and middle heat-conducting glue layer (13)
Lower end be fixed with second time ceramic wafer (14), be connected with first time heat-conducting glue layer above first time ceramic wafer (4)
(17), the top surface of first time heat-conducting glue layer (17) is fitted with the second wiring board (16), second wiring board (16) it is upper
End is fixed with second time heat-conducting glue layer (15).
2. a kind of high impedance multilayer insulation metal base circuit board according to claim 1, it is characterised in that：On described first
Ceramic wafer (2), ceramic wafer (12), first time ceramic wafer (4) and second time ceramic wafer (14) are beryllium oxide on second
Ceramic wafer.
3. a kind of high impedance multilayer insulation metal base circuit board according to claim 1, it is characterised in that：First resistance
Solder paste layer of ink (6) and the second solder mask layer (7) respectively with ceramic wafer (2) on described first and first time ceramic wafer
(4) it fits closely.
4. a kind of high impedance multilayer insulation metal base circuit board according to claim 1, it is characterised in that：The cooling fin
(3) it is copper metal material with the metal frame (8), the cooling fin (3) is closely welded with the metal frame (8), and is radiated
Piece (3) is equipped with multiple.
5. a kind of high impedance multilayer insulation metal base circuit board according to claim 1, it is characterised in that：On described first
Ceramic wafer (2) is fixedly connected with ceramic wafer (12) on described second by the first line plate (10), first time ceramics
Plate (4) is fixedly connected with second time ceramic wafer (14) by second wiring board (16).
6. a kind of high impedance multilayer insulation metal base circuit board according to claim 1, it is characterised in that：The metal holds
Shell (5) is put to be clamped by the way that the second solder mask layer (7) is fixed with first time ceramic wafer (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721651362.2U CN207518936U (en) | 2017-12-01 | 2017-12-01 | A kind of high impedance multilayer insulation metal base circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721651362.2U CN207518936U (en) | 2017-12-01 | 2017-12-01 | A kind of high impedance multilayer insulation metal base circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207518936U true CN207518936U (en) | 2018-06-19 |
Family
ID=62542841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721651362.2U Expired - Fee Related CN207518936U (en) | 2017-12-01 | 2017-12-01 | A kind of high impedance multilayer insulation metal base circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207518936U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112399705A (en) * | 2020-11-10 | 2021-02-23 | 四川深北电路科技有限公司 | High-frequency high-heat-conductivity mixed compression plate for 5G communication equipment and manufacturing method thereof |
-
2017
- 2017-12-01 CN CN201721651362.2U patent/CN207518936U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112399705A (en) * | 2020-11-10 | 2021-02-23 | 四川深北电路科技有限公司 | High-frequency high-heat-conductivity mixed compression plate for 5G communication equipment and manufacturing method thereof |
| CN112399705B (en) * | 2020-11-10 | 2022-09-30 | 四川深北电路科技有限公司 | High-frequency high-heat-conductivity mixed compression plate for 5G communication equipment and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI230103B (en) | Semiconductor module and circuit substrate connecting to semiconductor device | |
| TWM380610U (en) | Electrical connector assembly | |
| CN109244045A (en) | A kind of thick film substrate miniaturization Can encapsulating structure | |
| CN207518936U (en) | A kind of high impedance multilayer insulation metal base circuit board | |
| US6760225B1 (en) | Heat-dissipating structure of circuit board | |
| US20080136580A1 (en) | Chip network resistor contacting pcb through solder balls and semiconductor module having the same | |
| CN207753917U (en) | A kind of camera high-density flexible circuit board of suitable chip package | |
| CN209882208U (en) | High-impedance multilayer circuit board | |
| CN108806902B (en) | Chip resistor and chip resistor assembly | |
| CN206533608U (en) | A kind of high impedance multilayer insulation metal base circuit board | |
| CN102469698A (en) | Method of manufacturing semiconductor package board | |
| CN206963175U (en) | A kind of novel circuit board | |
| CN205987528U (en) | Printed circuit board assembly easily dispels heat | |
| CN206879206U (en) | A kind of novel precise type internal layer interconnection line plate | |
| CN201117381Y (en) | Multiple layer-type current sensing component structure | |
| CN205946369U (en) | Soft or hard combines circuit board | |
| US20180122537A1 (en) | Electronic component | |
| CN111341740A (en) | Novel power management chip packaging system | |
| US7547974B2 (en) | Wiring substrate with improvement in tensile strength of traces | |
| CN204795827U (en) | Novel circuit board | |
| TWM379953U (en) | Circuit board | |
| CN209234103U (en) | A kind of LED circuit board | |
| CN206923236U (en) | Suitable for the electromagnetic shielding film of moisture absorption Reflow Soldering | |
| CN113394179B (en) | Electronic component with multilayer carrier structure | |
| CN108135075A (en) | A kind of high heat conduction printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180619 Termination date: 20201201 |