CN206963175U - A kind of novel circuit board - Google Patents
A kind of novel circuit board Download PDFInfo
- Publication number
- CN206963175U CN206963175U CN201720852587.8U CN201720852587U CN206963175U CN 206963175 U CN206963175 U CN 206963175U CN 201720852587 U CN201720852587 U CN 201720852587U CN 206963175 U CN206963175 U CN 206963175U
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- CN
- China
- Prior art keywords
- heat
- circuit board
- pad
- heat conducting
- conducting coating
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Abstract
The utility model discloses a kind of novel circuit board, including substrate, solder side, line layer, insulating barrier, heat conducting coating, semiconductor chilling plate, wire, pad, heat-absorbing shield, the substrate surface includes solder side and insulating barrier, welding line layer is fixed on the solder side surface, insulating barrier is fixedly connected with around the solder side, substrate surface is fixedly connected with heat conducting coating on the outside of the insulating barrier, the heat conducting coating surface is fixedly connected with semiconductor chilling plate, the substrate surface sets pad, heat-absorbing shield is fixedly connected with the outside of the pad, the semiconductor chilling plate passes through wire jointing soldering points.The utility model to wiring board by being improved, and collection radiating and fixed pin one, novel in design, clever structure is simple to operate, has good promotional value.
Description
Technical field
A kind of wiring board is the utility model is related to, more particularly to a kind of novel circuit board.
Background technology
The title of circuit board has：Ceramic circuit board, aluminium oxide ceramics circuit board, aluminium nitride ceramics circuit board, wiring board,
Pcb board, aluminium base, high frequency plate, thick copper coin, impedance plate, PCB, ultra-thin wiring board, ultrathin circuit board, print (copper lithographic technique)
Circuit board etc..Circuit board makes circuit miniaturization, directly perceivedization, batch production and optimization electrical appliance layout lifting for permanent circuit
Act on.Circuit board can be described as printed substrate or printed circuit board (PCB), and English name is (Printed Circuit Board)
(FPC wiring boards are also known as FPC flexibility for PCB, (Flexible Printed Circuit board) FPC wiring boards [1]
Circuit board is that have height reliability, excellent pliability printing electricity to be a kind of made of base material using polyimides or polyester film
Road plate.With the characteristics of Distribution density is high, in light weight, thickness of thin, good bending property！) and Rigid Flex (reechas, Soft
And hard combination plate)-FPC and PCB birth and development, expedited the emergence of Rigid Flex this new product.
Therefore, Rigid Flex, it is exactly FPC and rigid wiring board, by processes such as pressings, is combined by related process requirement
Together, the wiring board with FPC characteristics and PCB characteristics of formation, conventional wiring board is due to concentrating circuit, heat conducting circuit board
Cause thermal damage is easily crossed, conventional wiring board pin scolding tin easily migrates in addition, the problem of causing micro-short circuit between pin, while prevents one
A little halogen residues, moisture invasion, tin sweat(ing) or scruff residual also easily cause the not normal hidden danger of electric control function.Therefore, it is proposed that
A kind of novel circuit board.
Utility model content
Main purpose of the present utility model is to provide a kind of novel circuit board can effectively solve asking in background technology
Topic.
To achieve the above object, the technical scheme that the utility model is taken is：
A kind of novel circuit board, including substrate, solder side, line layer, insulating barrier, heat conducting coating, semiconductor chilling plate, lead
Line, pad, heat-absorbing shield, the substrate surface include solder side and insulating barrier, and welding line layer is fixed on the solder side surface,
Insulating barrier is fixedly connected with around the solder side, substrate surface is fixedly connected with heat conducting coating, the heat conduction on the outside of the insulating barrier
Coating surface is fixedly connected with semiconductor chilling plate, and the substrate surface sets pad, suction is fixedly connected with the outside of the pad
Heat cover, the semiconductor chilling plate pass through wire jointing soldering points.
Further, the semiconductor chilling plate and circuit in parallel.
Further, the heat-absorbing shield passes through heat-conductive coating and heat conducting coating integrally connected.
Further, the wire is electrically connected with through heat conducting coating and with semiconductor chilling plate.
Further, the pad belongs to line layer.
Compared with prior art, the utility model has the advantages that：This kind of novel circuit board on substrate by welding
Junction and the layout of insulating barrier and line layer, are easy to implement the basic function of wiring board, pass through what is be fixedly connected on substrate surface
Heat conducting coating, it is easy to heat caused by absorption circuit, disperses heat, make circuit steady operation, prevented cause thermal damage, pass through fixation
The semiconductor chilling plate on heat conducting coating surface is connected to, is easy to the comprehensive heat for absorbing heat conducting coating, ties up heat conducting coating heat
It is fixed to keep steady, and by the heat-absorbing shield being fixed on the outside of pad, is easy to absorb heat caused by pad, and be scattered in heat conduction painting
Layer, while be beneficial to isolate pad, prevent some halogen residues, moisture invasion, tin sweat(ing) or scruff residual from also easily causing electricity
The hidden danger of malfunction is controlled, by semiconductor chilling plate and circuit in parallel, does not influence circuit work, and the work of wiring board can be maintained
Stablize, and the permanent use of pad, the utility model to wiring board by being improved, collection radiating and fixed pin one
Body, novel in design, clever structure is simple to operate, has good promotional value.
Brief description of the drawings
Fig. 1 is a kind of overall schematic top plan view of novel circuit board of the utility model.
Fig. 2 is a kind of front view of novel circuit board of the utility model.
In figure：1st, substrate；2nd, solder side；3rd, line layer；4th, insulating barrier；5th, heat conducting coating；6th, semiconductor chilling plate；7th, lead
Line；8th, pad；9th, heat-absorbing shield.
Embodiment
Technological means, creation characteristic, reached purpose and effect to realize the utility model are easy to understand, below
With reference to embodiment, the utility model is expanded on further.
As shown in Figure 1-2, a kind of novel circuit board, including substrate 1, solder side 2, line layer 3, insulating barrier 4, heat conducting coating
5th, semiconductor chilling plate 6, wire 7, pad 8, heat-absorbing shield 9, the surface of substrate 1 includes solder side 2 and insulating barrier 4, described
Welding line layer 3 is fixed on solder side surface, and insulating barrier 4, the outside substrate 1 of insulating barrier 4 are fixedly connected with around the solder side 2
Surface is fixedly connected with heat conducting coating 5, and the surface of heat conducting coating 5 is fixedly connected with semiconductor chilling plate 6, and the surface of substrate 1 is set
Pad 8 is put, the outside of pad 8 is fixedly connected with heat-absorbing shield 9, and the semiconductor chilling plate 6 passes through the jointing soldering points of wire 7
8。
Wherein, the semiconductor chilling plate 6 and circuit in parallel.
Wherein, the heat-absorbing shield 9 passes through heat-conductive coating and the integrally connected of heat conducting coating 5.
Wherein, the wire 7 is electrically connected with through heat conducting coating 5 and with semiconductor chilling plate 6.
Wherein, the pad 8 belongs to line layer 3.
It should be noted that the utility model is a kind of novel circuit board, during work, pass through solder side on substrate and insulation
The layout of layer and line layer, the basic function of wiring board is easy to implement, by the heat conducting coating being fixedly connected on substrate surface, just
In heat caused by absorption circuit, disperse heat, make circuit steady operation, prevented cause thermal damage, by being fixedly connected on heat conduction
The semiconductor chilling plate of coating surface, it is easy to the comprehensive heat for absorbing heat conducting coating, heat conducting coating heat is remained stable, pass through
The heat-absorbing shield being fixed on the outside of pad, it is easy to absorb heat caused by pad, and is scattered in heat conducting coating, at the same it is beneficial
In isolation pad, it is not normal to prevent that some halogen residues, moisture invasion, tin sweat(ing) or scruff residual from also easily causing electric control function
Hidden danger, by semiconductor chilling plate and circuit in parallel, circuit work is not influenceed, and can maintain the working stability of wiring board, and weldering
The permanent use of contact.
The advantages of general principle and principal character of the present utility model and the utility model has been shown and described above.One's own profession
The technical staff of industry is it should be appreciated that the utility model is not restricted to the described embodiments, described in above-described embodiment and specification
Simply illustrate principle of the present utility model, on the premise of the spirit and scope of the utility model is not departed from, the utility model is also
Various changes and modifications are had, these changes and improvements are both fallen within claimed the scope of the utility model.The utility model
Claimed scope is by appended claims and its equivalent thereof.
Claims (5)
1. a kind of novel circuit board, including substrate (1), solder side (2), line layer (3), insulating barrier (4), heat conducting coating (5), half
Conductor cooling piece (6), wire (7), pad (8), heat-absorbing shield (9), it is characterised in that：Substrate (1) surface includes welding
Face (2) and insulating barrier (4), the solder side surface are fixed welding line layer (3), are fixedly connected around the solder side (2) absolutely
Edge layer (4), insulating barrier (4) outside substrate (1) surface are fixedly connected with heat conducting coating (5), and heat conducting coating (5) surface is solid
Surely semiconductor chilling plate (6) is connected, substrate (1) surface sets pad (8), is fixedly connected on the outside of the pad (8)
Heat-absorbing shield (9), the semiconductor chilling plate (6) pass through wire (7) jointing soldering points (8).
A kind of 2. novel circuit board according to claim 1, it is characterised in that：The semiconductor chilling plate (6) and circuit
It is in parallel.
A kind of 3. novel circuit board according to claim 1, it is characterised in that：The heat-absorbing shield (9) passes through heat-conductive coating
With heat conducting coating (5) integrally connected.
A kind of 4. novel circuit board according to claim 1, it is characterised in that：The wire (7) runs through heat conducting coating (5)
And it is electrically connected with semiconductor chilling plate (6).
A kind of 5. novel circuit board according to claim 1, it is characterised in that：The pad (8) belongs to line layer
(3)。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720852587.8U CN206963175U (en) | 2017-07-14 | 2017-07-14 | A kind of novel circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720852587.8U CN206963175U (en) | 2017-07-14 | 2017-07-14 | A kind of novel circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206963175U true CN206963175U (en) | 2018-02-02 |
Family
ID=61384540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720852587.8U Active CN206963175U (en) | 2017-07-14 | 2017-07-14 | A kind of novel circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206963175U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112423465A (en) * | 2019-08-22 | 2021-02-26 | 聚鼎科技股份有限公司 | Heat-conducting substrate |
-
2017
- 2017-07-14 CN CN201720852587.8U patent/CN206963175U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112423465A (en) * | 2019-08-22 | 2021-02-26 | 聚鼎科技股份有限公司 | Heat-conducting substrate |
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| GR01 | Patent grant |