CN214774479U - High heat-resistant copper-clad plate - Google Patents
High heat-resistant copper-clad plate Download PDFInfo
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- CN214774479U CN214774479U CN202023169096.4U CN202023169096U CN214774479U CN 214774479 U CN214774479 U CN 214774479U CN 202023169096 U CN202023169096 U CN 202023169096U CN 214774479 U CN214774479 U CN 214774479U
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Abstract
The utility model discloses a high heat-resistant copper-clad plate, which belongs to the technical field of circuit boards, wherein a substrate is made of a copper plate, one surface of the substrate is coated with a first upper bonding layer, the first upper bonding layer is a high heat-conducting adhesive coating, the other surface of the first upper bonding layer is bonded with an insulating layer, the other surface of the insulating layer is coated with a second upper bonding layer, the other surface of the second upper bonding layer is bonded with a copper foil layer, the high heat-resistant copper-clad plate not only has good rigidity, but also has the insulating function and the high heat-conducting function, greatly improves the heat transfer efficiency of the copper foil layer, and the lower bonding layer and the heat-conducting metal layer which are arranged simultaneously also have excellent heat-conducting performance, thereby improving the heat transfer performance of plates and further improving the heat-resistant performance of the plates, and through the technological mode of press bonding, not only reduces the production difficulty, but also reduces the production cost.
Description
Technical Field
The utility model relates to a circuit board technical field, more specifically say, relate to a high heat-resisting copper-clad plate.
Background
The circuit board generally refers to a circuit board, which enables the circuit to be miniaturized and visualized and plays an important role in batch production of fixed circuits and optimization of electrical appliance layout.
At present, the existing circuit board is mostly copper clad laminate or aluminum clad laminate, because the material is softer, in transportation or use, lead to circuit board bending deformation or rupture easily to the insulating layer and the adhesive linkage heat transfer performance that current circuit board set up are relatively poor, make the thermal resistance increase, influence the heat transfer, and the heat conduction is slow moreover, and the heat degree constantly accumulates the increase, thereby leads to the heat to give off and does not go out, for this reason, we have designed a high heat-resisting copper clad laminate, solve above-mentioned problem.
SUMMERY OF THE UTILITY MODEL
To the problem that exists among the prior art, an object of the utility model is to provide a high heat-resisting copper-clad plate, this high heat-resisting copper-clad plate not only rigidity is good, and the first adhesive linkage of going up that sets up, the adhesive linkage not only has insulating function on insulating layer and the second, and has high heat conduction's function, great improvement the heat transfer efficiency of copper foil layer, the lower adhesive linkage and the heat conduction metal level that set up simultaneously also have good heat conductivility, thereby the heat transfer performance of panel has been improved, and then the heat resistance of panel has been improved, and the process method through the pressfitting bonding, not only the production degree of difficulty has been reduced, and the production cost is also reduced.
In order to solve the above problems, the utility model adopts the following technical proposal.
A high heat-resistant copper-clad plate comprises a substrate, wherein the substrate is made of a copper plate, a first upper bonding layer is coated on one surface of the substrate and is a high heat-conducting glue coating, an insulating layer is bonded on the other surface of the first upper bonding layer, a second upper bonding layer is coated on the other surface of the insulating layer, a copper foil layer is bonded on the other surface of the second upper bonding layer, the copper foil layer is a circuit copper foil plate, a lower bonding layer is bonded on the other surface of the substrate, a heat-conducting metal layer is bonded on the other surface of the lower bonding layer, a protective layer is bonded on the other surface of the heat-conducting metal layer, the high heat-resistant copper-clad plate is good in rigidity, the first upper bonding layer, the insulating layer and the second upper bonding layer have insulating functions and high heat-conducting functions, and the heat transfer efficiency of the copper foil layer is greatly improved, the lower bonding layer and the heat-conducting metal layer which are arranged simultaneously also have excellent heat-conducting performance, so that the heat transfer performance of the plate is improved, the heat-resisting performance of the plate is further improved, and the production difficulty and the production cost are reduced through a process mode of press bonding.
Furthermore, the material of the second upper bonding layer and the material of the lower bonding layer are the same as the material of the first upper bonding layer, so that the copper-clad plate has a high heat conduction function, and the heat conduction and heat dissipation efficiency of the copper-clad plate is improved.
Furthermore, the insulating layer is made of polyimide, and the insulating layer is bonded with the copper foil layer through pressing, so that the polyimide has excellent insulating and voltage breakdown resistance.
Furthermore, the heat-conducting metal layer is made of aluminum, the thickness of the heat-conducting metal layer is 0.02 mm, and the heat-conducting metal layer has excellent heat conductivity.
Furthermore, the protective layer is made of environment-friendly resin and is in a film shape, so that the bottom of the copper-clad plate can be protected, and the copper-clad plate can be conveniently stored and moved.
Compared with the prior art, the utility model has the advantages of:
(1) this scheme rigidity is not only good, the first adhesive linkage of going up that sets up in addition, the adhesive linkage not only has insulating function on insulating layer and the second, and the function that has high heat conduction has moreover, great improvement the heat transfer efficiency of copper foil layer, the lower adhesive linkage and the heat conduction metal level that set up simultaneously also have good heat conductivility, thereby the heat transfer performance of panel has been improved, and then the heat resistance of panel has been improved, and through the technological mode of pressfitting bonding, not only reduced the production degree of difficulty, also reduced manufacturing cost.
(2) The material of the second upper bonding layer and the material of the lower bonding layer are the same as the material of the first upper bonding layer, so that the copper-clad plate has a high heat conduction function, and the heat conduction and heat dissipation efficiency of the copper-clad plate is improved.
(3) The insulating layer is made of polyimide, and the polyimide is bonded with the copper foil layer through pressing, so that the polyimide has excellent insulating and voltage breakdown resistance.
(4) The heat conducting metal layer is made of aluminum, the thickness of the heat conducting metal layer is 0.02 mm, and the heat conducting metal layer has excellent heat conductivity.
(5) The protective layer is made of environment-friendly resin and is in a film shape, so that the bottom of the copper-clad plate can be protected, and the copper-clad plate can be conveniently stored and moved.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a side view of the overall structure of the present invention.
The reference numbers in the figures illustrate:
the heat-conducting and heat-insulating composite board comprises a base plate 1, a first upper adhesive layer 2, an insulating layer 3, a second upper adhesive layer 4, a copper foil layer 5, a lower adhesive layer 6, a heat-conducting metal layer 7 and a protective layer 8.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, a high heat-resistant copper clad laminate includes a substrate 1, referring to fig. 1-2, the substrate 1 is made of copper plate, one surface of the substrate 1 is coated with a first upper bonding layer 2, the first upper bonding layer 2 is a high heat-conducting glue coating, the other surface of the first upper bonding layer 2 is bonded with an insulating layer 3, the insulating layer 3 is made of polyimide and is bonded with a copper foil layer 5 through pressing, the polyimide has excellent insulation and voltage breakdown resistance, the other surface of the insulating layer 3 is coated with a second upper bonding layer 4, the materials of the second upper bonding layer 4 and the second lower bonding layer 6 are the same as those of the first upper bonding layer 2, the high heat-conducting function is provided, the heat-conducting and heat-dissipating efficiency of the copper clad laminate is improved, the other surface of the second upper bonding layer 4 is bonded with the copper foil layer 5, the copper foil layer 5 is a circuit copper foil plate and has a conductive function, another surface of base plate 1 bonds and has lower adhesive linkage 6, and another surface of lower adhesive linkage 6 bonds and has heat conduction metal level 7, and the material of heat conduction metal level 7 is aluminium, and thickness is 0.02 millimeter, has good heat conductivity, and another surface subsides of heat conduction metal level 7 have protective layer 8, and protective layer 8 adopts environmental protection resin to make, is the film form, can protect the bottom of copper-clad plate, the copper-clad plate of being convenient for deposit the removal.
When the high heat-resistant copper-clad plate is produced, a first upper bonding layer 2 and a second upper bonding layer 4 are respectively coated on one surface of a substrate 1 and one surface of an insulating layer 3, then the insulating layer 3 and the substrate 1 are bonded through pressing, a copper foil layer 5 and the insulating layer 3 are bonded, a lower bonding layer 6 is coated on one surface of a heat-conducting metal layer 7, then the lower bonding layer is bonded with the other surface of the substrate 1 through pressing, and a protective layer 8 is attached to the other surface of the heat-conducting metal layer 7, so that the high heat-resistant copper-clad plate has good rigidity, the arranged first upper bonding layer 2, the arranged insulating layer 3 and the second upper bonding layer 4 have insulating functions and high heat-conducting functions, the heat transfer efficiency of the copper foil layer 5 is greatly improved, and the arranged lower bonding layer 6 and the arranged heat-conducting metal layer 7 also have excellent heat-conducting performance, thereby improving the heat transfer performance of a circuit board, and the heat resistance of the plate is improved, and the production difficulty and the production cost are reduced through a pressing and bonding process mode.
The above description is only the preferred embodiment of the present invention; the scope of the present invention is not limited thereto. Any person skilled in the art should also be able to cover the technical scope of the present invention by replacing or changing the technical solution and the improvement concept of the present invention with equivalents and modifications within the technical scope of the present invention.
Claims (5)
1. The high-heat-resistance copper-clad plate comprises a substrate (1) and is characterized in that: the utility model discloses a circuit copper foil board, including base plate (1), bonding layer (2) on the first surface of base plate (1) has been paintd, and bonding layer (2) are high heat conduction glue coating on the first, another surface bonding of bonding layer (2) has insulating layer (3) on the first, bonding layer (4) on the second has been paintd on another surface of insulating layer (3), another surface bonding of bonding layer (4) has copper foil layer (5) on the second, copper foil layer (5) are circuit copper foil board, another surface bonding of base plate (1) has lower bonding layer (6), another surface bonding of bonding layer (6) has heat conduction metal level (7) down, another surface bonding of heat conduction metal level (7) has protective layer (8).
2. The high heat-resistant copper-clad plate according to claim 1, characterized in that: the material of the second upper bonding layer (4) and the material of the lower bonding layer (6) are the same as the material of the first upper bonding layer (2).
3. The high heat-resistant copper-clad plate according to claim 1, characterized in that: the insulating layer (3) is made of polyimide and is bonded with the copper foil layer (5) through pressing.
4. The high heat-resistant copper-clad plate according to claim 1, characterized in that: the heat-conducting metal layer (7) is made of aluminum and is 0.02 mm thick.
5. The high heat-resistant copper-clad plate according to claim 1, characterized in that: the protective layer (8) is made of environment-friendly resin and is in a film shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023169096.4U CN214774479U (en) | 2020-12-25 | 2020-12-25 | High heat-resistant copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023169096.4U CN214774479U (en) | 2020-12-25 | 2020-12-25 | High heat-resistant copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214774479U true CN214774479U (en) | 2021-11-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023169096.4U Active CN214774479U (en) | 2020-12-25 | 2020-12-25 | High heat-resistant copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214774479U (en) |
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2020
- 2020-12-25 CN CN202023169096.4U patent/CN214774479U/en active Active
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