CN209748896U - Low thermal resistance aluminum base plate structure - Google Patents
Low thermal resistance aluminum base plate structure Download PDFInfo
- Publication number
- CN209748896U CN209748896U CN201920092748.7U CN201920092748U CN209748896U CN 209748896 U CN209748896 U CN 209748896U CN 201920092748 U CN201920092748 U CN 201920092748U CN 209748896 U CN209748896 U CN 209748896U
- Authority
- CN
- China
- Prior art keywords
- layer
- epoxy glue
- thermal resistance
- glue layer
- low thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The utility model discloses a low thermal resistance aluminum base plate structure, which relates to the technical field of printed circuit board production and comprises a composite insulating layer, wherein the composite insulating layer comprises a first epoxy glue layer, a film material layer and a second epoxy glue layer; the film material layer is arranged between the first epoxy glue layer and the second epoxy glue layer. A copper foil is arranged on the upper surface of the first epoxy adhesive layer; an aluminum plate is arranged on the lower surface of the second epoxy glue layer; by adopting the composite insulating layer of the polyimide film and the epoxy glue layer, the high temperature resistance and the insulativity of the polyimide film are fully utilized, the comprehensive thermal resistance of the insulating layer is reduced, the high heat dissipation characteristic of the aluminum substrate is ensured, and the aluminum substrate has excellent machinability and space bending characteristic.
Description
Technical Field
The utility model relates to a printed circuit board production technical field, concretely relates to low thermal resistance aluminum base plate structure.
Background
During the processing of the aluminum substrate, certain stress damage can be caused to the insulating layer, microcracks are generated if the stress damage is light, chips of the insulating layer are dropped if the stress damage is heavy, and the mechanical processability and the spatial bending property of the aluminum substrate are weakened when the reliability of the insulating layer is enhanced; how to make an aluminum substrate have low thermal resistance and high insulation characteristics and have both excellent machinability and space bending characteristics becomes a technical problem.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problem, the utility model provides a low thermal resistance aluminum base plate structure, composite insulation layer through adopting polyimide film and epoxy glue film, the high temperature resistance of the characteristic and the insulating nature of make full use of polyimide film reduce the comprehensive thermal resistance of insulating layer, also have good machinability when guaranteeing that aluminum base plate has high heat radiation characteristic.
The utility model provides a low thermal resistance aluminum substrate structure, which comprises a composite insulating layer;
the composite insulating layer comprises a first epoxy glue layer, a film material layer and a second epoxy glue layer;
The film material layer is arranged between the first epoxy glue layer and the second epoxy glue layer.
As an improvement of the utility model, the total thickness of the composite insulating layer is 45-50 μm.
As an improvement of the utility model, the upper surface of the first epoxy glue layer is provided with a copper foil.
as an improvement of the utility model, the lower surface of the second epoxy glue layer is provided with an aluminum plate.
as an improvement of the present invention, the film material layer is a polyimide film material layer.
as an improvement of the present invention, the first epoxy adhesive layer is an epoxy resin material layer.
the utility model has the advantages that: the insulating layer of the composite layer is adopted, so that the thickness of the insulating layer is thinner, the high insulativity of the aluminum substrate is ensured, the comprehensive thermal resistance of the insulating layer is reduced, and the heat dissipation performance of the aluminum substrate is higher; and also has excellent machinability of the aluminum substrate.
Drawings
Fig. 1 is a schematic view of a low thermal resistance aluminum substrate structure of the present invention;
The attached drawings are marked as follows: 1-a composite insulating layer; 11-a first epoxy glue layer; 12-a layer of film material; 13-second epoxy glue layer; 2-copper foil; 3-aluminum plate.
Detailed Description
the technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
As shown in fig. 1, an embodiment of the present invention discloses a low thermal resistance aluminum substrate structure, which includes a composite insulating layer 1, wherein the composite insulating layer 1 includes a first epoxy glue layer 11, a thin film material layer 12, and a second epoxy glue layer 13; the film material layer 12 is disposed between the first epoxy glue layer 11 and the second epoxy glue layer 13. The composite insulating layer which is formed by matching the polyimide film and the epoxy glue layer is adopted, so that the comprehensive thermal resistance of the insulating layer is realized, and the heat dissipation performance of the aluminum substrate is higher.
in the present embodiment, the total thickness of the composite insulating layer 1 is 45 μm to 50 μm. The aluminum substrate has a higher degree of withstand voltage.
In this embodiment, the upper surface of the first epoxy glue layer 11 is provided with a copper foil 2. The adhesive is used for mounting electronic power devices.
In the present embodiment, the lower surface of the second epoxy glue layer 13 is provided with the aluminum plate 3. Supporting the aluminum substrate and having high thermal conductivity.
In the present embodiment, the film material layer 12 is a polyimide film material layer. The aluminum substrate has good machinability and space bending property.
In this embodiment, the first epoxy glue layer 11 and the second epoxy glue layer 13 are epoxy resin material layers. The thermal resistance of the insulating layer is reduced.
Finally, only the specific embodiments of the present invention have been described in detail. The invention is not limited to the specific embodiments described above. Equivalent modifications and substitutions by those skilled in the art to the present invention are also within the scope of the present invention. Accordingly, variations and modifications in equivalents may be made without departing from the spirit and scope of the invention, which is intended to be covered by the following claims.
Claims (6)
1. The utility model provides a low thermal resistance aluminium base board structure, includes composite insulation layer (1), its characterized in that:
The composite insulating layer (1) comprises a first epoxy glue layer (11), a film material layer (12) and a second epoxy glue layer (13);
The film material layer (12) is arranged between the first epoxy glue layer (11) and the second epoxy glue layer (13).
2. A low thermal resistance aluminum substrate structure according to claim 1, wherein:
The total thickness of the composite insulating layer (1) is 45-50 μm.
3. A low thermal resistance aluminum substrate structure according to claim 1, wherein:
and a copper foil (2) is arranged on the upper surface of the first epoxy glue layer (11).
4. A low thermal resistance aluminum substrate structure according to claim 1, wherein:
And an aluminum plate (3) is arranged on the lower surface of the second epoxy glue layer (13).
5. a low thermal resistance aluminum substrate structure according to claim 1, wherein:
The film material layer (12) is a polyimide film material layer.
6. A low thermal resistance aluminum substrate structure according to claim 1, wherein:
The first epoxy glue layer (11) and the second epoxy glue layer (13) are epoxy resin material layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920092748.7U CN209748896U (en) | 2019-01-21 | 2019-01-21 | Low thermal resistance aluminum base plate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920092748.7U CN209748896U (en) | 2019-01-21 | 2019-01-21 | Low thermal resistance aluminum base plate structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209748896U true CN209748896U (en) | 2019-12-06 |
Family
ID=68706036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920092748.7U Active CN209748896U (en) | 2019-01-21 | 2019-01-21 | Low thermal resistance aluminum base plate structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209748896U (en) |
-
2019
- 2019-01-21 CN CN201920092748.7U patent/CN209748896U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5218657B2 (en) | Optical module | |
| WO2012165045A1 (en) | Semiconductor device and wiring substrate | |
| CN104135816B (en) | Aluminum-based copper-clad plate and preparation method thereof, circuit electronic circuit board | |
| JP2018133527A (en) | Semiconductor device and semiconductor device manufacturing method | |
| JP2014135389A (en) | Flexible printed wiring board using metal base material film and non-contact ic card using flexible printed wiring board | |
| JP2008192787A (en) | Heat conduction board, circuit module using the same and its manufacturing method | |
| JP2009010213A (en) | Hybrid integrated circuit device | |
| CN209748896U (en) | Low thermal resistance aluminum base plate structure | |
| CN209488908U (en) | A kind of double-sided wiring board with waterproof cooling function | |
| JP5087048B2 (en) | Circuit board with integrated heat dissipation components | |
| TWI702887B (en) | Flexible circuit board structure | |
| JP2010003718A (en) | Heat-dissipating substrate and its manufacturing method, and module using heat-dissipating substrate | |
| JP4998183B2 (en) | Electronic equipment | |
| CN101908528A (en) | Electronic packaging structure and substrate thereof | |
| CN214774479U (en) | High heat-resistant copper-clad plate | |
| JP2008235321A (en) | Heat conductive substrate and manufacturing method, and circuit module using the same | |
| CN220692000U (en) | Power chip packaging loading board | |
| CN111354692A (en) | Power heat dissipation device | |
| JP2008172128A (en) | Circuit module and its manufacturing method | |
| CN205124123U (en) | Copper -clad plate of high heat conduction copper of high proof voltage base | |
| CN217389106U (en) | Ceramic substrate with high thermal conductivity | |
| CN216292005U (en) | High-efficient heat dissipation type graphite flake | |
| CN214228544U (en) | Copper-based heat dissipation circuit board | |
| CN217088245U (en) | Heat radiation substrate | |
| CN210745654U (en) | Heat-conducting copper-clad laminate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |