TWI702887B - Flexible circuit board structure - Google Patents

Flexible circuit board structure Download PDF

Info

Publication number
TWI702887B
TWI702887B TW106142520A TW106142520A TWI702887B TW I702887 B TWI702887 B TW I702887B TW 106142520 A TW106142520 A TW 106142520A TW 106142520 A TW106142520 A TW 106142520A TW I702887 B TWI702887 B TW I702887B
Authority
TW
Taiwan
Prior art keywords
metal foil
patterned metal
foil layer
circuit board
board structure
Prior art date
Application number
TW106142520A
Other languages
Chinese (zh)
Other versions
TW201927084A (en
Inventor
劉逸群
陳穎星
李遠智
曾山一
Original Assignee
同泰電子科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 同泰電子科技股份有限公司 filed Critical 同泰電子科技股份有限公司
Priority to TW106142520A priority Critical patent/TWI702887B/en
Priority to CN202310889072.5A priority patent/CN116669286A/en
Priority to CN201711426326.0A priority patent/CN109874223A/en
Priority to CN201721838115.3U priority patent/CN208094874U/en
Publication of TW201927084A publication Critical patent/TW201927084A/en
Application granted granted Critical
Publication of TWI702887B publication Critical patent/TWI702887B/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details

Abstract

A circuit board structure is configured to carry a heat-generating component and includes a flexible substrate and at least one heat-conducting through hole. The flexible substrate includes an insulating layer, a first metal foil and a second metal foil. The first metal foil and the second metal foil are disposed on two opposite surfaces of the insulating layer respectively. The heat-generating component is configured to be disposed on the first metal foil. A thickness of the second metal foil is greater than a thickness of the first metal foil. The heat-conducting through hole penetrate through the flexible substrate and is thermally coupled to the heat-generating component.

Description

軟性線路板結構 Flexible circuit board structure

本發明是有關於一種線路板結構，且特別是有關於一種軟性線路板結構。 The present invention relates to a circuit board structure, and in particular to a flexible circuit board structure.

現今之資訊社會下，人類對電子產品之依賴性與日俱增。為了因應現今電子產品高速度、高效能、且輕薄短小的要求，具有撓曲特性之可撓性線路板已逐漸應用於各種電子裝置中，例如筆記型電腦(Notebook PC)、行動電話(Cell Phone)、數位相機(digital camera)、個人數位助理器(Personal Digital Assistant,PDA)、印表機(printer)與光碟機(optical disk drive)等。值得注意的是，軟性線路板不僅可作為電性連接之用，更可用於承載晶片或其他電子元件，其應用層面相當廣泛。 In today's information society, mankind's dependence on electronic products is increasing day by day. In order to meet the high-speed, high-efficiency, thin and short requirements of today's electronic products, flexible circuit boards with flex characteristics have gradually been used in various electronic devices, such as notebook PCs and cell phones. ), digital camera, personal digital assistant (PDA), printer and optical disk drive, etc. It is worth noting that the flexible circuit board can be used not only for electrical connection, but also for carrying chips or other electronic components, and its application level is quite extensive.

一般而言，晶片等電子元件通常配設於軟性電路板上，且電子元件係與軟性電路板之連接墊連接。由於電子元件運作所產生熱能，造成軟性電路板與電子元件之溫度升高，因此連接墊與電子元件之連接處容易因為高溫，而產生劣化，進而造成電子元件失效。此外，配設於此軟性電路板之其他電子元件，也會因為軟性電 路板之溫度升高，而造成其他電子元件本身之效能下降。 Generally speaking, electronic components such as chips are usually arranged on a flexible circuit board, and the electronic components are connected to the connection pads of the flexible circuit board. Due to the heat generated by the operation of the electronic components, the temperature of the flexible circuit board and the electronic components rises. Therefore, the connection between the connection pad and the electronic component is prone to deterioration due to high temperature, which will cause the electronic component to fail. In addition, other electronic components installed on this flexible circuit board will also be The temperature of the circuit board increases, which causes the performance of other electronic components to decrease.

本發明提供一種軟性線路板結構，其具有良好的散熱效率。 The present invention provides a flexible circuit board structure, which has good heat dissipation efficiency.

本發明的軟性線路板結構適於承載一發熱元件並包括一軟性基板以及至少一導熱貫孔。軟性基板包括一絕緣層、一第一圖案化金屬箔層以及一第二圖案化金屬箔層，其中第一圖案化金屬箔層以及第二圖案化金屬箔層分別設置於絕緣層的相對兩表面。發熱元件適於設置於第一圖案化金屬箔層，且第二圖案化金屬箔層的一厚度大於第一圖案化金屬箔層的一厚度。導熱貫孔貫穿軟性基板，並與發熱元件熱耦接。 The flexible circuit board structure of the present invention is suitable for carrying a heating element and includes a flexible substrate and at least one heat conducting through hole. The flexible substrate includes an insulating layer, a first patterned metal foil layer, and a second patterned metal foil layer, wherein the first patterned metal foil layer and the second patterned metal foil layer are respectively disposed on two opposite surfaces of the insulating layer . The heating element is suitable for being arranged on the first patterned metal foil layer, and a thickness of the second patterned metal foil layer is greater than a thickness of the first patterned metal foil layer. The heat conducting through hole penetrates the flexible substrate and is thermally coupled with the heating element.

在本發明的一實施例中，上述的軟性線路板結構更包括一圖案化金屬層，覆蓋於第一圖案化金屬箔層以及第二圖案化金屬箔層上，並至少覆蓋至少一導熱貫孔的內壁。 In an embodiment of the present invention, the above-mentioned flexible circuit board structure further includes a patterned metal layer covering the first patterned metal foil layer and the second patterned metal foil layer, and at least covering at least one thermally conductive through hole The inner wall.

在本發明的一實施例中，上述的圖案化金屬層填滿至少一導熱貫孔。 In an embodiment of the present invention, the patterned metal layer described above fills at least one thermally conductive through hole.

在本發明的一實施例中，上述的至少一導熱貫孔的直徑實質上介於20微米(μm)至50微米之間。 In an embodiment of the present invention, the diameter of the aforementioned at least one thermally conductive through hole is substantially between 20 micrometers ( μm ) and 50 micrometers.

在本發明的一實施例中，上述的軟性線路板結構更包括一散熱片，設置於第二圖案化金屬箔層上。 In an embodiment of the present invention, the above-mentioned flexible circuit board structure further includes a heat sink disposed on the second patterned metal foil layer.

在本發明的一實施例中，上述的散熱片包括石墨片或鋁 片。 In an embodiment of the present invention, the aforementioned heat sink includes graphite sheet or aluminum sheet.

在本發明的一實施例中，上述的第一圖案化金屬箔層以及第二圖案化金屬箔層的材料包括銅。 In an embodiment of the present invention, the material of the first patterned metal foil layer and the second patterned metal foil layer includes copper.

在本發明的一實施例中，上述的發熱元件設置於軟性基板的一元件設置區並與第一圖案化金屬箔層熱耦接，至少一導熱貫孔設置於元件設置區的外圍。 In an embodiment of the present invention, the above-mentioned heating element is arranged in an element arrangement area of the flexible substrate and thermally coupled to the first patterned metal foil layer, and at least one heat conducting through hole is arranged at the periphery of the element arrangement area.

在本發明的一實施例中，上述的發熱元件設置於軟性基板的一元件設置區並與第一圖案化金屬箔層熱耦接，至少一導熱貫孔設置於元件設置區內並與發熱元件連接。 In an embodiment of the present invention, the above-mentioned heating element is arranged in an element arrangement area of the flexible substrate and thermally coupled to the first patterned metal foil layer, and at least one heat conducting through hole is arranged in the element arrangement area and is connected to the heating element connection.

在本發明的一實施例中，上述的第一圖案化金屬箔層包括彼此電性絕緣的一線路部以及一散熱部，發熱元件電性連接線路部並熱耦接散熱部。 In an embodiment of the present invention, the aforementioned first patterned metal foil layer includes a circuit portion and a heat dissipation portion electrically insulated from each other, and the heating element is electrically connected to the circuit portion and thermally coupled to the heat dissipation portion.

基於上述，本發明實施例的軟性線路板結構包括軟性基板以及導熱貫孔。軟性基板的第一圖案化金屬箔層以及第二圖案化金屬箔層分別設置於絕緣層的相對兩表面，且第二圖案化金屬箔層的厚度大於第一圖案化金屬箔層的厚度。導熱貫孔貫穿軟性基板並熱耦接設置於第一圖案化金屬箔層上的發熱元件。如此配置，發熱元件運作時所產生的熱可經由與之熱耦接的導熱貫孔而傳導至第二圖案化金屬箔層，並且，第二圖案化金屬箔層的厚度較厚，可有效增進熱傳導及散熱的效率，進而可將熱迅速地散逸至外界。因此，本發明實施例可有效提升軟性線路板結構的散熱效率。 Based on the above, the flexible circuit board structure of the embodiment of the present invention includes a flexible substrate and a thermally conductive through hole. The first patterned metal foil layer and the second patterned metal foil layer of the flexible substrate are respectively disposed on two opposite surfaces of the insulating layer, and the thickness of the second patterned metal foil layer is greater than the thickness of the first patterned metal foil layer. The thermally conductive through hole penetrates the flexible substrate and is thermally coupled to the heating element disposed on the first patterned metal foil layer. With this configuration, the heat generated during the operation of the heating element can be conducted to the second patterned metal foil layer through the thermally-coupled thermally conductive through holes, and the thickness of the second patterned metal foil layer is thicker, which can effectively increase The efficiency of heat conduction and heat dissipation can quickly dissipate heat to the outside world. Therefore, the embodiments of the present invention can effectively improve the heat dissipation efficiency of the flexible circuit board structure.

為讓本發明的上述特徵和優點能更明顯易懂，下文特舉 實施例，並配合所附圖式作詳細說明如下。 In order to make the above-mentioned features and advantages of the present invention more obvious and understandable, the following special The embodiments and the accompanying drawings are described in detail as follows.

100:軟性線路板結構 100: Flexible circuit board structure

110、110a:軟性基板 110, 110a: Flexible substrate

112:絕緣層 112: insulating layer

114:第一圖案化金屬箔層 114: The first patterned metal foil layer

114a:線路部 114a: Line Department

114b:散熱部 114b: Heat sink

116:第二圖案化金屬箔層 116: second patterned metal foil layer

116a:線路部 116a: Line Department

116b:散熱部 116b: Heat sink

113:第一金屬箔層 113: The first metal foil layer

115:第二金屬箔層 115: second metal foil layer

120a:貫孔 120a: Through hole

120:導熱貫孔 120: Thermal through hole

122:導電通孔 122: conductive via

130:圖案化金屬層 130: patterned metal layer

130a:金屬層 130a: Metal layer

140:散熱片 140: heat sink

200:發熱元件 200: heating element

A1:元件設置區 A1: Component setting area

D1、D2:厚度 D1, D2: thickness

圖1至圖4是依照本發明的一實施例的一種軟性線路板結構的製作流程剖面示意圖。 1 to 4 are schematic cross-sectional views of a manufacturing process of a flexible circuit board structure according to an embodiment of the present invention.

圖5是依照本發明的一實施例的一種軟性線路板結構的剖面示意圖。 5 is a schematic cross-sectional view of a flexible circuit board structure according to an embodiment of the invention.

圖6是依照本發明的一實施例的一種軟性線路板結構的剖面示意圖。 6 is a schematic cross-sectional view of a flexible circuit board structure according to an embodiment of the invention.

有關本發明之前述及其他技術內容、特點與功效，在以下配合參考圖式之各實施例的詳細說明中，將可清楚的呈現。以下實施例中所提到的方向用語，例如：「上」、「下」、「前」、「後」、「左」、「右」等，僅是參考附加圖式的方向。因此，使用的方向用語是用來說明，而並非用來限制本發明。並且，在下列各實施例中，相同或相似的元件將採用相同或相似的標號。 The foregoing and other technical content, features and effects of the present invention will be clearly presented in the detailed description of each embodiment with reference to the drawings. The directional terms mentioned in the following embodiments, for example: "up", "down", "front", "rear", "left", "right", etc., are just directions for referring to the attached drawings. Therefore, the directional terms used are used to illustrate, but not to limit the present invention. In addition, in the following embodiments, the same or similar elements will use the same or similar reference numerals.

圖1至圖4是依照本發明的一實施例的一種軟性線路板結構的製作流程剖面示意圖。在本實施例中，軟性線路板結構100適於承載一發熱元件200，並可對此發熱元件200進行散熱。本實施例的軟性線路板結構100的製作流程包括下列步驟。請先參照 圖1，提供如圖1的一軟性基板110a，其包括一絕緣層112以及一第一金屬箔層113以及一第二金屬箔層115。在本實施例中，第一金屬箔層113以及第二金屬箔層115如圖1所示之分別設置於絕緣層112的相對兩表面。第二金屬箔層115的厚度D2大於第一金屬箔層113的厚度D1。在本實施例中，第一金屬箔層113以及第二金屬箔層115的材料包括銅，也就是說，第一金屬箔層113以及第二金屬箔層115可為厚度不同的兩銅箔層，其分別壓合於絕緣層112的相對兩表面。 1 to 4 are schematic cross-sectional views of a manufacturing process of a flexible circuit board structure according to an embodiment of the present invention. In this embodiment, the flexible circuit board structure 100 is suitable for carrying a heating element 200 and can dissipate heat from the heating element 200. The manufacturing process of the flexible circuit board structure 100 of this embodiment includes the following steps. Please refer first FIG. 1 provides a flexible substrate 110 a as shown in FIG. 1, which includes an insulating layer 112, a first metal foil layer 113 and a second metal foil layer 115. In this embodiment, the first metal foil layer 113 and the second metal foil layer 115 are respectively disposed on two opposite surfaces of the insulating layer 112 as shown in FIG. 1. The thickness D2 of the second metal foil layer 115 is greater than the thickness D1 of the first metal foil layer 113. In this embodiment, the material of the first metal foil layer 113 and the second metal foil layer 115 includes copper, that is, the first metal foil layer 113 and the second metal foil layer 115 can be two copper foil layers with different thicknesses. , Which are respectively pressed on two opposite surfaces of the insulating layer 112.

請參照圖2，形成貫孔120a於軟性基板110a上，其中，貫孔120a貫穿軟性基板110a。在本實施例中，貫孔120a的形成方式可包括雷射或是機械鑽孔等。在本實施例中，貫孔120a的直徑約可介於20微米(μm)至50微米之間。當然，本實施例僅用以舉例說明，本發明並不限制形成貫孔120a的直徑及其形成方法。 Referring to FIG. 2, a through hole 120a is formed on the flexible substrate 110a, wherein the through hole 120a penetrates the flexible substrate 110a. In this embodiment, the formation method of the through hole 120a may include laser or mechanical drilling. In this embodiment, the diameter of the through hole 120a may be approximately between 20 microns ( μm ) and 50 microns. Of course, this embodiment is only for illustration, and the present invention does not limit the diameter of the through hole 120a and the method of forming it.

接著，請參照圖3，形成一金屬層130a，其覆蓋於第一金屬箔層113以及第二金屬箔層115上，並至少覆蓋貫孔120a的內壁，以形成導熱貫孔120。在本實施例中，導熱貫孔120的直徑約可介於20微米(μm)至50微米之間，而金屬層130a可例如透過電鍍的方式而形成，以全面性覆蓋第一金屬箔層113以及第二金屬箔層115上並可填滿貫孔120a。在其他實施例中，若貫孔120a的直徑較大(例如貫孔120a的直徑大於50微米)，金屬層130a亦可僅覆蓋貫孔120a的內壁，之後再以填孔材料填滿貫孔120a。 Next, referring to FIG. 3, a metal layer 130 a is formed, which covers the first metal foil layer 113 and the second metal foil layer 115 and at least covers the inner wall of the through hole 120 a to form the thermally conductive through hole 120. In this embodiment, the diameter of the thermally conductive through hole 120 can be approximately between 20 micrometers ( μm ) and 50 micrometers, and the metal layer 130a can be formed, for example, by electroplating to cover the first metal foil layer completely. 113 and the second metal foil layer 115 can fill the through hole 120a. In other embodiments, if the diameter of the through hole 120a is larger (for example, the diameter of the through hole 120a is greater than 50 microns), the metal layer 130a may only cover the inner wall of the through hole 120a, and then fill the through hole with a filling material 120a.

請參照圖4，接著，對第一金屬箔層113以及第二金屬箔 層115以及覆蓋第一金屬箔層113以及第二金屬箔層115的金屬層130a進行一圖案化製程，以形成如圖4所示之第一圖案化金屬箔層114、第二圖案化金屬箔層116以及覆蓋第一圖案化金屬箔層114及第二圖案化金屬箔層116的圖案化金屬層130。如此，本實施例的軟性線路板結構100即可大致完成。 Please refer to Figure 4, then, the first metal foil layer 113 and the second metal foil The layer 115 and the metal layer 130a covering the first metal foil layer 113 and the second metal foil layer 115 undergo a patterning process to form the first patterned metal foil layer 114 and the second patterned metal foil as shown in FIG. 4 The layer 116 and the patterned metal layer 130 covering the first patterned metal foil layer 114 and the second patterned metal foil layer 116. In this way, the flexible circuit board structure 100 of this embodiment can be substantially completed.

就結構上而言，本實施例的軟性線路板結構100包括軟性基板110以及至少一導熱貫孔120。軟性基板110包括絕緣層112、第一圖案化金屬箔層114、第二圖案化金屬箔層116以及圖案化金屬層130，其中，第一圖案化金屬箔層114以及第二圖案化金屬箔層116分別設置於絕緣層112的相對兩表面，且第二圖案化金屬箔層116的厚度D2大於第一圖案化金屬箔層114的厚度D1。圖案化金屬層130覆蓋於第一圖案化金屬箔層114以及第二圖案化金屬箔層116上，並至少覆蓋導熱貫孔120的內壁。如此，發熱元件200可如圖4所示之設置於第一圖案化金屬箔層114上，且導熱貫孔120貫穿軟性基板110，並與發熱元件200熱耦接。如此配置，發熱元件200運作時所產生的熱可經由與之熱耦接的導熱貫孔120而傳導至第二圖案化金屬箔層116，並且，第二圖案化金屬箔層116的厚度D2較厚，可有效增進熱傳導及散熱的效率。 In terms of structure, the flexible circuit board structure 100 of this embodiment includes a flexible substrate 110 and at least one thermally conductive through hole 120. The flexible substrate 110 includes an insulating layer 112, a first patterned metal foil layer 114, a second patterned metal foil layer 116, and a patterned metal layer 130, wherein the first patterned metal foil layer 114 and the second patterned metal foil layer 116 are respectively disposed on two opposite surfaces of the insulating layer 112, and the thickness D2 of the second patterned metal foil layer 116 is greater than the thickness D1 of the first patterned metal foil layer 114. The patterned metal layer 130 covers the first patterned metal foil layer 114 and the second patterned metal foil layer 116 and at least covers the inner wall of the thermally conductive through hole 120. In this way, the heating element 200 can be disposed on the first patterned metal foil layer 114 as shown in FIG. 4, and the heat conducting through hole 120 penetrates the flexible substrate 110 and is thermally coupled to the heating element 200. With this configuration, the heat generated during the operation of the heating element 200 can be conducted to the second patterned metal foil layer 116 through the thermally-coupled thermally conductive through holes 120, and the thickness D2 of the second patterned metal foil layer 116 is smaller than Thickness can effectively improve the efficiency of heat conduction and heat dissipation.

在本實施例中，發熱元件200可如圖4所示之設置於軟性基板100的元件設置區A1上，並與圖案化金屬層130以及第一圖案化金屬箔層114熱耦接。本實施例中，導熱貫孔120可設置於元件設置區A1以外。並且，導熱貫孔120的數量可為多個，在 這樣的配置下，導熱貫孔120可環繞元件設置區A1設置，並經由第一圖案化金屬箔層114而與發熱元件200熱耦接。也就是說，導熱貫孔120的設置位置可不與元件設置區A1重疊。在本實施例中，發熱元件200可例如透過覆晶接合的方式設置於軟性線路板結構100上，並與圖案化金屬層130以及第一圖案化金屬箔層114熱耦接。當然，本發明並不以此為限，在其他實施例中，發熱元件200也可例如透過打線接合的方式設置於軟性線路板結構100上。 In this embodiment, the heating element 200 can be disposed on the element disposing area A1 of the flexible substrate 100 as shown in FIG. 4, and thermally coupled to the patterned metal layer 130 and the first patterned metal foil layer 114. In this embodiment, the thermally conductive through hole 120 may be disposed outside the element installation area A1. In addition, the number of thermally conductive through holes 120 can be multiple. In this configuration, the thermally conductive through hole 120 can be arranged around the device placement area A1 and thermally coupled to the heating element 200 via the first patterned metal foil layer 114. In other words, the arrangement position of the thermally conductive through hole 120 may not overlap with the element arrangement area A1. In this embodiment, the heating element 200 can be disposed on the flexible circuit board structure 100 by flip chip bonding, and is thermally coupled to the patterned metal layer 130 and the first patterned metal foil layer 114. Of course, the present invention is not limited to this. In other embodiments, the heating element 200 may also be disposed on the flexible circuit board structure 100 by wire bonding.

在本實施例中，第一圖案化金屬箔層114可包括彼此電性絕緣的一線路部114a以及一散熱部114b，發熱元件200電性連接線路部114a並熱耦接散熱部114b，且導熱貫孔120連接散熱部114b。舉例而言，發熱元件200可包括多個接墊，其分別連接至線路部114a及散熱部114b，導熱貫孔120連接散熱部114b，如此配置，發熱元件200所產生的熱可經由散熱部114b以及與之連接的導熱貫孔120而傳導至第二圖案化金屬箔層116。對應地，第二圖案化金屬箔層116也可包括彼此電性絕緣的一線路部116a以及一散熱部116b，導熱貫孔120連接散熱部116b，以將熱傳導至第二圖案化金屬箔層116的散熱部116b而進行散熱。在本實施例中，軟性線路板結構100可包括多個通孔，其中，連接至散熱部114b及/或散熱部116b的通孔即為用以散熱的導熱貫孔120，而連接至線路部114a及/或線路部116a的通孔則為用以電性連接的導電通孔122。 In this embodiment, the first patterned metal foil layer 114 may include a circuit portion 114a and a heat dissipation portion 114b that are electrically insulated from each other. The heating element 200 is electrically connected to the circuit portion 114a and thermally coupled to the heat dissipation portion 114b, and conducts heat. The through hole 120 is connected to the heat dissipation portion 114b. For example, the heating element 200 may include a plurality of pads respectively connected to the circuit portion 114a and the heat dissipation portion 114b, and the heat conduction through hole 120 is connected to the heat dissipation portion 114b. With this configuration, the heat generated by the heating element 200 can pass through the heat dissipation portion 114b And the heat conducting through hole 120 connected therewith is conducted to the second patterned metal foil layer 116. Correspondingly, the second patterned metal foil layer 116 may also include a circuit portion 116a and a heat dissipation portion 116b that are electrically insulated from each other, and the heat conducting through hole 120 is connected to the heat dissipation portion 116b to conduct heat to the second patterned metal foil layer 116 The heat dissipating portion 116b is used to dissipate heat. In this embodiment, the flexible circuit board structure 100 may include a plurality of through holes. Among them, the through holes connected to the heat dissipation portion 114b and/or the heat dissipation portion 116b are the heat conduction through holes 120 for heat dissipation, and are connected to the circuit portion The through holes 114a and/or the circuit portion 116a are conductive through holes 122 for electrical connection.

圖5是依照本發明的一實施例的一種軟性線路板結構的 剖面示意圖。在此必須說明的是，本實施例的軟性線路板結構100與圖4的軟性線路板結構100相似，因此，本實施例沿用前述實施例的元件標號與部分內容，其中採用相同的標號來表示相同或近似的元件，並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例，本實施例不再重複贅述。請參照圖5，以下將針對本實施例的軟性線路板結構100與圖4之軟性線路板結構100的差異做說明。 Figure 5 is a structure of a flexible circuit board according to an embodiment of the present invention Schematic cross-section. It must be noted here that the flexible circuit board structure 100 of this embodiment is similar to the flexible circuit board structure 100 of FIG. 4, therefore, this embodiment uses the component numbers and part of the content of the previous embodiment, and the same reference numbers are used to indicate The same or similar elements, and the description of the same technical content is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiment, and the details are not repeated in this embodiment. Please refer to FIG. 5, the following will describe the difference between the flexible circuit board structure 100 of this embodiment and the flexible circuit board structure 100 of FIG. 4.

在本實施例中，發熱元件200可設置於軟性基板110的元件設置區A1並與第一圖案化金屬箔層114熱耦接，並且，本實施例的導熱貫孔120設置於此元件設置區A1內並與發熱元件200連接。換句話說，導熱貫孔120的設置位置可與元件設置區A1重疊而使導熱貫孔120位於發熱元件200的下方。並且，在本實施例中，發熱元件200的電性接墊可直接連接導熱貫孔120，以使導熱貫孔120運作時所產生的熱能直接經由導熱貫孔120傳導至厚度較厚的第二圖案化金屬箔層116並進行散熱。 In this embodiment, the heating element 200 can be arranged in the element arrangement area A1 of the flexible substrate 110 and thermally coupled to the first patterned metal foil layer 114, and the heat conducting through hole 120 of this embodiment is arranged in this element arrangement area Inside A1 and connected with the heating element 200. In other words, the setting position of the heat-conducting through hole 120 can overlap with the element setting area A1 so that the heat-conducting through hole 120 is located below the heating element 200. Moreover, in this embodiment, the electrical pads of the heating element 200 can be directly connected to the thermally conductive through holes 120, so that the heat generated during the operation of the thermally conductive through holes 120 is directly transferred to the thicker second through hole 120. The metal foil layer 116 is patterned and dissipated.

圖6是依照本發明的一實施例的一種軟性線路板結構的剖面示意圖。在此必須說明的是，本實施例的軟性線路板結構100與圖4的軟性線路板結構100相似，因此，本實施例沿用前述實施例的元件標號與部分內容，其中採用相同的標號來表示相同或近似的元件，並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例，本實施例不再重複贅述。請參照圖6，以下將針對本實施例的軟性線路板結構100與圖4之軟性線路板結構 100的差異做說明。 6 is a schematic cross-sectional view of a flexible circuit board structure according to an embodiment of the invention. It must be noted here that the flexible circuit board structure 100 of this embodiment is similar to the flexible circuit board structure 100 of FIG. 4, therefore, this embodiment uses the component numbers and part of the content of the previous embodiment, and the same reference numbers are used to indicate The same or similar elements, and the description of the same technical content is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiment, and the details are not repeated in this embodiment. Please refer to FIG. 6, the following will focus on the flexible circuit board structure 100 of this embodiment and the flexible circuit board structure of FIG. 4 The difference of 100 is explained.

在本實施例中，軟性線路板結構100更可包散熱片140，其設置於第二圖案化金屬箔層116上。進一步而言，散熱片140是設置於覆蓋第二圖案化金屬箔層116的圖案化金屬層130上。以增進熱傳導的效率，使傳導至第二圖案化金屬箔層116的熱能可經由散熱片140而快速散逸至外界。在本實施例中，散熱片140可包括石墨片或鋁片。並且，散熱片140可例如貼附於第二圖案化金屬箔層116的散熱部116b上。在使用石墨片作為散熱片140的實施例中，石墨片可大幅提高軟性線路板結構100在橫向(XY方向)上的熱傳導效率。在使用鋁片作為散熱片140的實施例中，鋁片可進一步增強軟性線路板結構100的剛性，以便於將軟性線路板結構100固定於其他電子元件上。在一實施例中，散熱片140可以僅覆蓋部分第二圖案化金屬箔層116。 In this embodiment, the flexible circuit board structure 100 may further include a heat sink 140 which is disposed on the second patterned metal foil layer 116. Furthermore, the heat sink 140 is disposed on the patterned metal layer 130 covering the second patterned metal foil layer 116. In order to improve the efficiency of heat conduction, the heat energy conducted to the second patterned metal foil layer 116 can be quickly dissipated to the outside through the heat sink 140. In this embodiment, the heat sink 140 may include a graphite sheet or an aluminum sheet. In addition, the heat sink 140 may be attached to the heat sink 116b of the second patterned metal foil layer 116, for example. In the embodiment in which graphite sheets are used as the heat sink 140, the graphite sheets can greatly improve the heat transfer efficiency of the flexible circuit board structure 100 in the lateral direction (XY direction). In the embodiment using aluminum sheet as the heat sink 140, the aluminum sheet can further enhance the rigidity of the flexible circuit board structure 100, so as to fix the flexible circuit board structure 100 to other electronic components. In an embodiment, the heat sink 140 may only cover a part of the second patterned metal foil layer 116.

綜上所述，本發明實施例的軟性線路板結構包括軟性基板以及導熱貫孔。軟性基板的第一圖案化金屬箔層以及第二圖案化金屬箔層分別設置於絕緣層的相對兩表面，且第二圖案化金屬箔層的厚度大於第一圖案化金屬箔層的厚度。導熱貫孔貫穿軟性基板並熱耦接設置於第一圖案化金屬箔層上的發熱元件。如此配置，發熱元件運作時所產生的熱可經由與之熱耦接的導熱貫孔而傳導至第二圖案化金屬箔層，並且，第二圖案化金屬箔層的厚度較厚，可有效增進熱傳導及散熱的效率，進而可將熱迅速地散逸至外界。因此，本發明實施例可有效提升軟性線路板結構的散熱效率。 In summary, the flexible circuit board structure of the embodiment of the present invention includes a flexible substrate and thermally conductive through holes. The first patterned metal foil layer and the second patterned metal foil layer of the flexible substrate are respectively disposed on two opposite surfaces of the insulating layer, and the thickness of the second patterned metal foil layer is greater than the thickness of the first patterned metal foil layer. The thermally conductive through hole penetrates the flexible substrate and is thermally coupled to the heating element disposed on the first patterned metal foil layer. With this configuration, the heat generated during the operation of the heating element can be conducted to the second patterned metal foil layer through the thermally-coupled thermally conductive through holes, and the thickness of the second patterned metal foil layer is thicker, which can effectively increase The efficiency of heat conduction and heat dissipation can quickly dissipate heat to the outside world. Therefore, the embodiments of the present invention can effectively improve the heat dissipation efficiency of the flexible circuit board structure.

雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be determined by the scope of the attached patent application.

100:軟性線路板結構 100: Flexible circuit board structure

110:軟性基板 110: Flexible substrate

112:絕緣層 112: insulating layer

114:第一圖案化金屬箔層 114: The first patterned metal foil layer

114a:線路部 114a: Line Department

114b:散熱部 114b: Heat sink

116:第二圖案化金屬箔層 116: second patterned metal foil layer

116a:線路部 116a: Line Department

116b:散熱部 116b: Heat sink

120:導熱貫孔 120: Thermal through hole

122:導電通孔 122: conductive via

130:圖案化金屬層 130: patterned metal layer

200:發熱元件 200: heating element

A1:元件設置區 A1: Component setting area

D1、D2:厚度 D1, D2: thickness

Claims (8)

一種軟性線路板結構，適於承載一發熱元件，包括：一軟性基板，包括一絕緣層、一第一圖案化金屬箔層以及一第二圖案化金屬箔層，其中該第一圖案化金屬箔層以及該第二圖案化金屬箔層分別設置於該絕緣層的相對兩表面，該發熱元件適於設置於該第一圖案化金屬箔層上，且該第二圖案化金屬箔層的一厚度大於該第一圖案化金屬箔層的一厚度；至少一導熱貫孔，貫穿該軟性基板，並與該發熱元件熱耦接；一散熱片，設置於該第二圖案化金屬箔層上，其中該散熱片包括鋁片，且該散熱片僅覆蓋部分該第二圖案化金屬箔層；以及至少一導電通孔，貫穿該軟性基板，其中該至少一導電通孔用以該第一圖案化金屬箔層與該第二圖案化金屬箔層的電性連接。 A flexible circuit board structure suitable for carrying a heating element, comprising: a flexible substrate, including an insulating layer, a first patterned metal foil layer, and a second patterned metal foil layer, wherein the first patterned metal foil Layer and the second patterned metal foil layer are respectively disposed on two opposite surfaces of the insulating layer, the heating element is suitable for being disposed on the first patterned metal foil layer, and a thickness of the second patterned metal foil layer Is greater than a thickness of the first patterned metal foil layer; at least one thermally conductive through hole penetrates the flexible substrate and is thermally coupled to the heating element; a heat sink is disposed on the second patterned metal foil layer, wherein The heat sink includes an aluminum sheet, and the heat sink only covers a part of the second patterned metal foil layer; and at least one conductive via penetrates the flexible substrate, wherein the at least one conductive via is used for the first patterned metal The foil layer is electrically connected to the second patterned metal foil layer. 如申請專利範圍第1項所述的軟性線路板結構，更包括一圖案化金屬層，覆蓋於該第一圖案化金屬箔層以及該第二圖案化金屬箔層上，並至少覆蓋該至少一導熱貫孔的內壁。 The flexible circuit board structure described in item 1 of the scope of the patent application further includes a patterned metal layer covering the first patterned metal foil layer and the second patterned metal foil layer, and at least covering the at least one The inner wall of the thermally conductive through hole. 如申請專利範圍第2項所述的軟性線路板結構，其中該圖案化金屬層填滿該至少一導熱貫孔。 The flexible circuit board structure as described in item 2 of the scope of patent application, wherein the patterned metal layer fills the at least one thermally conductive through hole. 如申請專利範圍第1項所述的軟性線路板結構，其中該至少一導熱貫孔的直徑實質上介於20微米(μm)至50微米之間。 In the flexible circuit board structure described in the first item of the scope of patent application, the diameter of the at least one thermally conductive through hole is substantially between 20 micrometers (μm) and 50 micrometers. 如申請專利範圍第1項所述的軟性線路板結構，其中該第一圖案化金屬箔層以及該第二圖案化金屬箔層的材料包括銅。 The flexible circuit board structure according to the first item of the scope of patent application, wherein the material of the first patterned metal foil layer and the second patterned metal foil layer includes copper. 如申請專利範圍第1項所述的軟性線路板結構，其中該發熱元件設置於該軟性基板的一元件設置區並與該第一圖案化金屬箔層熱耦接，該至少一導熱貫孔設置於該元件設置區以外。 The flexible circuit board structure according to the first item of the scope of patent application, wherein the heating element is arranged in an element arrangement area of the flexible substrate and is thermally coupled to the first patterned metal foil layer, and the at least one heat conducting through hole is arranged Outside the component setting area. 如申請專利範圍第1項所述的軟性線路板結構，其中該發熱元件設置於該軟性基板的一元件設置區並與該第一圖案化金屬箔層熱耦接，該至少一導熱貫孔設置於該元件設置區內並與該發熱元件連接。 The flexible circuit board structure according to the first item of the scope of patent application, wherein the heating element is arranged in an element arrangement area of the flexible substrate and is thermally coupled to the first patterned metal foil layer, and the at least one heat conducting through hole is arranged In the element installation area and connected with the heating element. 如申請專利範圍第1項所述的軟性線路板結構，其中該第一圖案化金屬箔層包括彼此電性絕緣的一線路部以及一散熱部，該發熱元件電性連接該線路部並熱耦接該散熱部，該導熱貫孔連接該散熱部。 The flexible circuit board structure according to the first item of the patent application, wherein the first patterned metal foil layer includes a circuit portion and a heat dissipation portion electrically insulated from each other, and the heating element is electrically connected to the circuit portion and thermally coupled The heat dissipation part is connected, and the heat conduction through hole is connected to the heat dissipation part.
TW106142520A 2017-12-05 2017-12-05 Flexible circuit board structure TWI702887B (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW106142520A TWI702887B (en) 2017-12-05 2017-12-05 Flexible circuit board structure
CN202310889072.5A CN116669286A (en) 2017-12-05 2017-12-26 Flexible circuit board structure capable of conducting heat
CN201711426326.0A CN109874223A (en) 2017-12-05 2017-12-26 Flexible circuitry plate structure that can be thermally conductive
CN201721838115.3U CN208094874U (en) 2017-12-05 2017-12-26 Flexible circuit board structure with heat conduction through hole

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW106142520A TWI702887B (en) 2017-12-05 2017-12-05 Flexible circuit board structure

Publications (2)

Publication Number Publication Date
TW201927084A TW201927084A (en) 2019-07-01
TWI702887B true TWI702887B (en) 2020-08-21

Family

ID=64068703

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106142520A TWI702887B (en) 2017-12-05 2017-12-05 Flexible circuit board structure

Country Status (2)

Country Link
CN (3) CN208094874U (en)
TW (1) TWI702887B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI702887B (en) * 2017-12-05 2020-08-21 同泰電子科技股份有限公司 Flexible circuit board structure
TWI748740B (en) 2020-11-11 2021-12-01 宸寰科技有限公司 Heat-dissipating conductive soft board

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201008403A (en) * 2008-07-11 2010-02-16 Mitsui Mining & Smelting Co Printed circuit board having excellent heat dissipation
TW201206261A (en) * 2010-07-30 2012-02-01 Umu Technology Co Ltd Circuit board containing metallic heat-dissipation layer and its manufacturing method
TW201436677A (en) * 2012-12-03 2014-09-16 Meiko Electronics Co Ltd Circuit board and method for manufacturing circuit board

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2501266B2 (en) * 1991-11-15 1996-05-29 株式会社東芝 Semiconductor module
US7808013B2 (en) * 2006-10-31 2010-10-05 Cree, Inc. Integrated heat spreaders for light emitting devices (LEDs) and related assemblies
JP5185683B2 (en) * 2008-04-24 2013-04-17 パナソニック株式会社 LED module manufacturing method and lighting apparatus manufacturing method
CN104284533B (en) * 2008-09-28 2019-03-19 华为技术有限公司 Multilayer circuit board and preparation method thereof and communication equipment
DE102011077206B4 (en) * 2011-06-08 2019-01-31 Zf Friedrichshafen Ag Printed circuit board and control unit for a transmission of a vehicle with the printed circuit board
JP5794002B2 (en) * 2011-07-07 2015-10-14 ソニー株式会社 Solid-state imaging device, electronic equipment
CN202535631U (en) * 2011-12-28 2012-11-14 鋐鑫电光科技股份有限公司 Aluminum oxide ceramic circuit board having metal posts and packaging structure of aluminum oxide ceramic circuit board
KR101418008B1 (en) * 2012-07-10 2014-07-09 주식회사 케이씨씨 Substrate for LED and LED heat-sink structure
JP6073637B2 (en) * 2012-10-18 2017-02-01 株式会社小糸製作所 Electronic unit
CN203340400U (en) * 2013-03-06 2013-12-11 乐健科技（珠海）有限公司 Printed circuit board with heat conduction column for LED installation
US9706668B2 (en) * 2014-10-24 2017-07-11 Samsung Electro-Mechanics Co., Ltd. Printed circuit board, electronic module and method of manufacturing the same
KR20160108867A (en) * 2015-03-09 2016-09-21 엘이디라이텍(주) Flexible printed circuit board for LED lamp
TWI702887B (en) * 2017-12-05 2020-08-21 同泰電子科技股份有限公司 Flexible circuit board structure

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201008403A (en) * 2008-07-11 2010-02-16 Mitsui Mining & Smelting Co Printed circuit board having excellent heat dissipation
TW201206261A (en) * 2010-07-30 2012-02-01 Umu Technology Co Ltd Circuit board containing metallic heat-dissipation layer and its manufacturing method
TW201436677A (en) * 2012-12-03 2014-09-16 Meiko Electronics Co Ltd Circuit board and method for manufacturing circuit board

Also Published As

Publication number Publication date
CN116669286A (en) 2023-08-29
TW201927084A (en) 2019-07-01
CN208094874U (en) 2018-11-13
CN109874223A (en) 2019-06-11

Similar Documents

Publication Publication Date Title
JP4610414B2 (en) Electronic component storage package, electronic device, and electronic device mounting structure
US20080278917A1 (en) Heat dissipation module and method for fabricating the same
US8549739B2 (en) Method of making circuit board module
JPWO2016080333A1 (en) module
KR20140021910A (en) Core substrate and printed circuit board using the same
TWI508238B (en) Chip thermal system
TWI690246B (en) Built-in longitudinal heat dissipation ceramic block printed circuit board and circuit assembly with the circuit board
JPWO2010050087A1 (en) Multilayer semiconductor device and manufacturing method thereof
TWI702887B (en) Flexible circuit board structure
JP5607092B2 (en) Package structure and manufacturing method thereof
JP3164067U (en) Circuit board
US20150053462A1 (en) Wiring board structure
TWM438651U (en) Stacked type heat dissipation module of electronic device
JP5087048B2 (en) Circuit board with integrated heat dissipation components
JP2008004688A (en) Semiconductor package
JP5411174B2 (en) Circuit board and manufacturing method thereof
JP6686467B2 (en) Electronic component heat dissipation structure
TWI786182B (en) Thermal-dissipating substrate structure
JP2012023283A (en) Heat dissipation substrate and method for manufacturing the same
TWM565458U (en) Flexible circuit board structure
JP2006216674A (en) Printed circuit with improved heat dissipation performance and circuit module comprising the same
TWI726567B (en) Light emitting device cooling structure and manufacturing method thereof
TW202107742A (en) Heat dissipation substrate and manufacturing method thereof
TWI836729B (en) Ceramic board structure and power module
TWI809754B (en) Circuit board and method of manufacturing the same