CN116669286A - Flexible circuit board structure capable of conducting heat - Google Patents
Flexible circuit board structure capable of conducting heat Download PDFInfo
- Publication number
- CN116669286A CN116669286A CN202310889072.5A CN202310889072A CN116669286A CN 116669286 A CN116669286 A CN 116669286A CN 202310889072 A CN202310889072 A CN 202310889072A CN 116669286 A CN116669286 A CN 116669286A
- Authority
- CN
- China
- Prior art keywords
- patterned metal
- metal foil
- foil layer
- circuit board
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 124
- 239000002184 metal Substances 0.000 claims abstract description 124
- 239000011888 foil Substances 0.000 claims abstract description 102
- 238000010438 heat treatment Methods 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 25
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 description 22
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
Abstract
A heat-conductive flexible circuit board structure is used for bearing a heating element and comprises a flexible substrate and at least one heat-conductive through hole. The flexible substrate comprises an insulating layer, a first patterned metal foil layer and a second patterned metal foil layer, wherein the first patterned metal foil layer and the second patterned metal foil layer are respectively arranged on two opposite surfaces of the insulating layer. The heating element is arranged on the first patterned metal foil layer, and the thickness of the second patterned metal foil layer is larger than that of the first patterned metal foil layer. The heat conducting through hole penetrates through the flexible substrate and is thermally coupled with the heating element.
Description
Technical Field
The present disclosure relates to circuit board structures, and particularly to a flexible circuit board structure with heat dissipation.
Background
Today's information society will have an increasing dependence of humans on electronic products. In order to meet the requirements of high speed, high performance, and light weight, thin and small electronic products, flexible circuit boards with flexible characteristics have been increasingly used in various electronic devices, such as Notebook PCs (Notebook PCs), mobile phones (Cell phones), digital cameras (digital cameras), personal digital assistants (Personal Digital Assistant, PDAs), printers, and optical discs (optical disk drive). It should be noted that the flexible circuit board not only can be used for electrical connection, but also can be used for carrying chips or other electronic components, and has a quite wide application range.
Generally, electronic components such as chips are disposed on a flexible circuit board, and the electronic components are connected to connection pads of the flexible circuit board. The temperature of the flexible circuit board and the electronic element is increased due to heat energy generated by the operation of the electronic element, so that the connection part of the connection pad and the electronic element is easily degraded due to high temperature, and the electronic element is disabled. In addition, other electronic components disposed on the flexible circuit board may also have reduced performance due to the increased temperature of the flexible circuit board.
Disclosure of Invention
The invention provides a heat-conducting flexible circuit board structure which has good heat dissipation efficiency.
The flexible circuit board structure is used for bearing the heating element and comprises a flexible substrate and at least one heat conducting through hole. The flexible substrate comprises an insulating layer, a first patterned metal foil layer and a second patterned metal foil layer, wherein the first patterned metal foil layer and the second patterned metal foil layer are respectively arranged on two opposite surfaces of the insulating layer. The heating element is arranged on the first patterned metal foil layer, and the thickness of the second patterned metal foil layer is larger than that of the first patterned metal foil layer. The heat conducting through hole penetrates through the flexible substrate and is thermally coupled with the heating element.
In an embodiment of the invention, the flexible circuit board structure further includes a patterned metal layer covering the first patterned metal foil layer and the second patterned metal foil layer and at least covering an inner wall of the at least one heat conductive via.
In an embodiment of the invention, the patterned metal layer fills at least one heat-conducting via.
In an embodiment of the invention, a diameter of the at least one heat-conducting via is between 20 micrometers (μm) and 50 μm.
In an embodiment of the invention, the flexible circuit board structure further includes a heat sink disposed on the second patterned metal foil layer.
In an embodiment of the invention, the heat sink includes a graphite sheet or an aluminum sheet.
In an embodiment of the invention, the material of the first patterned metal foil layer and the second patterned metal foil layer includes copper.
In an embodiment of the invention, the heating element is disposed in an element disposition area of the flexible substrate and is thermally coupled to the first patterned metal foil layer, and the at least one heat-conducting through hole is disposed at an outer periphery of the element disposition area.
In an embodiment of the invention, the heating element is disposed in the element disposition area of the flexible substrate and is thermally coupled to the first patterned metal foil layer, and the at least one heat-conducting via is disposed in the element disposition area and is connected to the heating element.
In an embodiment of the invention, the first patterned metal foil layer includes a circuit portion and a heat dissipation portion electrically insulated from each other, and the heating element is electrically connected to the circuit portion and thermally coupled to the heat dissipation portion.
Based on the above, the flexible circuit board structure of the embodiment of the invention includes the flexible substrate and the heat conduction through hole. The first patterned metal foil layer and the second patterned metal foil layer of the flexible substrate are respectively arranged on two opposite surfaces of the insulating layer, and the thickness of the second patterned metal foil layer is larger than that of the first patterned metal foil layer. The heat conducting through hole penetrates through the flexible substrate and is thermally coupled with the heating element arranged on the first patterned metal foil layer. So configured, heat generated by the heating element during operation can be conducted to the second patterned metal foil layer through the heat conducting through hole thermally coupled with the heating element, and the second patterned metal foil layer has a thicker thickness, so that the heat conduction and heat dissipation efficiency can be effectively improved, and the heat can be rapidly dissipated to the outside. Therefore, the embodiment of the invention can effectively improve the heat dissipation efficiency of the flexible circuit board structure.
In order to make the above features and advantages of the present invention more comprehensible, embodiments accompanied with figures are described in detail below.
Drawings
Fig. 1 to 4 are schematic cross-sectional views illustrating a manufacturing process of a flexible circuit board structure according to an embodiment of the invention;
FIG. 5 is a schematic cross-sectional view of a flexible circuit board structure according to an embodiment of the invention;
fig. 6 is a schematic cross-sectional view of a flexible circuit board structure according to an embodiment of the invention.
Symbol description:
100: a flexible circuit board structure;
110. 110a: a flexible substrate;
112: an insulating layer;
114: a first patterned metal foil layer;
114a: a wiring section;
114b: a heat dissipation part;
116: a second patterned metal foil layer;
116a: a wiring section;
116b: a heat dissipation part;
113: a first metal foil layer;
115: a second metal foil layer;
120a: a through hole;
120: a heat-conducting through hole;
122: a conductive via;
130: patterning the metal layer;
130a: a metal layer;
140: a heat sink;
200: a heating element;
a1: a component setting region;
d1, D2: thickness.
Detailed Description
The foregoing and other features, aspects and advantages of the present invention will become more apparent from the following detailed description of embodiments, which proceeds with reference to the accompanying drawings. The directional terms mentioned in the following embodiments are, for example: "upper", "lower", "front", "rear", "left", "right", etc., are merely directions with reference to the drawings. Thus, the directional terminology is used for purposes of illustration and is not intended to be limiting of the invention. Also, in the following embodiments, the same or similar elements will be given the same or similar reference numerals.
Fig. 1 to 4 are schematic cross-sectional views illustrating a manufacturing process of a flexible circuit board structure according to an embodiment of the invention. In the present embodiment, the flexible circuit board structure 100 is used for carrying the heat generating element 200, and can dissipate heat of the heat generating element 200. The manufacturing process of the flexible circuit board structure 100 of the present embodiment includes the following steps. Referring to fig. 1, a flexible substrate 110a shown in fig. 1 is provided and includes an insulating layer 112, a first metal foil layer 113 and a second metal foil layer 115. In the present embodiment, the first metal foil layer 113 and the second metal foil layer 115 are respectively provided on opposite surfaces of the insulating layer 112 as shown in fig. 1. The thickness D2 of the second metal foil layer 115 is greater than the thickness D1 of the first metal foil layer 113. In this embodiment, the materials of the first metal foil layer 113 and the second metal foil layer 115 include copper, that is, the first metal foil layer 113 and the second metal foil layer 115 may be two copper foil layers with different thicknesses, which are respectively pressed on two opposite surfaces of the insulating layer 112.
Referring to fig. 2, a through hole 120a is formed on the flexible substrate 110a, wherein the through hole 120a penetrates through the flexible substrate 110a. In this embodiment, the forming manner of the through hole 120a may include laser or mechanical drilling. In this embodiment, the diameter of the through hole 120a may be between about 20 micrometers (μm) and 50 μm. Of course, this embodiment is merely for illustration, and the present invention is not limited to the diameter of the through hole 120a and the forming method thereof.
Next, referring to fig. 3, a metal layer 130a is formed to cover the first metal foil layer 113 and the second metal foil layer 115 and at least cover the inner wall of the through hole 120a, so as to form the heat conductive through hole 120. In the present embodiment, the diameter of the heat-conducting via 120 may be between about 20 micrometers (μm) and 50 μm, and the metal layer 130a may be formed, for example, by electroplating, so as to entirely cover the first metal foil layer 113 and the second metal foil layer 115 and fill the via 120a. In other embodiments, if the diameter of the through hole 120a is larger (e.g., the diameter of the through hole 120a is larger than 50 μm), the metal layer 130a may cover only the inner wall of the through hole 120a, and then fill the through hole 120a with the filling material.
Referring to fig. 4, a patterning process is performed on the first and second metal foil layers 113 and 115 and the metal layer 130a covering the first and second metal foil layers 113 and 115 to form the first and second patterned metal foil layers 114 and 116 and the patterned metal layer 130 covering the first and second patterned metal foil layers 114 and 116 as shown in fig. 4. Thus, the flexible circuit board structure 100 of the present embodiment can be substantially completed.
Structurally, the flexible circuit board structure 100 of the present embodiment includes a flexible substrate 110 and at least one heat conductive via 120. The flexible substrate 110 includes an insulating layer 112, a first patterned metal foil layer 114, a second patterned metal foil layer 116 and a patterned metal layer 130, wherein the first patterned metal foil layer 114 and the second patterned metal foil layer 116 are respectively disposed on two opposite surfaces of the insulating layer 112, and a thickness D2 of the second patterned metal foil layer 116 is greater than a thickness D1 of the first patterned metal foil layer 114. The patterned metal layer 130 covers the first patterned metal foil layer 114 and the second patterned metal foil layer 116 and covers at least the inner walls of the heat conductive vias 120. In this way, the heating element 200 can be disposed on the first patterned metal foil layer 114 as shown in fig. 4, and the heat conductive via 120 penetrates through the flexible substrate 110 and is thermally coupled with the heating element 200. So configured, heat generated during operation of the heat generating element 200 can be conducted to the second patterned metal foil layer 116 through the thermally conductive via 120 thermally coupled thereto, and the thickness D2 of the second patterned metal foil layer 116 is thicker, thereby effectively improving heat conduction and heat dissipation efficiency.
In the present embodiment, the heating element 200 may be disposed on the element disposition area A1 of the flexible substrate 110 as shown in fig. 4, and thermally coupled with the patterned metal layer 130 and the first patterned metal foil layer 114. In this embodiment, the heat conducting via 120 may be disposed outside the device disposition area A1. Also, the number of the heat conductive vias 120 may be plural, and in such a configuration, the heat conductive vias 120 may be disposed around the element disposition region A1 and thermally coupled with the heat generating element 200 via the first patterned metal foil layer 114. That is, the installation position of the heat conductive via 120 may not overlap with the element installation region A1. In the present embodiment, the heating element 200 may be disposed on the flexible circuit board structure 100, for example, by flip-chip bonding, and thermally coupled with the patterned metal layer 130 and the first patterned metal foil layer 114. Of course, the invention is not limited thereto, and in other embodiments, the heating element 200 may be disposed on the flexible circuit board structure 100 by wire bonding, for example.
In the present embodiment, the first patterned metal foil layer 114 can include a circuit portion 114a and a heat dissipation portion 114b electrically insulated from each other, the heating element 200 is electrically connected to the circuit portion 114a and thermally coupled to the heat dissipation portion 114b, and the heat conductive via 120 is connected to the heat dissipation portion 114b. For example, the heating element 200 may include a plurality of pads respectively connected to the circuit portion 114a and the heat dissipation portion 114b, and the heat conducting via 120 is connected to the heat dissipation portion 114b, so that the heat generated by the heating element 200 can be conducted to the second patterned metal foil layer 116 through the heat dissipation portion 114b and the heat conducting via 120 connected thereto. Correspondingly, the second patterned metal foil layer 116 can also include a circuit portion 116a and a heat dissipation portion 116b electrically insulated from each other, and the heat conductive via 120 is connected to the heat dissipation portion 116b to conduct heat to the heat dissipation portion 116b of the second patterned metal foil layer 116 for dissipating heat. In the present embodiment, the flexible circuit board structure 100 may include a plurality of through holes, wherein the through holes connected to the heat dissipation portion 114b and/or the heat dissipation portion 116b are the heat conducting through holes 120 for dissipating heat, and the through holes connected to the circuit portion 114a and/or the circuit portion 116a are the conductive through holes 122 for electrically connecting.
Fig. 5 is a schematic cross-sectional view of a flexible circuit board structure according to an embodiment of the invention. It should be noted that the flexible circuit board structure 100 of the present embodiment is similar to the flexible circuit board structure 100 of fig. 4, and therefore, the present embodiment uses the element reference numerals and part of the content of the foregoing embodiment, where the same reference numerals are used to designate the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted parts, reference is made to the foregoing embodiments, and the description of this embodiment will not be repeated. Referring to fig. 5, the following description will be given for the differences between the flexible circuit board structure 100 of the present embodiment and the flexible circuit board structure 100 of fig. 4.
In the present embodiment, the heating element 200 may be disposed in the element disposition area A1 of the flexible substrate 110 and thermally coupled with the first patterned metal foil layer 114, and the heat conductive via 120 of the present embodiment is disposed in the element disposition area A1 and connected with the heating element 200. In other words, the placement position of the heat conductive via 120 may overlap the element placement area A1 such that the heat conductive via 120 is located below the heat generating element 200. In the present embodiment, the pad of the heating element 200 can be directly connected to the heat-conducting via 120, so that the heat generated during the operation of the heat-conducting via 120 is directly conducted to the second patterned metal foil layer 116 with a thicker thickness via 120 and dissipated.
Fig. 6 is a schematic cross-sectional view of a flexible circuit board structure according to an embodiment of the invention. It should be noted that the flexible circuit board structure 100 of the present embodiment is similar to the flexible circuit board structure 100 of fig. 4, and therefore, the present embodiment uses the element reference numerals and part of the content of the foregoing embodiment, where the same reference numerals are used to designate the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted parts, reference is made to the foregoing embodiments, and the description of this embodiment will not be repeated. Referring to fig. 6, the following description will be given for the differences between the flexible circuit board structure 100 of the present embodiment and the flexible circuit board structure 100 of fig. 4.
In this embodiment, the flexible circuit board structure 100 can further include a heat sink 140 disposed on the second patterned metal foil layer 116. Further, a heat sink 140 is disposed on the patterned metal layer 130 covering the second patterned metal foil layer 116. To enhance the heat conduction efficiency, the heat energy conducted to the second patterned metal foil layer 116 can be rapidly dissipated to the outside through the heat sink 140. In this embodiment, the heat sink 140 may include a graphite sheet or an aluminum sheet. And, the heat sink 140 can be attached to the heat sink 116b of the second patterned metal foil layer 116, for example. In embodiments using graphite sheets as the heat sink 140, the graphite sheets can greatly improve the heat conduction efficiency of the flexible circuit board structure 100 in the lateral (XY) directions. In embodiments using aluminum sheets as the heat sink 140, the aluminum sheets may further enhance the rigidity of the flexible circuit board structure 100 to facilitate securing the flexible circuit board structure 100 to other electronic components.
In summary, the flexible circuit board structure according to the embodiments of the present invention includes a flexible substrate and a heat conductive via. The first patterned metal foil layer and the second patterned metal foil layer of the flexible substrate are respectively arranged on two opposite surfaces of the insulating layer, and the thickness of the second patterned metal foil layer is larger than that of the first patterned metal foil layer. The heat conducting through hole penetrates through the flexible substrate and is thermally coupled with the heating element arranged on the first patterned metal foil layer. So configured, heat generated by the heating element during operation can be conducted to the second patterned metal foil layer through the heat conducting through hole thermally coupled with the heating element, and the second patterned metal foil layer has a thicker thickness, so that the heat conduction and heat dissipation efficiency can be effectively improved, and the heat can be rapidly dissipated to the outside. Therefore, the embodiment of the invention can effectively improve the heat dissipation efficiency of the flexible circuit board structure.
Although the present invention has been described with reference to the above embodiments, it should be understood that the invention is not limited thereto, but rather may be modified or altered somewhat by those skilled in the art without departing from the spirit and scope of the present invention.
Claims (10)
1. A thermally conductive flexible circuit board structure for carrying a heating element, comprising:
the flexible substrate comprises an insulating layer, a first patterned metal foil layer and a second patterned metal foil layer, wherein the first patterned metal foil layer and the second patterned metal foil layer are respectively arranged on two opposite surfaces of the insulating layer, the heating element is arranged on the first patterned metal foil layer, and the thickness of the second patterned metal foil layer is larger than that of the first patterned metal foil layer;
at least one heat conducting through hole penetrating the flexible substrate and thermally coupled with the heating element; and
and the heat radiating fin is arranged on the second patterned metal foil layer, the material of the second patterned metal foil layer comprises copper, the heat radiating fin comprises a graphite sheet or an aluminum sheet, and heat generated by the heating element is thermally conducted to the heat radiating fin through the first patterned metal foil layer, the at least one heat conducting through hole and the second patterned metal foil layer.
2. The flexible circuit board structure of claim 1 further comprising a patterned metal layer overlying the first patterned metal foil layer and the second patterned metal foil layer, the patterned metal layer filling the at least one thermally conductive via.
3. The flexible circuit board structure of claim 2 wherein the patterned metal layer has no interface with portions within the at least one thermally conductive via on the first patterned metal foil layer and the second patterned metal foil layer.
4. The flexible circuit board structure of claim 2 wherein the patterned metal layer is in direct contact with the heat sink.
5. The flexible circuit board structure of claim 2 wherein the patterned metal layer is in direct contact with the second patterned metal foil layer.
6. The flexible circuit board structure of claim 2 wherein the heat sink is separated from the second patterned metal foil layer by the patterned metal layer.
7. The flexible circuit board structure of claim 2 wherein the first patterned metal foil layer comprises a first circuit portion and a first heat sink portion electrically insulated from each other, the heating element electrically connected to the first circuit portion and thermally coupled to the first heat sink portion, the thermally conductive via connecting the first heat sink portion and the patterned metal layer.
8. The flexible circuit board structure of claim 2 wherein the second patterned metal foil layer comprises a second circuit portion and a second heat sink portion electrically insulated from each other, the thermally conductive via connecting the second heat sink portion and the patterned metal layer.
9. The flexible circuit board structure of claim 1 wherein the first patterned metal foil layer comprises copper.
10. The flexible circuit board structure of claim 1, wherein the at least one thermally conductive via has a diameter between 20 microns and 50 microns.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106142520A TWI702887B (en) | 2017-12-05 | 2017-12-05 | Flexible circuit board structure |
| TW106142520 | 2017-12-05 | ||
| CN201711426326.0A CN109874223A (en) | 2017-12-05 | 2017-12-26 | Flexible circuitry plate structure that can be thermally conductive |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711426326.0A Division CN109874223A (en) | 2017-12-05 | 2017-12-26 | Flexible circuitry plate structure that can be thermally conductive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116669286A true CN116669286A (en) | 2023-08-29 |
Family
ID=64068703
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721838115.3U Active CN208094874U (en) | 2017-12-05 | 2017-12-26 | Flexible circuit board structure with heat conduction through hole |
| CN202310889072.5A Pending CN116669286A (en) | 2017-12-05 | 2017-12-26 | Flexible circuit board structure capable of conducting heat |
| CN201711426326.0A Pending CN109874223A (en) | 2017-12-05 | 2017-12-26 | Flexible circuitry plate structure that can be thermally conductive |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721838115.3U Active CN208094874U (en) | 2017-12-05 | 2017-12-26 | Flexible circuit board structure with heat conduction through hole |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711426326.0A Pending CN109874223A (en) | 2017-12-05 | 2017-12-26 | Flexible circuitry plate structure that can be thermally conductive |
Country Status (2)
| Country | Link |
|---|---|
| CN (3) | CN208094874U (en) |
| TW (1) | TWI702887B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI702887B (en) * | 2017-12-05 | 2020-08-21 | 同泰電子科技股份有限公司 | Flexible circuit board structure |
| TWI748740B (en) | 2020-11-11 | 2021-12-01 | 宸寰科技有限公司 | Heat-dissipating conductive soft board |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2501266B2 (en) * | 1991-11-15 | 1996-05-29 | 株式会社東芝 | Semiconductor module |
| US7808013B2 (en) * | 2006-10-31 | 2010-10-05 | Cree, Inc. | Integrated heat spreaders for light emitting devices (LEDs) and related assemblies |
| JP5185683B2 (en) * | 2008-04-24 | 2013-04-17 | パナソニック株式会社 | LED module manufacturing method and lighting apparatus manufacturing method |
| JP2010021400A (en) * | 2008-07-11 | 2010-01-28 | Mitsui Mining & Smelting Co Ltd | Printed circuit board with excellent heat dissipation property |
| CN104284533B (en) * | 2008-09-28 | 2019-03-19 | 华为技术有限公司 | Multilayer circuit board and preparation method thereof and communication equipment |
| TWI391039B (en) * | 2010-07-30 | 2013-03-21 | Umu Technology Co Ltd | Circuit board with metal heat sink and manufacturing method thereof |
| DE102011077206B4 (en) * | 2011-06-08 | 2019-01-31 | Zf Friedrichshafen Ag | Printed circuit board and control unit for a transmission of a vehicle with the printed circuit board |
| JP5794002B2 (en) * | 2011-07-07 | 2015-10-14 | ソニー株式会社 | Solid-state imaging device, electronic equipment |
| CN202535631U (en) * | 2011-12-28 | 2012-11-14 | 鋐鑫电光科技股份有限公司 | Aluminum oxide ceramic circuit board having metal posts and packaging structure of aluminum oxide ceramic circuit board |
| KR101418008B1 (en) * | 2012-07-10 | 2014-07-09 | 주식회사 케이씨씨 | Substrate for LED and LED heat-sink structure |
| JP6073637B2 (en) * | 2012-10-18 | 2017-02-01 | 株式会社小糸製作所 | Electronic unit |
| WO2014087470A1 (en) * | 2012-12-03 | 2014-06-12 | 株式会社メイコー | Circuit board and method for manufacturing circuit board |
| CN203340400U (en) * | 2013-03-06 | 2013-12-11 | 乐健科技（珠海）有限公司 | Printed circuit board with heat conduction column for LED installation |
| US9706668B2 (en) * | 2014-10-24 | 2017-07-11 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board, electronic module and method of manufacturing the same |
| KR20160108867A (en) * | 2015-03-09 | 2016-09-21 | 엘이디라이텍(주) | Flexible printed circuit board for LED lamp |
| TWI702887B (en) * | 2017-12-05 | 2020-08-21 | 同泰電子科技股份有限公司 | Flexible circuit board structure |
-
2017
- 2017-12-05 TW TW106142520A patent/TWI702887B/en active
- 2017-12-26 CN CN201721838115.3U patent/CN208094874U/en active Active
- 2017-12-26 CN CN202310889072.5A patent/CN116669286A/en active Pending
- 2017-12-26 CN CN201711426326.0A patent/CN109874223A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW201927084A (en) | 2019-07-01 |
| CN208094874U (en) | 2018-11-13 |
| CN109874223A (en) | 2019-06-11 |
| TWI702887B (en) | 2020-08-21 |
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