TWI391039B - Circuit board with metal heat sink and manufacturing method thereof - Google Patents

Description

Circuit board with metal heat dissipation layer and manufacturing method thereof

The invention relates to a circuit board with a metal heat dissipation layer and a manufacturing method thereof, in particular to a heat dissipation circuit substrate with a solid copper substrate and a manufacturing method thereof, which can be widely used in a light-emitting diode. Applications such as body (LED) heat sink circuit boards or refrigerator heat sink circuit boards.

With the development of high-performance, high-frequency, high-speed, and thin-and-light electronic products, under the design concept of "light, thin, short, small, and versatile", the main components related to various electronic systems, such as the central Processors (CPUs), chipsets, etc. are all researching and developing toward high speed, multi-function, high power, and small volume. Therefore, under such a high-density packaging condition, of course, the heat generated by the power consumption of the components is continuously increased, and the stability, reliability, and life of the electronic components may be attenuated or even deteriorated as the temperature increases. The lower the temperature, the lower the failure rate, so good heat dissipation technology is also the key to the performance improvement of electronic components.

At present, the application level and field of the circuit board are quite broad. Today, the circuit board is an electronic component that responds to high power and high thermal energy, and strives to improve the heat dissipation of the circuit board to provide a heat dissipation circuit board with high heat dissipation efficiency.

In the traditional circuit board application, due to the small number of electronic components and low power consumption, most of the thermal energy generated by the electronic components can be conducted through the metal copper layer and directly radiated into the air environment. However, in the case where the power of electronic components mounted on the circuit board is increasing and the number is increasing, as the amount of current increases, the electric power consumed increases, thereby causing a problem that the power consumption is excessively high, and the electronic component itself is utilized. The heat conduction path for waste heat removal has not been able to dissipate most of the heat.

Since the working temperature of overheating will cause the physical characteristics of the electronic components to change, the electronic components cannot achieve the predetermined working efficiency, which may result in burning and shortening the service life of the product.

The use of multi-layer circuit boards is a good solution to improve the density of electronic components and circuits. The general multilayer circuit board structure and process are usually based on a planar insulating dielectric substrate, which is a high-temperature pressure bonding process. The circuit layer and the adhesive insulating layer are disposed on one or both sides of the substrate to be laminated, and finally processed to complete the fabrication of the multilayer printed circuit board.

However, in order to improve the density of components and lines, the problem of poor heat dissipation efficiency is also relatively derived. In particular, the conventional printed circuit board uses a glass fiber hybrid resin as the material of the adhesive insulating layer, and the heat dissipation coefficient is extremely low at about 0.36 W/mK. Due to the poor thermal conductivity, the vertical heat conduction effect is greatly limited, and the heat energy accumulated by the components cannot be efficiently conducted to the air environment through the circuit board, so that the internal temperature of the components is too high, thereby reducing the performance and even reducing the performance. The life of the component, which is more serious in multi-layer boards loaded with high-power electronic components.

In the development trend of package design, only the heat conduction path of the component (electrode metal wire, via hole) can not quickly derive enough thermal energy into the air environment, resulting in high component temperature and heat accumulation in the component inside the board. On the surface, the heat dissipation function of the circuit board must be used to enhance the heat dissipation function, and the thermal energy can be derived into the overall system circuit board. Therefore, the insulating thermal conductive adhesive of the resin mixed alumina material is specially developed as the adhesive layer of the metal circuit layer. In practice, the thermal conductivity of the insulating thermal conductive adhesive is very low, about 0.8-1.3 W/mK, which is only 2 to 4 times that of the conventional printed circuit board. Therefore, the vertical heat conduction and heat dissipation efficiency can be improved, and the circuit board is relatively improved. The manufacturing cost has no other effect of greatly increasing the vertical heat conduction and current carrying. In the case where the circuit board requires heat dissipation and current carrying capacity is increasing, the conventional circuit board is not suitable for use. Traditional circuit board structures and manufacturing methods are in need of innovation and improvement.

The main object of the present invention is to provide a circuit board with a metal heat dissipation layer and a manufacturing method thereof, wherein a copper metal is deposited on a through hole of a dielectric substrate by an electroforming process to form a solid copper heat conduction column, which is larger than a conventional dielectric substrate. The thin conductive wall formed by the plated through holes is thicker, so that it has better heat transfer efficiency and greatly improves the heat conduction and current carrying capacity of the dielectric substrate in the vertical direction.

In order to achieve the above, the method for manufacturing a circuit board with a metal heat dissipation layer comprises the steps of: selecting a predetermined dielectric substrate; performing through-hole processing on the dielectric substrate; and depositing copper metal deposition by an electroforming process Forming a solid copper heat conducting column inside the through hole, and thickening the surface of the dielectric substrate to form a copper metal thickening layer; forming a circuit pattern of the copper metal thickening layer by using a film (anti-etching dry film), an exposure developing process, and an etching process Stripping the anti-etching dry film on the copper metal thickening layer; and plating other anti-oxidation metals to form a metal protective layer on the surface of the copper metal thickening layer.

In a preferred embodiment, the dielectric substrate is formed on the surface of the dielectric substrate by a screen printing process or a sputtering process to form a thin film copper metal layer before the through hole processing; or the dielectric substrate is processed through the through hole. A nickel/copper metal plated through hole and a surface nickel/copper metal layer are formed by a sputtering process, and the through hole processing can be performed as ultrasonic processing, electron beam processing, laser processing, oil punching, conventional drilling or plastic One of the processing methods for hole forming.

The dielectric substrate may be one of a ceramic substrate, a printed circuit substrate, an engineering plastic substrate or other composite substrate, wherein the ceramic substrate may be selected from the group consisting of alumina, aluminum nitride, tantalum carbide, cerium oxide, zinc oxide or oxidation. One of the ceramic materials of the crucible; wherein the printed circuit substrate may be selected from the group consisting of resin, glass fiber/epoxy resin, polyimide, polytetrafluoroethylene (PTFE) or BT/epoxy; Among them, the engineering plastic substrate can be selected from one of thermoplastic materials, thermosetting plastics or composite plastic materials, which are made by plastic molding methods. The metal protective layer of the present invention is composed of one of a chemical nickel layer mixed with a chemical gold layer, a chemical silver layer, a tin layer or a tin alloy layer. Further, the copper metal thickening layer and the metal protective layer on the surface of the dielectric substrate of the present invention are a double-sided circuit substrate structure.

The invention further discloses a circuit board with a metal heat dissipation layer, the structure comprising: a dielectric substrate having a plurality of through holes penetrating the upper and lower ends of the substrate; a copper metal thickening layer disposed on the surface of the dielectric substrate An etching circuit pattern is formed, and a solid copper heat conducting column is formed inside the through hole of the dielectric substrate; and a metal protective layer is disposed on the surface of the copper metal thickening layer having the etching line pattern.

The dielectric substrate may be one of a ceramic substrate, a printed circuit substrate, an engineering plastic substrate or another composite substrate, wherein the ceramic substrate may be selected from the group consisting of aluminum oxide, aluminum nitride, tantalum carbide, cerium oxide, zinc oxide or One of the ceramic materials of cerium oxide; the above printed circuit board may be selected from the group consisting of resin, glass fiber/epoxy resin, polyimide, polytetrafluoroethylene (PTFE) or BT/epoxy; The above engineering plastic substrate may be selected from one of thermoplastic materials, thermosetting plastics or composite plastic materials, and is made by a plastic molding method.

Further, a nickel/copper metal layer is further disposed between the dielectric substrate and the copper metal thickening layer to form a nickel/copper metal plated through hole between the through hole and the copper metal thickening layer, and the through hole is set to One of a circular hole, a square hole or other geometric through hole having an area size larger than 0.01 mm2, which is processed by ultrasonic machining, electron beam processing, laser processing, oil punching, conventional drilling or plastic hole forming. One of the processing methods is formed. Further, the metal protective layer is composed of one of a chemical nickel layer mixed with a chemical gold layer, a chemical silver layer, a tin layer or a tin alloy layer.

The invention is characterized in that the dielectric substrate is processed by a plurality of through holes, and a solid copper heat conducting column is formed inside the through hole deposited on the dielectric substrate by an electroforming process, and the heat conducting column is compared with the conventional substrate. The thin wall volume of the thermally conductive metal formed by the plated through holes is a thicker structure, has better heat conduction effect, and greatly improves the heat conduction and current carrying capacity of the dielectric substrate in the vertical direction.

In order to facilitate further understanding and understanding of the structure, use and features of the present invention, the preferred embodiments are described in detail with reference to the drawings as follows: First, please refer to FIG. 1 to FIG. In the first preferred embodiment shown in the drawing, the method for manufacturing a circuit board with a metal heat dissipation layer of the present invention comprises the following steps:

(A) A dielectric substrate 20 is selected.

The dielectric substrate 20 may be one of a ceramic substrate, a printed circuit substrate, an engineering plastic substrate or another composite substrate; wherein the ceramic substrate may be selected from the group consisting of aluminum oxide, aluminum nitride, tantalum carbide, hafnium oxide, and zinc oxide. Or one of ceramic materials of cerium oxide; the above printed circuit board may be selected from the group consisting of resin, glass fiber/epoxy resin, polyimide, polytetrafluoroethylene (PTFE) or BT/epoxy resin. The above engineering plastic substrate may be selected from one of thermoplastic materials, thermosetting plastics or composite plastic materials, which are made by plastic molding methods. However, this description is for convenience only and is not limited. This means that the dielectric substrate 20 can also be selected as other different substrate materials.

(B) The through hole 21 is processed on the dielectric substrate 20.

The above-mentioned through hole processing can be set as one of processing methods of ultrasonic processing, electron beam processing, laser processing, oil punching, conventional drilling or plastic hole forming.

(C) A nickel/copper metal plated through hole 22 and a surface nickel/copper metal layer 23 are formed on the surface of the dielectric substrate 20 and the hole wall of the through hole 21 by a sputtering process.

The so-called sputtering process uses ions generated by the plasma to bombard the electrode to be sputtered by ions, so that the atoms in the gas phase of the plasma have atoms to be plated, and then a deposited metal plating film is produced.

(D) A copper metal deposition is filled in the nickel/copper metal plated through hole 22 to form a solid copper heat conducting column 28 by an electroforming process, and a surface of the dielectric substrate 20 is thickened to form a copper metal thickening layer 24.

The so-called electroforming process is a process of electroplating deposition. The external solution containing metal ions and other additives is subjected to electrochemical redox reaction on the surface of the cathode or anode by the externally supplied electric energy to deposit the desired metal. On the surface of the prototype.

(E) A wiring pattern of the copper metal thickening layer 24 is formed by a film (anti-etching dry film), an exposure developing process, and an etching process 30.

The film forming process is a dry film 31 (Dry Film) in which a pair of ultraviolet-ray-reactive polymerizable resins are adhered on the surface of the copper metal thickening layer 24 on which the wiring pattern is to be formed on the dielectric substrate 20, and is mainly used for protecting copper metal after polymerization. The line pattern of thickened layer 24 is not etched away.

The exposed part in the exposure and development process is that after the circuit pattern is made into a genuine mask, it is first positioned and flattened on the copper metal thickening layer 24 to which the dry film 31 is attached, and then vacuumed and pressed by the exposure machine. Completed by ultraviolet radiation. The dry film 31 which is irradiated with ultraviolet rays will cause polymerization, and the dry film 31 is blocked by the mask to be blocked by ultraviolet rays, and polymerization will not occur.

In the developing part of the exposure and development process, the dry film 31 which is not polymerized is partially removed by the developer, and the line pattern to be retained is visually revealed by physical and chemical stripping, and the circuit formed by the process step is formed. The pattern has the characteristics of being straight and flat.

The etching process 30 is etched by an etching solution to dissolve and remove the copper metal thickening layer 24 having no dry film 31 on the surface of the dielectric substrate 20.

(F) The anti-etching dry film 31 on the copper metal thickening layer 24 is stripped.

(G) Electroplating of other oxidation resistant metal forms a metal protective layer 25 on the surface of the copper metal thickening layer 24.

The metal protective layer 25 is composed of one of a chemical nickel layer mixed with a chemical gold layer, a chemical silver layer, a tin layer or a tin alloy layer.

The circuit board having the metal heat dissipation layer of the present invention can be produced by the steps (A) to (G).

Referring to FIG. 1 to FIG. 2, the circuit board structure of the present invention is provided with a dielectric substrate 20 having a plurality of through holes 21 for penetrating through the upper and lower ends of the dielectric substrate 20, and A nickel/copper metal layer 23 and a nickel/copper metal plated through hole 22 are deposited on the surface of the dielectric substrate 20 and the through hole 21 hole wall; a copper metal thickening layer 24 is disposed on the surface of the nickel/copper metal layer 23, A solid copper heat conducting column 28 is formed by depositing a nickel/copper metal plated through hole 22; the copper metal thickening layer 24 has an etched line pattern and an etched line pattern corresponding to the copper metal thickening layer 24. A metal protective layer 25 is disposed on the surface.

The dielectric substrate 20 may be one of a ceramic substrate, a printed circuit substrate, an engineering plastic substrate or another composite substrate; wherein the ceramic substrate may be selected from the group consisting of aluminum oxide, aluminum nitride, tantalum carbide, hafnium oxide, and zinc oxide. Or one of ceramic materials of cerium oxide; the above printed circuit board may be selected from the group consisting of resin, glass fiber/epoxy resin, polyimide, polytetrafluoroethylene (PTFE) or BT/epoxy resin. The above engineering plastic substrate may be selected from one of thermoplastic materials, thermosetting plastics or composite plastic materials, and is made by a plastic molding method. The metal protective layer 25 is composed of a chemical nickel layer mixed with a chemical gold layer, a chemical silver layer, a tin layer or a tin alloy layer.

In the first preferred embodiment, the through hole 21 is one of a circular hole, a square hole or another geometric through hole having an area size larger than 0.012 mm, and the through hole 21 is processed by ultrasonic processing and electron beam processing. One of the processing methods of laser processing, hydraulic punching, conventional drilling or plastic hole forming.

Referring to the second preferred embodiment shown in FIGS. 3 to 4, the method for manufacturing a circuit board with a metal heat dissipation layer of the present invention comprises the following steps:

(A) A dielectric substrate 20a is selected.

The dielectric substrate 20a may be one of a ceramic substrate, a printed circuit board, an engineering plastic substrate, or another composite substrate.

(B) The thin film copper metal layer 26a on the surface of the dielectric substrate 20a is formed by a screen printing process or a sputtering process.

The so-called screen printing sintering is a process in which a powder material is heated after printing deposition to form a film layer bonded to the surface of the substrate.

(C) The through hole 21a is processed on the dielectric substrate 20a.

(D) A solid copper heat transfer column 28a is formed by depositing a copper metal deposit inside the through hole 21a by an electroforming process, and a copper metal thickening layer 24a is formed on the surface of the dielectric substrate 20a.

(E) A wiring pattern of the copper metal thickening layer 24a is formed by a film (anti-etching dry film), an exposure developing process, and an etching process 30a.

(F) The anti-etching dry film 31a on the copper metal thickening layer 24a is peeled off.

(G) Electroplating of other oxidation resistant metal forms a metal protective layer 25a on the surface of the copper metal thickening layer 24a.

The metal protective layer 25a is composed of one of a chemical nickel layer mixed with a chemical gold layer, a chemical silver layer, a tin layer or a tin alloy layer.

In the second preferred embodiment, the electroforming process, the lamination, the exposure development, and the etching process 30a are the same as the first preferred embodiment. Similarly, one of the ceramic substrate 20a, the printed circuit board, the engineering plastic substrate, or other composite substrate may be the same as the first preferred embodiment, and will not be described herein.

The through hole 21a is one of a circular hole, a square hole or another geometric through hole having an area size larger than 0.01 mm2, and the through hole 21a is ultrasonically machined, electron beam processed, laser processed, and oil punched. One of the processing methods of conventional drilling or plastic hole forming.

In addition, the circuit board structure formed by the manufacturing method of the second preferred embodiment is the same as the circuit board structure of the first preferred embodiment, and will not be described again for the same reason.

Referring to the third preferred embodiment shown in FIGS. 5 to 6 , the method for manufacturing a circuit board with a metal heat dissipation layer of the present invention comprises the following steps:

(A) A printed circuit board 27 having a thin film copper metal layer 26b on its surface is selected.

(B) The through hole 21b is processed on the printed circuit board 27.

(C) A copper metal deposition is filled in the through hole 21b to form a solid copper heat transfer column 28b by an electroforming process, and a surface of the printed circuit board 27 is thickened to form a copper metal thickening layer 24b.

(D) A wiring pattern of the copper metal thickening layer 24b is formed by a film (anti-etching dry film), an exposure developing process, and an etching process 30b.

(E) The anti-etching dry film 31b on the copper metal thickening layer 24b is peeled off.

(F) Electroplating of other anti-oxidation metal forms a metal protective layer 25b on the surface of the copper metal thickening layer 24b.

Referring to FIG. 5 to FIG. 6 , in the embodiment, the circuit board structure of the present invention is provided with a printed circuit board 27 having a plurality of through holes 21 b for penetrating the surface of the printed circuit board 27 . a thin copper metal layer 26b is disposed on the upper and lower ends, and a copper metal thickening layer 24b is disposed on the surface of the printed circuit board 27 for filling a solid copper heat conducting column 28b formed in the through hole 21b. The copper metal thickening layer 24b There is an etched line pattern, and a metal shield layer 25b is disposed on the surface of the etched line pattern corresponding to the copper metal thickening layer 24b. The through hole 21b is one of a circular hole, a square hole or another geometric through hole having an area size larger than 0.012 mm.

In the third preferred embodiment, the metal protective layer 25b is also composed of one of a chemical nickel layer mixed with a chemical gold layer, a chemical silver layer, a tin layer or a tin alloy layer.

It can be seen from the foregoing three manufacturing methods that, as shown in FIG. 7, the circuit board manufacturing method of the metal heat dissipation layer of the present invention mainly comprises: selecting a dielectric substrate which is preset for through-hole processing; and using a electroforming process to form a copper metal Depositing and filling a solid copper heat conducting column inside the through hole, and thickening the surface of the dielectric substrate to form a copper metal thickening layer; and then forming a copper metal thickening by using a lamination film (anti-etching dry film), exposure development and etching process The wiring pattern of the layer; stripping the anti-etching dry film on the copper metal thickening layer; and plating other anti-oxidation metal to form a metal protective layer on the surface of the copper thickening layer.

The dielectric substrate may be one of a ceramic substrate, a printed circuit substrate, an engineering plastic substrate or another composite substrate. The dielectric substrate may also be subjected to a screen printing process or a sputtering process for dielectric prior to the through hole processing. Forming a thin film copper metal layer on the surface of the substrate; or after the dielectric substrate is processed in the through hole, further forming a nickel/copper metal plated through hole and a surface nickel/copper metal layer by using a sputtering process, wherein the through hole is set to an area size One of a circular hole, a square hole or other geometric through hole larger than 0.012 mm, which is processed by ultrasonic machining, electron beam processing, laser processing oil punching, conventional drilling or plastic hole forming. A processing method is formed.

The present invention can be further disclosed in the foregoing three circuit board structures. The circuit board with a metal heat dissipation layer of the present invention mainly comprises: a dielectric substrate having a plurality of through holes for penetrating the upper and lower ends of the dielectric substrate; a copper metal thickening layer disposed on the surface of the dielectric substrate for filling a through hole of the dielectric substrate to form a solid copper heat conducting column, wherein the copper metal thickening layer has an etched line pattern; and a metal is disposed The protective layer is on the surface of the above-described copper metal thickening layer having an etched wiring pattern.

The dielectric substrate may be one of a ceramic substrate, a printed circuit substrate, an engineering plastic substrate or another composite substrate; wherein the printed circuit substrate may be selected from the group consisting of resin, glass fiber/epoxy resin, and polyamidamine ( Polyimide), one of polytetrafluoroethylene (PTFE) or BT/epoxy resin; wherein the engineering plastic substrate can be selected from one of thermoplastic materials, thermosetting plastics or composite plastic materials, which are plastic molding methods. production.

Further, a nickel/copper metal layer may be further disposed between the dielectric substrate and the copper metal thickening layer to form a nickel/copper metal plated through hole between the through hole and the copper metal thickening layer. The copper metal thickening layer and the metal protective layer disposed on the surface of the circuit board with the metal heat dissipation layer of the present invention are a double-sided circuit substrate structure.

Finally, please refer to FIG. 8 and FIG. 9 , which are respectively a front view combination diagram and a side view combination diagram of the heat dissipation substrate for a heat-generating electronic component according to the present invention, which are formed on the surface of the dielectric substrate 20 c and the inside of the through-hole by the above-mentioned manufacturing method. Forming a solid copper heat conducting column 28c and a copper metal thickening layer 24c having a line pattern, and disposing a metal protective layer 25c on the surface of the copper metal thickening layer 24c, connecting the front surface of the heat generating electronic component 40 with the electrode wires 41 and the back surface of the heat generating electronic component 40 The surface of the copper metal thickening layer 24c further comprises a metal heat dissipating circuit board having the capability of improving heat conduction and current carrying capacity, and the heat conducting layer of the circuit board with the metal heat dissipating layer of the present invention is thinner than the thin metal wall of the plated through hole metal copper of the conventional heat dissipating substrate. In effect, it has better heat transfer efficiency and effectively improves the heat conduction and current carrying capacity of the dielectric substrate in the vertical direction.

In summary, the circuit board with a metal heat dissipation layer of the present invention and the manufacturing method thereof can penetrate different dielectric substrates such as a ceramic substrate, a printed circuit substrate, an engineering plastic substrate or other composite material substrate into a plurality of through holes, and An electroforming process is used to deposit a copper metal deposit inside the through hole to form a solid copper heat conducting column. The metal copper heat conducting column is thicker than the thin metal wall of the heat conducting metal formed by the plated through hole on the conventional substrate. The structure has better heat conduction effect and greatly improves the heat conduction and current carrying capacity of the dielectric substrate in the vertical direction.

The above embodiments are intended to be illustrative only, and are not intended to limit the scope of the present invention. It is included in the scope of the following patent application.

20, 20a, 20c. . . Dielectric substrate

21, 21a, 21b. . . Through hole

twenty two. . . Nickel/copper metal plated through hole

twenty three. . . Nickel/copper metal layer

24, 24a, 24b, 24c. . . Copper metal thickening layer

25, 25a, 25b, 25c. . . Metal protective layer

26a, 26b. . . Thin film copper metal layer

27. . . Printed circuit board

28, 28a, 28b, 28c. . . Solid copper heat transfer column

30, 30a, 30b. . . Etching process

31, 31a, 31b. . . Dry film

40. . . Heated electronic component

41. . . Electrode lead

1 to 2 are schematic views showing the structure of a manufacturing process of a first preferred embodiment of the present invention;

3 to 4 are schematic structural views showing a manufacturing process of a second preferred embodiment of the present invention;

5 to 6 are schematic views showing the structure of a manufacturing process of a third preferred embodiment of the present invention;

Figure 7 is a flow chart showing a method of manufacturing a circuit board having a metal heat dissipation layer according to the present invention;

Figure 8 is a schematic view showing the front side combination of the heat-dissipating substrate of the heat-generating electronic component of the present invention;

Figure 9 is a schematic view showing the side combination of the heat-dissipating substrate of the heat-generating electronic component of the present invention.

Claims (22)

A method for manufacturing a circuit board with a metal heat dissipation layer, comprising: selecting a predetermined dielectric substrate; performing through-hole processing on the dielectric substrate; and depositing a copper metal deposit in the through-hole to form a solid copper by an electroforming process Conducting a heat-conducting column and thickening a surface of the dielectric substrate to form a copper metal thickening layer; forming a circuit pattern of the copper metal thickening layer by using a lamination film, an exposure developing process, and an etching process; and peeling off the etching resistant dry film on the copper metal thickening layer And electroplating other anti-oxidation metals to form a metal protective layer on the surface of the copper metal thickening layer. The method of manufacturing a circuit board having a metal heat dissipation layer according to the first aspect of the invention, wherein the dielectric substrate is one of a ceramic substrate, a printed circuit board, an engineering plastic substrate, or another composite material substrate. The method of manufacturing a circuit board having a metal heat dissipation layer according to claim 2, wherein the ceramic substrate is selected from the group consisting of alumina, aluminum nitride, tantalum carbide, cerium oxide, zinc oxide or cerium oxide. The method for manufacturing a circuit board with a metal heat dissipation layer according to claim 2, wherein the printed circuit board is selected from the group consisting of resin, glass fiber/epoxy resin, polyimide, and polytetrafluoroethylene (PTFE). ) or one of BT/epoxy materials. The method for manufacturing a circuit board with a metal heat dissipation layer according to the second aspect of the invention, wherein the engineering plastic substrate is selected from the group consisting of thermoplastic plastic, thermosetting plastic or composite plastic material, which is made by a plastic molding method. . The method for manufacturing a circuit board having a metal heat dissipation layer according to claim 1, wherein the through hole is one of a circular hole, a square hole or another geometric through hole having an area size larger than 0.01 mm 2 . The method for manufacturing a circuit board having a metal heat dissipation layer according to the first aspect of the invention, wherein the through hole processing is ultrasonic processing, electron beam processing, laser processing, oil punching, conventional drilling or plastic hole One of the processing methods for forming. The method for manufacturing a circuit board with a metal heat dissipation layer according to claim 1, wherein the dielectric substrate is formed by a sputtering process to form a nickel/copper metal plated through hole and a surface nickel/copper metal after the through hole is processed. Floor. The method for manufacturing a circuit board with a metal heat dissipation layer according to claim 1, wherein the dielectric substrate forms a thin film copper metal on the surface of the dielectric substrate by using a screen printing process or a sputtering process before the through hole processing. Floor. The method for manufacturing a circuit board having a metal heat dissipation layer according to claim 1, wherein the metal protective layer is composed of one of a chemical nickel layer mixed with a chemical gold layer, a chemical silver layer, a tin layer or a tin alloy layer. The method for manufacturing a circuit board having a metal heat dissipation layer according to claim 1, wherein the copper metal thickening layer and the metal protective layer on the surface of the dielectric substrate are double-sided circuit board structures. A circuit board having a metal heat dissipation layer, comprising: a dielectric substrate having a plurality of through holes penetrating the upper and lower ends of the substrate; a copper metal thickening layer disposed on the surface of the dielectric substrate to form an etched line pattern, And forming a solid copper heat conducting column inside the through hole filling the dielectric substrate; and a metal protective layer disposed on the surface of the copper metal thickening layer having the etched line pattern. The circuit board with a metal heat dissipation layer according to claim 12, wherein a nickel/copper metal layer is disposed between the dielectric substrate and the copper metal thickening layer to make the through hole and the copper metal thickening layer A nickel/copper metal plated through hole is formed therebetween. The circuit board with a metal heat dissipation layer according to claim 12, wherein the dielectric substrate is one of a ceramic substrate, a printed circuit substrate, an engineering plastic substrate, or another composite substrate. The circuit board with a metal heat dissipation layer according to claim 14, wherein the ceramic substrate is selected from the group consisting of alumina, aluminum nitride, tantalum carbide, cerium oxide, zinc oxide or cerium oxide. The circuit board with a metal heat dissipation layer according to claim 14, wherein the printed circuit board is selected from the group consisting of resin, glass fiber/epoxy resin, polyimide, polytetrafluoroethylene (PTFE) or One of the materials of BT/epoxy. The circuit board with a metal heat dissipation layer according to claim 14, wherein the engineering plastic substrate is selected from one of thermoplastic materials, thermosetting plastics or composite plastic materials, and is formed by a plastic molding method. The circuit board with a metal heat dissipation layer according to claim 12, wherein the through hole is one of a circular hole, a square hole or another geometric through hole having an area size larger than 0.01 mm 2 . The circuit board with a metal heat dissipation layer according to claim 12, wherein the through hole is formed by ultrasonic processing, electron beam processing, laser processing, oil punching, conventional drilling processing or plastic hole forming. One of the processing methods is formed. The circuit board with a metal heat dissipation layer according to claim 12, wherein the metal protection layer is composed of one of a chemical nickel layer mixed with a chemical gold layer, a chemical silver layer, a tin layer or a tin alloy layer. The circuit board with a metal heat dissipation layer according to claim 12, wherein the copper metal thickening layer and the metal protective layer on the surface of the dielectric substrate are double-sided circuit substrate structures. The circuit board with a metal heat dissipation layer according to claim 12, wherein the circuit board with the metal heat dissipation layer is applied to one of a light emitting diode heat dissipation circuit substrate or a refrigerator heat dissipation circuit substrate.