KR101119259B1 - Hybrid heat-radiating substrate and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a hybrid heat dissipation substrate, wherein the metal core layer in which the cavity is formed and the resin core layer located in the cavity form one core layer, and a heating element is mounted on the metal core layer, and the resin core layer is formed on the resin core layer. By mounting a heat-vulnerable element in the heat dissipation, it is possible to protect the heat-vulnerable element from the heat generated by the heat generating element.
In addition, the present invention relates to a method for manufacturing the hybrid heat dissipation substrate.

Description

HYBRID HEAT-RADIATING SUBSTRATE AND MANUFACTURING METHOD THEREOF

The present invention relates to a hybrid heat sink and a method of manufacturing the same.

Recently, the use of electronic devices requiring complex functions is increasing. Due to the nature of these products, various electronic components are mounted on a single substrate. Recently, the heat dissipation problem of the heating element mounted on the substrate has emerged as an issue. In order to solve the heat dissipation problem of the heating element, various types of heat dissipation substrates are manufactured by using a metal material having good thermal conductivity.

In the related art, a heat dissipation substrate was formed on a metal core layer and provided with a circuit layer on the formed insulation layer. Such a heat dissipation board has excellent heat dissipation as compared to a general organic PCB, but has a disadvantage in that high density / high density is implemented.

In addition, when a heat generating element such as an LED and an electronic device vulnerable to heat are simultaneously mounted on a single substrate, since the above-described heat dissipation substrate has high thermal conductivity, heat generated from the heat generating element is transferred to the entire heat dissipation substrate (especially the metal core layer). Through this), a problem occurs that is transmitted to an area where heat should not be transmitted, thereby degrading the performance of the heat-sensitive electronic device.

The present invention has been made to solve the above problems, including a metal core layer to maintain the heat dissipation of the heating element, a resin core layer for mounting an electronic device susceptible to heat by using a heterogeneous insulating material with low thermal conductivity characteristics By constructing the same time, we propose a hybrid heat dissipation substrate that can be mounted on the heating element and the heat-vulnerable element on one substrate at the same time.

In addition, a method of manufacturing the hybrid heat sink is proposed.

The present invention relates to a hybrid heat dissipation substrate, the metal core layer having a cavity formed in the thickness direction from the outer surface, a resin core layer formed in the cavity, an insulating layer formed on the outer surface of the metal core layer, and the first formed on the insulating layer A circuit layer comprising a first circuit pattern and a second circuit pattern formed on the resin core layer.

Further, it characterized in that it further comprises a protective layer formed on the circuit layer of the present invention.

In addition, the first circuit pattern of the present invention is formed on both surfaces of the metal core layer, characterized in that connected via a via.

In addition, the resin core layer of the present invention is located in the cavity so that the insulating layer and the outer surface is flattened.

In addition, the insulating layer of the present invention is characterized in that the oxide insulating layer formed by anodizing the metal core layer.

In addition, the cavity of the present invention is characterized in that one or two adjacent sides are formed to be exposed to the outside.

In addition, the heat dissipation substrate of the present invention is characterized in that it further comprises an insulating layer formed on the side and the bottom surface in contact with the cavity and the resin core layer.

In addition, the present invention is characterized in that the heating element is mounted on the first circuit pattern formed on the insulating layer.

In addition, the present invention is characterized in that a heat-vulnerable element is mounted on the second circuit pattern formed on the resin core layer.

And, the present invention relates to a method for manufacturing the heat dissipation substrate, (A) providing a metal core layer, (B) forming an insulating layer on the outer surface of the metal core layer, (C) the insulating layer Forming a cavity in the formed metal core layer, (D) forming a resin core layer in the cavity, and (E) a first circuit pattern located in the insulating layer and a second circuit located in the resin core layer Forming a circuit layer comprising the pattern.

In addition, the present invention is characterized in that in the step (B), the insulating layer is an oxide insulating layer formed by anodizing the metal core layer.

In addition, the present invention is characterized in that in the step (C), the cavity is formed so that one or two adjacent sides are exposed to the outside.

In addition, the present invention is characterized in that in the step (D), the thickness of the resin core layer is formed corresponding to the depth of the cavity.

In addition, the present invention is characterized in that after the step (E), (F-1) further comprises the step of mounting a heating element on the first circuit pattern formed on the insulating layer.

In addition, the present invention is characterized in that after the step (E), (F-2) further comprises the step of mounting a heat-sensitive device on the second circuit pattern formed on the resin core layer.

In another embodiment, a method of manufacturing a heat dissipation substrate may include (A) providing a metal core layer, (B) forming a cavity in the metal core layer, and (C) an inner surface of the cavity and the metal core layer. Forming an insulating layer on an outer surface of the substrate, (D) forming a resin core layer in the cavity in which the insulating layer is formed, and (E) a first circuit pattern positioned on the insulating layer exposed to the outside; And forming a circuit layer including a second circuit pattern positioned on the resin core layer.

In addition, the present invention is characterized in that in the step (B), the cavity is formed so that one or two adjacent sides are exposed to the outside.

In addition, the present invention is characterized in that in the step (C) the insulating layer is an oxide insulating layer formed by anodizing the metal core layer.

In addition, the present invention is characterized in that in the step (D), the resin core layer is formed in the cavity to planarize the insulating layer and the outer surface.

In addition, the present invention after the step (E), (F-1) mounting the heating element on the first circuit pattern formed on the insulating layer and (F-2) the second formed on the resin core layer It further comprises the step of mounting a heat-vulnerable element in the circuit pattern.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to this, the terms or words used in this specification and claims are not to be interpreted in a conventional and dictionary sense, and the inventors may appropriately define the concept of terms in order to best describe their own invention. It should be interpreted as meaning and concept corresponding to the technical idea of the present invention based on the principle that the present invention.

The hybrid type heat dissipation substrate according to the present invention employs a metal core layer to easily dissipate heat generated from the heat generating device, thereby maintaining the performance of the heat generating device in an optimized state.

In addition, the hybrid heat dissipation substrate according to the present invention thermally separates the heat-vulnerable element from the heat-generating element while maintaining heat dissipation so that heat generated from the heat-generating element is not transferred to the heat-vulnerable element mounted on the same substrate.

1 is a cross-sectional view schematically showing a hybrid heat sink according to a first embodiment of the present invention.
FIG. 2 is a cross-sectional view schematically illustrating a modified example of the hybrid heat sink shown in FIG. 1.
3 is a cross-sectional view schematically showing a hybrid heat sink according to a second embodiment of the present invention.
4 is a schematic cross-sectional view of a hybrid heat sink according to a third exemplary embodiment of the present invention.
5 to 10 are cross-sectional views briefly illustrating a manufacturing process of the hybrid heat sink shown in FIG. 1.
11 to 13 are cross-sectional views illustrating a manufacturing process of the hybrid heat sink shown in FIG. 2.
FIG. 14 is a cross-sectional view for describing a manufacturing process of the hybrid heat sink shown in FIG. 3.
15 to 20 are cross-sectional views briefly illustrating a manufacturing process of the hybrid heat sink shown in FIG. 4.

The objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and the preferred embodiments associated with the accompanying drawings. In the present specification, in adding reference numerals to the components of each drawing, it should be noted that the same components as possible, even if displayed on different drawings have the same number as possible. In addition, in describing the present invention, if it is determined that the detailed description of the related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view schematically showing a hybrid heat dissipation substrate (hereinafter, a heat dissipation substrate) according to a first preferred embodiment of the present invention, and FIG. 2 is a cross-sectional view schematically showing a modification of the heat dissipation substrate shown in FIG. 1. to be. Hereinafter, the heat radiation board according to the present embodiment will be described with reference to this.

As shown in FIG. 1, the heat dissipation substrate 100 has heat dissipation and has a metal core layer 110 having a cavity 115, an insulating layer 120, a resin core layer 130 having a low thermal conductivity, and a circuit layer ( 140).

Here, the metal core layer 110 is made of a metal, and because the strength is greater than that of the general resin core layer, the metal core layer 110 increases resistance to warpage, and is applied to a heating element (not shown) mounted on the heat dissipation substrate 100. It serves to release heat generated by the outside. The metal core layer 110 generally has a planar quadrangular shape, but is not limited thereto. The shape of the metal core layer 110 may be modified. The metal core layer 110 may be formed of, for example, aluminum (Al), nickel (Ni), magnesium (Mg), titanium (Ti), zinc (Zn), tantalum (Ta), or an alloy thereof. .

The cavity 115 is formed in the thickness direction on the outer surface of the metal core layer 110. The cavity 115 may have a planar quadrangular shape and is formed to have a depth shorter than the thickness of the metal core layer 110. In FIG. 1, the side surface of the cavity 115 is formed perpendicular to the outer surface of the metal core layer 110, but may be formed obliquely to have a predetermined angle.

In addition, as shown in FIG. 1, the insulating layer 120 is formed on the outer surface of the metal core layer 110, where the depth of the cavity 115 is further extended by the thickness of the insulating layer 120.

The insulating layer 120 is formed on the outer surface of the metal core layer 110. The insulating layer 120 may be formed by stacking a conventional insulating layer or by attaching an adhesive insulating sheet.

In this case, the insulating layer 120 is preferably composed of an oxide insulating layer formed by anodizing the metal core layer 110. The oxide insulating layer may have an excellent heat dissipation and insulation property and may be formed to have a shape of a thin film, thereby reducing the thickness of the heat dissipation substrate 100. For example, when the metal core layer 110 is made of aluminum, the insulating layer 120 is made of Al ₂ O ₃ .

Meanwhile, although the insulating layer 120 is formed on both sides of the metal core layer 110 in FIG. 1, this is only one example and may be formed only on one surface of the metal core layer 110.

The resin core layer 130 is located in the cavity 115 to form a core layer of the heat dissipation substrate 100 together with the metal core layer 110, and is made of a plastic resin or ceramic having low thermal conductivity.

The resin core layer 130 is mounted with a heat vulnerable element to protect the heat vulnerable element from heat generated by a heat generating element (not shown). Therefore, the above-described metal core layer 110 serves to release heat, and the resin core layer 130 serves to prevent heat transfer, thereby forming a thermally separated region on one substrate.

At this time, the shape of the resin core layer 130 has a shape corresponding to the cavity 115 formed in the metal core layer 110.

In particular, the resin core layer 130 may be formed to be planarized with the insulating layer 120 formed on the outer surface of the metal core layer 110. That is, the thickness of the resin core layer 130 is formed to be equal to the depth of the cavity 115. As a result, the core layer has a flat outer surface, thereby improving the reliability of the circuit layer 140 formation (formed on the outer surface of the core layer), and deviating from design limitations.

The circuit layer 140 includes a first circuit pattern 141 formed on the insulating layer 120 and a second circuit pattern 142 formed on the resin core layer 130. The first circuit pattern 141 and the second circuit pattern 142 are generally formed at the same time, and are connected to each other to transmit an electrical signal.

The heating element (not shown) is mounted on the first circuit pattern 141 formed on the insulating layer 120, and the heat-vulnerable element (not shown) is mounted on the second circuit pattern 142 formed on the resin core layer 130. do. Each circuit pattern may include a pad unit for mounting an electronic device.

In addition, the heat dissipation substrate 100 may further include a protective layer 150 that protects the circuit layer 140. The protective layer 150 may be a solder resist. The solder resist serves to protect the circuit layer 140 from being oxidized without solder being applied to the circuit pattern during soldering with a heat resistant coating material. In addition, when the circuit layer 140 includes the pad part, it is preferable to expose the pad part by processing an opening in the solder resist for electrical connection with the electronic device.

In addition, a pad protection layer (not shown) may be formed on the pad part. The pad protection layer protects the pad portion exposed to the outside from oxidation, improves solderability of the part, and improves conductivity. The pad protective layer contains a metal with low corrosiveness and high conductivity, such as tin, silver, and gold.

As shown in FIG. 2, in the heat dissipation substrate 100, the insulating layer 120 is formed on both surfaces of the metal core layer 110, and the first circuit pattern 141 formed on the insulating layer 110 is also formed on both surfaces. And connected via via 145.

The first circuit pattern 141-1 formed on the top surface of the heat dissipation substrate 100 has the same function as the first circuit pattern 141 described with reference to FIG. 1, and the first circuit pattern 141-2 formed on the bottom surface thereof. Also may further include a pad protective layer formed on the pad portion and the pad portion. In this case, the heat dissipation substrate 100 according to the present embodiment may be mounted on another circuit board such as a motherboard by bonding solder balls or the like on the pad portion of the first circuit pattern 141-2 formed on the bottom surface.

The via 145 electrically connects the first circuit pattern 141-1 formed on the top surface and the first circuit pattern 141-2 formed on the bottom surface. The via 145 may connect the second circuit pattern 142 formed on the top surface of the heat dissipation substrate 100 and the first circuit pattern 141-2 formed on the bottom surface of the via 145.

3 is a cross-sectional view schematically showing a hybrid heat sink (hereinafter, referred to as a heat sink) according to a second embodiment of the present invention. Hereinafter, the heat radiation board according to the present embodiment will be described with reference to this. However, detailed descriptions of the same components referred to in FIG. 1 will be omitted.

The heat dissipation substrate 200 according to the present embodiment is characterized in that one or two adjacent side surfaces of the cavity 215 formed in the metal core layer 210 are exposed to the outside. One side is exposed to the outside when formed at the edge of the heat sink in a plane, and two consecutive sides are exposed to the outside when formed at the vertex.

In the cavity 215 of this shape, since the resin core layer 230 positioned in the cavity 215 is in contact with the metal core layer 210 on three sides or two sides, the resin core layer (in the metal core layer 210) The amount of heat transferred to 230 is reduced.

4 is a schematic cross-sectional view of a hybrid heat sink (hereinafter, referred to as a heat sink) according to a third embodiment of the present invention. Hereinafter, the heat dissipation substrate 300 according to the present embodiment will be described with reference to this. However, detailed descriptions of the same components referred to in FIG. 1 will be omitted.

The heat dissipation substrate 300 according to the present exemplary embodiment further includes an insulating layer 325 formed between the cavity 315 formed on the metal core layer 310 and the contact surfaces (side and bottom) of the resin core layer 330.

The insulating layer 325 is formed on the side and bottom of the cavity 315, and may be composed of an oxide insulating layer formed by anodizing the metal core layer 310, and in this case, the insulating layer 325 is a metal core. It may be formed simultaneously with the insulating layer 320 formed on the outer surface of the layer 310.

In this case, in forming the resin core layer 330 in the cavity 315, the resin core layer 330 is substantially formed on the insulating layer 325 formed in the cavity 315, which is a metal core layer made of metal. Bonding is stronger than the direct bonding with 310, thereby improving the bonding reliability.

A method of manufacturing the heat dissipation substrate according to the first embodiment of the present invention shown in FIG. 1 will be described with reference to FIGS. 5 to 10. In addition, the heat radiation substrate shown in FIG. 2 will be described with reference to FIGS. 11 to 13.

First, as shown in FIG. 5, a metal core layer 110 is provided. The metal core layer 110 may be formed of, for example, aluminum (Al), nickel (Ni), magnesium (Mg), titanium (Ti), zinc (Zn), tantalum (Ta), or an alloy thereof. .

Next, an insulating layer 120 is formed on the outer surface of the metal core layer 110. Ordinary insulating layers may be laminated, or an insulating sheet may be attached, and an insulating material may be applied to form the coating.

In particular, when anodizing is performed on the outer surface of the metal core layer 110 as shown in FIG. 6, an oxide insulating layer is formed. Anodization refers to oxidizing the surface of the metal core layer 110 by immersing it in an acid solution (electrolyte solution) by connecting the metal core layer 110 to an anode of a direct current power source. This anodization process is well known and detailed description thereof will be omitted.

As shown in FIG. 7, the cavity 115 is formed in the metal core layer 110 on which the insulating layer 120 is formed. The insulating layer 120 is removed to correspond to the shape of the cavity 115, and the metal core layer 110 is removed to have a predetermined depth. It is removed by an etching process, and this etching process is well known and detailed description thereof will be omitted.

In addition, as shown in FIG. 8, the resin core layer 130 is formed in the cavity 115. The resin core layer 130 may be formed of a plastic resin or ceramic, and may be formed by filling the material in the cavity 115 or may be formed by inserting a separately manufactured cavity 115 shaped core into the cavity 115. .

In particular, the resin core layer 130 is preferably formed to have the same thickness as the depth of the cavity 115. As a result, the core layers (metal core layer and resin core layer) have a flat outer surface, thereby facilitating formation of the circuit layer 140.

Thereafter, as shown in FIG. 9, the circuit layer 140 including the first circuit pattern 141 located in the insulating layer 120 and the second circuit pattern 142 located in the resin core layer 130. To form. The first circuit pattern 141 and the second circuit pattern 142 may be simultaneously formed by one process, and may be a conventional semi-additive process (SAP), a modified semi-additive process (MSAP), or a subtractive. It can be formed using a method (Subtractive) and the like.

In addition, a heat generating element (not shown) and a heat-vulnerable element (not shown) may be immediately mounted on the heat dissipation substrate 100 illustrated in FIG. 9. The solder ball method or the wire bonding method may be mounted, and the heat generating element may be mounted to be connected to the first circuit pattern 141 to be connected to the second circuit pattern 142.

In this case, as shown in FIG. 10, the protective layer 150 may be further formed on the circuit layer 140 so that the circuit layer exposed to the outside may not be damaged (for example, not oxidized). The protective layer 150 may be made of a solder resist. It may be formed by a screen printing method, a roller coating method, a curtain coating method, a spray coating method, and at this time, it is preferable to form the pad part included in the circuit layer 140 to be exposed.

In addition, in order to manufacture the heat dissipation substrate 100 shown in FIG. 2, first, an insulating layer 120 and a cavity 115 are formed in the metal core layer 110 as shown in FIGS. 5 to 8.

Next, as shown in FIG. 11, a via hole 117 is formed to penetrate through the insulating layer 120 and the metal core layer 110. The via hole 117 may be a mechanical drilling method using a drill bit and a laser processing method by a YAG laser, a CO 2 laser, or the like.

Thereafter, as illustrated in FIG. 12, the via 145, the first circuit patterns 141-1 and 141-2, and the second circuit pattern 142 are formed. After the plating layer is formed in the via hole 117, the insulating layer 120, and the resin core layer 130, a circuit pattern may be formed by performing an image development process and an etching process (panel plating method).

In addition, a circuit pattern can be formed using a pattern plating method. A seed layer is formed by electroless copper plating, and an electroless plating layer (seed layer) is formed through electroless plating. The electroless plating layer is formed by a thin film formation method (sputtering method or CVD method) using a conductive metal containing copper. Thereafter, a plating resist (dry film, liquid photosensitive material) is laminated on the electroless plating layer, and the plating resist is patterned to form an opening through exposure and development. Then, electroplating is performed by supplying electricity to the electroless plating layer so that copper or the like precipitates on the electroless plating layer in the opening.

As illustrated in FIG. 13, the first circuit patterns 141-1 and 141-2 and the second circuit pattern 142 exposed to the outside are not damaged (for example, not oxidized). The protective layer 150 may be further formed on the circuit layer.

The heat dissipation substrate 200 according to the second embodiment of the present invention shown in FIG. 3 is manufactured by a process very similar to the heat dissipation substrate 100 shown in FIG. 1 described with reference to FIGS. 5 to 10.

As described with reference to FIG. 7, in the case of forming the cavity 115 in the metal core layer 110, one or more adjacent shapes of the cavity 115 are exposed to the outside (see FIG. 14). The heat radiation substrate 200 shown in 3 is manufactured.

That is, after forming the cavity 215 illustrated in FIG. 3, the resin core layer 230 is formed in the cavity 215, the circuit layer 240 is formed, and then the protective layer 250 is formed. Production of 200 is possible.

In addition, after the resin core layer 230 is formed, the process described with reference to FIGS. 11 to 13 may be performed to manufacture the heat dissipation substrate 200 having the circuit layers formed on both surfaces thereof.

A method of manufacturing the heat dissipation substrate according to the third embodiment of the present invention shown in FIG. 4 will be described with reference to FIGS. 15 to 20.

First, as shown in FIG. 15, a metal core layer 310 is provided. Since the metal core layer 310 is the same as that described with reference to FIG. 5, a detailed description thereof will be omitted.

Next, as shown in FIG. 16, a cavity 315 is formed in the metal core layer 310. The metal core layer 310 is removed to have a predetermined depth according to the etching process or the polishing process.

17, the insulating layer 320 is formed on the outer surface of the metal core layer 310. In particular, when the metal core layer 310 is anodized, an oxide insulating layer is formed on the inner surfaces (side and bottom) of the cavity 315 simultaneously with the outer surface of the metal core layer 310. When the insulating layer 325 is formed on the inner surface of the cavity 315, the volume of the cavity 315 is somewhat reduced. If the insulating layer 325 is formed on the inner surface of the cavity 315, the resin core layer 330 may be more strongly bonded than the metal core layer 310 directly bonded to the metal material.

18 to 20, the resin core layer 330 is formed in the cavity 315, and the circuit layer 340 is formed on the insulating layer 320 and the resin core layer 330. The protective layer 350 is formed on the circuit layer 340.

In this case, as shown in FIG. 18, the resin core layer 330 may be formed to have a predetermined thickness that forms the same plane as the insulating layer 320.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention. It is therefore intended that such variations and modifications fall within the scope of the appended claims.

100, 200, 300: Hybrid heat sink
110, 210, 310: metal core layer
115, 215, 315: cavity 120, 220, 320, 325: insulation layer
130, 230, 330: resin core layer 140, 240, 340: circuit layer
150, 250, 350: Protective layer 117: Via hole
145: Via

Claims (20)

A metal core layer having a cavity formed in the thickness direction on the outer surface;
A resin core layer formed in the cavity;
An insulation layer formed on an outer surface of the metal core layer; And
A circuit layer including a first circuit pattern formed on the insulating layer and a second circuit pattern formed on the resin core layer;
Hybrid heat sink comprising a. The method according to claim 1,
And a protective layer formed on the circuit layer. The method according to claim 1,
The first circuit pattern is formed on both sides of the metal core layer, characterized in that connected via a via via hybrid type heat sink. The method according to claim 1,
And the resin core layer is positioned in the cavity such that the insulating layer and the outer surface are flattened. The method according to claim 1,
And said insulating layer is an oxide insulating layer formed by anodizing said metal core layer. The method according to claim 1,
The cavity is a hybrid heat sink, characterized in that one or two adjacent sides are formed to be exposed to the outside. The method according to claim 1,
The heat dissipation substrate further comprises an insulating layer formed on the side and the bottom contact with the cavity and the resin core layer. The method according to claim 1,
And a heat generating element is mounted on the first circuit pattern formed on the insulating layer. The method according to claim 1,
And a heat-vulnerable element is mounted on the second circuit pattern formed on the resin core layer. (A) providing a metal core layer;
(B) forming an insulating layer on an outer surface of the metal core layer;
(C) forming a cavity in the metal core layer on which the insulating layer is formed;
(D) forming a resin core layer in the cavity; And
(E) forming a circuit layer including a first circuit pattern positioned in the insulating layer and a second circuit pattern positioned in the resin core layer;
Method of manufacturing a hybrid heat-radiating substrate comprising a. The method according to claim 10,
In the (B) step, the insulating layer,
And a oxidizing insulating layer formed by anodizing the metal core layer. The method according to claim 10,
In the step (C),
The cavity is a method of manufacturing a hybrid heat sink, characterized in that the one or two adjacent sides are formed to be exposed to the outside. The method according to claim 10,
In the step (D),
And a thickness of the resin core layer is formed to correspond to the depth of the cavity. The method according to claim 10,
After the step (E),
(F-1) The method of manufacturing a hybrid heat sink further comprising the step of mounting a heating element on the first circuit pattern formed on the insulating layer. The method according to claim 10,
After the step (E),
(F-2) The method of manufacturing a hybrid heat-radiating substrate further comprising the step of mounting a heat-vulnerable element on the second circuit pattern formed on the resin core layer. (A) providing a metal core layer;
(B) forming a cavity in the metal core layer;
(C) forming an insulating layer on an inner surface of the cavity and an outer surface of the metal core layer;
(D) forming a resin core layer in the cavity in which the insulating layer is formed on an inner surface thereof; And
(E) forming a circuit layer including a first circuit pattern located in the insulating layer exposed to the outside and a second circuit pattern located in the resin core layer;
Method of manufacturing a hybrid heat-radiating substrate comprising a. The method according to claim 16,
In the step (B)
The cavity is a method of manufacturing a hybrid heat sink, characterized in that the one or two adjacent sides are formed to be exposed to the outside. The method according to claim 16,
In the (C) step, the insulating layer,
And a oxidizing insulating layer formed by anodizing the metal core layer. The method according to claim 16,
In the step (D), the resin core layer,
The method of claim 1, wherein the insulating layer and the outer surface are flattened in the cavity. The method according to claim 16,
After the step (E),
(F-1) mounting a heating element on the first circuit pattern formed on the insulating layer; And
(F-2) The method of manufacturing a hybrid heat-radiating substrate further comprising the step of mounting a heat-vulnerable element on the second circuit pattern formed on the resin core layer.

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