JPH02127054U - - Google Patents

Info

Publication number
JPH02127054U
JPH02127054U JP3554189U JP3554189U JPH02127054U JP H02127054 U JPH02127054 U JP H02127054U JP 3554189 U JP3554189 U JP 3554189U JP 3554189 U JP3554189 U JP 3554189U JP H02127054 U JPH02127054 U JP H02127054U
Authority
JP
Japan
Prior art keywords
heating element
metal core
contact
insulating layer
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3554189U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3554189U priority Critical patent/JPH02127054U/ja
Publication of JPH02127054U publication Critical patent/JPH02127054U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例を示す側断面図、第
2図は同実施例の要部斜視図、第3図は従来例を
示す側断面図である。 1…発熱素子、2…リード線、3…金属コア、
4…絶縁層、5…スルーホール、6…ハンダ、7
…座ぐり穴、8…高熱伝導絶縁シート。
FIG. 1 is a side sectional view showing an embodiment of the present invention, FIG. 2 is a perspective view of essential parts of the same embodiment, and FIG. 3 is a side sectional view showing a conventional example. 1... Heat generating element, 2... Lead wire, 3... Metal core,
4... Insulating layer, 5... Through hole, 6... Solder, 7
...Counterbore, 8...High heat conductive insulation sheet.

Claims (1)

【実用新案登録請求の範囲】 板状の金属コアと、該金属コアに設けた発熱素
子のリード線を挿入するスルーホールと、前記板
状の金属コアの表面を絶縁する絶縁層とを有する
金属コア基板において、 前記発熱素子が搭載される面の絶縁層に、発熱
素子の形状に合わせた座ぐり穴を設け、 かつ、高熱伝導絶縁シートを、その上面が前記
発熱素子の底面に接触し下面が前記金属コアに接
触するように前記座ぐり穴に密着挿入したことを
特徴とする金属コア基板。
[Claims for Utility Model Registration] A metal having a plate-shaped metal core, a through hole into which a lead wire of a heating element provided in the metal core is inserted, and an insulating layer insulating the surface of the plate-shaped metal core. In the core substrate, a counterbore hole corresponding to the shape of the heating element is provided in the insulating layer on the surface on which the heating element is mounted, and a highly thermally conductive insulating sheet is placed such that the upper surface thereof is in contact with the bottom surface of the heating element and the lower surface is in contact with the bottom surface of the heating element. is closely inserted into the counterbore hole so as to contact the metal core.
JP3554189U 1989-03-30 1989-03-30 Pending JPH02127054U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3554189U JPH02127054U (en) 1989-03-30 1989-03-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3554189U JPH02127054U (en) 1989-03-30 1989-03-30

Publications (1)

Publication Number Publication Date
JPH02127054U true JPH02127054U (en) 1990-10-19

Family

ID=31540990

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3554189U Pending JPH02127054U (en) 1989-03-30 1989-03-30

Country Status (1)

Country Link
JP (1) JPH02127054U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004179309A (en) * 2002-11-26 2004-06-24 New Japan Radio Co Ltd Heat dissipating structure for printed circuit board and method for manufacturing the same
JP2011146665A (en) * 2010-01-12 2011-07-28 Samsung Electro-Mechanics Co Ltd Hybrid heat dissipation substrate, and method of manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004179309A (en) * 2002-11-26 2004-06-24 New Japan Radio Co Ltd Heat dissipating structure for printed circuit board and method for manufacturing the same
JP2011146665A (en) * 2010-01-12 2011-07-28 Samsung Electro-Mechanics Co Ltd Hybrid heat dissipation substrate, and method of manufacturing the same

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