JPH02127054U - - Google Patents
Info
- Publication number
- JPH02127054U JPH02127054U JP3554189U JP3554189U JPH02127054U JP H02127054 U JPH02127054 U JP H02127054U JP 3554189 U JP3554189 U JP 3554189U JP 3554189 U JP3554189 U JP 3554189U JP H02127054 U JPH02127054 U JP H02127054U
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- metal core
- contact
- insulating layer
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 1
- 238000009413 insulation Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Description
第1図は本考案の一実施例を示す側断面図、第
2図は同実施例の要部斜視図、第3図は従来例を
示す側断面図である。
1…発熱素子、2…リード線、3…金属コア、
4…絶縁層、5…スルーホール、6…ハンダ、7
…座ぐり穴、8…高熱伝導絶縁シート。
FIG. 1 is a side sectional view showing an embodiment of the present invention, FIG. 2 is a perspective view of essential parts of the same embodiment, and FIG. 3 is a side sectional view showing a conventional example. 1... Heat generating element, 2... Lead wire, 3... Metal core,
4... Insulating layer, 5... Through hole, 6... Solder, 7
...Counterbore, 8...High heat conductive insulation sheet.
Claims (1)
子のリード線を挿入するスルーホールと、前記板
状の金属コアの表面を絶縁する絶縁層とを有する
金属コア基板において、 前記発熱素子が搭載される面の絶縁層に、発熱
素子の形状に合わせた座ぐり穴を設け、 かつ、高熱伝導絶縁シートを、その上面が前記
発熱素子の底面に接触し下面が前記金属コアに接
触するように前記座ぐり穴に密着挿入したことを
特徴とする金属コア基板。[Claims for Utility Model Registration] A metal having a plate-shaped metal core, a through hole into which a lead wire of a heating element provided in the metal core is inserted, and an insulating layer insulating the surface of the plate-shaped metal core. In the core substrate, a counterbore hole corresponding to the shape of the heating element is provided in the insulating layer on the surface on which the heating element is mounted, and a highly thermally conductive insulating sheet is placed such that the upper surface thereof is in contact with the bottom surface of the heating element and the lower surface is in contact with the bottom surface of the heating element. is closely inserted into the counterbore hole so as to contact the metal core.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3554189U JPH02127054U (en) | 1989-03-30 | 1989-03-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3554189U JPH02127054U (en) | 1989-03-30 | 1989-03-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02127054U true JPH02127054U (en) | 1990-10-19 |
Family
ID=31540990
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3554189U Pending JPH02127054U (en) | 1989-03-30 | 1989-03-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02127054U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004179309A (en) * | 2002-11-26 | 2004-06-24 | New Japan Radio Co Ltd | Heat dissipating structure for printed circuit board and method for manufacturing the same |
JP2011146665A (en) * | 2010-01-12 | 2011-07-28 | Samsung Electro-Mechanics Co Ltd | Hybrid heat dissipation substrate, and method of manufacturing the same |
-
1989
- 1989-03-30 JP JP3554189U patent/JPH02127054U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004179309A (en) * | 2002-11-26 | 2004-06-24 | New Japan Radio Co Ltd | Heat dissipating structure for printed circuit board and method for manufacturing the same |
JP2011146665A (en) * | 2010-01-12 | 2011-07-28 | Samsung Electro-Mechanics Co Ltd | Hybrid heat dissipation substrate, and method of manufacturing the same |