JPS6279368U - - Google Patents

Info

Publication number
JPS6279368U
JPS6279368U JP17162685U JP17162685U JPS6279368U JP S6279368 U JPS6279368 U JP S6279368U JP 17162685 U JP17162685 U JP 17162685U JP 17162685 U JP17162685 U JP 17162685U JP S6279368 U JPS6279368 U JP S6279368U
Authority
JP
Japan
Prior art keywords
metal layer
jumper chip
solder
tin
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17162685U
Other languages
Japanese (ja)
Other versions
JPH0249651Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985171626U priority Critical patent/JPH0249651Y2/ja
Publication of JPS6279368U publication Critical patent/JPS6279368U/ja
Application granted granted Critical
Publication of JPH0249651Y2 publication Critical patent/JPH0249651Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例であるジヤンパーチ
ツプの断面図、第2図a〜eは同ジヤンパーチツ
プの製造工程を説明するための図、第3図は同実
施例のジヤンパーチツプの使用状態を示す断面図
、第4図は従来のジヤンパーチツプの断面図であ
る。 10……絶縁性基板、20……基体金属層、3
0……(スズまたは半田の)メツキ層。
Fig. 1 is a sectional view of a jumper chip which is an embodiment of the present invention, Figs. 2 a to e are diagrams for explaining the manufacturing process of the jumper chip, and Fig. 3 shows how the jumper chip of the embodiment is used. 4 is a cross-sectional view of a conventional jumper chip. 10... Insulating substrate, 20... Base metal layer, 3
0...Plated layer (of tin or solder).

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁性基板の表面から裏面の両端部にかけ基体
金属層を形成し、かつその基板金属層の表面にス
ズまたは半田メツキを施してなるジヤンパーチツ
プ。
A jumper chip in which a base metal layer is formed from the front surface to both ends of the back surface of an insulating substrate, and the surface of the substrate metal layer is plated with tin or solder.
JP1985171626U 1985-11-06 1985-11-06 Expired JPH0249651Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985171626U JPH0249651Y2 (en) 1985-11-06 1985-11-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985171626U JPH0249651Y2 (en) 1985-11-06 1985-11-06

Publications (2)

Publication Number Publication Date
JPS6279368U true JPS6279368U (en) 1987-05-21
JPH0249651Y2 JPH0249651Y2 (en) 1990-12-27

Family

ID=31107425

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985171626U Expired JPH0249651Y2 (en) 1985-11-06 1985-11-06

Country Status (1)

Country Link
JP (1) JPH0249651Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02134663U (en) * 1989-04-13 1990-11-08
JPH0382512U (en) * 1989-12-14 1991-08-22

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5673493A (en) * 1979-11-20 1981-06-18 Matsushita Electric Ind Co Ltd Chip part for jumber

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5673493A (en) * 1979-11-20 1981-06-18 Matsushita Electric Ind Co Ltd Chip part for jumber

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02134663U (en) * 1989-04-13 1990-11-08
JPH0382512U (en) * 1989-12-14 1991-08-22

Also Published As

Publication number Publication date
JPH0249651Y2 (en) 1990-12-27

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