JPS62163945U - - Google Patents
Info
- Publication number
- JPS62163945U JPS62163945U JP1986052711U JP5271186U JPS62163945U JP S62163945 U JPS62163945 U JP S62163945U JP 1986052711 U JP1986052711 U JP 1986052711U JP 5271186 U JP5271186 U JP 5271186U JP S62163945 U JPS62163945 U JP S62163945U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- metal layer
- protruding electrode
- bonded
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
第１図、第２図は本考案の一実施例の実装工程
を順次示す側断面図、第３図、第４図は従来の実
装工程を順次示す側面図である。
１：半導体素子、２：基板、４：金属層、６：
突起状電極、７：くぼみ。
1 and 2 are side sectional views sequentially showing the mounting process of an embodiment of the present invention, and FIGS. 3 and 4 are side views sequentially showing the conventional mounting process. 1: semiconductor element, 2: substrate, 4: metal layer, 6:
Protruding electrode, 7: recess.
Claims (1)
れたくぼみ内面に被着された金属層に圧着された
ことを特徴とする半導体装置。 A semiconductor device characterized in that a protruding electrode of a semiconductor element is pressure-bonded to a metal layer coated on the inner surface of a recess provided on one surface of a substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986052711U JPS62163945U (en) | 1986-04-08 | 1986-04-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986052711U JPS62163945U (en) | 1986-04-08 | 1986-04-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62163945U true JPS62163945U (en) | 1987-10-17 |
Family
ID=30878118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986052711U Pending JPS62163945U (en) | 1986-04-08 | 1986-04-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62163945U (en) |
-
1986
- 1986-04-08 JP JP1986052711U patent/JPS62163945U/ja active Pending