JPS6265863U - - Google Patents
Info
- Publication number
- JPS6265863U JPS6265863U JP15716685U JP15716685U JPS6265863U JP S6265863 U JPS6265863 U JP S6265863U JP 15716685 U JP15716685 U JP 15716685U JP 15716685 U JP15716685 U JP 15716685U JP S6265863 U JPS6265863 U JP S6265863U
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- integrated circuit
- hybrid integrated
- conductive path
- metal substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
Description
第１図は本考案の実施例を示す断面図、第２図
は従来例を示す断面図である。
１…金属基板、２…絶縁フイルム、３…導電路
、４…導電パツド、５…金ペースト。
FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is a sectional view showing a conventional example. DESCRIPTION OF SYMBOLS 1... Metal substrate, 2... Insulating film, 3... Conductive path, 4... Conductive pad, 5... Gold paste.
Claims (1)
て結合する絶縁フイルムと、該フイルム上に貼着
した銅箔を所望形状に形成した導電路と、該導電
路上に設けた導電パツドと、前記導電路上に設け
た複数の回路素子とを具備し、前記絶縁フイルム
を折曲げて前記基板の金属露出面が接する様に配
置した混成集積回路に於いて、前記導電パツド上
に金（Ａｕ）ペーストを塗布したことを特徴とす
る混成集積回路。 Two metal substrates, an insulating film that connects the two metal substrates at a distance, a conductive path made of copper foil adhered to the film in a desired shape, and a conductive pad provided on the conductive path. and a plurality of circuit elements provided on the conductive pad, and the insulating film is bent so that the exposed metal surface of the substrate is in contact with the hybrid integrated circuit. A hybrid integrated circuit characterized in that it is coated with Au) paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15716685U JPS6265863U (en) | 1985-10-15 | 1985-10-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15716685U JPS6265863U (en) | 1985-10-15 | 1985-10-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6265863U true JPS6265863U (en) | 1987-04-23 |
Family
ID=31079462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15716685U Pending JPS6265863U (en) | 1985-10-15 | 1985-10-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6265863U (en) |
-
1985
- 1985-10-15 JP JP15716685U patent/JPS6265863U/ja active Pending
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