JPS6249290U - - Google Patents
Info
- Publication number
- JPS6249290U JPS6249290U JP14171385U JP14171385U JPS6249290U JP S6249290 U JPS6249290 U JP S6249290U JP 14171385 U JP14171385 U JP 14171385U JP 14171385 U JP14171385 U JP 14171385U JP S6249290 U JPS6249290 U JP S6249290U
- Authority
- JP
- Japan
- Prior art keywords
- metal substrates
- divided metal
- insulating film
- exposed
- divided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 238000005452 bending Methods 0.000 description 2
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の実施例を示す断面図、第２図
は本実施例を折曲る前の断面図、第３図は本実施
例に用いる折曲る前の金属基板の平面図、第４図
は他の実施例の基板断面図、第５図は他の実施例
を示す断面図、第６図は従来例を示す断面図であ
る。
１……金属基板、２……絶縁フイルム、３……
導電路、４……回路素子、５……外部リード、６
……切欠孔、７……連結体。
FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a sectional view of the embodiment before bending, and FIG. 3 is a plan view of the metal substrate used in the embodiment before bending. FIG. 4 is a sectional view of a substrate of another embodiment, FIG. 5 is a sectional view of another embodiment, and FIG. 6 is a sectional view of a conventional example. 1... Metal substrate, 2... Insulating film, 3...
Conductive path, 4...Circuit element, 5...External lead, 6
...notch hole, 7...connection body.
Claims (1)
属基板を離間して結合する絶縁フイルムと、該絶
縁フイルムに設けた所望形状の導電路と、前記分
割した複数の金属基板から導出される外部リード
と、前記導電路上に設けた複数の回路素子とを具
備し、前記分割した複数の金属基板を蛇腹状に配
置し、前記金属基板の金属露出面が露出する様に
パツケージすることを特徴とする混成集積回路。 A plurality of divided metal substrates, an insulating film that connects the plurality of divided metal substrates at a distance, a conductive path of a desired shape provided on the insulating film, and an external lead led out from the plurality of divided metal substrates. and a plurality of circuit elements provided on the conductive surface, the plurality of divided metal substrates are arranged in a bellows shape, and packaged so that the exposed metal surface of the metal substrate is exposed. Hybrid integrated circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14171385U JPS6249290U (en) | 1985-09-17 | 1985-09-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14171385U JPS6249290U (en) | 1985-09-17 | 1985-09-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6249290U true JPS6249290U (en) | 1987-03-26 |
Family
ID=31049755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14171385U Pending JPS6249290U (en) | 1985-09-17 | 1985-09-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6249290U (en) |
-
1985
- 1985-09-17 JP JP14171385U patent/JPS6249290U/ja active Pending