JPS6249294U - - Google Patents
Info
- Publication number
- JPS6249294U JPS6249294U JP14171485U JP14171485U JPS6249294U JP S6249294 U JPS6249294 U JP S6249294U JP 14171485 U JP14171485 U JP 14171485U JP 14171485 U JP14171485 U JP 14171485U JP S6249294 U JPS6249294 U JP S6249294U
- Authority
- JP
- Japan
- Prior art keywords
- metal substrates
- conductive path
- divided metal
- integrated circuit
- exposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 8
- 238000009423 ventilation Methods 0.000 claims description 2
- 238000005452 bending Methods 0.000 description 2
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の実施例を示す斜視図、第２図
は本実施例に用いる金属基板の折曲る前の平面図
、第３図は本実施例に用いる金属基板の折曲げる
前の断面図、第４図は従来例の断面図である。
１……金属基板、２……絶縁フイルム、３……
導電路、４……回路素子、５……外部リード、６
……蓋体、７……切欠孔、８……連結体、９……
突出部、１０……換気孔、１１……空間部。
Fig. 1 is a perspective view showing an embodiment of the present invention, Fig. 2 is a plan view of the metal substrate used in this embodiment before bending, and Fig. 3 is a plan view of the metal substrate used in this embodiment before bending. 4 is a sectional view of a conventional example. 1... Metal substrate, 2... Insulating film, 3...
Conductive path, 4...Circuit element, 5...External lead, 6
... Lid body, 7 ... Notch hole, 8 ... Connecting body, 9 ...
Projection part, 10...Ventilation hole, 11...Space part.
Claims (1)
金属基板を離間して結合する絶縁フイルムと、該
フイルム上に設けた所望形状の導電路と、前記分
割した複数の金属基板から導出される外部リード
と、前記導電路上に設けた複数の回路素子とを具
備し、前記分割した複数の金属基板を蛇腹状に配
置し、前記金属基板の金属露出面が露出する様に
パツケージする混成集積回路に於いて、前記パツ
ケージに用いる蓋体に複数の換気孔を設けること
を特徴とする混成集積回路。 A plurality of divided metal substrates, an insulating film that connects the plurality of divided metal substrates at a distance, a conductive path of a desired shape provided on the film, and an external conductive path led out from the plurality of divided metal substrates. A hybrid integrated circuit comprising leads and a plurality of circuit elements provided on the conductive path, wherein the plurality of divided metal substrates are arranged in a bellows shape and packaged so that the exposed metal surface of the metal substrate is exposed. A hybrid integrated circuit characterized in that a lid used for the package is provided with a plurality of ventilation holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14171485U JPS6249294U (en) | 1985-09-17 | 1985-09-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14171485U JPS6249294U (en) | 1985-09-17 | 1985-09-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6249294U true JPS6249294U (en) | 1987-03-26 |
Family
ID=31049757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14171485U Pending JPS6249294U (en) | 1985-09-17 | 1985-09-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6249294U (en) |
-
1985
- 1985-09-17 JP JP14171485U patent/JPS6249294U/ja active Pending